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APCPCWM_4828539:WP_0000001WP_0000001

ACRICHE LIGHTING DESIGN GUIDE - MR16 –

Solution Part

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Contents Contents

Table of contents

1. MR16 Summary – Conventional Light Source 2. LED Requirements for Replacing Conventional MR16 3. Target Setting 4. Considerations for Optical, Thermal and Electrical Selections 5. Supply Chain 6. Standard

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I.I. Summary Summary of of MR16 MR16 - Conventional Conventional Light Light Source Source 1. MR (Multifaceted Reflector) Lamp MR stands for multifaceted reflector, in which reflective material is coated uniformly on each facet of the reflector of compressed glass having a multifaceted structure. Such a facet has an optical characteristic of gathering or collecting light coming out from a filament. Some MR lamp reflectors are of a smooth, not multifaceted, structure, but they are still commonly called MR lamps. Originally MRs were developed for the light source of a slide projector, but at present they are used for direct lighting in track lighting, recessed ceiling lights, desk lamps, pendant fixtures, landscape lighting, and display lighting.

A reflector of an MR16 lamp is coated with aluminum or dichroic. In a dichroiccoated lamp, visible rays are directed to the front and infrared heat is absorbed to the back. But the aluminum-coated lamp discharges both visible rays and infrared rays to the front. Some MR16 lamps have a glass cover on the front, and this keeps fragments off when the lamp is broken.

MR lamps are different in size, which is determined according to the greatest diameter of the lamp. Most lamps known as MR lamps are MR16 lamps, in which the number 16 indicates the maximum diameter size of the outer side of the MR lamp. It is calculated to be 16/8 inches, that is, 2 inches, which means the outer diameter of the lamp is about 5 cm. For an MR8 lamp, it is 8/8 inch, which is about 2.5 cm; an MR11 lamp has a diameter of 11/8 inches, meaning it has a diameter of 3.5 cm.

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2. What are Advantages in Using MR16 Lamps? 2.1 Size The size of MR16 lamps is small. With a diameter of 2 inches (5 cm), it can be flexibly used. It can be conveniently used in a place for which spatial constraints or aesthetic considerations should be given. For example, it can be used also in a place having an aperture of 1¼ Inches (3 cm) such as a pinhole downlight. 2.2 Color temperature characteristic MR16 has color temperature from 2800K to 3200K in general, and dichroic-coated products can have temperatures higher than this, up to 4700K. This color temperature is higher than that of a common incandescent lamp. This is because the filament is compact thus resulting in a high temperature. 2.3 Color rendering index (CRI) The CRI of an MR16 lamp is 95-100. 2.4 Beam control The low-voltage filament used in MR16 lamps uses a reflector to make beam control easy. An MR16 lamp emits light at an angle from 7 degrees to 60 degrees, so it is very useful for lighting designers to design.

3. What are Disadvantages in Using MR16 Lamps? Unless MR16 lamps are used normally, dangerous things could happen, so caution should be taken in using them. 3.1 Energy efficiency characteristic Since it is not a light source having a high efficiency like a fluorescent light, it is not suitable to application for overall lighting. It is suitable to application for local lighting. 3.2 Temperature characteristics The filament temperature rises at least up to 260℃ and halogen recycling is done while it is being lighted. There is a danger of burns due to high temperature, and if it is used especially in a place such as a museum, caution is needed for items that could be damaged by heat. 3.3 Caution for handling filament If you touch the surface of a pressurized filament by hand, it could be damaged when driving the lamp.

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2. 2. LED LED Requirements Requirements for for Replacing Replacing Conventional Conventional MR16 MR16 1. MR16 Classification of ANSI ANSI Designation

Lamp Abbreviation* (wattage MR16 / Beam Angle)

