45 Yellow LED Lamp

PART NO.: EOQ-HNYTDD0-KK Part Description: Through Hole 5Ø 105°/45° Yellow LED Lamp PART NO.: EOQ-HNYTDD0-KK Features Applications ■ Oval Shape ...
Author: Millicent Cross
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PART NO.: EOQ-HNYTDD0-KK

Part Description: Through Hole 5Ø 105°/45° Yellow LED Lamp

PART NO.: EOQ-HNYTDD0-KK

Features

Applications

■ Oval Shape Package ■ Wide Viewing Angle:

■ Indoor/Outdoor Applications ■ Full Color Signs

major axis 105° minor axis 45°

■ Variable Message Signs

■ High brightness AlInGaP LED ■ UV Resistant Epoxy ■ Pb free & RoHS Compliant Product

Package Dimension Notes: 1. All dimensions are in millimeter. 2. Tolerance is ±0.20mm unless otherwise noted. 3. Protruded resin under flange is 1.5mm max. 4. Lead spacing is measured where the leads emerge from the package.

Lens Color

Beam Color

Yellow Yellow Diffused

Leadframe Material

Stand Off

Flange

Iron base

Yes

No

Beam Pattern 0° 30°

30°

60°

100% 75%

60°

50%

25%

0%

25%

50%

75% 100%

I v (%)

Spec No.: A-Q-317-00 Date: 2010/8/3 Ver.: A-00

Tel: 886-3-5679000 Fax: 886-3-5679999

http://www.eoi.com.tw/ E-mail: [email protected]

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PART NO.: EOQ-HNYTDD0-KK

Absolute Maximum Ratings at TA = 25°C Parameter

Symbol

Max.

IF

50 100

Average Forward Current[a] [c] Peak Forward Current[b] Reverse Voltage Power Dissipation Current Linearity vs. Ambient Temperature LED Junction Temperature Operating Temperature Range[c] Storage Temperature Range Lead Soldering Condition [3mm(.118”) away from epoxy]

Unit

mA mA 5 V 120 mW - 0.72 mA/℃ 125 ℃ -40℃ ~ +100℃ -40℃ ~ +100℃

I peak VR PD TCI TJ T OPR T STO T SOL

260℃ / 5 seconds

Notes : [a] Design of heat dissipation should be considered. Notes : [b] Duty Ratio=1/10, Pulse Width=0.1ms. Notes : [c] The allowable operating current at different operation temperature, please take reference from Fig. 4 page 4.

Electrical and Optical Characteristics at TA = 25°C Parameter

Symbol

Min.

Typ.

Max.

Unit

Test Condition

Iv

1135

2500

---

mcd

IF=20mA

2θ1/2

---

105/45

---

Deg

IF=20mA

Dominant Wavelength

λD

585

589

595

nm

IF=20mA

Spectral Half Width

△λ

---

25

---

nm

IF=20mA

Forward Voltage

VF

1.8

2.0

2.4

V

IF=20mA

Reverse Current

IR

---

---

10

µA

VR=5V

Luminous Intensity Viewing Angle

Rank Combination Dominant Wavelength λD (nm) @IF=20mA min 585 587 589 591 593

max 587 589 591 593 595

Code YC YD YE YF YG

Luminous Intensity Iv (mcd) @IF=20mA min 1135 1590 2225 3115 -

max 1590 2225 3115 4360 -

Code 0S* 0T 0U* 0V* -

Forward Voltage VF (v) @IF=20mA min 1.8 2.0 2.2 -

max 2.0 2.2 2.4 -

Code A B C -

Note:1. All of rank combinations which include luminous intensity, dominant wavelength, and forward voltage will be included in every shipment. 2. Measurement Uncertainty of the Luminous Intensity: ±15% 3. Measurement Uncertainty of the Dominant Wavelength: ±1nm 4. Measurement Uncertainty of the Voltage: ±0.05V 5. [*] Bin with less distribution Spec No.: A-Q-317-00 Date: 2010/8/3 Ver.: A-00

Tel: 886-3-5679000 Fax: 886-3-5679999

http://www.eoi.com.tw/ E-mail: [email protected]

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PART NO.: EOQ-HNYTDD0-KK

Typical Electrical / Optical Characteristics Curves ( 25℃ Ambient Temperature Unless Otherwise Noted )

IF (mA)

250 Relative Luminous Intensity

100 80 60 40 20

V F (v)

0 1.6

2

2.4

2.8

3.2

200 150 100 50 IF (mA) 0 0 10 20 30 40 50 Fig.2 Luminous Intensity vs. Forw ard Current

