Design & Verification Challenges for 3G/3.5G/4G Wireless Baseband MPSoCs

Michael Speth Herbert Dawid Frank Gersemsky Infineon Technologies AG Duisburg, Germany

Outline „ challenges of 3G / 4G modem design †

data throughput

†

latency

†

configurability

„ wireless standards: a nightmare for system verification „ keys to success: †

architecture

†

methodology

†

team-setup

03.07.2008

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State of the Art Cellphone Platform Focus: Digital Baseband

„ A Heterogeneous Application Specific Multi-Processor SoC 03.07.2008

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Example: Infineon MP-EH Platform

Customer Demands: 1. Functionality 2. Platform BOM 3. Power Consumption

03.07.2008

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Why Dedicated Wireless MPSoCs? „ Thought Experiment: Modern digital cellular baseband ¬ 20 GOPs peak signal processing demand (active) ¬

0 GOPs computational demand (standby, paging)

¬ State of the art battery with 1400 mAh capacity

„ What if we use 2 general purpose processors (like the ones in your desktop PC), assuming they would be powerful enough? ¬ 60 W peak power consumption ¬ 20 W standby power consumption

„ Result †

Active Time: 40 s

†

Standby Time: 30 min

„ We are building SoCs which are 100-1000x more energy efficient than state of the art GP processors and at the same time more efficient, faster, smaller and cheaper 03.07.2008

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Throughput

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Wireless Data Rate Evolution

NOMADIC/WLAN MAN / LAN / PAN

109

UWB 802.lln

! s h t on LTE

802.llag 802.llb Bluetooth

ng i l b Dou

Bits per second

106

M 6 1 ry E ve HSDPA UMTS

GSM

4G

3G

2G

Broadband Multimedia, Broadcast Video, High-Speed Packet Data

Multimedia Messaging, Medium-Speed, Packet Data

Digital Voice

CELLULAR

1 1992 03.07.2008

1996

2000

2004

2008

2012

Source: C. Drewes, Infineon Page 7

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How to Address the Challenge „ “Shannon beats Moore” †

Increasing gap between chip technology and throughput requirements

„ Architecture + Algorithm †

2G: DSP Centric Architectures

†

3.XG: + Dedicated HW Centric Architectures

†

4G

: + More Efficient Transmission Technology (OFDM) Throughput requirements are extremely tough but can be met with state of the art architectures + methodology

03.07.2008

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Latency Requirements

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03.07.2008

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Network Modem Interaction Network View Radio Network Controller

Radio Network Controller

Base Stations

MRC

MRC

Closed Loop Transmit Diversity

03.07.2008

Highly advanced Signal Processing Algorithms plus Radio Link Adaptation and fast Scheduling Copyright © Infineon Technologies 2008. All rights reserved.

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Network Modem Interaction Digital Baseband Architectural View

3G Tx Framing & Channel Coding

3G Tx Modulator

3G RF Frontend

HSUPA HARQ DL Power Control HSUPA E-DCH E-TFC Selection HSDPA HARQ(ACK/NACK) (ACK/NACK) & CQI Intra-Frequency Measurements Modem Core SW Layer 1 Schedulers, FSMs, Drivers Physical Layer Re-Config Layer 2/3 Stack (MAC, RLC, RRC) Cell Search

AGC

Transport Channel Reconfig Soft Handover

Sync.

Layer 1 Schedulers, FSMs, Drivers

Delay Profile Estimation

TFCI 3G Inner Receiver

Data

L1 Config/Ctrl

3G Outer Receiver

System Information/Higher Layer Ctrl

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Example: 3G Power control Slot (2560 chips)

DL DPCCH at UTRAN

PILOT

T TF P CI C

Data1

Data2

Propagation delay DL-UL timing offset (1024 chips)

DL DPCCH at UE

PILOT

Data1

PILOT

T Data1 P C

Response To TPC (*3)

T TF P CI C

Data2

PILOT

Data1

T P C

512 chips DL SIR measurement (*1)

UL DPCCH at UE

PILOT

Response to TPC

TFCI

TPC

PILOT

Slot (2560 chips) Propagation delay

UL DPCCH at UTRAN *1,2

PILOT

UL SIR measurement (*2)

TFCI

TPC

PILOT

The SIR measurement periods illustrated here are examples. Other ways of measurement are allowed to achieve accurate SIR estimation. If there is not enough time for UTRAN to respond to the TPC, the action can be delayed until the next slot.

„ Latency + Reconfiguration dominates system architecture *3

„ Deterministic Scheduling is a must „ System Requirements must be known to the deepest detail 03.07.2008

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System Configurability

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Example: UMTS TX

TX accounts only for a few percent of silicon area + functionality

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TX Processing for UMTS Rel. 6 FW Config

extremely timing critical RX / TX interaction

Coding + Interleaving ~ 300 Parameters frame/subframe

source

coding

Modulation

Modulator: ~ 70 Parameters frame / slot Copyright © Infineon Technologies 2008. All rights reserved.