BAB

20MR16/40°

ESX

20MR16/10°

EXN

50MR16/40°

EXT

50MR16/15°

EXZ

50MR16/25°

FPA

65MR16/15°

FPB

65MR16/40°

FPC

2. Nomenclature of Beam Angle by Lamp Manufacturer Beam Angle (degrees)

GE

OSRA M

SYLVANI A Philips

USHIO

7

VNSP

*

*

*

8

*

NSP

SP

*

10

*

NSP

SP

*

12

*

*

*

Narrow

13

*

*

*

Narrow

15

NSP

*

*

*

20

SP

*

*

Medium

65MR16/25°

22

*

*

*

Medium

EYC

75MR16/40°

23

*

*

*

Medium

EYF

75MR16/15°

24

*

*

NFL

Medium

EYJ

75MR16/25°

25

NFL

NFL

*

*

* Data taken from ANSI C78.379-1994 Annex B

28

*

*

*

Medium

30

NFL

*

*

*

35

*

FL

*

*

36

*

*

FL

Wide

38

*

*

FL

Wide

39

*

*

*

Wide

40

FL

FL

*

*

55

WFL

*

*

*

60

*

VWFL

WFL

Super Wide

VNSP: Very narrow spot (8 degrees or less) NSP: Narrow spot (8-15 degrees) SP: Spot (8-20 degrees) NFL: Narrow flood (24-30 degrees) FL: Flood (35-40 degrees) WFL: Wide flood (55-60 degrees) VWFL: Very wide flood (60 or more)

* Lamp manufacturer does not offer beam angle

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3. The Ways How Lighting Designers Select MR16 Lamps 3.1 Determine the beam angle and the center beam candlepower (CBCP) for obtaining necessary illuminance and lighting effect before choosing M16. (Even for MR16s of the same shape, the center beam candlepower could differ by companies and products.) 3.2 Select CCT. (Even in the products of the same companies, in reality the CCT of MR16 can have color differences.) 3.3 Colors of various light types are required according to application. It is necessary to choose according to the requirements before installing. 4. MR16 Requirements with LED-Applied 4.1 The beam angle and the center beam candlepower should be the same with those of MR16. (Determine the beam angle between 7 degrees - 60 degrees) 4.2 Should have color temperature of 2800K - 3200K and color temperature of 4200K is also necessary. 4.3 Color rendering index (CRI) should be 75 or more in Korea and 80 or more in America (based on KS, Energy Star). 4.4 Determine luminous flux per power consumption (W) referring to the following table. Actual Measurement (1H after light on)

By Specification

Manufa cturer

Power consump tion (W)

CCT (K)

1

Osram

20

2

Osram (ST)

No

3 4

Type

MR1 6

lm

Efficacy (lm/W)

Bea m angl e

CCT (K)

lm

Efficacy (lm/W)

3000

320

16

36

2848

210

10.5

35

3000

900

25.7

38

2951

310

8.9

Osram (ES)

35

3000

900

25.7

36

2911

620

17.7

Osram

50

3000

1250

25

36

2834

557

11.1

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3. 3. Target Target Setting Setting 1. Target Setting for Replacing Conventional MR16 Conventional Lamp Light Source Base

GU5.3 GU10 E11

Lifetim e [hr]

2000~ 6000

Importance

Critical

Potentially Important

Color Temp. [K]

2750~ 3050

A3 4W

AN4 4W

W

lm

lm/W

lm

lm

20

150

7.5

215(CW) 145(WW)

200

35

250

7.1

-

-

50

400

8.0

-

-

Characteristic

Unit A3 4W

AN4 4W

200(CW) 120(WW)

200

Luminous Flux

Lumens (lm)

Electrical Power consumption

Watts (W)

4W

Beam Angle

Degree

36

Lifetime

Hours

Operating temperatures

℃

Operating humidity

% RH

Color temperature

K

CRI Manufacturability Ease of installation Form factor

Residential Indoor : 25,000h Residential Outdoor: 35,000h All Commercial : 35,000h

2800-3200K 75(Korea), 80(America)

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2. How to Determine the Number of LEDs - First select lumen of the target product. - How to calculate lumen needed for LEDs to be implemented actually. Actually needed Lumens = Target Lumens/(Optical Efficiency * Thermal Efficiency) - Determine the number of LEDs. Number of LEDs = Actually needed Lumens / Lumens of LED

ex) 1. Select MR16 20W, and the Target Lumen is 150 lm. 2. Actually needed Lumens = Target Lumens/(Optical Efficiency * Thermal Efficiency) = 150 lm / (91% *85%) = 193.9 lm 3. Number of LEDs = Actually needed Lumens / Lumens of LED = 193.9 lm / 215 lm = 1 LED

(AW3220 = 215 lm)

3. Determine the Outdoor Temperature of the Heat Sink - Determine it based on the specification of KS high-efficiency equipment and materials. : LED lamp cap(base – 90 degrees, LED lamp body – 70 degrees, LED lamp luminous plane – should not exceed 60 degrees. (Ta = 25 degrees) * Reference Data - Efficiency of light, heat and electrical system System

