IID-A

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

Herschel/Planck Instrument Interface Document IID PART A

Name

Signature

Prepared/

Herschel/Planck Project Team

compiled by

Alcatel / Astrium / Alenia

Agreed by

Instrument Pi's: Planck HFI: J.L.Puget Planck LFI: N.Mandolesi Herschel PACS: A.Poglitch Herschel SPIRE: M.Griffin Herschel HIFI: Th. De Graauw

Approved by

Industry Project Managers Alcatel J.-J. Juillet Alenia: P.Musi Astrium. W.Ruehe

Approved by

ESA Project Manager T.Passvogel ESA/ESTEC/SCI/PT

PAGE : i

IID-A

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : ii

DISTRIBUTION LIST (Distribution in electronic format (Adobe PDF) Qty

Organisation

Institute

e.mail

1

ESA

ESA

[email protected]

1

Prime Contractor

Alcatel

[email protected]

Planck PLM 1

Herschel EPLM

Astrium GmbH

[email protected]

1

SVM

Alenia

[email protected]

1

Herschel SPIRE

Univ.Cardiff/RAL [email protected]

1

Herschel PACS

MPE

[email protected]

1

Herschel HIFI

SRON

[email protected]

1

Planck LFI

TESRE/CNR

[email protected]

1

Planck HFI

IAS

[email protected]

1

Planck Reflectors

DSRI

IID-A

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : iii

DOCUMENT CHANGE RECORD IssueRev

Date

Version

Pages affected

1-0

01/09/2000

Initial Issue for ITT

New Document

2-0

31/07/2001

Issue for SRR

Complete Revision: Renaming of FIRST by Herschel. Changes marked by change bars (including editorial changes). PDR version Taking into account Alcatel Change requests HP-ASPI-CR 21, 22, 23, 24, 25

3-0

30/06/02

PDR version

HIFI Change requests HP-HIFI-CR- 9 issue 2, 16 issue 2, 18, 19, 20, 21 + red line copy including update of the spacecrafts design by industry Based on Instruments and industry comments, and evolution of the design., tracked by change record database IID-A_modification list_3.0_to_3.1.xls, on ftp server) Main changes are: Mechanical loads update (section 9), data handling refined (section 5.11), and most figures to comply with current design

3.1

12/02/2004

CDR version

Update of all interface control drawings (annexes) New annexes: System ICD (annex 9) (replace ICD templates) WIH ICD (annex 10 Herschel telescope ICD (annex 11) Planck scanning strategy (added in annex 2) Version for Planck PLM CDR

Includes the change database Comments on version IID-A 3.1.xls Version for Planck PLM Distributed as part of CDR the PPLM CDR data Only section 5, 7, and 9 have been updated pack + to instruments Section 5.17 added (lifetime) PPLM CDR version

3.2_draf 15/04/2004 t0

Planck PLM and S/C AIT sequences have been

IID-A

IssueRev

Date

Version

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : iv

Pages affected merged Change record included Complete issue Update Section 2 with AD / RD updated from modules & system CDR data-package Update section 4 with latest issues of the drawings, add 2 sections on Herschel OBA & Baffle, simplify section on cryocover Section 9: remove Planck SVM STM, & all tests after CQM cryo test

3.2 draft 30/06/2004 1

Section 10: update instrument delivery dates & system schedule

Not published. Completion of the PPLM CDR version

Annex 5 (SVM ICD) updated from new SVM MICD Complete new annexes 6 (H-PLM ICD) and annex 8 (cryoharness ICD), based on CDR ICD's from Astrium Annex 7 updated with the drawings available from PPLM CDR Annex 9: System ICD updated with lates version of drawings Annex 11: Update Herschel telescope EICD to issue 3.0 (small scatter cone) Add annex 12: SVM harness interfaces See complete change record below

System CDR Version. 3.3

30/06/2004

Change bars against issue 3.1

Section 2: Move 4 documents (Instruments testing at System Levels) from RD List to AD List, following recommendation from HPLM CDR (RD 30 ÆAD13 (Herschel, QM), RD31 ÆAD14 (Herschel FM) RD 33ÆAD15(Planck QM), RD34ÆAD16 (Planck FM)

are Add RD93, 94, 95, 76 Section 7: Update Planck test sequence to take into account the deletion of the Planck SVM STM (no tests after Planck cryo test Add section 7.3.5: Herschel cryostat ground interface temperatures, and 7.3.6: Herschel cryostat tilting

IID-A

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : v

TABLE OF CONTENTS section

title

Applicability responsibility for section edition

1

INTRODUCTION

H-P

ASP

2

APPLICABLE/REFERENCE DOCUMENTS

H-P

ASP

2.1

APPLICABLE DOCUMENTS

H-P

ASP

2.2

REFERENCE DOCUMENTS

H-P

ASP

2.3

LIST OF ACRONYMS

H-P

ASP

3

KEY PERSONNEL AND RESPONSIBILITIES

H-P

ASP

3.1

ESA PERSONNEL

H-P

ASP

3.2

CONTRACTOR PERSONNEL

H-P

ASP

4

SATELLITE DESCRIPTION

H-P

ASP

4.1

INTRODUCTION

H-P

ASP

4.2

SYSTEM DESCRIPTION

H-P

ASP

4.3

Herschel PAYLOAD MODULE (HPLM)

H

ASED

4.3.1

Herschel Telescope

H

ASED

4.3.2

Helium Cryostat

H

ASED

4.3.3

Herschel PLM Optical Bench Assembly (OBA)

H

ASED

4.4.4

Herschel PLM Optical Baffle design

H

ASED

4.3.5

Herschel PLM Cryo Cover

H

ASED

4.4

Planck PAYLOAD MODULE (PPLM)

P

ASP-PPLM

4.4.1

Planck Telescope and FPU

P

ASP-PPLM

4.4.2

PSVM Units

P

ASP-PPLM

4.5

SERVICE MODULES (SVM)

H-P

AL

4.5.1

Herschel Service Module

H

AL

4.5.2

Planck Service Module

P

AL

4.5.3

SVM Subsystems

H-P

AL

4.6

OPERATING MODES

H-P

ASP

4.6.1

Launch

H-P

ASP

4.6.2

Herschel

H

ASP

4.6.3

Planck

P

ASP

5

INTERFACE WITH INSTRUMENTS

H-P

ASP

5.1

IDENTIFICATION AND LABELLING

H-P

ASP

5.1.1

Project code

H-P

ASP

IID-A

section

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

title

PAGE : vi

Applicability responsibility for section edition

5.1.2

Unit identification code

H-P

ASP

5.1.3

Connector identification

H-P

ASP

5.2

COORDINATE SYSTEM

H-P

ASP

5.2.1

Spacecraft's Coordinate system

H-P

ASP

5.2.2

Instrument unit co-ordinate system

H-P

ASP

5.3

LOCATION AND ALIGNMENT

H-P

ASP

5.3.1

Instrument location

H-P

ASP

5.3.2

Instrument alignment

H-P

ASP

5.4

EXTERNAL CONFIGURATION DRAWINGS

H-P

ASP

5.5

SIZES AND MASS PROPERTIES

H-P

ASP

5.5.1

Mass tolerances

H-P

ASP

5.5.2

Centre of Gravity Location and Tolerances

H-P

ASP

5.5.3

Moments of Inertia and Tolerances

H-P

ASP

5.5.4

Overall Instrument Mass Allocation

H-P

ASP

5.6

MECHANICAL INTERFACES

H-P

ASP

5.6.1

Herschel Payload Module

H

ASED

5.6.2

Planck Payload Module

P

ASP-PPLM

5.6.3

Service Modules

H-P

AL

5.7

THERMAL INTERFACES

H-P

ASP

5.7.1

Herschel Payload Module

H

ASED

5.7.2

Planck Payload Module

P

ASP-PPLM

5.7.3

Service Modules

H-P

AL

5.7.4

Temperature monitoring

H-P

ASP

5.8

OPTICAL INTERFACES

H-P

ASP

5.8.1

Herschel Instruments

H

ASED

5.8.2

Planck Instruments

P

ASP-PPLM

5.9

POWER

H-P

ASP

5.9.1

Thermal dissipation on Herschel Payload Module

H

ASED

5.9.2

Thermal dissipation on Planck Payload Module

P

ASP-PPLM

5.9.3

Thermal dissipation on Herschel Service Module

H

AL

5.9.4

Thermal dissipation on Planck Service Module

P

AL

5.9.5

Power Supply - Load on main-bus

H-P

ASP

5.10

CONNECTORS, HARNESS, GROUNDING, BONDING

H-P

ASP

IID-A

section

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

title

PAGE : vii

Applicability responsibility for section edition

5.10.1

Connectors

H-P

ASP

5.10.2

Harness

H-P

ASP

5.10.3

Grounding and Isolation

H-P

ASP

5.10.4

Bonding

H-P

ASP

5.11

DATA HANDLING

H-P

ASP

5.11.1

Telemetry

H-P

ASP

5.11.2

SSR Mass Memory

H-P

ASP

5.11.3

Timing

H-P

ASP

5.11.4

Tele-commands

H-P

ASP

5.11.5

Polling Strategy

H-P

ASP

5.11.6

Special signals

H-P

ASP

5.11.7

Interface circuits

H-P

ASP

5.11.8

Application Process Identifiers

H-P

ASP

5.11.9.

Observation Identifiers

H-P

ASP

5.11.10.

Addresses on 1553 bus

H-P

ASP

5.12

ATTITUDE AND ORBIT CONTROL/POINTING

H-P

ASP

5.12.1

Terminology

H-P

ASP

5.12.2

Herschel Pointing Requirements

H

ASP

5.12.3

Planck Pointing Requirements

P

ASP

5.12.4

Herschel Scientific Pointing modes

H

ASP

5.12.5

Calibration

H-P

ASP

5.12.6

On-Target Flag

H

ASP

5.12.7

Planck Reference Star Pulse

P

ASP

5.12.8

Herschel Slews

H

ASP

5.12.9

Planck Slews

P

ASP

5.12.10.

Attitude constraints

H-P

ASP

5.13

ON-BOARD HARDWARE/SOFTWARE AND AUTONOMY FUNCTIONS

H-P

ASP

5.13.1

On-board hardware

H-P

ASP

5.13.2

On-board software

H-P

ASP

5.14

EMC

H-P

ASP

5.14.1

Electrical Interfaces

H-P

ASP

5.14.2

Harness, Connectors and Shielding

H-P

ASP

IID-A

section

title

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : viii

Applicability responsibility for section edition

5.14.3

EMC Performance Requirements

H-P

ASP

5.14.4

Conducted Emission/Susceptibility

H-P

ASP

5.14.5

Radiated Emission/Susceptibility

H-P

ASP

5.14.6

Frequency Plan

H-P

ASP

5.14.7.

Plug-in and Inrush current

H-P

ASP

5.15

INSTRUMENT HANDLING

H-P

ASP

5.15.1

Transport container

H-P

ASP

5.15.2

Cleanliness

H-P

ASP

5.15.3

Physical handling

H-P

ASP

5.15.4

Purging

H-P

ASP

5.15.5

Mechanism positions

H-P

ASP

5.16

Environment requirements

H-P

ASP

5.16.1.

Pressure environment

H-P

ASP

5.16.2.

Radiation environment

H-P

ASP

5.17

Lifetime

H-P

ASP

5.16.3.

