Aktuelle Trends der Verbindungstechnik: Vom Cu-Drahtbond zum Embedding Andreas Ostmann Fraunhofer IZM Gustav-Meyer-Allee 25, 13355 Berlin, Germany email: [email protected]

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Inhalt Elektronik-Packaging
Heute
vom Au- und Al- zum Cu-Draht
Embedding
Morgen
Panel Level Packaging
Power Embedding
Übermorgen
Modulare Elektronik

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Heute

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Packaging Today

... more than just a handful of types

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Inside Packages - Interconnect Evolution First level chip interconnection technologies inside a package:

chip & wire

flip chip

chip embedding

established

smallest in 2D

smallest in 3D

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Wire Bonding – From Au to Cu

Today more than 50 % of all bond wires are Cu

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Wire Bonding – From Al to Cu for Power Applications Cu wires and ribbons for high reliability power modules

thick Cu wire on IZM power cycling test vehicle

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Chip Embedding - Technology Progress Chip Embedding in organic substrates  use of PCB technology & material

Production started  Japan  Korea  Europe First Standards  JPCA

First Patent 1968 [email protected]

Basic R&D 2000

Production Demos 2005

Production 2010

Chip Embedding – Chances & Challenges via to substrate

via to chip

dielectric

chip core substrate

adhesive

Advantages  thin planar packaging, enabling 3D stacking  improved electrical performance  cost saving by large area process Challenges  improvement of process yield  new supply chain structure has to be established

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PCB Embedding Today – Power and Logic The production of embedded packages is ramping up fast Today 2013: 340 Mio., Forecast 2016; 1700 Mio. (source Yole) Smart Phone Market • DC/DC converters • Power management units • Connectivity module Computer market • MOSFET packages • Driver MOS SiPs PCB Embedding Technology is implemented or will come soon at • PCB manufacturers • Semiconductor manufacturers • OSATS

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Power Chip Embedding - Features







Embedding of power chips into Printed Circuit Board structures
cost saving by large area process
Direct connection by Cu conductors / no bond wires
high reliability by direct Cu to chip interconnects
shielding capability Completely planar conductors
multiple wiring layers possible
SMD assembly on top allows driver integration
top side cooling possible
very low parasitic effects

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Power Chip Embedding – Manufacturing Process

conductive chip attach


backside contact by conductive die bond  conductive adhesive  soldering  sintering
very good thermal conductivity
die attach on thick Cu possible
compatible to standard Ag backside

embedding by lamination

via drilling top, through-via

Cu plating and structuring [email protected]

Ag sintered die bond

Embedded Component Packaging (ECP)

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courtesy AT&S

Embedded Component Packaging (ECP)

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courtesy AT&S/GaN Systems

Semiconductor Embedded in Substrate (SESUB)

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Blade Package SMD power packagea  embedded MOSFET / Driver  manufacturing on PCB format

Licensing and process transfer from Fraunhofer IZM [email protected]

Morgen

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Today's Packaging – Limited Manufacturing Formats Leadframe Packaging

Strip Packaging

Wafer-level Packaging Fan-out Wafer-level Packaging

Need for further cost reduction  Increase of production format size [email protected]

From Wafer Size to Panel Size PCB Technologies

• Based on standard thin film technology equipment • Tightest tolerances for fine pitch line/space (2/2 µm) • Currently limited to 12” – 300 mm

8“

12“

Thin Film Technologies [email protected]

• Based on standard PCB materials & equipment • 3D and double sided routing are standard features for PCBs • Line/space down to 10 µm • Full format/large area is standard

24“x18“ / 24“x24“

Panel-Level Packaging - PLP Definition: Throughout manufacturing of packages on large formats Features • Lead-less package (BGA, QFN, LGA) • embedded components (active and passive ) • components on top • high-density interconnects • 3D capability • rectangular or square production formats 18" - 24“ or larger

singulation

manufacturing on panel-level [email protected]

package / SiP / module

PLP Strategies at Fraunhofer IZM Panel-Size FO WLP


Large-area molding 18" x 24"