Efficiency

Type

Optical

91%

Light

Thermal

85%

Light

Electrical

87%

Power

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4. 4. Considerations Considerations for for Thermal, Thermal, Optical, Optical, and and Electrical Electrical Selections Selections 1. Light Loss in LED 1.1 Thermal Loss In LEDs, the quantity of light drops according to junction temperature. In general, the quantity of light written on the specifications is the quantity at Tj=25 degrees, and the LED light quantity drop-down rate according to Tj is also marked on the specifications. (See Fig. 1). Therefore, the quantity of light should be calculated by considering the Tj of an LED that was actually installed in a module when manufacturing an LED lighting fixture. Ex) If Tj is measured 90 degrees after four P4 Cool White LEDs are installed, the actual quantity of light is 100l m*4ea*0.82 (Luminous efficiency at Tj=90℃) = 328 lm.

Tj=90℃, 82%

1.2 Optical Loss Most lighting equipments using LEDs use secondary optics to change the light distribution pattern. In general, the efficiency of secondary optics is 85~90%. And light is also lost by the fixture of lighting equipment such as a reflector. However, because LED lighting has a luminescence pattern which is narrower than conventional lighting such as common CFL so that the portion matching the fixture is relatively small, loss due to fixtures is less than conventional light sources.

Fig.1. Junction Temperature vs Relative Light Output

1.3 Electrical Loss Most driver efficiencies used in LED lighting equipment do not reach 100%. Because such driver efficiency has a decreasing effect on the efficacy of the overall lighting equipment, this should be considered in designing an LED lighting system. The driver efficiency is usually 80~90%, and if it is to be more than 90% the cost increases. And the efficiency of a converter differs according to output load. For lowcost driver design, an output load should be at least 50% or higher. (See Fig. 2). Fig. 2. Efficiency vs Output Load

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2. Designing the Heat Sink - Lowering Tj through heat sink can minimize the decrease of lifetime and luminous flux. - Considerations in designing the heat sink : Quality of the material of heat sink Angle, fin thickness, and gap of heat sink

Relative Light Output [%]

Example of light output according to Tj 100

Lifetime 80

Luminous flux Allowable current

60

∝

1 Tj

40

20

0 20

Pure White

40

60

80

100

120

140

It is important to lower Tj through heat sink

o

Junction Temperature, TJ [ C]

Conditions 1. Ambient temperature: 25℃ 2. Heat sink design for bulb - Ø 60 standard design 3. heat source : A3 size [ 3.4W ] 2ea Heat sink : Al6061 4. T monitor point : - heat source

Heat sink fin gap and thickness

Heat sink material

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2.1 Simulation by Quality of Material of Heat Sink - Simulation conditions: MR16 Ø 49 standard design Heat source is A3 (3.4W) 1pcs Ambient temp is 25℃

MR16

175

Heat conductivity

Junction temperature

Remarks

0.76

158.00

RTP LCP_3499-3X

1.50

138.30

-

3.00

124.10

-

5.00

116.50

-

10.00

109.20

Coolpoly_LCP_d5506

20.00

104.50

Coolpoly_LCP_e2

50.00

101.10

100.00

99.79

ALDC 12

200.00

99.08

AL 1100, Epoxy/Carbon Fiber Composite

o

Junction Temperature [ C ]

200

150

125

100

75

50 0.1

1

10

100

1000

Thermal conductivity [W/mK]

Heat conductivity : 0.76

Heat conductivity: 10

Heat conductivity: 100

Note : If material with heat conductivity of 10 w/mK or more is applied at room temperature drive conditions, the junction temperature is considered not to exceed 110 °C. In the structure of an MR16 lamp, the heat source is located in the center and the path of heat conduction is designed to be as short as possible, so the effective radiating surface is efficiently used. However, it is important to optimize interfacial conditions of the junction surface due to the polymer surface structure.

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2.2 Simulation According to the Reflector Angle of Heat Sink - Simulation conditions: MR16 Ø 49 standard design Heat source is A3 (3.4W) 1pcs 30

o

Thermal resistance [ C/W ]