Micrometeorite environment

H-P

ASP

6

GROUND SUPPORT EQUIPMENT

H-P

ASP

6.1

Mechanical Ground Support Equipment

H-P

ASP

6.2

Electrical Ground Support Equipment

H-P

ASP

6.3

Commonality

H-P

ASP

6.3.1

EGSE

H-P

ASP

6.3.2

Instrument Control and Data Handling

H-P

ASP

6.3.3

Other Areas

H-P

ASP

7

INTEGRATION, TESTING AND OPERATIONS

H-P

ASP

7.1

AIV Sequence Overview

H-P

ASP

7.1.1.

Herschel/Planck Satellites Model Philosophy

H-P

ASP

7.1.2.

Herschel AIV Sequence Overview

H-P

ASED

7.1.3.

Planck AIV Sequence Overview

P

ASP-PPLM

7.1.4.

Satellite Test Plans - Summary

H-P

ASP

7.2

Integration

H-P

ASP

7.2.1

HPLM Integration

H

ASED

7.2.2

PPLM Integration

P

ASP-PPLM

7.2.3

HSVM Integration

H

AL

IID-A

section

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

title

PAGE : ix

Applicability responsibility for section edition

7.2.4

PSVM Integration

P

AL

7.2.5

Herschel S/C PFM Integration

H

ASED

7.2.6

Planck S/C Integration

P

ASP-PPLM

7.3

Herschel Testing

H

ASED

7.3.1

Herschel PLM CQM Testing

H

ASED

7.3.2

Herschel S/C CQM Testing

H

ASED

7.3.3

Herschel PLM PFM Testing

H

ASED

7.3.4

Herschel S/C PFM Testing

H

ASED

7.3.5

Thermal interface temperatures for Instruments testing on ground

H

ASED

7.3.6

Herschel EQM & PFM orientation during Instrument testing

H

ASED

7.4

Planck testing

P

ASP-PPLM

7.4.1

Planck S/C CQM Testing

P

ASP-PPLM

7.4.2

Planck S/C FM Testing

P

ASP-PPLM

7.5

Operations

H-P

ASP

7.6

Commonality

H-P

ASP

8

PRODUCT ASSURANCE

H-P

ASP

9

DEVELOPMENT and VERIFICATION

H-P

ASP

9.1

General

H-P

ASP

9.1.1

Definitions

H-P

ASP

9.1.2

Documentation

H-P

ASP

9.2

Model Philosophy

H-P

ASP

9.2.1

Spacecraft Models

H-P

ASP

9.2.2

Deliverable Instrument Models

H-P

ASP

9.3

Deliverable Instrument Test Plan

H-P

ASP

9.3.1

Instrument Verification

H-P

ASP

9.3.2

Instrument Scientific Performance Validation

H-P

ASP

9.4

Design and Analysis Requirements

H-P

ASP

9.4.1

Mechanical Design and Analysis

H-P

ASP

9.4.2

Thermal Verification Requirements

H-P

ASP

9.4.3

Mechanism Verification Requirements

H-P

ASP

9.4.4

Electrical and Software Verification Requirements

H-P

ASP

9.4.5

Radiation Environment Verification

H-P

ASP

IID-A

section

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

title

PAGE : x

Applicability responsibility for section edition

9.5

Verification and Testing

H-P

ASP

9.5.1

General Test Requirements

H-P

ASP

9.5.2

Test Level Tolerances

H-P

ASP

9.5.3

Mechanical Verification and Testing

H-P

ASP

9.5.4

Thermal Verification and Testing

H-P

ASP

9.5.5

Mechanism Verification and Testing

H-P

ASP

9.5.6

EMC Verification and Testing

H-P

ASP

9.5.7

Qualification to the Radiation Environment

H-P

ASP

10

MANAGEMENT, PROGRAMME, SCHEDULE

H-P

ASP

10.1

General

H-P

ASP

10.2

Management

H-P

ASP

10.2.1

ESA Responsibilities

H-P

ASP

10.2.2

ESA Organisation

H-P

ASP

10.2.3.

Prime contractor Responsibilities

H-P

ASP

10.2.4.

Prime contractor Organisation related to instrument interfaces

H-P

ASP

10.2.5

Principal Investigator Responsibilities

H-P

ASP

10.2.6

Instrument Team Organisation

H-P

ASP

10.2.7

Formal Communication

H-P

ASP

10.2.8

Financing

H-P

ASP

10.3

Project Control

H-P

ASP

10.3.1

Project Control Objectives

H-P

ASP

10.3.2

Project Breakdown Structures

H-P

ASP

10.4

Schedule Control

H-P

ASP

10.4.1

Baseline Master Schedule

H-P

ASP

10.4.2

Schedule Monitoring

H-P

ASP

10.4.3

Schedule Reporting

H-P

ASP

10.5

Configuration Management

H-P

ASP

10.5.1

Objectives

H-P

ASP

10.5.2

Responsibilities

H-P

ASP

10.5.3

Configuration Identification

H-P

ASP

10.6

Configuration Control

H-P

ASP

10.6.1

Instrument Internal Configuration Control

H-P

ASP

IID-A 3.3

Change Notice: issue 3.1 3.2 --> 3.3

on ID issue 3.1 3.1

Ref

Com Origi Sectio ment n n Nb from

HFI/IAS/JC HFI JC h 04-008 HPLM PM 639 ASP BC 20 176

iv

28

red team wk 7

ASP YR

gener al

3.1

29

red team wk 7

ASP YR

gener al

3.1

86

red team wk 7

ASP PR

Gener al

3.1

627

mail 30-03ESA PE 2004

Gen

3.1

628

mail 30-03ESA PE 2004

Gen

3.1

3.1

629

630

631

mail 30-03ESA PE 2004

mail 30-03ESA PE 2004

mail 30-03ESA PE 2004

title, fig, Remarks table, or req

ii

3.1

3.1

Page

table of content

Distribute in electronic format to : [email protected] replace table of content by applicability/responsibility matrix some inputs missing from ALS: - fig 5.6.3-7, -8, -9 - screws page 37 - sorption attachment page 41 MS Word bug: some sections are not properly numbered (eg 5.1.1.3 => 5.6.1.3 and following, 5.1.1.4 => 5.10.3.4 and following) Il faut bien distinguer dans l'IID-A 3 types de texte: - les exigences vis à vis des instruments (type GDIR ou verif): "The instrument shall…" - des exigences vis à vis des satellites : "The spacecraft shall…" - des parties descritives: "The spacecraft is..." It is not obvious how this document, as it stands today, can effectively document and control proper implementation of the instrument requirements as captured in the IID-Bs. It should document a design, some parts do, some do not. The introduction states (page 1-1) that the "IID-A describes the implementation of the instrument requirements...".Because much of the text in the IID-A (not only section 4) is descriptive in nature it is not easy throughout the document to entangle descriptions, "requirements" on the instruments, "requirements" on the spacecraft and committing implementation/design. This is quite evident in the electrical part where, in particular, implementation details are relegated to (probably outdated) Reference Documents, e.g RD42 to RD45.

Page 1

Industry Reply, or ref OK

y

y

y

y

y

y

Yes. The information came after this edition, and is now available. Will be updated

y

y

y

BC

Identified in 7 positions: also 5.6.3.3, 5.8.2.2, 5.10.3.4, 5.12.5.2, 5.14.2.12, 7.4.1.5, and 9.5.3,& follow (BC)

y

y

at pdf output

BC

so what ? Rewrite the document ?

y

n

y

BC

Agree. There are many critics against this document, but this is the only one we have. Do you have a better proposal ?

y

n

y

BC

Agreed, but how would you like the document to be modified ?

y

n

y

BC

IID-A is applicable to the instruments. So it should appear in their verification matrix (throuh applicability matrix). In is proposed in the next y version to enrich the table of content with an applicability matrix (Herxhel/planck, and modules)

y

y

BC

y

y

y

BC

SCS interface document appears as annex to LFI IID-B, and is considered as such. In term on interface management, we discussed directly with JPL (for the TMU). The situation is y less clear with the SCE, which is more in a free running mode. This has been highligted several times to HFI/LFI management.

n

y

BC

y

n

y

BC

y

y

y

BC

n

y

BC

n

y

BC

Gen

Gen

IID-A and IID-Bs go hand in hand. They shall be mutually complete and consistent. Is Industry checking that this is 100% the case, i.e. that for every VCD will be written (IID-A against IID-Bs), for "requirement"/ goal in one IID-B there is a system CDR corresponding design "solution" in the IID-A? Is this addressed during the instrument I/F meetings? (this is not intended to sound like an insult...)

Gen

The position of the Sorption Cooler w.r.t. the IID-A is unclear. Is it an "instrument" of its own (as it should be, I believe) or a subset of LFI, managed by HFI? For the operations it is a full instrument, that shall have its own Identification and Labelling (chapter 5), User's Manual, Data Base, set of Flight Procedures, OBSW management, etc. etc. Note also that several of the unsettled issues in the IID-A concern the SCS.

632

mail 30-03ESA PE 2004

Gen

3.1

633

mail 30-03ESA PE 2004

Gen

3.1

634

mail 30-03ESA PE 2004

Gen

3.1

635

mail 30-03ESA PE 2004

Gen

There are several places in the IID-A (e.g. 5-9, 5-33, 540, 123, and many places in chapter 7) where assumptions are made, some quite important. These can you be more explicit on the type of should be tracked systematically and resoved, i.e. assumptions ? validated or otherwise as quickly as possible. By the time of the "system" CDR most (if not all) should have been resolved. There are many places in the IID-A containing TBDs and TBCs. Some are certainly trivial and can be resolved at a later stage i.e. past CDR, for other this is not so clear. In particular in chapter 7, the There was a campaign after PDR to track TBD accumulation of assumptions, TBDs and TBCs is and TBC's. Most of them have been resolved. cause for concern since this affects directly integration and testing, therefore has the potential to TBD/TBC will be tracked before issuing version 3.2 draft. seriously disrupt the entire schedule if some assumptions are wrong and some TBDs/TBCs not closed on time. These should be tracked systematically and resoved as quickly as possible.

For all thes items (HIFI bridging wave guides due to late definition of LSU, and DECMEC late definition (no ICD tet on 30/3/04), this is due to the lack of the instrument unit ICDs. Therefore industry took the lead to define the boundary conditions (formalized by a system ICD to be found in annex 9) to help both parties to continue y their design. HIFI never completely accepts their responsibility in the bridging wave guides. PACS agreed (our ICD is in PACS IID-B), but has little control on their contractors (CSL + belgium industry, through prodex). Latest CR on DECMEC confirmed this. Sorption cooler fixation is now closed. Definition came after edition of IID-A 3.1? And should be available in issue 3.2. However, the relevance of the baseplate has been re-discussed by ESA open points (SCS): MGSE and SCC fixation on SVM (change the pipes to compressor position by (p. 5-40); Thermal and EMC impact of 4K regulator 2mm). move to the shear web (p. 5-42); HFI PAU and LFI y 4K regulator position does not affect the BEU temperature stability requirements (vesrsus goal) instrument, as the cable to the 4K cooler (p. 5-64). Same as for points 6-8. This should be electronics & compressor (Y shaped) is tracked by Industry and closed as quickly as possible. maunufactured by industry. HFI PAU/REU temperature stability has been accepted by industry, and is considered as a requirement for TCS, and tracked at this level. There are several places in the IID-A where interfaces are not settled, e.g. (i) "details need to be agrreed between instrument and spacecraft", page 5-16; (ii) "flexible bridging wave guides interface to LSU unit are assumed to be delivered by HIFI"; (iii). DECMEC ICD not available from PACS. Industry should keep a controlled list of all these issues, with due dates for closing, in such a way that no interface issues remain unsolved at the time of the CDR. Is this the intention? These should be tracked systematically and resoved as quickly as possible.

