2013 Optical Interconnects Conference (OI 2013)

Santa Fe, New Mexico, USA 5 – 8 May 2013

IEEE Catalog Number: ISBN:

CFP13HSD-PRT 978-1-4673-5061-7

Table of Contents

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Monday 6 May MA

HPC Systems One

MA1

Why we Need Exascale and Why We Won't Get there by 2020

MA2

Energy-per-bit Advantages of Chip-scale Hybrid-integrated Optical Interconnects using Surface-normal Electro-aborption MQW Modulators

N/A

1

Michael Haney*, University of Delaware; Tian Gu, University of Delaware; Anupama Venkataraman, University of Delaware MA3

Scalable Electrical-Optical Thermal Simulator for Multicores with Optical Interconnects

3

Yu-Hsin Chen*, MIT; Chen Sun, MIT; Vladimir Stojanovic, MIT MA4

The Role of Optical Links in HPC System Interconnects

5

Gilbert Hendry*, Sandia National Labs

MB

Roadmapping and Technology Gaps

MB1

Low Power VCSEL interconnects

7

Darwin Serkland*, Sandia National Laboratories MB2

Multicore optical fiber and connectors for high bandwidth density, short reach optical links

9

Douglas Butler*, Corning Incorporated; Ming-Jun Li, Corning; Shenping Li, Corning; Karen Matthews, Corning; Vladimir Nazarov, Corning; Alexander Koklyushkin, Corning; Robert McCollum, Corning; Ying Geng, Corning; James Luther, Corning MB3

A Compact 10x10 Gbps Transmitter Module Based on a Low Cost 3D Stacking Solution

11

Oded Raz*, Eindhoven University of Technology; Pinxiang Duan, Tecnical University of Eindhoven; Sander Dorrestein, TE connectivity; Kevin Williams, Tecnical University of Eindhoven; Denis Molin, Prysmian Group; Pierre Sillard, Prysmian Group; Finn Kraemer, IPtronics A/S; Barry Smalbrugge, Tecnical University of Eindhoven; Gerard Kuyt, Prysmian Group; Steen Christensen, IPtronics A/S; Henning Lysdal, IPtronics A/S; Jeroen Duis, TE connectivity; Harmen Dorren, Tecnical University of Eindhoven MB4

Energy Efficient 850 nm VCSELs for Error-free 30 Gb/s Operation across 500 m of Multitude Optical Fiber with 85 fJ of Dissipated Energy per Bit

13

Philip Moser, Technische Universität Berlin; Philip Wolf, Technische Universität Berlin; Gunter Larisch, Technische Universiät Berlin; Hui Li, Technische Universität Berlin; James Lott*, Technische Universität Berlin; Dieter Bimberg, Technische Universitä MB5

Packaging Technology For Embedded Optical Modules

15

Charlie Kuznia*, Ultra Communications Inc; Joseph Ahadian, Ultra Communications; Kris Kusumoto, Ultra Communications; Paul Bachta, Ultra

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Communications; Man Wong, Ultra Communications; Dick Pommer, Ultra Communications; Richard Hagan, Ultra Communications

MC

High Performance Silicon Photonics Modulators and Detectors

MC1

A Small Form Factor Si-Based Coherent Receiver

17

Yves Painchaud*, TeraXion; Michel Poulin, TeraXion; Martin Pelletier, TeraXion; François Pelletier, TeraXion; Christine Latrasse, TeraXion; Guillaume Robidoux, TeraXion; Simon Savard, TeraXion; Jean-Frédéric Gagné, TeraXion; Vincent Trudel, TeraXion; Marie-Josée Picard, TeraXion; Patrick Poulin, TeraXion; Patrick Sirois, TeraXion; Frédéric D'Amours, TeraXion; Daniel Asselin, TeraXion; Stéphane Paquet, TeraXion; Carl Paquet, TeraXion; Michel Cyr, TeraXion; Martin Guy, TeraXion; Mohamed Morsy-Osman, McGill University; Matthieu Chagnon, McGill University; Qunbi Zhuge, McGill University; Xian Xu, McGill University; David Plant, McGill University MC2

L-Shaped Resonant Microring (LRM) Modulator

19

Erman Timurdogan*, RLE - MIT; Cheryl Sorace-Agaskar, RLE - MIT; Michael Watts, RLE - MIT MC3

Evaluation of optical interconnects built up from a complete CMOS-Photonicsdevices-library

21

Sylvie Menezo*, CEA-Leti; Edouard Grellier, CEA-Leti MC4

Breaking the energy-bandwidth limit of electro-optic modulators: theory and a device proposal