Ambient temp is 25℃

PCB LED

Θ

Lens plate

with plate w/o plate 20

10

Lens plate adopted Angle

0

10

20

30

Measured point

Temperature

Temperature

Temperature

Temperature

hot source

77.7

79.6

78.8

75.4

top base

75.3

77.1

76.0

73.1

wall

73.2

75.0

73.6

71.4

inside air

57.3

61.5

59.8

59.0

ambient

25.0

25.0

25.0

25.0

angle

angle

angle

angle

Measured point

Temperature

Temperature

Temperature

Temperature

hot source

83.0

86.7

85.7

81.4

top base

80.5

84.2

82.9

79.1

wall

78.5

82.1

80.6

77.4

inside air

66.4

69.6

68.2

67.2

ambient

25.0

25.0

25.0

25.0

0 -10

0

10

20

30

40

o

angke [ ]

with plate

Lens plate not adopted

w/o plate

Note : With the increase of angle the convective heat transfer increases, so radiation efficiency increases. When the lens plate is removed, the heat transfer coefficient of the heat sink surface increases very little, but in spite of low heat resistance of P.C., the quantity of heat transferred to the lens plate is radiated from the lens surface, so it acts beneficially in terms of heat release.

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2.3 Simulation According to Fin Thickness and Clearance of Heat Sink - Simulation conditions: MR16 Ø 49 standard design Heat source is A3 (3.4W) 1pcs Ambient temp is 25℃

TYPE 1 thickness

1

1

1

1

2

2

pitch

1

3

4

5

2

4

Measured point

Temp.

Temp.

Temp.

Temp.

Temp.

Temp.

hot source

79.2

75.4

77.4

78.5

77.0

77.4

top base

76.7

72.9

74.9

75.9

74.5

74.8

wall

75.2

71.2

73.2

72.1

72.9

71.6

inside air

65.1

61.9

63.5

64.2

63.3

63.5

ambient

25.0

25.0

25.0

25.0

25.0

25.0

thickness

1

1

1

pitch

1

3

5

Measured point

Temp.

Temp.

Temp.

hot source

76.9

78.9

81.9

top base

74.4

76.4

79.3

wall

72.9

74.8

75.0

inside air

63.6

64.7

67.1

ambient

25.0

25.0

25.0

TYPE 1 fin pitch Lens plate

TYPE 2

TYPE 2

Lens plate

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o

Thermal resistance [ C/W ]

30

Type 1 Type 2 20

10

Temperature distribution

0 0

1

2

3

4

5

6

pitch [ mm ] Note : In order to increase the heat transfer quantity for fins, an increase of fin thickness is not efficient. A fin gap of 3mm is optimum for an increase of flow rate in type 1 heat sinks . In designing the upper part, it is preferable to secure the area for ensuring adequate heat transfer for the portion with no flow rate.

Flow rate distribution Conclusion: The angle of lower reflector is 30 degrees, Fin thickness is 1 mm Fin gap is 3 mm When designing the upper part, increase heat transfer area with heat sink for the part without flow rate.

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Reference: Heat characteristics by conductivity according to heat sink area and fin height 220

H=05 mm H=10 mm H=15 mm H=18 mm H=20 mm H=30 mm

o

Junction Temperature [ C]

200 180 160

Heat conductivity: 0.76 Heat distribution: 5mm fin

Heat conductivity: 0.76 Heat distribution: 30mm fin

Heat conductivity: 385 Heat distribution: 5mm fin

Heat conductivity: 385 Heat distribution: 30mm fin

140 120 100 80

By fin height 60 0.1

1

10

100

1000

Thermal Conductivity [W/mK] 220 2

900 mm 2 1600 mm 2 2500 mm 2 3600 mm 2 4900 mm

o

Junction Temperature [ C]

200 180 160 140 120 100 80

By heat sink floor area 60 0.1

1

10

100

Thermal Conductivity [W/mK]

1000

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3. Secondary Optic Design - Adjust beam angle and secure quantity of light through secondary optic. - Secondary optic considerations : Shape, beam angle and light loss when joining with LED 3.1 Secondary Optic Types and Characteristics Reflector type

Collimator type

Fresnel Lens type

3.2 Comparison Simulation Result s by Lens Type (based on A3 PKG 120 degrees) Lens type

Beam angle

10 Degree Target Efficiency

30 Degree Target Efficiency

Cost

Remarks Transparent cover need extra Additional light loss due to cover

Reflector type

81.5%

81.61%

60%(R/F) + 30%(Cover)

Collimator type

84.7%

83.52%

100%

Fresnel Lens type

74.65%

74.6%

Thin lens possible to implement

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3.2.1 Secondary Optic A3 PKG Reflector Type Simulation