Done in Reply by IID-A

done, & proposed to ASED/ESA/AL

The IID-A places several requirements on the instruments (chapter 5 and chapter 9), so it goes further than its stated purpose in page 1-1. Is there a rigorous process in place that checks that the instruments really fulfil these requirements and if not (when not) that work around solutions are implemented ? I assume that this is in the hands of PA/QA via the RFD / RFW set up. Is this watertight?

3.1

Modify reply IID-A (Y/N)

BC

IID-A 3.3

Change Notice: issue 3.1 3.2 --> 3.3

on ID issue

Ref

Com Origi Sectio ment n n Nb from

Page

title, fig, Remarks table, or req chapters 5.9.5 and 5.10: It is completely unclear if these are requirements to be fulfilled by the instruments, requirements on the PCDU (in this case they should not be requirements but description of a spacecraft implementation that fulfills the instrument requirements) or a mixture of both. Please clarify. Maybe it is sufficient to replace "shall" by "will" in most cases??? It seems that a lot of text that does not really describe design solutions could be removed. It would make the whole document shorter, crisper and easier to maintain.

Page 2

Industry Reply, or ref

Modify reply IID-A (Y/N)

Done in Reply by IID-A

5.9.5 is clearly a max power allocation = requirement. 5.10 are design drivers. We have started the requirement identification which is not finished, and should allow to clearly identify the requirement from drescription or performances.

y

y

y

BC

This has to be discussed. Sometimes descriptions of performances have been added to temper the y requirements.

n

y

BC

Difficult. IID-A is usually published at main satellite reviews, together with many documents. We will inform the instrument of the update of the y main AD/RD's in between, and upload the documents on the ftp server. A note has been added for that.

n

y

BC

this is late, but OK

y

y

BC

y

y

BC

y

y

BC

n

y

BC

3.1

636

mail 30-03ESA PE 2004

Gen

3.1

637

mail 30-03ESA PE 2004

Gen

3.1

mail wvL 386 5/3/04

3.1

328

3.1

mail 30-03468 ESA CS 2004

2-1

02-01

3.1

469

mail 30-03ESA PE 2004

2-1

02-01

3.1

470

mail 30-03ESA PE 2004

2-1

02-01

3.1

471

mail 30-03ESA PE 2004

2-2

02-02

Proper title for RD6 is "System Operations and FDIR" "System Operations and FDIR requirements" Operational -> operations agreed

y

y

y

BC

y

y

y

BC

y

y

y

BC

y

y

y

BC

y

y

y

BC

y

y

y

BC

y

y

y

BC

red team wk 7

HIFI

WvL

ASP PC

2.1

Applicable / 02-01 reference How to ensure latest version is applicable? documents

2.1

02-01

add RD12: H-P-1-ASPI-SP-0017_1.0 "radiation requirements"

y

agreed, but not all versions are available. This Issue and date of AD1-1, 2, 3, 4 shall be changed to was consistant at the date of publication of this y the PLM CDR versions (outcome of ESA IID-B CCB). document. Will be updated accordingly. AD4-1 and AD4-2 should be removed since (rightly!) OK They are never used in IID-A as a reference the IID-A does not cover the I/Fs with ICC, HSC and and are here for historical reasons. But where are y DPCs. they applicable to the instruments ? No. This is transparent to instruments, and they (probably) the Space-to-Ground ICD should be added are not interested by the physical aspects of the y as an AD. links S/C to ground. PS-ICD and OIRD should be sufficient to them.

3.1

662

ASP BC

2.2

02-02

add RD13 Solid Particle Environment for Herschel and Planck", EMA/02-027/GD/PLCK, 08/03/2002ESA/TOS-EMA

3.1

664

ASP BC

2.2

02-02

Split RD 26 Planck AIT Plan into RD26-1: Planck FM AIT Plan H-P-3-ASPI-PL-0208 RD26-2: Planck CQM AIT Plan H-P-3-ASP-PL-0668 RD26-3: Planck RFQM AIT Plan H-P-3-ASP-PL-0669 add 2 reference documents (synthesis of Planck instruments tests at QM or FM levels): RD 33 - H-P-3-ASP-PL-0675: HFI testing on CQM SM level RD 34 - H-P-3-ASP-PL-0676: Planck instruments testing at FM level new RD 33: H-P-3-ASP-PL-0675: HFI testing on CQM SM level new RD 34: H-P-3-ASP-PL-0676: Planck instruments testing at FM level (see comment 643) Update document issues: thermal analysis reports Updated PPLM to issue 2, HPLM to issue 4 add RD 90H-P-3-ASP-TN-0185 Planck cryogenic & included thermal test program

3.1

643

ASP BC

2.2

02-03

3.1

663

ASP BC

2.2

02-03

3.1

665

ASP BC

2.2

02-03

3.1

666

ASP BC

2.2

02-04

2.3

List of 02-05 acronyms

Add PR, SR (ref. section 5.15.2.3)

agreed. Primary & secondary reflectors

y

y

y

BC

I.Bén 3.2.1 ilan

03-02

Doubrovik, without c before k

ok

y

y

y

BC

CS

03-03

Typo : Juergen Kroeker (not Juerhen Kroeker)

Typo thank you

y

y

Y

BC

04-02

Orbit angle for Planck is 15 degrees.

yes for the earth, but the sun/SC aspect angle remains < 10° as indicated on p 4-2. So no change in the current text

y

n

y

BC

04-02

Not true for Planck: PSO, not the DPC, will provide MOC with 'observation schedules'.

OK, replace DPC by PSO=Planck Science Office

y

y

y

BC

4.2

04-02

3rd paragraph: ground station is New Norcia. Kourou is used during LEOP, Commissioning and PV.

OK text to be modified acordingly

y

y

Y

BC

4.2

04-04 Figure 4.2-2 HFI Dilution Cooler exhaust "T" is not shown

Yes, but this is not really important here… Drawing will be updated if a new one is available

y

y

Y

BC

y

Y

BC

y

Y

BC

3.1 3.1 3.1

mail wvL 387 HIFI 5/3/04 red team 69 ASP wk 7 mail 30-03472 ESA 2004

WvL

3.1

mail 30-03473 ESA JT 2004

3.1

mail 30-03474 ESA JT 2004

3.1

mail 30-03475 ESA PE 2004

3.1

177

3.1

476

3.1

178

3.1

179

3.1

180

3.1

181

HFI/IAS/JC HFI h 04-008 mail 30-032004 HFI/IAS/JC h 04-008 HFI/IAS/JC h 04-008 HFI/IAS/JC h 04-008 HFI/IAS/JC h 04-008

JC

3.2.2 4.2 4.2

Page in the header shall be 4-24 (not 24) Same 04-24 comment for the following pages of chapter 4 REU location is no longer correct, (and 2d star tracker 04-17 Figure 4.4-1 not shown) 3d line :" … and the Read-Out PAU Unit of the HFI 04-20 instrument"

OK. Typo probably due to section change. Will be y corrected Agreed. Drawing will be updated if a new one is y available

ESA CS

4.2

HFI

JC

4.4

HFI

JC

4.4.2

OK replace Read-Out Unit by PAU

y

y

Y

BC

HFI

JC

4.5.3

04-22 Figure 4.5-1 Scanned (?) figure impossible to read

updated

y

y

Y

BC

HFI

JC

4.5.3

04-23 Figure 4.5-2 Scanned (?) figure impossible to read

updated

y

y

Y

BC

y

y

Y

BC

y

y

Y

BC

y

y

y

Second paragraph shall be changed against : A modular approach is also used for the accommodation of units on the lateral panels: the avionics on Herschel SVM is concentrated on 3 of the 8 panels, the avionics on Planck SVM is located on 2 agreed of the 8 panels. The instrument warm units have dedicated panel(s) per instrument, sharing 4 panels (Herschel) or 6 panels (Planck).

3.1

477

mail 30-03ESA CS 2004

4.5.3. 1

3.1

182

HFI/IAS/JC HFI h 04-008

4.5.3. 04-24 to 1 29

3.1

mail 30-03478 ESA CS 2004

4.5.3. 9

HFI/IAS/JC 183 HFI h 04-008 HFI/IAS/JC 184 HFI h 04-008

JC

4.5.3. 9

04-27 Fig 4.5-4

"4KCRU" is not correct, replace by "4KCCR"

OK. Are HFI names stables now ?

y

y

Y

BC

JC

4.6.1

04-29

Sentences 2 and 3 are not coherent

Agreed. This will be corrected. I propose to remove the 2nd sentence.

y

y

Y

BC

3.1 3.1

JC

04-24

04-25

OK. Editorial. Thanks for the remark. See what we can do. there are no pyrotechnic pulses in Herschel nor Clarify if harness for ‘pyrotechnic pulses’ is needed on Planck. The only device under this type could be H/P the NCA's to open the Herschel cover.

Page number do not include chapter prefix

IID-A 3.3

Change Notice: issue 3.1 3.2 --> 3.3

on ID issue

Ref

Com Origi Sectio ment n n Nb from

3.1

479

mail 30-03ESA CS 2004

4.6.2

3.1

480

mail 30-03ESA PE 2004

4.6.2

3.1 3.1

Page

04-29

Nominally observation/schedule parameters, i.e. the MTL is loaded for the next 24h (top-up) not 48h. 4- 8/ 29 Drawing Her. NT. 0167. T. ASTR ICD DT0021222 04-08 Table 4.3.1- says Scattering cone diameter = 38mm only one of 1 the 2 can be correct. make consistent

mail PAC 4.3.3. 437 Wildgruber ng- 1 S 1 3/3/04 mail 30-03ESA TP 5 05-001 481 2004

185

HFI/IAS/JC HFI h 04-008

JC

5.1.2 05-001

3.1

482

mail 30-03ESA CS 2004

5.1.3 05-002

3.1 3.1 3.1

red team 89 wk 7 red team 90 wk 7 red team 91 wk 7

3.1

71

3.1

92

red team wk 7

red team wk 7 red team 30 wk 7

S/C I.Bén ASP 5.2.1 05-002 coordinate ilan system

ASP PR

5.2.1 05-002

ASP PR

5.2.1 05-002

ASP PR

OK, covered by above statement

y

y

Y

BC

ICD has to be updated, nit table. Small scatter cone is used (33mm) Done

y

y

Y

BC

Delete first sentence

Agreed

y

y

y

BC

y

y

BC

y

y

y

BC

y

n

y

BC

y

y

y

BC

not in the text

y

n

n

BC

OK

y

y

y

BC

OK

y

y

y

BC

OK

y

y

y

BC

OK

y

y

y

BC

OK

y

y

y

BC

y

y

y

BC

add the compliance with HFI Dilution valve opening

3.1

red team wk 7 red team 88 wk 7

BC

07-27

ASP PR

87

Y

7.5

646

3.1

y

05-001

3.1

red team wk 7

y

5

mail 30-03ESA JT 2004

70

Done in Reply by IID-A

Agreed. SRS related requirements are included in a new section 5.17: "The Herschel and planck satellite lifetime will be as follows: For the Herschel mission , the Herschel There are no lifetime requirements on the instruments spacecraft shall have a nominal lifetime of 3.5 y apart from a single sentence stating the mission years from launch till the end of the mission. This lifetime. A proper requirements should be placed. duration includes an allocation of 6 months for the transfer to the L-2 Lissajous orbit. For the Planck mission , the Planck spacecraft shall have a nominal lifetime of at least 21 months from launch till the end of mission."

