Freescale Semiconductor Data Sheet: Technical Data
MC9S08PA4 Data Sheet Supports: MC9S08PA4(A)
Key features • 8-Bit S08 central processor unit (CPU) – Up to 20 MHz bus at 2.7 V to 5.5 V across operating temperature range – Supporting up to 40 interrupt/reset sources – Supporting up to four-level nested interrupt – On-chip memory – Up to 4 KB flash read/program/erase over full operating voltage and temperature – Up to 128 byte EEPROM; 2-byte erase sector; program and erase while executing flash – Up to 512 byte random-access memory (RAM) – Flash and RAM access protection • Power-saving modes – One low-power stop mode; reduced power wait mode – Peripheral clock enable register can disable clocks to unused modules, reducing currents; allows clocks to remain enabled to specific peripherals in stop3 mode • Clocks – Oscillator (XOSC) - loop-controlled Pierce oscillator; crystal or ceramic resonator range of 31.25 kHz to 39.0625 kHz or 4 MHz to 20 MHz – Internal clock source (ICS) - containing a frequencylocked-loop (FLL) controlled by internal or external reference; precision trimming of internal reference allowing 1% deviation across temperature range of 0 °C to 70 °C and 2% deviation across whole operating temperature range; up to 20 MHz • System protection – Watchdog with independent clock source – Low-voltage detection with reset or interrupt; selectable trip points – Illegal opcode detection with reset – Illegal address detection with reset
© 2011–2015 Freescale Semiconductor, Inc.
Document Number MC9S08PA4 Rev. 4, 06/2015
MC9S08PA4 MC9S08PA4A is recommended for new design
• Development support – Single-wire background debug interface – Breakpoint capability to allow three breakpoints setting during in-circuit debugging – On-chip in-circuit emulator (ICE) debug module containing two comparators and nine trigger modes • Peripherals – ACMP - one analog comparator with both positive and negative inputs; separately selectable interrupt on rising and falling comparator output; filtering – ADC - 8-channel, 12-bit resolution; 2.5 µs conversion time; data buffers with optional watermark; automatic compare function; internal bandgap reference channel; operation in stop mode; optional hardware trigger – FTM - two 2-channel flex timer modulators modules; 16-bit counter; each channel can be configured for input capture, output compare, edgeor center-aligned PWM mode – RTC - 16-bit real timer counter (RTC) – SCI - one serial communication interface (SCI/ UART) modules optional 13-bit break; full duplex non-return to zero (NRZ); LIN extension support • Input/Output – Up to 18 GPIOs including one output-only pin – One 8-bit keyboard interrupt module (KBI) – Two, ultra-high current sink pins supporting 20 mA source/sink current • Package options – 20-pin SOIC – 16-pin TSSOP
Table of Contents 1 Ordering parts.......................................................................................3
5.2 Switching specifications.............................................................. 15
1.1 Determining valid orderable parts............................................... 3
5.2.1
Control timing................................................................ 15
2 Part identification................................................................................. 3
5.2.2
Debug trace timing specifications..................................16
2.1 Description...................................................................................3
5.2.3
FTM module timing....................................................... 17
2.2 Format.......................................................................................... 3 2.3 Fields............................................................................................3
5.3 Thermal specifications................................................................. 18 5.3.1
Thermal characteristics.................................................. 18
2.4 Example....................................................................................... 4
6 Peripheral operating requirements and behaviors................................ 18
3 Parameter Classification.......................................................................4
6.1 External oscillator (XOSC) and ICS characteristics....................18
4 Ratings..................................................................................................4
6.2 NVM specifications..................................................................... 20
4.1 Thermal handling ratings............................................................. 4
6.3 Analog..........................................................................................21
4.2 Moisture handling ratings............................................................ 5
6.3.1
ADC characteristics....................................................... 21
4.3 ESD handling ratings................................................................... 5
6.3.2
Analog comparator (ACMP) electricals.........................24
4.4 Voltage and current operating ratings..........................................5
7 Dimensions...........................................................................................25
5 General................................................................................................. 6
7.1 Obtaining package dimensions.................................................... 25
5.1 Nonswitching electrical specifications........................................ 6
8 Pinout................................................................................................... 25
5.1.1
DC characteristics.......................................................... 6
8.1 Signal multiplexing and pin assignments.................................... 25
5.1.2
Supply current characteristics........................................ 13
8.2 Device pin assignment................................................................. 26
5.1.3
EMC performance..........................................................14
9 Revision history....................................................................................27
MC9S08PA4 Data Sheet, Rev. 4, 06/2015 2
Freescale Semiconductor, Inc.