PCB Embedding


use of new polymers / laminates


Through mold vias for 3D

 thin layers (10 µm) for high density


Interconnects using PCB

 high breakthrough (>40 kV/mm) for power

materials & technology
mold embedding of sensors


improved resolution for interconnects 10 µm  5 µm  2 µm
processes to reduce warpage

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Fraunhofer IZM Substrate Integration Line  High-end manufacturing equipment dedicated to customer-specific R&D  Complete 18" x 24 " PCB manufacturing & assembly line PCB laser, drilling & lamination lab

Laser, drilling , lamination Lithography (LDI), sputtering galvanics, etching Assembly, molding, analytics Total area

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400 m² 280 m² 100 m² 340 m² 1120 m²

40 scientist, engineers and technicians with long-term experience in advanced packaging

Fraunhofer IZM Substrate Integration Line

Datacon evo/ ASM Siplace CA3

Mahr OMS 600/ IMPEX proX3

Schmoll MX1

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WL: Towa up to 8” PL: APIC up to 18”x24” incl. 12” WL (Q3 – 2014)

Ramgraber automatic plating line

Lauffer/ Bürkle

Orbotech Paragon Ultra 200

Siemens Microbeam/ Schmoll Picodrill with HYPER RAPID 50

Schmid

18”x 24” Panel-Level FO WLP

Assembly of 5528 dies on large area 18”x 24” with 6500 dies/h speed

Mold embedding on large area 18”x 24” by sheet lamination

Fully electrical connected WL embedded package stack with TMV & 3D routing [email protected]

Panel Molding 18”x 24” – APIC Yamada

Equipment in Japan before shipment

Large area compression molding:
Wafer Level: 300 mm up to 450 mm possible
Panel Level: 18” x 24” (456 x 610 mm²)
Lamination Up and Running in Q4/2014 [email protected]

First molded panel 18" x 24 "

Übermorgen

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Electronic System - Quo Vadis?

board from Zuse Z23 computer, 1963

1950 [email protected]

SMD board with 01005 components, early 21. century

2000

2050

Electronic System - Quo Vadis?

board from Zuse Z23 computer, 1963

1950 [email protected]

SMD board with 01005 components, early 21. century

2000

Modular Electronics ?

2050

Modular Microelectronics - System Concept Today

Modular Microsystem

Design

Hardware

SMD components mounted on a PCB [email protected]

stacked modules (functional blocks)

Modular Microelectronics – Concept Traditional electronic system capacitors

µController

resistors MOSFET

Vision

flash memory

system control / memory

Pt100

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temperature sensing power management

PCB

components on a PCB

Modular System

3D  stacked modules

stacked modules

Modular Microelectronics - 1st Level (inside Modules) Requirements on Modules:

SMD

R

Si Chip

Si Chip

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• easy to handle • stackable ⇒ planar • reliable  Embedding Technology

C

Embedded SMD System-in-Packages • embedding of packaged SMDs • required if bare dies are not available • thicker modules (1-2 mm)

C

Embedded Chips System-in-Packages • planar modules with embedded dies and thin passives • thin modules (ca. 150 µm) Embedded Thin Chip • all functions integrated in a SoC • ultra-thin (< 100 µm) / CSP form factor

Modular Microelectronics – 2nd Level (between Modules) Soldering • solder • diffusion soldering Adhesive Joining • ACF • b-stage ICA/NCA Sintering • Ag sinter paste Mechanical Connection • „press fit“ contacts • reworkable contacts

 only few contacts between modules [email protected]

Modular Microelectronics - Serial Data Bus  Serial bus connection between modules Bus Systems Name max. Speed LIN 0.02 Mbit/s CAN 1 Mbit/s 3,4 Mbit/s I2 C USB 2.0 480 Mbit/s USB 3 5000 Mbit/s

D+

no. of I/Os 2 4 4 4 6

Low number of contacts between modules  simplified assembly process  high assembly yield  high reliability

