2016-03-07
High Power Infrared Emitter (850 nm) Version 1.7 / acc. to OS-PCN-2015-025-A
SFH 4258S
Features: • High Power Infrared LED • Double Stack emitter • Half angle: ± 15° • High forward current allowed at high temperature • The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Automotive Grade Discrete Semiconductors. Applications • Industrial applications • Infrared Illumination for cameras • IR data transmission • Sensor technology • Automotive technology Notes Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471.
Ordering Information Type:
Radiant Intensity
Ordering Code
Ie [mW/sr] IF=100 mA, tp=20 ms SFH 4258S Note:
185 (≥ 80)
Q65111A1158
Measured at a solid angle of Ω = 0.01 sr
2016-03-07
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Version 1.7 / acc. to OS-PCN-2015-025-A
SFH 4258S
Maximum Ratings (TA = 25 °C) Parameter
Symbol
Values
Operation and storage temperature range
Top; Tstg
-40 ... 100
°C
Reverse voltage
VR
5
V
Forward current
IF
100
mA
Surge current (tp ≤ 300 µs, D = 0)
IFSM
0.7
A
Power consumption
Ptot
245
mW
ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)
VESD
2
Thermal resistance junction - ambient 1) page 12
RthJA
300
K/W
Thermal resistance junction - soldering point
RthJS
140
K/W
2) page 12
Unit
kV
Characteristics (TA = 25 °C) Parameter
Symbol
Values
Unit
Peak wavelength (IF = 100 mA, tp = 20 ms)
(typ)
λpeak
860
nm
Centroid wavelength (IF = 100 mA, tp = 20 ms)
(typ)
λcentroid
850
nm
Spectral bandwidth at 50% of Imax (IF = 100 mA, tp = 20 ms)
(typ)
∆λ
30
nm
Half angle
(typ)
ϕ
± 15
Dimensions of active chip area
(typ)
LxW
Rise and fall time of Ie ( 10% and 90% of Ie max) (IF = 100 mA, RL = 50 Ω)
(typ)
tr, tf
Forward voltage (IF = 100 mA, tp = 20 ms) Forward voltage (IF = 700 mA, tp = 100 µs)
2016-03-07
mm x mm
15
ns
(typ (max)) VF
3.1 (≤ 3.6)
V
(typ (max)) VF
4 (≤ 5.2)
V
Reverse current (VR = 5 V) Total radiant flux (IF= 100 mA, tp=20 ms)
0.3 x 0.3
°
(typ)
2
IR
not designed for reverse operation
µA
Φe
115
mW
Version 1.7 / acc. to OS-PCN-2015-025-A
Parameter
SFH 4258S
Symbol
Values
Unit
Temperature coefficient of Ie or Φe (IF = 100 mA, tp = 20 ms)
(typ)
TCI
-0.5
%/K
Temperature coefficient of VF (IF = 100 mA, tp = 20 ms)
(typ)
TCV
-2
mV / K
Temperature coefficient of wavelength (IF = 100 mA, tp = 20 ms)
(typ)
TCλ
0.3
nm / K
Grouping (TA = 25 °C) Group
Min Radiant Intensity
Max Radiant Intensity
Typ Radiant Intensity
IF=100 mA, tp=20 ms
IF=100 mA, tp=20 ms
IF = 700 mA, tp = 25 µs
Ie, min [mW / sr]
Ie, max [mW / sr]
Ie, typ [mW / sr]
SFH 4258S-V2
80
125
540
SFH 4258S-AW
100
200
795
SFH 4258S-BW
160
320
1270
SFH 4258S-CW1
250
400
1720
Note:
measured at a solid angle of Ω = 0.01 sr Only one group in one packing unit (variation lower 2:1).