Ordering parts
1 Ordering parts 1.1 Determining valid orderable parts Valid orderable part numbers are provided on the web. To determine the orderable part numbers for this device, go to freescale.com and perform a part number search for the following device numbers: PA4.
2 Part identification 2.1 Description Part numbers for the chip have fields that identify the specific part. You can use the values of these fields to determine the specific part you have received.
2.2 Format Part numbers for this device have the following format: MC 9 S08 PA AA (V) B CC
2.3 Fields This table lists the possible values for each field in the part number (not all combinations are valid): Field
Description
Values
MC
Qualification status
• MC = fully qualified, general market flow
9
Memory
• 9 = flash based
S08
Core
• S08 = 8-bit CPU
PA
Device family
• PA
AA
Approximate flash size in KB
• 4 = 4 KB
(V)
Mask set version
• (blank) = Any version • A = Rev. 2 or later version, this is recommended for new design Table continues on the next page...
MC9S08PA4 Data Sheet, Rev. 4, 06/2015 Freescale Semiconductor, Inc.
3
Parameter Classification Field
Description
Values
B
Operating temperature range (°C)
• M = –40 to 125 • V = –40 to 105
CC
Package designator
• WJ = 20-SOIC • TG = 16-TSSOP
2.4 Example This is an example part number: MC9S08PA4VWJ
3 Parameter Classification The electrical parameters shown in this supplement are guaranteed by various methods. To give the customer a better understanding, the following classification is used and the parameters are tagged accordingly in the tables where appropriate: Table 1. Parameter Classifications P
Those parameters are guaranteed during production testing on each individual device.
C
Those parameters are achieved by the design characterization by measuring a statistically relevant sample size across process variations.
T
Those parameters are achieved by design characterization on a small sample size from typical devices under typical conditions unless otherwise noted. All values shown in the typical column are within this category.
D
Those parameters are derived mainly from simulations.
NOTE The classification is shown in the column labeled “C” in the parameter tables where appropriate.
4 Ratings 4.1 Thermal handling ratings Symbol
Description
Min.
Max.
Unit
Notes
TSTG
Storage temperature
–55
150
°C
1
TSDR
Solder temperature, lead-free
—
260
°C
2
MC9S08PA4 Data Sheet, Rev. 4, 06/2015 4
Freescale Semiconductor, Inc.
Ratings 1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life. 2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices.
4.2 Moisture handling ratings Symbol MSL
Description Moisture sensitivity level
Min.
Max.
Unit
Notes
—
3
—
1
1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices.
4.3 ESD handling ratings Symbol
Description
Min.
Max.
Unit
Notes
VHBM
Electrostatic discharge voltage, human body model
-6000
+6000
V
1
VCDM
Electrostatic discharge voltage, charged-device model
-500
+500
V
2
Latch-up current at ambient temperature of 125°C
-100
+100
mA
3
ILAT
1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM). 2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components. 3. Determined according to JEDEC Standard JESD78D, IC Latch-up Test. • Test was performed at 125 °C case temperature (Class II). • I/O pins pass +100/-100 mA I-test with IDD current limit at 200 mA. • I/O pins pass +20/-100 mA I-test with IDD current limit at 1000mA. • Supply groups pass 1.5 Vccmax. • RESET pin was only tested with negative I-test due to product conditioning requirement.
4.4 Voltage and current operating ratings Absolute maximum ratings are stress ratings only, and functional operation at the maxima is not guaranteed. Stress beyond the limits specified in below table may affect device reliability or cause permanent damage to the device. For functional operating conditions, refer to the remaining tables in this document. This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (for instance, either VSS or VDD) or the programmable pullup resistor associated with the pin is enabled. MC9S08PA4 Data Sheet, Rev. 4, 06/2015 Freescale Semiconductor, Inc.