23

Juejun Hu*, University of Delaware; Hongtao Lin, University of Delaware; Okechukwu Ogbuu, University of Delaware; Jifeng Liu, Dartmouth College; Lin Zhang, Massachusetts Institute of Technology; Jurgen Michel, Massachusetts Institute of Technology MC5

Nanoscale resonant-cavity-enhanced germanium photodetectors with 25 lithographically defined spectral response for improved performance at telecommunications wavelengths Krishna Coimbatore Balram*, Stanford University; Ross Audet, Stanford University; David Miller, Stanford University

MD

Integrated Photonics One

MD1

30GHz Silicon Platform for Photonics System

27

Yang Liu*, UD Nanophotonics Lab; Ran Ding, UD Nanophotonics Lab; Michael Gould, University of Washington; Tom Baehr-Johns, UD Nanophotonics Lab; Yisu Yang, UD Nanophotonics Lab; YangJin Ma, UD Nanophotonics Lab; Yi Zhang, UD Nanophotonics Lab; Andy Eu-Jin Lim, Institute of Microelectronics; Tsung-Yang Liow, Institute of Microelectronics; Selin Hwee-Gee Teo, Institute of Microelectronics; Guo-Qiang Lo, Institute of Microelectronics; Michael Hochberg, UD Nanophotonics Lab MD2

960 Gb/s Optical Backplane using Embedded Polymer Waveguides and Demonstration in a 12G SAS Storage Array

29

Katharine Schmidtke*, Finisar Corporation; Frank Flens, Finisar Corporation; Alex Worrall, Xyratex; Richard Pitwon, Xyratex; Felix Betschon, vario-optics ag.; Tobias Lamprecht, vario-optics ag.; Roger Kraehenbuehl, Huber+Suhner Low Loss optical interlayer coupling using reflector-enhanced grating couplers

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MD3

MD4

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31 Jin Yao*, Oracle; Ivan Shubin, Oracle Labs; Xuezhe Zheng, Oracle Labs; Guoliang Li, Oracle Labs; Ying Luo, Oracle Labs; Hiren Thacker, Oracle Labs; Jin-Hyoung Lee, Oracle Labs; Justin Bickford, Adelphi Laboratory Center; Kannan Raj, Oracle Labs; John Cunningham, Oracle Labs; Ashok Krishnamoorthy, Oracle Labs High density, low cost, no-polish optical ferrule

33

Darrell Childers, US Conec Ltd; Mike Hughes*, US Conec Ltd MD5

Inter-layer grating coupler on double-layer silicon nanomembranes

35

Yang Zhang*, The University of Texas at Austin; David Kwong, The University of Texas at Austin; Xiaochuan Xu, The University of Texas at Austin; Amir Hosseini, Omega Optics; Sang Yang, University of Illinois at Urbana-Champaign; John Rogers, University of Illinois at Urbana-Champaign; Ray Chen, The University of Texas at Austin

Tuesday 7 May TuA

VSCELS and Multimode/Multicore Links

TuA1

National Academies study on optics and photonics: Essential technologies for our nation

TuA2

Optical Electronic Data Transfer Technical Gaps, Needs and Non-Needs Extracted from Industry Roadmaps (iNemi, ITRS and the MIT CTR)

N/A

37

Richard Otte*, Promex Industries Inc

TuB

Switching for Warehouse-Scale Computing

TuB1

The impact of network trends and architecture on optical technology requirements

41

Mark Nowell*, Cisco Systems TuB2

Ultra-low Latency Optical Switchinig for Short Message Sizes in Cluster Scale Systems

43

Gouri Dongaonkar*, Columbia University; Sebastien Rumley, Columbia University; Qi Li, Columbia University; Keren Bergman, Columbia University; Madeleine Glick, APIC Corporation TuB3

Analysis and Design of Micro-ring Based Switch Elements in Silicon Photonics for Optical Interconnection

45

Pietro Contu*, Scuola Superiore Sant'Anna; Paolo Pintus, Scuola Superiore Sant'Anna TuB4

AWGR-based all-to-all optical interconnects using limited number of wavelengths

47

Yawei Yin*, University of California TuB5

Facebook's Data Center Network Architecture

49

Nathan Farrington*, Facebook, Inc.; Alexey Andreyev, Facebook, Inc.