2016-03-07
3
Version 1.7 / acc. to OS-PCN-2015-025-A Relative Spectral Emission 3) page 12 Irel = f(λ), TA = 25°C
Radiant Intensity 3) page 12 Ie / Ie(100 mA) = f(IF), single pulse, tp = 25 µs, TA= 25°C
OHF04132
100
SFH 4258S
OHF05698
101
I rel %
Ιe
Ι e (100 mA)
80
100
60 10-1
40
10-2
20
0 700
750
800
850
10-3 0 10
nm 950
λ
IF
102
mA 103
IF Forward Current 3) page 12 IF = f(VF), single pulse, tp = 100 µs, TA= 25°C
Max. Permissible Forward Current IF, max = f(TA), RthJA = 300 K / W, RthJS = 140 K / W OHF05696
120 mA
101
IF
OHF05562
103 mA
100
102
80
R thJA
R thJS
60
101
40
20
0
2016-03-07
0
20
40
60
100
80 ˚C 100 TA , TS
2
3
4
V
VF
4
5
Version 1.7 / acc. to OS-PCN-2015-025-A
Permissible Pulse Handling Capability IF = f(tp), TA = 25 °C, duty cycle D = parameter
IF
SFH 4258S
Permissible Pulse Handling Capability IF = f(tp), T A = 85 °C, duty cycle D = parameter
OHF05697
0.8 A
t
D = TP
0.7
IF
0.3 0.2
IF T
0.60 0.55 0.50 D= 0.45 0.005 0.01 0.40 0.02 0.35 0.05 0.30 0.1 0.2 0.25 0.5 0.20 1 0.15 0.10 0.05 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102
D= 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1
0.4
t
tP
D = TP
T
0.6 0.5
OHF04491
0.75 IF A
tP
0.1 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102
tp
tp
Radiation Characteristics 3) page 12 Irel = f(ϕ), TA= 25°C 40˚
30˚
20˚
10˚ ϕ
50˚
OHL00021
0˚ 1.0
0.8
0.6 60˚ 0.4 70˚ 0.2 80˚ 0
90˚ 100˚ 1.0
2016-03-07
0.8
0.6
0.4
0
20˚
5
40˚
60˚
80˚
100˚
120˚
Version 1.7 / acc. to OS-PCN-2015-025-A
SFH 4258S
Package Outline 3.8 (0.150) max.
3.0 (0.118) 2.6 (0.102) 2.3 (0.091)
2.1 (0.083) 1.7 (0.067)
2.1 (0.083)
0.9 (0.035)
0.8 (0.031) 0.6 (0.024)
0.7 (0.028)
1.1 (0.043)
1
Package marking
0.18 (0.007)
ø2.55 (0.100)
ø2.60 (0.102)
0.1 (0.004) typ
0.5 (0.020)
3.7 (0.146) 3.3 (0.130)
3.4 (0.134) 3.0 (0.118) 2
4˚±1
4 (2.4) (0.095)
3
0.6 (0.024) 0.4 (0.016)
0.13 (0.005) GPLY6127
Dimensions in mm (inch).
Pinning Pin
Description
1
Cathode
2
Anode
3
Anode
4
Anode
Package Power TOPLED with Lens Approximate Weight: 35 mg
2016-03-07
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Version 1.7 / acc. to OS-PCN-2015-025-A
SFH 4258S
Recommended Solder Pad
Dimensions in mm.
Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01 OHA04525
300 ˚C
T 250
Tp 245 ˚C
240 ˚C
tP
217 ˚C 200
tL
150
tS
100
50 25 ˚C 0
0
50
100
150
200
250
s 300
t
2016-03-07
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Version 1.7 / acc. to OS-PCN-2015-025-A
Profil-Charakteristik Profile Feature
Symbol Symbol
Pb-Free (SnAgCu) Assembly Minimum
)
Ramp-up Rate to Preheat* 25 °C to 150 °C Time tS TSmin to TSmax
tS
SFH 4258S
60
Ramp-up Rate to Peak*) TSmax to TP
Recommendation
Maximum
2
3
100
120
2
3
Einheit Unit K/s s K/s
Liquidus Temperature
TL
217
Time above Liquidus temperature
tL
80
100
s
Peak Temperature
TP
245
250
°C
Time within 5 °C of the specified peak temperature TP - 5 K
tP
20
30
s
3
4
K/s
10
Ramp-down Rate* TP to 100 °C
480
Time 25 °C to TP All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
Taping
Dimensions in mm.