624

3.1

Modify reply IID-A (Y/N)

Industry Reply, or ref

The last paragraph contain ‘… and the observation/schedule parameters for the next 48 hrs will be uplinked.’ OK. Add: In addition, the second half of the upFor clarification, the paragraph shall also include the linked observation/ schedule parameter will be statement, that the second half of the uplinked updated during next (24 hours) ground contact. observation/ schedule parameter usually are updated during next (24 hours) ground contact.

04-29

3.1

3.1

title, fig, Remarks table, or req

Page 3

5.2.1 05-002

ASP PR

5.2.1 05-002

ASP PR

5.2.1 05-002

OK + the 4K launch lock. Section removed in 3.2_draft OK. This was directives at the start of the As seen in the IID-A itself, for many units 3 characters programme. We use what it as it was used by are not enough to units/harnesses identification instruments. No need to change the requirement now. The references in the last paragraph are wrong. Shall be exchanged against: .. RD10 (PFM) and RD11 OK. Thank you (EQM).

Make link "satisfies" to HERS-0320 Make link "satisfies" to HERS-0340 Make link "satisfies" to SVM-RS GEF-40-H Make link "satisfies" to PPLM-IFAS PPIF-ME-100 (TBW) Make link "satisfies" to PPLM-IFAS PPIF-ME-120 (TBW) 1e paragraphe: l'origine est à l'interface satellite/launcher pour les 2 satellites 2e paragraphe à supprimer (redondant with what follows) 3e paragraphe préciser que c'est le repère Herschel, et que Xhsc est "positive towards the payload" HPLM reference frame: parallèle au repère satellite. Supprimer le paragraphe sur Xhplm Planck X-axis: dire "nominally coincides with the longitudinal launcher axis"

Instrument I.Bén ASP 5.2.2 05-003 unit coilan ordinate

Not OK with GDIR §4.1.2

OK, but was defined before the existance of the GDIR, and this is too late to be modified. I just add a not indicating the non conformity

ASP PR

5.2.2 05-004

"as described in 5.2.1" à supprimer

OK

y

y

y

BC

ASP YR

5.3.1. 05-004 1

BOLA to be removed. Also in section 5.10.2.1 (p89)

OK

y

y

y

BC

3.1

red team 93 wk 7

ASP PR

5.3.1. 05-004 1

Table 5.3.1-1: SVM units "to be agreed upon on a case by case basis". On est maintenant d'accord sur les interfaces WU . Phrase à supprimer.

OK

y

y

y

BC

3.1

H-P-ASP330 MN-4530

ASE SI D

5.3.1. 05-004 1.

+ General ralated to LOU support, use the following names definition: LOU baseplate for the HIFI delivered LOU baseplate LOU support Plate for the ASED delivered plate. The LOU support Plate and the LOU struts form the LOU structure

OK

y

y

y

BC

3.1

mail PAC 439 Wildgruber rk- 1 S 3/3/04

5.3.1. 05-004 1

remove in the second line the words …” PACS Bolometer Amplifier Unit BOLA and the ”…

OK Thank you same as 92

Y

y

y

BC

3.1

388

fig 3.1.1; is there for information, unless you are able to do something with it. It will be updated when a better figure will be delivered by ASED. Annex 6 will be updated by ESAD for H-PLM CDR.

Y

n

y

BC

3.1

mail 30-03483 ESA TP 2004

agree. This was discussed with ASED and minuted in the last HPLM PM. See ASED comments n° 330 LOU baseplate for the HIFI delivered LOU baseplate LOU support Plate for the ASED delivered plate.

y

y

y

BC

3.1

241

red team wk 7

ASP JPC

5.3.1. 05-008 2

included in table 5.3.1-2

y

y

y

BC

3.1

94

red team wk 7

ASP PR

5.3.1. 05-008 2

OK

y

y

y

BC

mail 30-03484 ESA TP 2004 red team 48 ASP PM wk 7

5.3.2. 05-009 1 5.3.2. 05-009 1

3.1

3.1 3.1

mail wvL 5/3/04

HIFI

PLL

5.3.1. 05-005 Fig. 5.3.1-1 Fig. 5.3.1-1 and annex 6 outdated: IID-B is ruling! 1

5.3.1. 05-007 1

Figure 5.3.1-3: It would help to use consistently the same definitions, i .e. support frame – mounting structure, or even better to add somewhere a clear definition. add reference for HFI Helium tanks: 3He: +Z 4He #1 +Y 4He #2 -Z 4He #3 -Y Table 5.3.1-2: SVM units "to be agreed upon on a case by case basis". On est maintenant d'accord sur les interfaces WU . Phrase à supprimer. First sentence: AD7.1 has a different name/title

agreed: change to Herschel alignment concept

y

y

y

BC

Remplacer Herschel alignment plan par "Herschel alignment Concept"

OK

y

y

y

BC

IID-A 3.3

Change Notice: issue 3.1 3.2 --> 3.3

on ID issue

3.1

Ref

H-P-ASP331 MN-4530

Com Origi Sectio ment n n Nb from ASE SI D

Page

title, fig, Remarks table, or req

5.3.2. 05-009 1

3.1

485

mail 30-03ESA TP 2004

5.3.2. 05-009 2

3.1

486

mail 30-03ESA CS 2004

5.3.2. 05-009 2

3.1

332

H-P-ASPMN-4530

ASE SI D

5.3.2. 05-009 2

3.1

389

mail wvL 5/3/04

HIFI

5.3.2. Local 05-009 2 Oscillator

3.1

mail 30-03487 ESA TP 2004

5.3.2. 05-009 3

3.1

153 100204-1

ASP JBR

5.3.2. 05-009 3.1 3

ASP PM

5.3.2. 05-009 3

3.1

49

3.1

488

3.1

72

red team wk 7

WvL

mail 30-03ESA TP 2004

5.4

red team wk 7

5.4

ASP

I.Bén ilan

3.1

mail 30-03489 ESA TP 2004

3.1

390

mail wvL 5/3/04

HIFI

WvL

3.1

73

red team wk 7

ASP

I.Bén 5.5.1 ilan

3.1

3.1 3.1 3.1

mail 30-03491 ESA CS 2004 74

red team wk 7

ASP

5.5.2

5.5.3 5.5.3

I.Bén 5.5.3 ilan

3.1

75

3.1

186

HFI/IAS/JC HFI h 04-008

3.1

335

H-P-ASPMN-4530

ASE SI D

3.1

76

red team wk 7

ASP

ASP

5.5

I.Bén 5.5.2 ilan

red team 31 ASP YR wk 7 mail 30-03490 ESA TP 2004 red team wk 7

5.4

JC

5.5.3

Add a requirement for instruments to provide a measurement to reference the alignment cube to the dowel pin (for SPIRE /HIFI LOS referenced to PACS First Para: Provide description of real implementation: “will need” – uses; “shall” – will; “If the” – The; Last sentence first para: explain: “it will be very difficult ” ; To be verified: Does the plan/concept – annex 1 provide all necessary info to verify the alignment requirements??? Be more precise in the second paragraph at what ‘various stages’ (after TV? After transportation? …) alignment monitoring is planned. Remove Last sentence of first paragraph 2nd paragraph: change "pieces of special GSE" by "camera heads", and add baseplate at the end. Add a paragraph related to the delivery of pentaprism by HIFI Second paragraph / last sentence should be: “on the LOU support structure.” We speak probably just LFI alignment – should be clearer. The description is not very clear and need to be clarified/improved "with 2 calibrated pins on telescope side and 1 calibrated hole plus 1 extended hole one FPU side" to be replaced by "with 2 bushes per foot and 2 calibrated pins on telescope side and 13 calibrated hole plus 1 extended hole one FPU side"

5.5.3 05-012

5.5.4. 05-012 1

492

3.1

77

red team wk 7

Are masses fully in line with the IID-B’s??

3.1

78

red team wk 7

3.1

494

3.1

mail wvL 391 5/3/04

3.1

115

red team wk 7

ASP DF

5.6.1 05-013

Le télescope n'est pas mentionné dans ce paragraphe. C'est normal ?

3.1

493

mail 30-03ESA TP 2004

5.6.1. 05-013 1

First sentence: Do we have a standardised mechanical interface?? – seems not – remove sentence

Herschel I.Bén 5.5.4. 05-012 instruments Make link "satisfies" to SRS Ch.5 SGEN-050 H/P ilan 1 allocated Planck I.Bén 5.5.4. ASP 05-012 instruments Make link "satisfies" to SRS Ch.5 SGEN-050 H/P ilan 2 allocated ASP

HIFI

WvL

Modify reply IID-A (Y/N)

Done in Reply by IID-A

details to be provided by ASED (AI1). I include: Instruments are requested to provide position of their optical reference (FPU alignment cube) wrt the reference FPU dowel pin (at room & cryo temperatures).

y

y

y

BC

Text clarified, last sentence removed (see comment ASED 331)

y

y

y

BC

add "as described later in section 7.3"

y

y

y

BC

OK

y

y

y

BC

no: the LOU baseplate, (see ASED comment 330)

y

n

y

BC

add (LFI) after FPU.

y

y

y

BC

OK

y

y

y

BC

y

y

y

BC

y

y

y

BC

y

y

y

BC

y

n

y

BC

y

n

y

BC

y

n

n

BC

y

y

y

BC

y

n

n

BC

y

n

y

BC

y

y

y

BC

y

n

n

BC

y

n

y

BC

y

y

y

BC

MOI for LOU radiator (ref fax HP-FX-870/02 (16/2/02) add a spec for the maximum inertia of the LOU to be confirmed by ASED (AI2) Iy=3 kg.m2 Izz=2 kg.m2

3.1

mail 30-03ESA PE 2004

Industry Reply, or ref

Rajouter en fin de paragraphe la phrase suivante: "The horns phase centres position along ZRDP at OK operationnal shall be known with the acuracy required in the Planck alignment Plan(AD 7-2) “harness interface filler ” came in issue 3. No explanation. Will be Removed. Could you clarify why “harness interface filler ”; Areas of harness fixations are free areas on the 05-010 “Identification of areas of harness fixation ” is to be in unit where harness fixation devices can be the external confi drawings of the units? located (and after iteration & definition shall be paint free areas) Consistency with ICD in Appendix 1 of GDIR to be 05-010 ICD OK, but too late checked. Second para: The provision of 2D drawings in certain This is an agreement, leaving some freedom. Pdf 05-011 formats, incl CAD … – is this a requirement?? And is the most widely used. agreed by instruments your CR on the last HIFI (significant) mass increase has no influence on the mass allocation. 05-012 table 5.5.4-1 Mass figure in table inconsistent with CR-96V2 . The relevant parameter for us is the overall instrument allocations (Herschel + Planck), see our presenation at last QPM. Mass Make link "satisfies" to GDIR GDME-070. 05-11 not in the text tolerances Check consistency. In the last sentence, be more precise on the 05-011 measured accuracy. It is not clear if 0.5 mm means +/- +/- 0.5mm. IID-A updated accordingly 0.25mm or +/-0.5mm. CoG Make link "satisfies" to GDIR GDME-090. 05-011 Location Make link "satisfies" to GDIR GDME-100. not in the text and Check consistency. unfortunately…to be tracked for next issue . See 05-011 the MoI are not provided in the IID-Bs esa comment 490 Wording: change first sentence from “recorded” to “to 05-011 agreed be provided” Make link "satisfies" to GDIR GDME-120. MoI and 05-012 Make link "satisfies" to GDIR GDME-130. not in the text Tolerances Check consistency. OK. We need to define in IID-B's which of the MoI are recorded in ICDs as secified in § 5.4, but shall 05-012 tables or the ICD's has precedence (valid for not be repeated in IID-Bs mass, power, MOI, ….)