TuC

Thermal Tuning and Athermal Silicon Resonators

TuC1

Circuit design implications for silicon photonics

51

Ron Ho*, Oracle

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TuC2

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Integrated control of silicon-photonic micro-resonator wavelength via balanced homodyne locking

52

Jonathan Cox*, Sandia National Laboratories; Douglas Trotter, Sandia National Laboratories; Andrew Starbuck, Sandia National Laboratories TuC3

Integrated Microring Tuning in Deep-Trench Bulk CMOS

54

Chen Sun*, Massachusetts Institute of Technology; Erman Timurdogan, Massachusetts Institute of Technology; Michael Watts, Massachusetts Institute of Technology; Vladimir Stojanovic, Massachusetts Institute of Technology TuC4

Athermal Silicon Ring Modulators Clad with Titanium Dioxide by RF Magnetron Sputtering

56

Stevan Djordjevic*, University of California, Davis; Kuanping Shang, University of California, Davis; Binbin Guan, University of California, Davis; Stanley Cheung, University of California, Davis; Chuan Qin, University of California, Davis; Ling Liao, Intel Corporation; Juthika Basak, Intel Corporation; Hai-Feng Liu, Intel Corporation; S.J.B. Yoo, University of California, Davis TuC5

Microring Resonance Stabilization using Thermal Dithering

58

Kishore Padmaraju*, Department of Electrical Engineering, Columbia University; Dylan Logan, Department of Engineering Physics, McMaster University; Jason Ackert, Department of Engineering Physics, McMaster University; Andrew Knights, Department of Engineering Physics, McMaster University; Keren Bergman, Department of Electrical Engineering, Columbia University

TuD

Integrated Photonics Two

TuD1

Photonic and Electronic Interconnects for Etreme Scale Computing

TuD2

Intra- and Inter- Board Optical Interconnects by Polymeric Waveguides and Mirror Coupler with Inkjet-printed Micro-lenses

N/A

60

XIAOHUI LIN*, the University of Texas at Austin; Amir Hosseini, Omega Optics, Inc.; Xinyuan Dou, the University of Texas at Austin; Harish Subbaraman, Omega Optics, Inc.; Ray Chen, the University of Texas at Austin TuD3

Layer Separation Optimization in CMOS Compatible Multilayer Optical Networks

62

Adam Jones*, Sandia National Labs; Christopher DeRose, Sandia National Labs; Anthony Lentine, Sandia National Labs; Douglas Trotter, Sandia National Labs; Andrew Starbuck, Sandia National Labs; Robert Norwood, University of Arizona TuD4

Steerable Free Space Optical Interconnect with Corrugated Waveguide Gratings Optically Isolated by 2D Photonic Crystal

64

David Kwong*, University of Texas at Austin; John Covey, University of Texas at Austin; Amir Hosseini, University of Texas at Austin; Yang Zhang, University of Texas at Austin; Xiaochuan Xu, University of Texas at Austin; Ray Chen, University of Texas at Austin TuD5

Polarization Independent and Low Loss Laser Written Polysiloxane Interconnect Building Blocks

66

Alejandra Lopez-Santiago, College of Optical Sciences, The University of Arizona; Palash Gangopadhyay*, College of Optical Sciences, The University of Arizona; Arkady Bablumyan, TIPD, LLC, Tucson; Ram Voorakaranam, College of Optical Sciences, The University of Arizona; K. Takeuchi, Dow Corning Corporation; D.

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DeShazer, Dow Corning Corporation; Robert Norwood, College of Optical Sciences, The University of Arizona; N. Peyghambarian, College of Optical Sciences, The University of Arizona

TuP

Poster Session

TuP1

Integrated Photodiode Characterization in a SiG BiCMOS Process

68

Alireza Sharif-Bakhtiar*, University of Toronto; Shayan Shahramian, University of Toronto; Alain Rousson, University of Toronto; Hemesh Yasotharan, University of Toronto; Tony Chan Carusone, University of Toronto TuP2

Optical Interconnections Based on Elastic Spatial-Spectral Interworking

70

Milorad Cvijetic*, University of Arizona TuP3

Electro-optic Threshold Comparator Based on Multimode Interference

72

Yossef Ehrlichman*, Tel-Aviv University; Ofer Amrani, Tel-Aviv University; Shlomo Ruschin, Tel-Aviv University TuP4

RODIN- Energy-proportional SOA-based Optical Interconnect for Large Computing Platforms

74

Odile Liboiron-Ladouceur*, McGill University; Chunshu Zhang, McGill University; Xi Lu, McGill University; Peicheng Liao, McGill University; Pier Giorgio Raponi, Scuola Superiore Sant'Anna; Isabella Cerutti, Scuola Superiore Sant'Anna; Nicola Andriolli, Scuola Superiore Sant'Anna TuP5