5
General Symbol
Description
Min.
VDD
Supply voltage
–0.3
6.0
V
IDD
Maximum current into VDD
—
120
mA
Digital input voltage (except RESET, EXTAL, XTAL, or true open drain pin PTB0)
–0.3
VDD + 0.3
V
Digital input voltage (true open drain pin PTB0)
-0.3
6
V
Analog1,
–0.3
VDD + 0.3
V
–25
25
mA
VDD – 0.3
VDD + 0.3
V
VDIO
VAIO ID VDDA
RESET, EXTAL, and XTAL input voltage
Instantaneous maximum current single pin limit (applies to all port pins) Analog supply voltage
Max.
Unit
1. All digital I/O pins, except open-drain pin PTB0, are internally clamped to VSS and VDD. PTB0 is only clamped to VSS.
5 General 5.1 Nonswitching electrical specifications 5.1.1 DC characteristics This section includes information about power supply requirements and I/O pin characteristics. Table 2. DC characteristics Symbol
C
—
—
VOH
C
Min
Typical1
Max
Unit
—
2.7
—
5.5
V
5 V, Iload = -5 mA
VDD - 0.8
—
—
V
3 V, Iload = -2.5 mA
VDD - 0.8
—
—
V
High current drive pins, high-drive strength2
5 V, Iload = -20 mA
VDD - 0.8
—
—
V
3 V, Iload = -10 mA
VDD - 0.8
—
—
V
Max total IOH for all ports
5V
—
—
-100
mA
3V
—
—
-50
—
—
0.8
V
—
—
0.8
V
Descriptions Operating voltage Output high voltage
All I/O pins, standarddrive strength
C C C IOHT
D
Output high current
VOL
C
Output low voltage
C
All I/O pins, standard- 5 V, Iload = 5 drive strength mA 3 V, Iload = 2.5 mA
Table continues on the next page...
MC9S08PA4 Data Sheet, Rev. 4, 06/2015 6
Freescale Semiconductor, Inc.
Nonswitching electrical specifications
Table 2. DC characteristics (continued) Symbol
C
Descriptions
C
High current drive pins, high-drive strength2
C IOLT VIH
D P C
VIL
P C
Min
Typical1
Max
Unit
5 V, Iload =20 mA
—
—
0.8
V
3 V, Iload = 10 mA
—
—
0.8
V mA
Output low current
Max total IOL for all ports
5V
—
—
100
3V
—
—
50
Input high voltage
All digital inputs
VDD>4.5V
0.70 × VDD
—
—
VDD>2.7V
0.75 × VDD
—
—
Input low voltage
All digital inputs
VDD>4.5V
—
—
0.30 × VDD
VDD>2.7V
—
—
0.35 × VDD
V V
Vhys
C
Input hysteresis
All digital inputs
—
0.06 × VDD
—
—
mV
|IIn|
P
Input leakage current
All input only pins (per pin)
VIN = VDD or VSS
—
0.1
1
µA
|IOZ|
P
Hi-Z (offstate) leakage current
All input/output (per pin)
VIN = VDD or VSS
—
0.1
1
µA
|IOZTOT|
C
Total leakage All input only and I/O VIN = VDD or combined for VSS all inputs and Hi-Z pins
—
—
2
µA
RPU
P
Pullup resistors
All digital inputs, when enabled (all I/O pins other than PTB0)
—
30.0
—
50.0
kΩ
RPU3
P
Pullup resistors
PTB0 pin
—
30.0
—
60.0
kΩ
IIC
D
DC injection current4, 5, 6
Single pin limit
VIN < VSS, VIN > VDD
-0.2
—
2
mA
-5
—
25
Total MCU limit, includes sum of all stressed pins
CIn
C
Input capacitance, all pins
—
—
—
7
pF
VRAM
C
RAM retention voltage
—
2.0
—
—
V
1. Typical values are measured at 25 °C. Characterized, not tested. 2. Only PTB4, PTB5 support ultra high current output. 3. The specified resistor value is the actual value internal to the device. The pullup value may appear higher when measured externally on the pin. 4. All functional non-supply pins, except for PTB0, are internally clamped to VSS and VDD. 5. Input must be current-limited to the value specified. To determine the value of the required current-limiting resistor, calculate resistance values for positive and negative clamp voltages, then use the large one. 6. Power supply must maintain regulation within operating VDD range during instantaneous and operating maximum current conditions. If the positive injection current (VIn > VDD) is higher than IDD, the injection current may flow out of VDD and could result in external power supply going out of regulation. Ensure that external VDD load will shunt current higher than maximum injection current when the MCU is not consuming power, such as no system clock is present, or clock rate is very low (which would reduce overall power consumption).