1) Module type

Aluminum coating

30.0 φ mm

31.0 φ mm

14.0 mm

14.0 mm

13.0 φ mm

13.0 φ mm

Optical Efficiency: 81.50%

Optical Efficiency: 81.61%

2) Beam angle 13deg

0 30deg

0 1 .0

330

1 .0

330

30

30 0 .8

0 .8 0 .6

0 .6

300

300

60

60 0 .4

0 .4 0 .2

0 .2 0 .0

0 .0

270

270

90

90 0 .2

0 .2 0 .4

0 .4 0 .6

240

120

0 .6

240

120

0 .8

0 .8 1 .0

1 .0

210

150 180

210

150 180

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3.2.2 Secondary Optic A3 PKG Collimator Type Simulation

1) Module type

Polycarbonate 32.0 φ mm

33.3 φ mm 12.0 φ mm

14.0 φ mm 13.0 mm

8.0 mm 18.0 φ mm

18.0 φ mm

Optical Efficiency: 84.07% 2) Beam angle

Optical Efficiency: 83.52%

14deg

30deg 0

0 1 .0

330

1 .0

30

0 .8 300

0 .6

60

0 .4

0 .4

0 .2

0 .2 270

90

0 .0

0 .2

0 .2

0 .4

0 .4

0 .6

240

120

0 .8 1 .0

330

30

0 .8

0 .6

0 .0

14.0 mm

6.0 mm

0 .6

300

60

270

90

240

120

0 .8 210

150 180

1 .0

210

150 180

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3.2.3 Secondary Optic A3 PKG Fresnel Type Simulation

1) module type

18.0 mm

9.7 mm

Optical Efficiency: 74.65% 2) Beam angle

Optical Efficiency: 74.60%

14deg

30deg 0

0 1 .0

1 .0

30

330

0 .6

0 .6

60

300

0 .4

0 .4

0 .2

0 .2 270

90

0 .0

0 .2

0 .2

0 .4

0 .4

0 .6

240

120

0 .6

300

60

270

90

240

120

0 .8

0 .8 1 .0

30

0 .8

0 .8

0 .0

330

210

150 180

1 .0

210

150 180

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4 Electrical Considerations 4.1 Troubleshooting Trouble

Electrical trouble

Troubleshooting

Overvoltage

Use Zener Diode, TVS, MOV

Not lighted/Decreasing Brightness

Overcurrent

Use PTC, NTC

Dielectric breakdown

Secure Pcb pattern distance, insulation coating, instrumental method

Acriche afterglow

Acriche afterglow

Connect contact S/W, use resistance

4.2 Overvoltage Protection 4.2.1 Causes of Overvoltage : ESD (electrostatic discharge), lighting surge, transient voltage, switching of load in power circuits, etc... Item

Zener diode

TVS

MOV

Direction

Uni-directional

Bi-directional

Bi-directional

Supply voltage

DC

DC/AC

DC/AC

Response time

Tens of ps

Tens of ps

10-20 ns

Fig 1

Fig 2

Fig 3

Symbol

I-V characteristic

Application

. TVS : Transient Voltage Suppressor . MOV : Metal Oxide Varistor(Variable Resistor)

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4.2.1.1 Zener diode protection

(a) Zener diode I-V characteristic

(b) LED protective action

Fig 1. Example of zener protection - Operating principle ▪ If overvoltage is applied from power supply, overcurrent is bypassed through a zener diode due to zener yield action and regulated voltage of Vz is applied to an LED to protect the LED. ▪ Since zener diode protection is the simplest and most basic way for protecting an LED from overvoltage, it cannot protect an LED perfectly from all outside overvoltage. ->There is a need to construct additional protection circuit. - Considerations when selecting zener diode ▪ Use an element that has a Vz higher than the VF of the LED ▪ Select an element that has adequate rated voltage considering VF, IF and service voltage of the LED ▪ Select an element that has a low zener resistance for quick bypass action ▪ Select an element that has high a current density as possible if drive current of the LED is great ▪ Low leakage current

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4.2.1.2 TVS protection

(a) TVS I-V characteristic

(b) TVS clamping

(c) TVS protection circuit

Fig 2. Example of TVS protection - Operating principle ▪ A structure with a zener diode combined both ways, it is a protection element using avalanche breakdown. ▪ A bi-directional element may be used at an AC connection terminal and a DC uni-directional element may be used at a DC connection terminal. - Considerations for TVS selection ▪ Use an element that has a VBR value higher than the VF of the LED ▪ Select an element that has an adequate rated power considering VF, IF and service voltage of the LED ▪ Select an element that has a clamping voltage value (Vc) less than the breakdown voltage of the LED (If an element has a Vc of more than the LED breakdown voltage it cannot protect the LED from outside overvoltage)