Loss analysis for a two wire optical waveguide for chip-to-chip communication

76

Jonathan Dickason*, University of Delaware; Keith Goossen, University of Delaware TuP6

Experimental Demonstration of High-Speed Reconfigurable Card-to-Card Optical Interconnects with Broadcast capability

78

KE WANG*, National ICT Australia (NICTA), The University of Melbourne; Ampalavanapillai Nirmalathas, National ICT Australia (NICTA), The University of Melbourne; Christina Lim, The University of Melbourne; Efstratios Skafidas, National ICT Australia (NICTA), The University of Melbourne; Kamal Alameh, Edith Cowan University TuP7

Modeling a Multi Microring (MMR) Network-on-Chip

80

Paolo Pintus*, Scuola Superiore Sant'Anna; Pietro Contu, Scuola Superiore Sant'Anna; Nicola Andriolli, Scuola Superiore Sant'Anna; Isabella Cerutti, Scuola Superiore Sant'Anna; Pier Giorgio Raponi, Scuola Superiore Sant'Anna TuP8

Generating QAM signals with microring modulators

82

Yossef Ehrlichman*, Tel-Aviv University; Ofer Amrani, Tel-Aviv University; Shlomo Ruschin, Tel-Aviv University TuP9

Timing Jitter of Optical Clock Distribution Induced by Photodetection

84

Kambiz Jamshidi*, TU Berlin; Edgar Krune, TU Berlin; Karsten Voigt, TU Berlin; Lars Zimmermann, IHP; Klaus Petermann, TU Berlin TuP10

InAIAs/InGaAs Quantum Cascade Laser with concentric racetrack array cavity

86

Solomon Serunjogi*, Masdar Institute Of Science And Technology; Jaime Viegas, Masdar Institute Of Science And Technology TuP11

A Silicon-polymer Hybrid Modulator - Simulation and Proof of Principle

88

Roland Himmelhuber*, The University of Arizona - College of Optical Sciences;

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Oscar Herrera, The University of Arizona - College of Optical Sciences; Li Li, TIPD LLC; Adam Jones, The University of Arizona - College of Optical Sciences; Robert Norwood, The University of Arizona - College of Optical Sciences; Nasser Peyghambarian, The University of Arizona - College of Optical Sciences TuP12

Characterization of coplanar poled electro optic polymer films for Si-photonic devices with multiphoton microscopy

90

Roland Himmelhuber*, The University of Arizona - College of Optical Sciences; Khanh Kieu, The University of Arizona - College of Optical Sciences; Oscar Herrera, The Universiy of Arizona - College of Optical Sciences; Robert Norwood, The University of Arizona - College of Optical Sciences; Nasser Peyghambarian, The University of Arizona - College of Optical Sciences CMOS Compatible Modulator Utilizing the DC Kerr Effect TuP131$ Neal Bambha*, US Army Research Laboratory; Justin Bickford, US Army Research Laboratory; Stefan Preble, Rochester Institute of Technology TuP14

Evaluation of SiGe multiple quantum well modulators for short-reach, dense wavelength division multiplexed optical interconnects

94

Anthony Lentine*, Sandia National Laboratories; Rohan Kekatpure, Sandia National Laboratories

Wednesday 8 May WA

HPC Systems Two

WA1

How to stop interconnects from hindering the future of computing!

96

Shekhar Borkar*, Intel Corp. WA2

A Photonic Interconnection Network for Hardware Accelerator Enabled Utility Computing

98

Cathy Chen*, Columbia University; Howard Wang, Columbia University; Johnnie Chan, Columbia University; Keren Bergman, Columbia University WA3

Intelligent THz Photonic Processor for Interconnection Networks based on Spike Timing Dependent Plasticity

100

Mable Fok*, University of Georgia; Paul Prucnal, Princeton University WA4

FPGA Controlled Microring Based Tunable Add-Drop Filter

102

Xiaoliang Zhu*, Columbia University; Michael Wang, Columbia University; Hugo Lira, Cornell University; Lian-Wee Luo, Cornell University; Michal Lipson, Cornell University; Keren Bergman, Columbia University

WB

Lasers and Integrated Amplifiers for Interconnect

WB1

5.5fJ/bit Direct Modulation of Lambda-Scale Embedded Active Region PhotonicCrystal lasers