MC9S08PA4 Data Sheet, Rev. 4, 06/2015 Freescale Semiconductor, Inc.
7
Nonswitching electrical specifications
Table 3. LVD and POR Specification
1. 2. 3. 4.
Symbol
C
Description
Min
Typ
Max
Unit
VPOR
D
POR re-arm voltage1, 2
1.5
1.75
2.0
V
VLVDH
C
Falling low-voltage detect threshold - high range (LVDV = 1)3
4.2
4.3
4.4
V
VLVW1H
C
Level 1 falling (LVWV = 00)
4.3
4.4
4.5
V
VLVW2H
C
Level 2 falling (LVWV = 01)
4.5
4.5
4.6
V
VLVW3H
C
Level 3 falling (LVWV = 10)
4.6
4.6
4.7
V
VLVW4H
C
Level 4 falling (LVWV = 11)
4.7
4.7
4.8
V
VHYSH
C
High range low-voltage detect/warning hysteresis
—
100
—
mV
VLVDL
C
Falling low-voltage detect threshold - low range (LVDV = 0)
2.56
2.61
2.66
V
VLVDW1L
C
Level 1 falling (LVWV = 00)
2.62
2.7
2.78
V
VLVDW2L
C
Level 2 falling (LVWV = 01)
2.72
2.8
2.88
V
VLVDW3L
C
Level 3 falling (LVWV = 10)
2.82
2.9
2.98
V
VLVDW4L
C
Level 4 falling (LVWV = 11)
2.92
3.0
3.08
V
VHYSDL
C
Low range low-voltage detect hysteresis
—
40
—
mV
VHYSWL
C
Low range low-voltage warning hysteresis
—
80
—
mV
VBG
P
Buffered bandgap output 4
1.14
1.16
1.18
V
Falling lowvoltage warning threshold high range
Falling lowvoltage warning threshold low range
Maximum is highest voltage that POR is guaranteed. POR ramp time must be longer than 20us/V to get a stable startup. Rising thresholds are falling threshold + hysteresis. Voltage factory trimmed at VDD = 5.0 V, Temp = 25 °C
MC9S08PA4 Data Sheet, Rev. 4, 06/2015 8
Freescale Semiconductor, Inc.
Nonswitching electrical specifications
0.6
V DD -V OH (V)
0.5 0.4 125°C
0.3
25°C
0.2
-40°
0.1 0 0
1
2
3
4
5
6
7
I OH (mA)
Figure 1. Typical IOH Vs. VDD-VOH (standard drive strength) (VDD = 5 V)
0.9 0.8 V DD -V OH (V)
0.7 0.6 0.5
125°C
0.4
25°C
0.3
-40°C
0.2 0.1 0 0
1
2
3
4
5
6
7
I OH (mA)
Figure 2. Typical IOH Vs. VDD-VOH (standard drive strength) (VDD = 3 V)
MC9S08PA4 Data Sheet, Rev. 4, 06/2015 Freescale Semiconductor, Inc.
9
Nonswitching electrical specifications
0.7
V DD -V OH (V)
0.6 0.5 0.4
125°C
0.3
25°C
0.2
-40°C
0.1 0 0
5
10
15
20
25
30
I OH (mA)
Figure 3. Typical IOH Vs. VDD-VOH (high drive strength) (VDD = 5 V)
1.2
V DD -V OH (V)
1 0.8 125°C
0.6
25°C
0.4
-40°C
0.2 0 0
5
10
15
20
25
30
I OH (mA)
Figure 4. Typical IOH Vs. VDD-VOH (high drive strength) (VDD = 3 V)
MC9S08PA4 Data Sheet, Rev. 4, 06/2015 10
Freescale Semiconductor, Inc.