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4.2.1.3 MOV protection

(a) MOV I-V characteristic

(b) MOV equivalent model

(c) MOV protection circuit

Fig 3. Example of MOV protection - Operating principle ▪ Carry out overvoltage function identical to TVS. ▪ During normal operation, it has an insulation resistance value of more than hundreds of MΩ as a capacitor, but if instantaneous overvoltage is applied, it becomes a conductor of less than tens of MΩ and bypasses overcurrent. - Considerations for MOV selection ▪ Use an element which has a VB value higher than the VF of the LED ▪ Select an element that has an adequate rated power considering VF, IF and service voltage of the LED ▪ Recommended to use to prevent inflow of current that exceeds the rated capacity of an MOV

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4.2.2 Overcurrent Protection 4.2.2.1 PTCc (Positive Temperature Coefficient) resistor protection - Operating principle ▪ An element that has a characteristic that when the temperature of the element rises the resistance value increases greatly. ▪ If a greater than rated current flows in a PTC, the resistance value increases greatly due to a self-heating action to carry out the function of suppressing overcurrent. ▪ Series connection to an LED suppresses overcurrent flowing in the LED.

(a) PTC connection

(b) Resistance-Temperature Characteristic(R-T Characteristic)

(c) Current attenuation characteristic

Fig 4. Example of PTC protection - Considerations for PTC selection ▪ Select a PTC considering maximum voltage, maximum current, and maximum Ta of the LED ▪ Select an element that has quick current suppression response time of the PTC

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4.2.2.2 NTC (Negative Temperature Coefficient) resistor protection

In-rush current level

- Operating principle ▪ Use to protect an LED from in-rush current. ▪ In-rush current can be generated during boost action of the power supply and initial power-up action, and the LED can be broken without proper protection measure. ▪ Suppress in-rush current by series connection to the LED.

(a) PTC connection

(b) In-rush current suppression characteristic

Fig 5. Example of NTC protection

- Considerations for NTC selection ▪ NTC is largely of two types of high resistance and low resistance, of which low resistance NTC is mainly used for in-rush current protection ▪ Maximum allowable current/power of NTC

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4.3 How to Reinforce Dielectric Strength 4.3.1 Cause of dielectric strength decrease When the Cu pattern of a PCB is close to the PCB edge or PCB hole, the distance to metal heat sink or metal part of the PCB becomes closer to cause electric discharge, so electric current could flow between the heat sink and terminal if a high voltage is applied. ① Discharge at PCB Edge ② Discharge at PCB hole

③ Discharge at PCB edge ( PCB Pattern ↔ PCB Metal)

(PCB Pattern ↔ Metal Heat sink)

( PCB Pattern ↔ PCB Metal)

Cu Pattern PCB Metal Wire connection PCB hole

Heat sink

PCB insulation layer Fig. 2. Illustration of coating method

Fig. 1 . Analysis of dielectric strength decrease factors 4.3.2 How to improve dielectric strength ① Keep a constant distance from a PCB edge or hole when designing the pattern of the PCB To improve dielectric strength, keep the Cu pattern of a PCB a constant distance from the PCB edge or PCB hole. A distance of at least 5mm should be maintained to obtain a result of 4kV or more, and this may be changed according to customer design specification. ② Coat a PCB with insulating material Electricity is discharged usually at the PCB edge or hole which is close to the Cu pattern, so by coating

(Coat the discharge portion with insulating material)

this portion with insulating material, dielectric strength can be improved. It is preferable to choose a material with excellent thermal endurance and chemical resistance and a material that does not generate by-products such as gas that affects an LED sealing material. (See Fig. 2). ③ Insulate heat sink by installing a PCB in a case made of insulating material Make the case with an insulating material and install a PCB in it to completely insulate the heat sink. If a material that does not discharge heat well is used, it should be designed in such a way that heat discharge can be maintained smoothly by minimizing the thickness considering Tj of the LED PKG. (See Fig. 3).