I.Bén Mass 5.5.4 05-012 Make link "satisfies" to GDIR GDME-050 a ilan margin philo

mail 30-03ESA TP 2004

Page 4

not in the text

y

n

n

BC

Not exactly (see comment 390 from HIFI….). The relevant parameter is the overal instrument y masses (Planck + Herschel)

n

y

BC

not in the text

y

n

n

BC

not in the text

y

n

n

BC

y

y

y

BC

n

y

BC

y

y

BC

y

y

BC

several diagrams are out of date and need to be Agreed, This has been when the figures become updated (Figs. 5.6.3-7, 5.6.3-8, 5.6.3-9, 5.6.3-10, 5.6.3available 11, 5.6.3-14). This should be done for the next issue.

5.6

05-013

5.6

Mechanical 05-013 Just for info: IID-B is ruling wrt. ICD’s! interfaces

This is not true for the LSU and the DECMEC ICD's in annex 9: the late definition of these warm units led us to define for you an ICD (defining y volume, footprint, and connector location, applicable both to the spacecraft and to the instrument. There are no mechanical interfaces between instruments and telescope. This is however defined in top of section 5.6 by reference to annex y 11 (Herschel telescope ICD's (mechanical & optical). OK. This was the objective, but did not worked. 1st & 6th phrases removed.

y

IID-A 3.3

Change Notice: issue 3.1 3.2 --> 3.3

on ID issue

Ref

Com Origi Sectio ment n n Nb from

Page

title, fig, Remarks table, or req

Page 5

Industry Reply, or ref

Modify reply IID-A (Y/N)

Done in Reply by IID-A

y

y

y

BC

There are a number of requirements in this para – with no correspondence in the IID-Bs, i.e. forces due to thermal expansion (last but one para); More add "Instrument shall provide any dedicated tool

3.1

496

mail 30-03ESA TP 2004

5.6.1. 05-014 1

3.1

116

red team wk 7

ASP DF

5.6.1. 05-014 1

Je propose d'enlever la phrase :'The fixation principle shall be similar for all three instruments' qui n'apporte OK. Same as 493 rien.

y

y

y

BC

3.1

117

red team wk 7

ASP DF

5.6.1. 05-014 1

Il est demandé aux instruments de s'adapter à la contraction du OBA mais déplacement et CTE OBA pas spécifiés

y

y

y

DF

3.1 3.1 3.1 3.1 3.1

red team wk 7 red team 119 wk 7 H-P-ASP333 MN-4530 mail 30-03495 2004 118

ASP DF ASP DF ASE SI D ESA CS

mail 30-03497 ESA TP 2004 mail 30-032004 red team wk 7 red team wk 7 H-P-ASPMN-4530

05-014 05-014 05-014 05-014

5.6.1. 05-015 2 5.6.1. 2 5.6.1. 2 5.6.1. 2 5.6.1. 2

3.1

499

3.1

120

3.1

121

3.1

334

3.1

498

mail 30-03ESA TP 2004

5.6.1. 05-015 3

3.1

500

mail 30-03ESA TP 2004

5.6.1. 05-016 3

3.1

501

mail 30-03ESA CS 2004

5.6.1. 05-016 3

3.1

122

red team wk 7

5.6.1. 05-016 3

3.1 3.1

red team 123 wk 7 H-P-ASP336 MN-4530

ESA CS

5.6.1. 1 5.6.1. 1 5.6.1. 1: 5.6.1. 2

ASP DF ASP DF ASE SI D

ASP DF ASP DF ASE SI D

3.1

392

mail wvL 5/3/04

HIFI

3.1

124

red team wk 7

ASP DF

3.1

337

H-P-ASPMN-4530

ASE SI D

3.1

393

mail wvL 5/3/04

HIFI

3.1

502

mail 30-03ESA TP 2004

3.1

154 100204-2

PLL

PLL

ASP JBR

05-015 05-015 05-015 05-015

5.6.1. 05-016 3 5.6.1. 05-016 3

relevant: I understand that none of the mechanical necessary to integrate, to fix or to control the interfaces is standard and believe that the mounting fixation status of the FPU on the Optical Bench." hardware should be designed/selected very specifically for each kind of interface – to be technically addressed!!!

Le paragraphe sur la co-planarity / flatness / positionnement n'est pas clair Il faudrait spécifier un effort d'IF max en thermoélastique sur le OBA Add a paragraph for the responsibility of fixation hardware for the FPU Typo in first sentence : exchange ‘box’ against ‘boxes’. Sentence below the figure: change from “shall provide”to “provides”; clarify any special mounting hardware – if any In forth sentence of the page exchange ‘focal plane units’ against ‘JFETs’ 2 typo Je propos d'enlever le dessin dans le texte qui n'apporte rien SPIRE JFET replace 4 mounting holes by 4/5 mounting holes First sentence: “shall interface” to “interfaces”; Second para: S/c side should be described with “will” and the request to the LOU with shall and this should be reflected in the IID B ICD??!!! General: “shall” to “will”; Mass allocation? 6 kg??; Where do I find the interface definitions for the radiator (mechanical/thermal); Unclear what last para means – where are the details?? Figure reference is wrong. End of second sentence on the page shall be exchanged against :‘… is as per Figure 5.6.1-3, on the following page’.

OK. We add a statement: A relative thermal displacement of the OBA between room and operating cryogenic temperature is DL/L=15E-6. I find it clear

y

n

y

BC

Yes, Please provide.

y

y

n

DF

see next page

y

y

y

BC

OK

y

y

y

BC

OK

y

y

y

BC BC

OK

y

y

y

benche->bench Annexe6->Annex 6

y

y

y

BC

no. It will shift all figure numbering.

y

n

y

BC

OK

y

y

y

BC

OK

y

y

y

BC

interface definition in annex 6, section dedicated to LOU

y

n

y

BC

OK

y

y

y

BC

y

y

y

BC

masse radiateur 6 kg TBC : ça devrait être figé car CASA a déjà fait le dimensionnemnt, il doit donc bien TBC removed y avoir une spec quelquepart (chez ASED) Faut il mettre une spec d'effort entre le WG et le LOU Which one ? remove TBC

HIFI Local 5.6.1. 05-016 Oscillator 3 Unit 5.6.1. 05-018 5

On page 5-16 a reference is made to fig 5.3.1-6, which should be fig 5.6.1-3. This figure is an old figure from dec. 2002. Dessin des WG pas à jour (il manque les aiguilles sur le SVM) replace ICD of LOU WG by 3D view. 5.6.1. 05-018 Add: The bridging WG (SMV interface to LSU (HIFI 5 responsibility) shall be flexible. 1: SRON responsible for bridging waveguides? 5.6.1. HIFI LOU Inconsistent with last sentence of 5.3.1.1 Not agreed 05-018 5 Waveguides at IF-meeting 2: LCU ICD is outdated Last but one para: how can these requirements on 5.6.2. 05-021 loads be verified – designed by the FPU?? – would 1 need better explanation " 2 calibrated pins on telescope side and 1 calibrated hole plus 1 extended hole one FPU side" to be 5.6.2. 05-021 3.1 replaced by " 2 bushes per foot plus 2 calibrated pins 1 on telescope side and 13 calibrated holes plus 1 extended hole on FPU side"

y

y

n

DF

TBC removed

y

y

y

BC

changed. See comment 501

y

y

y

BC

Updated (see 337)

y

y

y

DF

3D view to be provided by ASED. Added ref to flexible bridging WG

y

y

y

SI

1: Yes 2: OK. This is for indication, and will be replaced y by 3D view. ICD (to be updated) in annex 6., see comment 227

n

y

BC

By analysis, during design phase.

y

n

y

BC

OK

y

y

y

BC

y

y

BC

3.1

503

mail 30-03ESA TP 2004

5.6.2. 05-022 3

Is it true that no specific care need to be taken to fix the JFET at a 40 K structure?

No. This is just to explain that no special thermal anchoring is provided. Just fixation. Text modified to: "The JFET is fixed on the back side of the PR panel by means of 4 feet with corresponding inserts in the panel. Design of the feet has been y optimized with HFI in order to reduce the interface effort (as specified belor), and the corresponding deformation of the PR panel and the impact on the telescope alignment (Solution is to use of 4 flexible blades).."

3.1

504

mail 30-03ESA TP 2004

5.6.2. 05-023 3

Same question as before – how to verify as an instrument these force interface requirements as given here – do I find the analysis in the IID B??

Same response. It is requested to the instrument to verify the interface forces by analysis.

y

n

y

BC

5.6.2. 05-023 3.1 3

Longueur de bellow AC

refere to ICD & CAD model.

y

y

y

BC

Included

y

y

y

JBR

same as 505 above

y

y

y

BC

same as 505 above

y

y

y

BC

3.1

155 100204-3

ASP JBR

3.1

156 100204-4

JBR/ 5.6.2. ASP TL/D 05-023 3.1 3 R

3.1

506

mail 30-03ESA TP 2004

5.6.2. 05-025 4.2

3.1

mail 30-03507 ESA TP 2004

5.6.2. 05-025 4.3

F radial < 180 N à mettre à jour selon H-P-ASP-LT 3061 : F global between each of 2 feet < 250 N. Update CTE format 0.1E-6 /K First Para – plural – typ; Third para – do not understand how mechanical support def. can be an instr. Resp First Para – plural – typo

IID-A 3.3

Change Notice: issue 3.1 3.2 --> 3.3

on ID issue

Ref

3.1

299 LP 001

3.1

157 100204-5

3.1

158 100204-6

3.1

159 100204-7

3.1

160 100204-8

3.1

419

3.1

39

3.1

650

3.1

463

3.1

95

mail Wildgruber 3/3/04 red team wk 7 mail M.Sias 10/02 mail Wildgruber 3/3/04 red team wk 7

3.1

mail wvL 394 5/3/04

3.1

508

3.1

Com Origi Sectio ment n n Nb from

LFI

title, fig, Remarks table, or req

L. 5.6.2. Paga 05-026 4.4 n

JBR/ ASP TL/D R JBR/ ASP TL/D R JBR/ ASP TL/D R JBR/ ASP TL/D R

JBR

5.6.2. 05-028 3.1 5

Included

y

y

y

JBR

5.6.2. 05-028 3.1 5

Paragraphe à homogénéiser avec 5.6.3 : rajouter § Design requirement (cf JBR pour détail)

Included

y

y

y

JBR

5.6.2. 05-028 3.1 5

Tableau à completer pour les IF suivantes : Frame/RAA, PR panel/bellow and PR panel/WG up str, PR panel Jfet, bellow/CS. Bellow/frame

Included

y

y

y

JBR

PAC MvB S

5.6.3 05-029

r < 1,5 is kept as a general goal. More time is needed This was similar in version 3.0 since June 2002. to check this new detailed descriptions. You had time to check.

y

n

y

BC

ASP YR

5.6.3 05-030

check table 5.6.3-2 (by mech team)

y

?