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GND

VCC

D-

Modular Microelectronics – From Chip to System Software

Hardware

Level component

Bootloader (Firmware)

module

Application Program (Runtime)

sub-system

system

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Manufacturing • Semiconductor Manufacturer • Packaging House • PCB Manufacturer

• Packaging House • OEM

• OEM

Modular Sensor – System Concept Sensor modules connected by I2C bus (4 contacts: SDA, SCL, Vcc, GND) Acceleration Sensing

Light Sensing

Temperature Sensing

Communication & Power

I2C Bus

Functions • 3 sensor functions / modules • acceleration • light • temperature • communication & power module • USB connection to PC • power conversion 5V (USB) to 3.3 V [email protected]

USB

PC

Modular Sensor – System Demonstrator

set of sensor system modules I2C bus contacts

top side

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ISP programming contacts

module x-ray image

bottom side

Modular Sensor – Module Packaging R

SMD

C

module after SMD assembly before embedding [email protected]

Module realisation • module size: 12 x 12 mm² • SMD assembly on 2-layer core PCB • build-up of outer layers • SMDs embedded into top layer

stack of test modules with embedded LEDs

Modular Sensor – Realized Module Stack • modules were successfully realized • stack of sensor modules on communication & power module • basic functional tests passed Next Steps implementation of bootloader software on modules level implementation of system control software on stack level evaluation of different application scenarios sensor module stack

x-ray image [email protected]

Project WiserBAN

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Project WiserBAN Thickness of the stack  module thickness: 500µm  antenna module: 650µm  piezo+SoC+balls: 1.5mm

Antenna thickness:650µm

piezo+SoC stack with bumps: 1.5mm

Piezo:500µm

SoC:500µm

Sn3Ag0.5Cu balls to PCB

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2,15 mm

Project – Modular Micro Camera

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MoMiCa – Modular Camera Module Motivation • to develop a miniaturized camera module with integrated image processing • using PCB PLP embedding Potential Applications

traffic lane recognition [email protected]

face / gender recognition

MoMiCa – Camera Module Geometry • 16 x 16 x 3.6 mm³, weight 2 g w/o lens PCB Layers • 2 + 8 + 1 construction • 8 layer core with stacked mircrovias Embedded Components • 32 bit microcontroller with image sensor interface (CogniVue CV2201 BGA 236 ) • 256 Mbit Flash Memory (Macronix 8WSON • MOSFET switch (IRF SOIC) • USB ESD protection (NXP SOT457) • 5 DC/DC-converters (Murata) • oscillator 24 MHz (NXP • 2 LEDs (0402) • 34 capacitors (0201, 0603) • 25 resistors (0201) • 3 inductors (0603) [email protected]

Components on top • 3 MPixel Image Sensor Omnivision 3642 • lens CMT746 + lens holder • 7 capacitors (0201) • 1 resistor (0201) • 1 inductor (0603) • 1 microswitch

MoMiCa - Layer Sequence SMD Bildsensor 2 Lagen Kern Bauelemente 3 Build-up Lagen 2 Lagen Kern 3 Build-up Lagen Bauelemente Außenlage

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MoMiCa - PLP Manufacturing • manufacturing on quarter format (12" x 9") • 77 modules per panel (only partially with components) • double-side component assembly on inner layer • embedding by prepreg lamination • assembly of image sensor on top • testing and programming on panel-level

assembled components on bottom inner layer [email protected]

assembled components on top inner layer

MoMiCa – Camera Module

3 Mpixel image sensor

32 bit microcontroller

capacitor

DC/DC converter flash memory

Modular camera with integrated 32 bit image processor and memory [email protected]

Modular Microelectronics – Vision • Embedding technology opens a way over small and robust SiPs towards Modular Microelectronics • Modular Microelectronics offer much shorter design cycle times • It can simplify the realisation of complex Modular System Architecture systems by use of tested functions Modular System Software Modular System Module Stacking Embedded SiP

Embedding Technology [email protected]

The Vision: System construction as easy as Lego

Danke für Ihre Aufmerksamkeit

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