Fig. 3. Illustration of PCB Case Concept

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4.4 How to Improve on Acriche(A3) Afterglow 4.4.1 Phenomenon :Acriche lamps do not completely turn off but emit weak light when the lighting integration switch is turned off after the Acriche-applied lighting module (bulb, MR, PAR, etc.) has been installed in a building. 4.4.2 Cause :This happens when the switch is connected to the N phase in a 380Vac 3-phase 4- line wiring in a building and the case (heat sink) of the lighting module is connected to F.G. (flame ground). → In most buildings, in the case of a lighting module being connected to F.G. in the building. F. G. is connected to the N phase in most cases. → In such a case, even if the switch is off, phase voltage strays in Acriche lamps by F.G. connected to the case of the lighting module, so afterglow occurs. (Voltage straying in Acriche lamps~ 130Vac) Acriche Acriche applied applied voltage voltage test test diagram diagram

General General power power supplying supplying method method (380V (380V 3-phase 3-phase 4-line) 4-line)

잔광발생

S/W

. Phase voltage in 3-phase 4-line Y wiring – 380Vac . Voltage between phase (R, S, T) and N – 220Vac

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4.4.3 Improvement Scheme 4.4.3.1 Connect S/W to L(R) phase or connect L-N two-contact S/Ws

S/W S/W

- Connect a S/W to the L phase so that remaining voltage does not apply to the Acriche when the S/W is turned off.

- Use L-N two-contact S/Ws if it is difficult to connect a S/W to the L(R) phase

4.4.3.2 Distribute voltage remaining in Acriche using resistance

A)

B)

Increase an MCPCB insulation resistance to divide the voltage applied to the Acriche with the MCPCB insulation resistance to remove the remaining light (when the S/W is turned off). Connect Rp in parallel to both ends of the Acriche to divide the remaining voltage to remove afterglow (when the S/W is turned off). : More than several MΩ

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5. 5. SUPPLY SUPPLY CHAIN CHAIN 1. Seoul Semiconductor Supply Chain Ledlink(Taiwan) IMS(USA) Carclo(EU) Gaggione(EU) Khatod(EU) LEDIL(EU) Polymer Optics(EU)

Microblock(Taiwan)

LENS DRIVER IC

Kaieryue Electronics Technology(China) Shenzhen Likeda(China)

Microchip(USA) National Semiconductor(USA) Wai Tat Electronics(China)

Donghaw IND(Korea)

SSC

Green Optics(Korea)

Pttc(Taiwan) Fela(EU)

Sekonix(Korea)

PCB CCI(Taiwan)

Xingtongbu Technology(China)

DDP(USA)

Inno Flex(Korea)

Fujipoly(USA) Ceramtec(EU) Fischer Elektronic(EU) Jindingli(China) Yongshenkeji(China)

GK Technik(EU)

HEATSINK

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APCPCWM_4828539:WP_0000001WP_0000001

2. Supply Chain WEB Sites SOLUTION

COMPANY

WEB SITE

Microblock(Taiwan)

www.mblock.com.tw

Microchip(USA)

www.microchip.com

National Semiconductor(USA)

www.national.com

Wai Tat Electronics(China)

www.wtel.com.cn

Pttc(Taiwan)

www.pttc.com.tw

Fela(EU)

www.fela.de

GK Technik(EU)

www.elektronik-von-gk.de

Xingtongbu Technology(China)

www.toppcb.cn

Inno Flex(Korea)

www.inno-flex.co.kr

Ledlink(Taiwan)

www.ledlink-optics.com

IMS(USA)

www.imslighting.com

Carclo(EU)

www.carclo-optics.com

Gaggione(EU)

www.lednlight.com

Khatod(EU)

www.khatod.com

LEDIL(EU)

www.ledil.fi

Polymer Optics(EU)

www.polymer-optics.co.uk

Kaieryue Electronics Technology(China)

www.kaieryue.cn.alibaba.com

Shenzhen Likeda(China)

www.ledlens.cn

Donghaw IND(Korea)

www.dwled.com

Green Optics(Korea)

www.greenopt.com

Sekonix(Korea)

www.sekonix.com

CCI(Taiwan)

www.ccic.com.tw

DDP(USA)

www.datadisplay.com

Fujipoly(USA)

www.fujipoly.com

Ceramtec(EU)

www.ceramtec.de

Fischer Elektronic(EU)

www.fischerelektronik.de

Jindingli(China)

www.kitili.com

Yongshenkeji(China)

www.szyongsen.cn

DRIVER IC

PCB

LENS

HEATSINK

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6. 6. Standard Standard 1. KS Specification ▶ General Specification s– For AC LED, apply those for KSC7651(with Ballast stabilizer inside) KS C 7651 (with Ballast stabilizer inside)

KS C 7652 (with stabilizer outside)

KS C 7653 (Flush-type light fixture)

Applicability

Rated 220V 60Hz, Rated power 60W

Rated 50V or less (12V, 24V, 48V)

Rated 220V 60Hz

Initial Luminous Flux (Measure after aging100 hours)