n

AL

Figure 5.6.3- For the updating see above. I propose to add on the 5.6.3 05-037 OK 7 sentence ......on Heta Pipes (Harness not shown)

y

y

y

BC

same as comment 419 from PACS

y

n

y

BC

OK remove 2nd one

y

y

y

BC

n

y

BC

n

y

BC

y

y

n

BM

y

y

y

BC

y

n

y

BC

y

y

y

y

MS

Design This section has to be rechecked by all E-Units PAC 5.6.3. js-14 05-029 requirement supplier for conformity. A TBD to all changes as long S 2 s: the E-Units supplier did not check/agree 5.6.3. "Boxes with mass < 1.5 kg…4 attachment points" ASP PR 05-029 2 répété 2 fois Design 5.6.3. 05-029 Requiremen Design Requirements have been increased! HIFI WvL 2 ts

LFI

5.6.3. 05-030 2

L. 5.6.3. Paga 05-030 2 n

3.1

395

mail wvL 5/3/04

HIFI

5.6.3. HIFI Warm 05-033 3.1 Units

3.1

509

3.1

378

3.1

97

3.1

512

3.1

187

WvL

ESA TP ASP BC ESA TP ESA TP ASP PR

mail 30-03ESA TP 2004

5.6.3. 3 5.6.3. 3 5.6.3. 3.1 5.6.3. 3.1 5.6.3. 3.2

05-031 05-031

OK

y

y

y

BC

y

y

y

BC

05-034

remarques sur CCU et FCU a supprimer, design agréé

OK. Similar CCU detaile removed. Not relevant y here OK: "The accommodation is based on the following: DECMEC ICD is the ASP one, as no PACS DECMEC ICD was available on time. Refer to annex 9 drawing ref ME.HES.114P.S.001SA y aimed to freeze the minimum boundary conditions: volume, footprint and connector location. This ICD is applicable both to PACS and to the satellite."

y

y

BC

y

y

BC

y

y

BC

5.6.3. 05-034 3.3

3.1

515

mail 30-03ESA TP 2004

3.1

mail 652 M.Sias 10/02

AL

3.1

660

ASP BC

3.1 3.1

3.1

mail 653 M.Sias 10/02

AL

MS

BC BC

OK

MS

mail 30-03514 ESA TP 2004 HFI/IAS/JC 188 HFI JC h 04-008

at pdf output at pdf output

Typos – beenrecently; braket

mail 651 M.Sias 10/02

MS

The accepted values for moments on the lower support structure feet are 4.83 Nm on the central holes, 2.15 Nm on the lateral holes, agreed with ASP on 4/2/04. The value of " 3.3

on ID issue

Ref

Com Origi Sectio ment n n Nb from

y

BC

mail 30-03ESA TP 2004

5.7.2. 05-057 2.1

520 W does this include the CDE?? Cooler is 470 W; mounting interface is not defined in para 5.6! (could be a numbering problem)

old figure, did not include SCE. Now agreement is 570W including SCE.

y

y

y

BC

mail 30-032004 HFI/IAS/JC h 04-008 mail 30-032004 mail 30-032004 mail 30-032004

5.7.2. 2.2 5.7.2. 2.3 5.7.2. 3 5.7.2. 3.1 5.7.2. 3.2 5.7.2. 3.2 5.7.2. 3.3

BC

536

3.1

538

3.1

539

JC

ESA TP HFI

JC

ESA TP ESA TP

3.1

541

3.1

163 100204-11 ASP JBR

3.1

540

ESA TP

mail 30-03ESA TP 2004

3.1

293 MM 001

3.1

542

3.1

HFI/IAS/JC 196 HFI h 04-008

3.1

543

3.1

546

3.1 3.1

LFI

05-057

Is this sufficient as thermal interface definition?

all section 5.7.2 should be moved to 5.7.3 (SVM)

y

y

n

05-057

Penultime word should read "that" not "tha"

Typo, corrected, thank you

y

y

y

BC

05-058

typo

are --> have

y

y

y

BC

05-058

Last sentence unclear

removed

y

y

y

BC

05-058

Be specific in the interface definition (last sentence)

corrected

y

y

y

BC

05-058 3.1

Remplacer 50K shield par 60K shield

replaced by 3rd V-Groove

y

y

y

BC

05-058

Where are the thermal interface in the figure 5.6.2-7? changed to the ICD in annex 7

Chapt M.Mi er 05-058 ccolis 5.7.2. 3.4

mail 30-03ESA TP 2004 JC

mail 30-03ESA TP 2004

mail 30-03ESA PE 2004 red team 34 ASP YR wk 7 red team 40 ASP YR wk 7

5.7.2. 05-059 3.5 § 5.7.2. 05-060 4

y

y

y

BC

table 5.7.3-1 (by therm team)

see LO comments

y

y

y

BC

corrected. PAU & 4KCU are still under evaluation. y

y

y

BC

see above Table is yet from TCS PDR. Might be updated after SVM CDR. Phrase deleted

y

y

y

BC

TBC removed

y

y

y

BC

y

n

y

BC

y

n

y

BC

y

n

y

BC

y

n

y

BC

y

n

y

BC

y

n

y

BC

y

n

y

BC

y

n

y

BC

y

y

y

BC

y

y

y

BC

5.7.3 05-061 3.1 5.7.3 05-061 3.1

140 141

3.1

HFI/IAS/JC 197 HFI h 04-008

3.1

HFI/IAS/JC 198 HFI h 04-008

5.7.3 05-061 3.1

ASP L.O

5.7.3 05-061 3.1

ASP L.O

5.7.3 05-061 3.1

ASP L.O

5.7.3 05-061 3.1

ASP L.O

5.7.3 05-061 3.1

199

HFI/IAS/JC HFI h 04-008

3.1

200

HFI/IAS/JC HFI h 04-008

3.1

243 CB 002

3.1

397

mail wvL 5/3/04

5.7.3 05-061 3.1

ASP L.O

3.1

LFI HIFI

BC

Warning: ALS consider 40°C for max T-op on PAU.

ASP L.O

3.1

y

5.7.3 05-061

ASP L.O

3.1

y

5.7.3 05-061

5.7.3 05-061 3.1

139

y

BC

ASP L.O

3.1

BC

y

Table 5.7.3- 05-061 1

138

y

y

ASP PR

137

y

PAU Requirement from IID-B is 30°C, and has precedence. RFW to be issued

red team wk 7

3.1

replace by "Cryoharness shall have heat intercept y on each V-groove shield."

text to be updated

102

3.1

Meaning of “It is desirable to have …”

Table 5.7.3-1 (p. 5-61): Table values for FHICU and PAU do not match the corresponding text.

3.1

ASP L.O

BC

5.7.3 05-061

5.7.3 05-061

red team wk 7 red team wk 7 red team wk 7 red team wk 7 red team wk 7

y

BC

mail 30-03ESA CS 2004

3.1

y

y

545

red team 136 wk 7

OK. The text has been corrected. "The thermal interface for the LFI wave guide (and cryoharness) on the V-groove is a set of 6 inserts on each of the 3 V-Grooves, 3 on each sides +/-Y y of the wave-guides bundles. Thermal straps between these insets and the wave-guides are provided by LFI."

y

3.1

3.1

BC

table provided by Alenia, from TCS PDR. Might be y updated after SVM CDR. Consistancy checked

5.7.3 05-061

3.1

y

Table: lot of tbcs and inconsistencies – get this clear

mail 30-03ESA AE 2004

red team wk 7 red team 134 wk 7 red team 135 wk 7

y

5.7.3 05-060

544

133

y

Actually the thermal straps coming from the waveguides are not strictly related to the waveguides bundles. It is understood that 6 thermal interface points, dedicated to the waveguides, are available on each V-groove, 3 per each side of the V-groove open. These interface points are connected by means of thermal straps to an interface bar that connects (electrically and thermally) the waveguides. Therefore in correspondence with the thermal interface flange, each bundle of waveguides, on a side is connected to the interface bar the waveguides. Then the bar is connected to the relevant V-groove.

Other one : "theoperating" should read "the operating" Typo corrected, thank you

3.1

3.1

Done in Reply by IID-A

y

3.1

537

Modify reply IID-A (Y/N)

This has been updated: Low emissivity (polished Al honeycomb sandwich facesheet with Al coating): 0.05+/- 0.005 y Hihg emissivity (open black painted honeycomb : 0.85+/-0.1

HFI/IAS/JC HFI h 04-008

194

Industry Reply, or ref

0.02 & 0.9 emissivities are impressive. Do you confirm them ?

195

3.1

title, fig, Remarks table, or req

5.7.2. 05-057 Fig 5.7.2-3 1

3.1

3.1

Page

Page 9

the text under the table 5.7.3-1 indicates a noncompliance for HIFI ICU. This is not true since the current hot case prediction is 25.3 degC. However, there should be a caveat added about the 4KCU: currently too hot ~50 degC with a "suspect TMM" 1) Clarify why the note under the table makes an exception from the requirements for the FHICU? The last Alenia analysis predicted +35˚C (including uncertainties). The fact, that the ICU power has increased from 29.6 to 34.5 after the analysis was performed, may result in a higher operation temperature. But an increase of 10˚C looks too high. Please clarify. 2) Delete last sentence under the table. La colonne sur les stabilit és n'est pas claire. Encore TBC, valeur en K/h alors qu'on définit la stabilit é sur 100 s WEH stability is out of spec (1,532 K/h instead of 1,1 K/h) WOV stability is out of spec (1,135 K/h instead of 1,1 K/h) WOH stability is out of spec (1,207 K/h instead of 1,1 K/h) 4K CCU maximum operating temperature is out of spec (50° instead of 40°C) 4K CRU maximum operating temperature is out of spec (45° instead of 40°C) 4K CEU maximum operating temperature is out of spec (43° instead of 40°C) BEU stability is out of spec (0,32 K/h instead of 0,2 K/h) SCC maximum operating temperature is out of spec (12° instead of 7°C) SCC fluctuation is out of spec (7/4,7/4,7° instead of 6/2/1°)

intermediate result. Not change if no waiver (req is from IID-B) intermediate result. Not change if no waiver (req is from IID-B) intermediate result. Not change if no waiver (req is from IID-B) CR from HFI to reduce upper temperature rejected. Current TCS design not mature to change requirement. intermediate result. Not change if no waiver (req is from IID-B) intermediate result. Not change if no waiver (req is from IID-B) intermediate result. Not change if no waiver (req is from IID-B) intermediate result. Not change if no waiver (req is from IID-B) updated, as SCS requirement has never been accepted Agreed. this table is a synthesis of the content of IID-B's (50°C for HFI & LFI & CSC compressor). This will be modiified to +50°C

JC

Table 5.7.3- SCS non op +60°C max T° is in contradiction with 5.7.3 05-061 1 spec to qualify at max operating +10°C (=50°)

JC

Table 5.7.35.7.3 05-061 HFI JFET not present here cannot be found elsewhere same as comment 201. Part of PPLM 5.7.2 1

JC

5.7.3 05-061

Table 5.7.3- "4KCU" and "4KAU" are not agrred names, should 1 read "4KCCU" and "4KCAU"

Table 5.7.3- 4KCCU max operating T° is not correct, or specify 1 where in unit Is it right that ASP make no guarantee about the unit Butle Table 5.7.35.7.3 05-061 non operational temperatures? Some clear staement r 1 about these n eeds to be made. Service Table 5.7.3-1: ICU not compliant, slope TBC? Use of WvL 5.7.3 05-061 Modules MLI is now baseline? JC