Nonswitching electrical specifications
0.6 0.5
VOL (V)
0.4 125°C
0.3
25°C
0.2
-40°
0.1 0 0
1
2
3
4
5
6
7
I OL (mA)
Figure 5. Typical IOL Vs. VOL (standard drive strength) (VDD = 5 V)
0.9 0.8 0.7 VOL (V)
0.6 0.5
125°C
0.4
25°C
0.3
-40°C
0.2 0.1 0 0
1
2
3
4
5
6
7
I OL (mA)
Figure 6. Typical IOL Vs. VOL (standard drive strength) (VDD = 3 V)
0.3 Freescale Semiconductor, Inc. 0.3
MC9S08PA4 Data Sheet, Rev. 4, 06/2015
125°C 125°C
11
Nonswitching electrical specifications
0.6 0.5
VOL (V)
0.4 125°C
0.3
25°C
0.2
-40°C
0.1 0 0
5
10
15
20
25
30
I OL (mA)
V OL (V)
Figure 7. Typical IOL Vs. VOL (high drive strength) (VDD = 5 V)
1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0
125°C 25°C -40°
0
5
10
15
20
25
30
I OL (mA)
Figure 8. Typical IOL Vs. VOL (high drive strength) (VDD = 3 V)
MC9S08PA4 Data Sheet, Rev. 4, 06/2015 12
Freescale Semiconductor, Inc.
Nonswitching electrical specifications
5.1.2 Supply current characteristics This section includes information about power supply current in various operating modes. Table 4. Supply current characteristics in operating temperature range Num
C
Parameter
Symbol
Bus Freq
VDD (V)
Typical1
Max
Unit
1
C
Run supply current FEI mode, all modules on; run from flash
RIDD
20 MHz
5
5.43
—
mA
10 MHz
3.46
—
1 MHz
1.71
—
5.35
—
C
2
C
20 MHz
C
10 MHz
3.45
—
1 MHz
1.69
—
4.51
—
10 MHz
3.01
—
1 MHz
1.68
—
4.47
—
C C
3
10 MHz
2.99
—
1 MHz
1.65
—
P
Run supply current FBE mode, all modules on; run from RAM
RIDD
20 MHz
3
5.31
7.41
10 MHz
5
3.17
—
1 MHz
1.25
—
5.29
—
C
20 MHz
C
10 MHz
3.17
—
1 MHz
1.24
—
4.39
6.59
2.71
—
1.21
—
4.39
—
P
Run supply current FBE mode, all modules off and gated; run from RAM
RIDD
20 MHz
3
5
10 MHz 1 MHz
C
20 MHz
C
10 MHz
2.71
—
1 MHz
1.20
—
3.62
—
10 MHz
2.27
—
1 MHz
1.11
—
3.61
—
10 MHz
2.31
—
1 MHz
1.10
—
C
Wait mode current FEI mode, all modules on
WIDD
C
7
5
C
C
6
20 MHz
20 MHz
C
5
RIDD
C
C
4
Run supply current FEI mode, all modules off and gated; run from flash
3
C
20 MHz
20 MHz
S3IDD
C
Stop3 mode supply current no clocks active (except 1 kHz LPO clock)2, 3
C
ADC adder to stop3
C
ADLPC = 1
3
5
3
—
5
5.4
—
—
3
1.40
—
—
—
5
96.0
—
—
—
3
88.3
—
mA
mA
mA
mA
µA
µA
Table continues on the next page...
MC9S08PA4 Data Sheet, Rev. 4, 06/2015 Freescale Semiconductor, Inc.
13
Nonswitching electrical specifications
Table 4. Supply current characteristics in operating temperature range (continued) Num
C
Parameter
Symbol
Bus Freq
VDD (V)
Typical1
Max
Unit
—
—
5
129
—
µA
3
126
—
ADLSMP = 1 ADCO = 1 MODE = 10B ADICLK = 11B 8
C
LVD adder to stop34
C 1. 2. 3. 4.
Data in Typical column was characterized at 5.0 V, 25 °C or is typical recommended value. RTC adder cause