95% or more of rated luminous flux

95% or more of rated luminous flux

95% or more of rated luminous flux

Luminous Maintenance Rate (Measure after 2000h Aging)

90% or more of initial measured value of luminous flux

90% or more of initial measured value of luminous flux

90% or more of initial measured value of luminous flux

Insulation Resistance

If 4000Vrms is applied for 1 minute

If 500Vrms is applied for 1 minute

Dielectric Strength

4MΩ or more

2MΩ or more

Power Factor

0.9 or more (more than 5W) 0.85 or more (5W or less)

0.9 or more (5W or less) 0.85 or more (5W or less)

0.9 or more (more than 5W) 0.85 or more (5W or less)

Cap Temperature

∆ts =120℃ or less (Temperature difference between lamp preparation stage and after stabilization)

∆ts =120℃ or less (Temperature difference between lamp preparation stage and after stabilization)

Suitable to KS C IEC 60598-2-2 2.8

Color Rendering Index

70 or higher

70 or higher

70 or higher

THD (Total Harmonic Wave Distribution)

According to KS C IEC61000-3-2 [*]

According to KS C IEC61000-3-2 [*]

According to KS C IEC61000-3-2 [*]

Suitable to KS C IEC 60598-2-2 2.14

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APCPCWM_4828539:WP_0000001WP_0000001

▶ KS Specification Light Efficiency Standard KS C 7651 (with Ballast stabilizer inside)

KS C 7652 (with stabilizer outside)

KS C 7653 (Flush-type light fixture)

Initial Luminous Flux (Measure after aging 100 hours)

95% or more of rated luminous flux

95% or more of rated luminous flux

95% or more of rated luminous flux

Luminous Flux Maintenance Rate (Measure after 2000h aging)

90% or more of initial measured value of luminous flux

90% or more of initial measured value of luminous flux

90% or more of initial measured value of luminous flux

Luminous Efficacy lm/W

Classification

Color Temperature

Luminous Efficacy lm/W

F 6500

6530±510

50

F 5700

5665±335

F 5000

Luminous efficacy lm/W (Should satisfy even after Initial luminous flux & 2000h aging) 10W or less

10W~ 30W

30W~ 60W

60W~ 100W

100W or more

55

50

55

60

65

70

50

55

50

55

60

65

70

5028±283

50

55

50

55

60

65

70

F 4500

4503±243

45

50

45

50

55

60

65

F 4000

3985±275

45

50

45

50

55

60

65

F 3500

3465±245

45

50

45

50

55

60

65

F 3000

3045±175

40

45

40

45

50

55

60

F 2700

2725±145

40

45

40

45

50

55

60

▶ Based on high-efficiency equipment light efficiency Items

5W or less

More than 5W and 10W or less

More than 10W and 15W or less

Super Luminous Flux

Should be Luminous Efficacy(lm/W) × Indicated input power (W) or more

Luminous Flux Maintenance Rate

90% or more of initial luminous flux

Luminous Efficacy

50 lm/W

55 lm/W

58 lm/W

Power Factor

0.9 or more

Total Harmonic Wave Distribution

40% or less

Color Rendering Index

75 or more

More than15W

60 lm/W

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2. Energy Star ▶ General Specification Conditions

Standards

Minimum Light Output

It should be at least 125lm per lineal foot and is computed with an equation as follows. (1ft=12inch)

Color Spatial Uniformity

In omnidirectional pattern on average CIE coordinates within 0.004 (based on CIE1976 u`v` coordinates)

Color Maintenance

Within coordinate change 0.007 in lifetime (based on CIE1976 u`v` coordinates)

Power Factor

Residential≥0.7

Commercial≥0.9

Output Operating Frequency

≥120Hz

Color Rendering Index (CRI)

Min75 (Indoor luminaires)

Lumen Depreciation of LED Light Sources(L70)

Residential Indoor : 25,000h Residential Outdoor: 35,000h All Commercial : 35,000h

▶ CIE 4500K & 5700K are added so as to make it possible to use the empty portion in CCT based on the conventional fluorescent lamp. Framed in quadrangles to overlap with 7-step MacAdam ellipses of CFL. Condition

CCT (Correlated Color Temperature)

Standard Nominal CCT (Fluorescent lamp)

CCT(K)

2700K

2725 ± 145

3000K

3045 ± 175

3500K

3465 ± 245

4000K

3985 ± 275

4500K

4503 ± 243

5000K

5028 ± 283

5700K

5665 ± 355

6500K

6530 ± 510