5.7.3 05-061

y

y

y

y

BC

agreed. Note that HFI has been warned at the begining of the programme of the complexe unit names proposed at the time, and has not been very stable on the used or definition of names.

y

y

y

BC

same as comment 203

y

y

y

BC

no. This is not true. Non operating emperature are considered as a requirement for us. The text will be updated to feflect this point.

y

y

y

BC

updated, and compliant

y

y

y

BC

IID-A 3.3

Change Notice: issue 3.1 3.2 --> 3.3

on ID issue

Ref

Com Origi Sectio ment n n Nb from

3.1

mail 30-03547 ESA PE 2004

3.1

204

HFI/IAS/JC HFI h 04-008

JC

3.1

201

HFI/IAS/JC HFI h 04-008

JC

3.1

202

HFI/IAS/JC HFI h 04-008

JC

3.1

HFI/IAS/JC 203 HFI h 04-008

JC

3.1 3.1

548 420

3.1

82

3.1

35

mail 30-032004 mail Wildgruber 3/3/04 red team wk 7 red team wk 7 mail 30-032004 red team wk 7

3.1

549

3.1

103

3.1

H-P-ASP346 MN-4530

3.1

398

3.1

550

3.1

mail wvL 5/3/04

ESA TP PAC MvB S

HIFI

WvL

mail 30-03ESA TP 2004 red team 36 ASP YR wk 7

3.1

104

red team wk 7

ASP PR

3.1

105

red team wk 7

ASP PR

3.1

142

red team wk 7

ASP L.O

3.1

205

HFI/IAS/JC HFI h 04-008

3.1

638

JC

ASP BC

y

BC

5.7.3 05-062 Fig 5.7.2-6

For coherence this table should be renamed 5.7.3-2

no: 5.7.3-1 as this is the 1st table in section 5.7.3 y

y

y

BC

y

n

y

BC

y

y

y

BC

y

n

y

BC

y

y

y

BC

Then the temperature preduction will be wrong for y PACS units.

n

y

BC

this table is related to SVM units. Table 5.7.2The JFET thermal requirement / performances 5.7.3 05-062 HFI JFET not present here cannot be found elsewhere 6 should be inluded in previous section 5.7.2, to be found with FPU. Table 5.7.2- "4KCU" and "4KAU" are not agreed names, should 5.7.3 05-062 agreed 6 read "4KCCU" and "4KCAU" the CR to modify the interface temperature from Table 5.7.2- 4KCCU max operating T° is not correct, or specify 5.7.3 05-062 40°C to 32°C has been rejected (margin philosopy 6 where in unit to be clarified) Wording: thermal filler use – need of compatibility of add thermal filler: "provided by TCS" 5.7.3 05-063 unit; Typo last but one sentence typo: "radiative" 5.7.3 05-063 05-063 3.1 05-063 05-063 05-063

268 FV001

LFI

F.Vill 5.7.3. 05-066 a 1.2

3.1

mail 30-03551 ESA TP 2004

3.1

552

3.1

3.1

?

The T° stability should be made clearer: max slope or max variation over a period of time? PLM interface requ. not to be placed into this chapter, 5.7.3 is the SVM chapter; typos in text

add (understood to be the maximum slope of the y temperature drift) OK Temperature stability moved up one level: y 5.7.4 (for all modules)

Bien clarifier la définition de la stabilit é (voir avec LO) see comment 35

5.7.3. 05-066 1.2

The two graphs in figure 5.7.2-7 report the expected temperature fluctuations for Planck Sorption Cooler at This is the actual temperature for this analysis 3.1 the interface between the beds and heat pipes. case. Therefore the y axis label is meaningless (temperature C). It should be delta T (K) Table reports extimated temperature fluctuations on footnotes refere to thermal analysis document 3.1 the PPLM; for the moon illumination there are footnote RD78. Footnotes removed from IID-A reference numbers without footnotes PLM interface requ. not to be placed into this chapter, see comment 549 5.7.3 is the SVM chapter

y

n

y

BC

y

y

BC

y

y

BC

y

y

y

BC

y

y

y

BC

y

n

y

BC

y

n

y

BC

y

n

y

BC

y

y

y

BC

y

n

y

BC

y

n

y

BC

y

y

y

BC

y

y

y

BC

y

n

y

BC

y

y

y

BC

y

y

y

BC

A. 5.7.3. Menn 05-066 3.1 1.2 ella

At the beginning of the page it is quoted: "There are no temperature stability requirements for the PPLM, but internal straylight requirements. The temperature fluctuation results are therefore processed to evaluate their impacts on the straylight." Because the requirements are defined at detector level, it is crucial to know how the transfer from a temperature fluctuation at a given emissive surface to the detected straylight signal is calculated. The document should contain the description of the underlying assumptions and of the calculation method or an explicit reference to a document where these are described in detail (some of the documents listed in the reference documents could be of interest, e.g. RD78, but they are not on the Livelink)

The temperature fluctuations are reported here from PPLM thermal analysis (RD78). The cross check between thermal analysis and Straylight is presented in the PPLM RF analysis (RD 84), not reported in IID-A. Reference to RD84 will be included in this section to enforce the statement. y All AD/RD documents are on the ftp server (incl RD78 & RD84) , next to IID-A (ftp://ftp.hpinstruments.asb2b.com/industry_to_instruments/IIDs/IIDA/Applicable%20and%20Reference%20document s/). Section 2 of IID-A includes hyperlinks to these documents. Access rights are available from LFI project office.

y

y

BC

A. 5.7.3. Menn 05-066 3.1 1.2 ella

Table with currently estimated temperature fluctuations on the PPLM: 1. Are the reported values peak-to-peak amplitudes? Please specify. 2. In the columns relative to Sorption Cooler induced fluctuations there is no mention of the contribution of ~60 s harmonics. This should be estimated/added in the table. 3. In the first column there is a reference to an internal and external part of shield 3. Does internal mean facing towards the telescope? Please clarify

1: Yes, this is peak to peak fluctuations (to be included in the descriptive text) 2: this table is extracted from a PDR document (RD78). The 60s contribution of the sorption y cooler fluctuation is included in RD78, not in the IID-A. 3: 3rd shield internal fluctuations are related to the interior of the optical cavity, and are indeed seen by the telescope

y

y

BC

5.7.4 05-066

What is the MOLA, what is the request expressed by SPIRE…??

MOLA was BOLA with Typo. Removed. Clarified with "The request for such a monitoring was expressed only by SPIRE…."

y

y

y

BC

5.7.4 05-067

table 5.7.4-1 (by elec team)

no feedback

y

n

y

BC

Why no temperature accuracy requ. for Planck??

no temperature monitoring requirement by instrument, untill very recent HP-LFI-CR-0040 from LFI. We are checking the least significant bit y from CDMU temperature measurement. This will not be very accurate anyhow… see LFI comments below 282, …

n

y

BC

mail 30-03ESA TP 2004

red team 41 wk 7

553

LFI

H-PLM stability OK

T stability : add "except the effect of HIFI heat peaks, and under the assumption for FPU thermal behaviour OK used in RD81 There is no temperature control (monitoring, Herschel heating) for WIH or WG. Requirement is not 5.7.3. Temp. drift < 30mK/100s: add IF and LWU Temp. drift 05-063 temperature realistic. All what can be done is to check what is 1.1 voir BH pour le total

In table 5.7.4-3 there is no column specifying the A. sensitivity (I.e. the resolution) of the various sensors. table 5.7.4-3 Menn 5.7.5 05-069 This is a parameter that should be specified, as in see comment 269 p 5-69 ella some cases the resolution is a parameter that is even more important than accuracy

558

560

5.7.4 05-069 3.1

3.1

T monitoring: The accuracy, precision and resolution should be defined and inserted in table.

mail 30-03ESA TP 2004 mail 30-03ESA PE 2004

5.7.4 05-070

What is done with the NC’s; Are these values all relevant instr. Interfaces??

table 5.7.4.4: remove LOU radiator T sensors 5.7.4 05-070 table 5.7.4.4 (proposal to implement SC sensors on LOR refused by HIFI) Effacer les bullets: 5.8.1. 05-071 -typical operating temperature 1 -emissivity linear central obscuration "about" 8.7% conflicts with Herschel 5.8.1. the area obscuration ratio 7.7% (Table 4.3.1-1). 05-071 Telescope 1 Emissivity 0.95 (Table 4.3.1-1). 5.8.1. Title adequate?; I assume that all these values are in 05-071 1.1 line with the spec?? 5.8.1. 05-071 angles (by Ivan) 2 5.8.1. 05-071 What are the achievements/implementation?? 2

see comment 599 above

y

n

y

BC

?

y

n

y

BC

given next page

y

n

y

BC

y

n

y

BC

y

n

y

BC

5.8.1. 05-072 2

Waiver existing for Out of spec for emission??

Straylight analysis document (RD 83) to be updated for H-PLM CDR. Should be associated with a waiver

5.8.1. 05-072 2

it is stated that the the Herschel straylight requirements will not be fullfilled. Is this final? If yes, what are the operational impacts? (answer is outside the scope of the IID-A)

same as 560

IID-A 3.3

Change Notice: issue 3.1 3.2 --> 3.3

on ID issue

3.1

561

Ref

Com Origi Sectio ment n n Nb from

mail 30-03ESA TP 2004

Modify reply IID-A (Y/N)

n

y

BC

5.8.1. 05-072 3

CVV windows

ASED to check the diameter of alignment windows (34mm--> 24mm ?) reply: Confirmed. Alignment windows free diameter is 24 mm. Note: this concerns the hole in y the CVV. The dimensions of the window quartz and frame are the same as for the other LOU windows. Regards Siegmund

y

y

SI

Update description and remove “tbd” “will be made”

3.1

563

mail 30-03ESA TP 2004

5.8.2. 05-073 1

3.1

mail 30-03564 ESA TP 2004

5.8.2. 05-074 1

3.1

565

mail 30-03ESA TP 2004

5.8.2. 05-075 1

Sec. Butle 5.8.2. 05-075 r 2

Seems quite important interface definition – but not readable and is it correct??? And complete??? Is this a requirement for LFI or HFI??? Horn definitions in the table – are these requirements to HFI and LFI??? Justify having removed the straylight requirements coming from the the 100 GHz of LFI why these have 3.1 not been replaced by those at 70 GHz in LFI to ensure that the requirements covering the full range of LFI are met.

add ref to telescope spec (AD6-2)

y

y

y

BC

do you refere to fig 5.8.2-1. This is still valid, and comes from telescope spec. Will be enlarged

y

y

y

BC

both

y

n

y

BC

I've removed all what is related to LFI 100GHz as I thought ist was cancelled. If you believe it should stay, we can keep it. My understanding is that it is y covered by the HFI 100GHz requirements (next line, similar)

n

y

BC

n

n

BC

y

n

n

BC

y

n

y

BC

y

n

y

BC

y

n

n

BC

y

n

y

BC

y

n

y

BC

3.1

272 FV005

LFI

F.Vill 5.8.2. 05-076 a 2

Sorry, this requirement has been proposed for LFI IID-B, and is not yet in there. Our position is that these requirements update should be requested formally by LFI through a change request, as it has impact on the analysis activity (no straylight External Straylight Requirements: insert the 70 GHz analysis was foreseen at 70GHz). This will not be external stray light requirements according to PL-LFIincluded in the forthcoming IID-B issue, not part of y 3.1 PST-TN-034 "LFI Optical Interfaces" and Bersanelli's PPLM CDR activities (datapack is closed), and email of 24th February. cannot therefore be in IID-A now. However, we do agree to consider these new requirements and to evaluate the activities to be performed after the PPLM CDR if a CR is issued by LFI.