104

Tomonari Sato, NTT Photonics Laboratories; Akihiko Shinya, NTT Basic Research Laboratories; Kengo Nozaki, NTT Basic Research Laboratories; Hideaki Taniyama, NTT Basic Research Laboratories; Koichi Hasebe, NTT Photonics Laboratories; Takaaki Kakitsuka, NTT Photonics Laboratories; Masaya Notomi, NTT Basic Research Laboratories; Shinji Matsuo, NTT Photonics Laboratories WB2

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Integrated Bidirectional Optical Amplifier for Crosstalk-Free WDM Communication

106

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Paolo Pintus*, Scuola Superiore Sant'Anna; Nicola Andriolli, Scuola Superiore Sant'Anna; Fabrizio Di Pasquale, Scuola Superiore Sant'Anna; John Bowers, University of California Santa Barbara WB3

Design Optimization of Energy-Efficient Hydrophobic Wafer-bonded III-V/Si Semiconductor Optical Amplifiers

108

Stanley Cheung, Department of Electrical and Computer Engineering, University of California; Kuanping Shang, Department of Electrical and Computer Engineering, University of California; Yasumasa Kawakita, Department of Electrical and Computer Engineering, University of California; S. J. B. Yoo, Department of Electrical and Computer Engineering, University of California WB4

Integration of Passive Components with High Performance Quantum Dot lasers on Silicon

110

Wei Guo*, Rochester Institute of Technology WB5

Approaches for a Viable Germanium Laser: Tensile Strain, GeSn Alloys, and n-Type Doping

112

David Sukhdeo*, Department of Electrical Engineering, Stanford University; Hai Lin, PhotonIC Corporation; Donguk Nam, Department of Electrical Engineering, Stanford University; Ze Yuan, Department of Electrical Engineering, Stanford University; Boris Vulovic, APIC Corporation; Suyog Gupta, Department of Electrical Engineering, Stanford University; James Harris, Department of Electrical Engineering, Stanford University; Birendra (Raj) Dutt, APIC Corporation; Krishna Saraswat, Department of Electrical Engineering, Stanford University

WC

Optical Links

WC1

Integration of Silicon Photonics in a Bulk CMOS Memory Flow

114

Roy Meade*, Micron Technology, Inc. WC2

Development of a chip-to-chip optical interconnect system

116

Jianwei Mu*, Massachusetts Institute of Technology; Vivek Ragunathan, Massachusetts Institute of Technology; Lin Zhang, Massachusetts Institute of Technology; Shintaro Okamoto, Massachusetts Institute of Technology; Lionel Kimerling, Massachusetts Institute of Technology; Jurgen Michel, Massachusetts Institute of Technology WC3

Differential signaling for low optical energy consumption in datacom optical interconnects

118

Ioannis Roudas*, Cornig Inc.; B. Hemenway, Corning Inc.; Matthew Whiting, Corning Inc.; Richard Grzybowski, Photonic Controls WC4

Optical multi-Gbps board-to-board interconnection with integrated FPGA-based diagnostics

120

Ulrich Lohmann, University of Hagen; Juergen Jahns, University of Hagen; Anton Kuzmin*, Friedrich-Alexander-University of Erlangen-Nuremberg; Dietmar Fey, Friedrich-Alexander-University of Erlangen-Nuremberg WC5

Hybrid Integrated DWDM Silicon Photonic Transceiver with Self-Adaptive CMOS Circuits

122

Chin-Hui Chen*, Hewlett-Packard Company

WD

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Polymer Waveguide Based Optical Backplanes and Electro-Optical Assembly Technology for Computing Applications

124

Roger Dangel*, IMB Zurich Research Laboratory WD2

Apodized Focusing Subwavelength Gratings for Simultaneous Coupling of TE and TM modes

126

Zhenzhou Cheng*, The Chinese University of Hong Kong; Ke Xu, The Chinese University of Hong Kong; Chi Yan Wong, The Chinese University of Hong Kong; Hon Ki Tsang, The Chinese University of Hong Kong WD3

A Fully-integrated Flexible Photonic Platform for Chip-to-Chip Optical Interconnects

128

Juejun Hu*, University of Delaware; Lan Li, University of Delaware; Hongtao Lin, University of Delaware; Yi Zou, University of Delaware; Tian Gu, University of Delaware; Michael Haney, University of Delaware WD4

Efficient Surface Normal Multi-Stage Grating Couplers in Silicon Based Waveguides

130

John Covey*, University of Texas at Austin WD5

Millimeter-bending-radius fiber bus for optical interconnects

132

Veronique Francois*, Ecole de technologie supérieure; Francois Laramee, Reflex Photonics Inc.

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