03.07.2008

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System Configurability „ 3G Transmitter: †

Well defined serial bit processing

†

But: parameter flow can exceed data-flow

„ 3G Receiver: much much more complicated †

Multiple Base Stations, Soft Handover, Transmit Diversity

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Multiple Rake Fingers, Receive Diversity

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Complex Reconfigurations

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Additional Neighbor Cell BCH

„ No exhaustive test possible „ Even minimum testing leads to thousands of complex test-cases 03.07.2008

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System Development and Bringup SW integration

HW issues SW issues Algorithm issues

Chip Developement

System Bringup

IOT

Live Network

„ Exhaustive verification impossible „ Flexibility required for very late changes 03.07.2008

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Architecture

03.07.2008

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System Design Paradigms System Predictability Static real-time scheduling based on Worst Case Execution Times (WCETs) Limited HW-SW Interaction

Localized Functionality „Divide „Divide and and Conquer: Conquer: Cluster Cluster Functionality Functionality Æ Æ Æ Æ Æ Æ Æ Æ

„HW-SW „HW-SW Split: Split: Encapsulate Encapsulate Functionality Functionality in in HW HW Æ HW-SW Æ HW-SW Interface Interface Natural Natural Boundary Boundary for for Function Function Clusters Clusters Æ Latency Æ Latency Critical Critical Paths Paths in in HW HW Æ Simplified Æ Simplified SW SW Scheduling Scheduling Æ No Æ No Critical Critical HW-SW HW-SW Interactions Interactions

Self-Contained Self-Contained HW HW && FW FW Blocks Blocks Localized Localized Functionality, Functionality, Lean Lean Interfaces Interfaces Simplified Simplified Integration Integration && Verification Verification Sometimes Sometimes Extra Extra HW HW Needed Needed

„Configuration „Configuration Granularity: Granularity: UMTS UMTS Slot Slot (667 (667 µs) µs) and and Frame Frame (10 (10 ms) ms) Boundaries Boundaries Æ Æ

Performance vs Complexity

Simplified Simplified Verification Verification

Flexibility Where Needed „Algorithm „Algorithm Design: Design: Robust Robust and and “As “As Good Good As As Needed” Needed”

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03.07.2008

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Digital Baseband Detailed Architecture RAM/ ROM

µC (RTOS, Layer 1 SW + Protocol Stack)

Control Bus System IRQ IRQ IRQ

P

P

Chip Control HW Peripherals

Interface Bus Bus Interface Bus Interface

Reset Reset

Reset

Signal Processing Signal Processing Signal Processing HWHWHW Peripherals/DSPs Peripherals/DSPs Peripherals / DSPs / ASIPs Data Path Bus RAM

Separate functionality into autonomous subsystems 03.07.2008

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System Architecture Concept “System View“ Required (Cross-Layer, -Functional, -Disciplinary)

„ split up development in parallel streams †

one team for each HW-Processing element

†

cross-functional setup

CE HW

FW CV

„ system level oriented flow for each sub-component: Compliance & IOT

Platform

Requirements Concept/Algorithm Design

System Integration

VP

HW/SW Architecture

Concurrent Development

HW/SW Integration

SW Design

Fine Architecture & VP Model RTL Design

Production Test Synthesis & Layout

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Team & Project Setup SW & FW Development

Architecture & Algorithm Design

Chip Development & Verification interdisciplinary interdisciplinaryteams: teams: „„ Concept & Algorithms Concept & Algorithms „„ HW HWdevelopment development „„ SW development SW development „„ System Systemverification verification 03.07.2008

joint responsibility

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„„ „„ „„ „„

Block Blocklevel leveldesign design&&verif. verif. Architecture refinement Architecture refinement HW/FW HW/FWcodesign codesign System integration System integration Page 22

Methodology

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Key Methodology: Virtual Prototype SW developers early SW integration on virtual hardware no pcb-limitation

VP

System architects explore/evaluate chip architectures by simulation

System testers early availability sophisticated debugging features no pcb-limitation

HW designers reference for verification (Executable Specification)

early proof of concept 03.07.2008

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Methodology: Bridging Levels of Abstraction 3GPP standard

test / regression system verification

verification

fast HW model

algo model

Test Config

VP

verification

verification code generation

code generation

SW

HW model interface description Copyright © Infineon Technologies 2008. All rights reserved.

03.07.2008

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Methodology „ VP is the essential vehicle for system integration and verification „ Integrated tool landscape to provide maximum reuse „ Seamless transition between different levels of abstraction „ Platform for cross-functional team interaction „ Provide uniform touch-and-feel throughout all project phases

system architecture

methodology

team setup / processes 03.07.2008

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Conclusion „ Wireless SoC design is one of the biggest challenges in the industry „ Greatest challenge: †

System reconfigurability

†

Latency critical loops

†

Not data-throughput

„ Success requires a system-level approach: †

Exhaustive and detailed system knowledge

†

Interdisciplinary teams

†

Integrated design and verification flow

03.07.2008

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