2016-03-07
°C
8
s
Version 1.7 / acc. to OS-PCN-2015-025-A
SFH 4258S
Tape and Reel 12 mm tape with 2000 pcs. on ∅ 180 mm reel W1 D0
P0
A N
F W
E
13.0 ±0.25
P2
Label
P1 Direction of unreeling
Direction of unreeling
W2
Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324
Tape dimensions [mm] Tape dim ensions in m m
W
P0
12 + 0.3 / - 0.1 4 ± 0.1
P1
P2
D0
E
F
4 ± 0.1 or 8 ± 0.1
2 ± 0.05
1.5 ± 0.1
1.75 ± 0.1
5.5 ± 0.05
Reel dimensions [mm] Reel dim ensions in m m
A
W
Nmin
W1
W2max
180
12
60
12.4 + 2
18.4
Barcode-Product-Label (BPL) OSRAM Opto
EX A
RoHS Compliant
(6P) BATCH NO: 1234567890
(1T) LOT NO: 1234567890
BIN1: XX-XX-X-XXX-X
LX XXXX
Semiconductors
MP
ML Temp ST X XXX °C X
(9D) D/C: 1234
Pack: RXX
LE
DEMY
XXX
X_X123_1234.1234 X
(X) PROD NO: 123456789(Q)QTY:
9999
(G) GROUP:
XX-XX-X-X
OHA04563
2016-03-07
9
Version 1.7 / acc. to OS-PCN-2015-025-A
SFH 4258S
Dry Packing Process and Materials
Moisture-sensitive label or print Barcode label
L VE el
LE
see lab e
If
nk, bla cod bar
y
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(R .
dit mi hu e ve ed ag ati
RH % /60 ˚C
rar ck rel 30 N s VE RS inf pa % ainITI TO of to ak 90 d ntNSUC < ns (pe TIO or d , cte itio U g coSEND an bje ing ˚C nd 5 ˚C su ss CO Ais baRE co ± ce y 40 be TU MI CThIS ˚C < tor ll pro SE _
, Mo se ure 3 is or . , is ha se Mo istist nk be nk rd g -03 Mo in n Flo r-p RH g, bla Mo ba TD po If blathi % kin Ca life s (if ar t. wi 10 ba tor J-S thi, va p. elf Ye ar ks _ < e icat me , C 1 Ye ee urs Sh terlow tem ted at ed uir > 1 W Ho un Af Indno uir DE 1. d e 4 8 ref dy reqy is 2. JE bo e Mo ore tim 16 req : C/ e es dit2b a) St tim or mi IP ed or g is tim e vic b) or e Hu Flo en tim or De 2a kin nc te Flo a) op or 3. b) baere Flo da e l 1 2 Flo If al ref tim ve l 4. se d l 2a3 ve Le g an ve l Le Ba te ure Le ve ure Le ist Da ure ist Mo ist ure Mo ist Mo Mo
MO TO OP
M RA OS
Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Comparator check dot
WET
If wet, examine units, if necessary bake units
15%
If wet, examine units, if necessary bake units
10% 5%
If wet, parts still adequately dry. change desiccant Humidity Indicator MIL-I-8835
AM OSR
Desiccant
OHA00539
Note: Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card. Regarding dry pack you will find further information in the internet. Here you will also find the normative references like JEDEC.
Transportation Packing and Materials
Barcode label
Y M DE
18
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99 8
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21
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TC BA
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(6
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Muster
:
34 : NO PR O ) (X
Packing Sealing label
Dimensions of transportation box in mm Width
Length
Height
195 ± 5
195 ± 5
30 ± 5
2016-03-07
M
RA
OS
D
5 14 2 110 0
(Q
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12 3G
TC
(6
P)
NO : 12 LO (1
T)
T
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: NO PR OD )
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Barcode label
10
OHA02044
Version 1.7 / acc. to OS-PCN-2015-025-A
SFH 4258S
Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered.
2016-03-07
11
Version 1.7 / acc. to OS-PCN-2015-025-A
SFH 4258S
Glossary 1)
Thermal resistance: junction -ambient, mounted on PC-board (FR4), padsize 16 mm2 each
2)
Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block)
3)
Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.
2016-03-07
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Version 1.7 / acc. to OS-PCN-2015-025-A
Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.
2016-03-07
13
SFH 4258S