3.6

Fig.1 Forw ard Current vs. Forw ard Voltage -50

-40

-30

-20

-10

(%)

0

60

0 V R (V)

IF(mA)

50 -10 40 -20

30 20

-30

10

-40

TA ( ℃ )

0 Fig.3 Reverse Current vs. Reverse Voltage

-50 IR ( μ A)

0 20 40 60 80 100 120 Fig.4 Allow able Forw ard Current vs. Ambient Temperature

(%) 200

100

50

20

TA ( ℃ )

10

Fig.5 Fig.5Luminous LuminousIntensity Intensity at atIF=20mA I =20mA vs. vs. Ambient Ambient Temperature Temperature F

Relative Luminous Intensity(%)

100

50

(nm) 0 350

400

450

500

550

600

650

700

750

800

850

900

950

1000

Fig 6. Relative Luminous Intensity vs. Wavelength

Note: The data shown above are typical curves. Every LED component may have some variations of characteristics. Spec No.: A-Q-317-00 Date: 2010/8/3 Ver.: A-00

Tel: 886-3-5679000 Fax: 886-3-5679999

http://www.eoi.com.tw/ E-mail: [email protected]

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PART NO.: EOQ-HNYTDD0-KK

Reliability Test EOI’s LED lamps are checked by reliability test based on MIL standards. 1. Test Conditions, Acceptable Criteria & Results: Classification

Test Item

Life Test

Operation Life Test (OLT)

Test Conditions

Duration Unit

Acc / Rej Result Criteria

MIL-STD-750D TA=25℃,IF =30mA * Method 1026.3

1000 Hrs

100

0/1

Pass

High Temperature Storage (HTS)

MIL-STD-750D TA=100℃ Method 1032.1

1000 Hrs

100

0/1

Pass

Low Temperature Storage (LTS)

MIL-STD-750D TA=-40℃ Method 1032.1

1000 Hrs

100

0/1

Pass

MIL-STD-750D TA=85℃,Rh=85% Method 103B IF =20mA **

500 Hrs

100

0/1

Pass

100 cycles

100

0/1

Pass

MIL-STD-750D -40℃ ~ 25℃~ 100℃ ~ 25℃ Method 1051.5 30min 5min 30min 5min

100 cycles

100

0/1

Pass

Solderability

MIL-STD-750D 235±5℃,5 sec. Method 2026.4

1 time

20

0/1

Pass

Resistance to Soldering Heat

MIL-STD-750D 260±5℃,5 sec. Method 2031.1

1 time

20

0/1

Pass

Lead Integrity

MIL-STD-750D Load 2.5N (0.25kgf) Method 2036.3 0°~ 90°~ 0°,bend

3 times

20

0/1

Pass

Environment Temp. & Humidity with Bias (THB) Test Thermal Shock Test (TST) Temperature Cycling Test (TCT)

Mechanical Test

Standard Test Method

MIL-STD-750D Method 1056.1

0℃ 2min

~

100℃ 2min

Remark:(*) IF =30mA for AlInGaP chip;IF =20mA for InGaN chip (**) IF =20mA for AlInGaP chip;IF =10mA for InGaN chip

2. Failure Criteria (TA =25℃): Test Item

Symbol

Test Conditions

Luminous Intensity

IV

IF =20 mA

Forward Voltage

VF

IF =20 mA

Criteria for Judgment Min.

Max.

LSL×0.7 ** USL×1.1

*

(*) USL : Upper Standard Level, (**) LSL : Lower Standard Level

Spec No.: A-Q-317-00 Date: 2010/8/3 Ver.: A-00

Tel: 886-3-5679000 Fax: 886-3-5679999

http://www.eoi.com.tw/ E-mail: [email protected]

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PART NO.: EOQ-HNYTDD0-KK

Bulk Package

Label

A nt i- st a tic/ an ti -c or ro si on b ag

H : 200mm L : 180mm PCS/BAG 3.0/4.0/5.0mm: >7.5mm : >10mm :

500pcs 400pcs 250pcs

Label Ba g

Corrugated paper box (3 la ye r s) H : 140mm L : 350mm W : 260mm PCS/INNER BOX 3.0/4.0/5.0mm:10,000pcs >7.5mm : 4,000pcs >10mm : 2,500pcs

In ner Bo x

Corrugated paper box (5 l ay er s) H : 320mm L : 380mm W : 280mm PCS/OUTER BOX 3.0/4.0/5.0mm:20,000pcs >7.5mm : 8,000pcs >10mm : 5,000pcs O ute r B ox

l abe l Customer P.O .N o. Par t N o.

Bin C ode

Q 'ty(P CS)

Label Total

Spec No.: A-Q-317-00 Date: 2010/8/3 Ver.: A-00

Tel: 886-3-5679000 Fax: 886-3-5679999

http://www.eoi.com.tw/ E-mail: [email protected]

-

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PART NO.: EOQ-HNYTDD0-KK

Taping Package

PACKING SPECIFICATIONS

(TT-0003)

ANODE

Feeder Direction

(Tape & Reel, Ammo Pack are available)

(Maximum 10 inner boxes in one outer box)

‧ ‧ ‧ ‧ ‧ ‧ ‧ ‧ ‧ ‧ ‧ ‧ ‧ ‧

Item

Symbol

Tape Feed Hole Diameter Component Lead Pitch Front To Rear Deflection Feed Hole To Bottom Of Component Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location Total Tape Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width

D F △h H1 H2 L P P1 P2 T W0 W1 W2 W3

Specification Minimum Maximum mm inch Mm inch 3.8 0.149 4.2 0.165 2.34 0.092 2.74 0.108 --2.0 0.078 19.0 0.709 21.0 0.787 --32.00 1.260 W0 11.0 0.433 12.4 0.488 13.0 0.511 4.4 0.173 5.8 0.228 5.05 0.198 7.65 0.301 --1.4 0.056 8.5 0.334 9.50 0.374 12.0 0.472 14.0 0.551 --4.0 0.157 17.5 0.689 19.0 0.748

label

Inner Box Corrugated paper box(3 layers) H : 250mm L : 330mm W : 50mm PCS/INNER BOX 3mm :2,500pcs 4/5mm :2,000pcs >7.5mm :1,000pcs

label

Outer Box

Note: Several standard types of taping package are available. Please contact with our salesman to get detail information. Spec No.: A-Q-317-00 Date: 2010/8/3 Ver.: A-00

Corrugated paper box(5 layers) H : 290mm L : 520mm W : 360mm PCS/OUTER BOX 3mm  :25,000pcs 4/5mm :20,000pcs > 7.5mm:10,000pcs

Tel: 886-3-5679000 Fax: 886-3-5679999

http://www.eoi.com.tw/ E-mail: [email protected]

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PART NO.: EOQ-HNYTDD0-KK

Precaution of Application 1. Circuit layout Due to the forward voltage of LED will vary with temperature and its driving current, the current- limited protective circuit should be considered in the LED circuit design. When LEDs are arrayed as parallel circuit, different inherent resistance of LED will cause unbalance current. The unbalanced driving current which exists in every parallel circuit may make LED to be driven at different power. Therefore, the LED driven at higher power may be damaged by over driving current, and the LED driven at lower power may be dimmer than the others. To solve this situation, a suitable resistor is recommended to put in series with each LED circuit. The resistor will limit and balance the driving current which flow through every parallel circuits.

2. Electric Static Discharge (ESD) Protection All kinds of LED materials, such as GaP, AlGaAs, AllnGaP, GaN, or InGaN chips, are STATIC SENSITIVE device. ESD protection or surge voltages shall be considered and taken care in the initial design stage, and whole production process. The following protection is recommended: (1) A wrist band or an anti-electrostatic glove shall be used when handling the LEDs (2) All devices, equipment and machinery must be properly grounded If LED is damaged by ESD or surge voltage, damaged LED may show some unusual characteristics. It may appear leakage current, and LED does not emit at low current. And when using microscope to inspect damaged LED chip at low driving current, it may have some black dots within the emitting area.

Spec No.: A-Q-317-00 Date: 2010/8/3 Ver.: A-00

Tel: 886-3-5679000 Fax: 886-3-5679999

http://www.eoi.com.tw/ E-mail: [email protected]

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PART NO.: EOQ-HNYTDD0-KK

3. Lead Forming The leads should not be bent or cut at the point of 3mm or shorter than 3mm from the base of the epoxy bulb while forming the leads. It’s recommended to cut or form the lead by tooling made rather than by hand operation. Do not apply any bending stress to the base of the lead, and don’t cause any stress after mounting the LED lamp on PCB. The stress to the base may damage the LED’s characteristics, or cause deterioration of the epoxy resin. This will hurt and degrade the LEDs.

4. Storage It’s recommended to store the products in the following conditions: (1) Shelf life in sealed bag: 12 months at TA