3.1

273 FV006

LFI

F.Vill 5.8.2. 05-076 a 2

3.1

3.1

566

mail 30-03ESA TP 2004

5.8.2. 05-076 2

3.1

mail 30-03567 ESA PE 2004

5.8.2. 05-076 2

3.1

284 AM_007

3.1

3.1

285 AM_007

274 FV007

LFI

LFI

LFI

Done in Reply by IID-A

because there is an error in the HIFI drawings for the soacing (50mm at 293K, should be at 70K (as fr ASED°. However the delta is small enough to y be easily compensated. It is here to close the subject, and avoid further iterations on the subject

H-P-ASPMN-4530

LFI

Industry Reply, or ref

Why these for and back discussions of temperature distances??

348

245 CB 004

title, fig, Remarks table, or req

5.8.1. 05-072 3

3.1

3.1

ASE SI D

Page

Page 12

A. 5.8.2. Menn 05-076 3.1 2 ella

A. 5.8.2. Menn 05-076 3.1 2 ella

F.Vill 5.8.2. 05-077 a 2

same as comment 272, as the internal straylight Internal Straylight requirements: change requirements requirement is modified, and needs further according to the Bersanelli's email of 24th February. analyses to be assessed (this is comming too late for PPLM CDR) Seems to be the spec – what is with implementation ref RD 84. Compliand with the specification and performanc??? Text below Note 2). definition of tel. free standing configuration; computation of radiation pattern; RF yes, refer to RD 83 measurements. must be followed up! Planck internal straylight requirements. The requirements are given at detector level as a single number in form of and amplitude spectral density with a factor X to account for the presence of periodic fluctuations. The representation in amplitude spectral density is adequate to represent only a requirement on random fluctuations and not on periodic flucuations that are not damped with the square root of the integration time. Furthermore the factor X is not a correct representation of the damping of a periodic fluctuation provided by the scanning strategy as it considers an same as 273 observation time of one hour, while the average time spent on each pixel is about one order of magnitude less. A complete requirement needs to be split in three parts, one for fast/random fluctuations (which are damped with the square root of the pixel integration time), one for spin synchronous fluctuations (which are not damped at all), and one for periodic non-spin-synchronous fluctuations (which are damped approximately with the inverse of the number of redundant measurements performed on The numbers defined in Table 5-2 of the LFI scientific requirement document give the acceptable level of unwanted signal from internal straylight that is compatible with Planck scientific objectives. These numbers have been translated into requirements at detector level : RANDOM FLUCTUATIONS: 10^-18 W x Hz^(-1/2) PERIODIC SPIN SYNCH FLUCTUATIONS: : 1.5 X 10^(-19) W (peak-to-peak, corresponding to 1.8 microK peak-to-peak) same as 273 PERIODIC NON SPIN SYNCH FLUCTUATIONS (period longer than spin): 5 X 10^(-17) W (peak-topeak)” These define acceptable levels of internal straylight at detector level for LFI. For random fluctuations the requirement is of the same order of magnitude of the one specified in IID-A (although somewhat more stringent), while for spin synchronous and other periodic fluctuations it is simply non possible to make a comparison and they have to be listed separately.

Parameters defining the horns for straylight verification. Since the 100 GHz LFI has been deleted the 70 GHz LFI channel needs to be inserted on the table. In addition the electromagnetic parameters and position of the horns needs to be consinstent with the same as 272 3.1 FM design. The data of the horn for the 70 GHz FM design will be delivered to ALCATEL in a forthcoming mail. It is not clear how the "global coordinate system is defined"

IID-A 3.3

Change Notice: issue 3.1 3.2 --> 3.3

on ID issue

Ref

Com Origi Sectio ment n n Nb from

294 MM 002

3.1

mail PAC 440 Wildgruber rk- 2 S 3/3/04

568

3.1

83

3.1

569

3.1 3.1

mail 30-03ESA TP 2004

red team wk 7

n

y

BC

in the PACS box, replace “Stdby” by “Safe”

Y

y

y

BC

Chapter is built from what has been received (IIDA from ESA + design updates & comments). I try to update the document without modifying too Do not understand the value of the complete chapter much the structure, to avoid many reactions. ??? Why not just the close of the interface y some initiatives have been rejected in tha past. requirements as given in the IID – B and the achieved The power allocation (dissipations or power performance demand) are mainly dictated by the S/C design & resources and IID-B's. This is what is reflected in the allocation tables.

n

y

BC

y

n

y

BC

Table 5.9.1-1 and Table 5.9.1-3 are not coherent. Table 5.9.1Estimations on L0 and L1 are higher than the allowed This is exactly the message that I want to give. 1 values

y

n

y

BC

agreed, units included

y

y

y

BC

165 100204-13 ASP JBR

5.9.2 05-079 3.1

20%/20%/10% = spec ESA et non pas marge

OK Changed to SRS margin, + note on the origin of the 10%

y

y

y

BC

There is a mismatch between these dissipations and the IID-Bs. If the peak load, energy and stability are really NA then the table should be re-formatted, otherwise the values should be included.

Yes. Instrument have increased their dissipation. This does not necessarily modify their allocation, even if they are above. The relevant parameter is the overall allocation per satellite, taking into y account the dissipation of instrument in various modes (instruments dissip less in standby mode). Table 5.9.3-2 explaining the various instrument dissipation combination vs operating modes is included to clarify. see also 400 & 571

y

y

BC

same remark as 570-571. Instrument may increase the dissipation, but this does not necessarily increase their allocation. We add a table 5.9.3-2 giving the current combination of instrument modes (prime/standby) and related dissipation.

y

y

y

BC

see 570 & 400

y

y

y

BC

PACS thermal dissipation does not match with PACS yes . 125 W allocated for both total power consumption

y

n

y

BC

add: The difference between BOL and EOL dissipations must be < 10%.

y

y

y

BC

y

y

y

BC

y

n

y

BC

mail 30-03ESA AE 2004

3.1

571

3.1

mail PAC 421 Wildgruber MvB S 3/3/04

3.1

649

3.1

145

3.1

146

HIFI

AN

mail 30-03ESA TP 2004

ASP BC

red team wk 7

ASP L.O

red team ASP L.O wk 7 HFI/IAS/JC 207 HFI JC h 04-008

3.1

mail 30-03572 ESA TP 2004

3.1

mail wvL 401 5/3/04

HIFI

AN

3.1

648

3.1

mail PAC 422 Wildgruber MvB S 3/3/04

ASP IB

3.1

246 CB 005

3.1

106

red team wk 7

LFI

5.9.2 05-078

Thermal Dissipation 5.9.3 05-079 on Herschel Figures in table inconsistent with CR-54V3 Service Module 5.9.3/ 05-080 4 5.9.3 and 05-080 5.9.5

5.9.4 05-080 3.1

Maximum average load specified by JPL on SCS is 519W (SCC) + 110W (SCE)

5.9.4 05-080 3.1

SVM TCS design and performance are based on these values.

§ 05-080 5.9.4

"Total" is missing in last line , 1st column box of table

agreed

y

y

y

BC

5.9.5 05-080

Values are not in line with the IID B, clarify the separation between the requi. In the SRS, the needs in the B and the implementation

see 570 & 400. Ref to new table 5.9.3-2 included here)

y

y

y

BC

Power figure inconsistent with CR-54V3

OK new table 5.9.3-2 included. Allocation not changed.

y

y

y

BC

During launch, power is supplied to the 4K cooler compressor to lock the pistons, with the following limitations: (see table next page)

included

y

y

y

IB

Agreed. We had no feedback at the time of the edition of 3.1. This is modified in issue 3.2

y

y

y

BC

This is a commitment. I propose to change "this range can be reduced to 26V to 27.5V" by "this range is reduced to 26V to 27.5V"

y

y

y

BC

done.

y

y

y

BC

Table 5.9.55.9.5 05-080 1 4K cooler 5.9.5 05-080 power during 5.9.5 05-082

red team ASP BH wk 7 red team 108 ASP BH wk 7 mail 30-03573 ESA TP 2004

5.9.5. 05-083 2 5.9.5. 05-083 3.2 5.9.5. 050-83 4

3.1

109

red team wk 7

295 MM 003

LFI

Sec. Butle 5.9.5. 050-85 r 6.4

ASP BH

LFI

done. Also in 5.9.3 (herschel) no. There is an agreement that the total dissipation is < 570W, with 470W on SCS & 100W on SCE (BOL). At EOL, the SCE increses to 110W, and the compressor decreases to 560W. In addition, thermal design shall be compatible with + 10% ->620W. Add a note to explain this sharing see also new table 5.9.3-2 with dissipation in various modes.

5.9.5. 05-083 2

247 CB 006

These are dissipations on the SVM are these values correct???? Seems not!!!

5.9.4 05-079

Sec. Butle 5.9.5. 05-083 r 2

107

Same concern as for Herschel

5.9.3 and 05-079 5.9.4

ASP BH

3.1

3.1

May be, but the idea was to include here the horn position that we use in the straylight analysis, y which should match with the IID-B.

Table 5.9.1(fractions of time to be checked) 2

5.9.1 05-078

Done in Reply by IID-A

same as 568

3.1

3.1

05-078

Modify reply IID-A (Y/N)

§ table 5.9.205-079 Tables in this § do not include used units 5.9.2 1, 2, 3

mail wvL 400 5/3/04

3.1

The tables containing the info on the horn positions are redundant (at least for LFI) with respect to the annex 5 of the IID-B that is understood to take the precedence on the IID-A. We suggest putting here a sentence that explains that the actual and detailed information is in the relevant annex of the IID-Bs.

Industry Reply, or ref

mail 30-03ESA TP 2004 HFI/IAS/JC 206 HFI JC h 04-008

570

3.1

5.9

ASP BdM 5.9.1. 05-078

3.1

3.1

title, fig, Remarks table, or req

M.Mi 5.8.2. 05-077 ccolis 2

3.1

3.1

LFI

Page

Page 13

5.9.5. 050-85 6.4

Chapt M.Mi er 050-85 ccolis 5.9.5. 6.4

Table 5.9.5- For PACS MEC1 and MEC2 LCL Class III was 3 approved after assessment of PACS CR- 0033 The statement concerning the voltage range for the 20A LCL for the Sorption Cooler does not make a 3.1 commitment. Update the text from "can" be reduced" to "will be reduced" Phrase "For the Planck sorption cooler…27.5 V" rajouter à la fin "when the cooler is operating. When the cooler is not operating the maximum voltage will be 29 V" "0 V to 35 V" à remplacer par "0 V to 32 V" et supprimer la paranthèse qui suit 1e paragraphe: at Power Control Distribution Unit outputs connectors Seems a requirement table – what is the implementation and is it correct?? Statement about setting under voltage in range 21-26 V during manufacturing indicates that we will be requested to supply the setting value prior to 3.1 manufacturing. If this is the case when do we need to supply the value? If no value is given, what value will be used to set ther under voltage? bullet "- The LCL under voltage threshold…" à supprimer. Ne concerne pas les instruments The overshoot time is indicated to be 50ms instead of 50microseconds as in the figure. It has been introduced an undervoltage detection on the LCLs this is new and could interact with the input power circuits of the DC/DC converters.

done.

y

y

y

BC

done.

y

y

y

BC

no this is a description of the LCL's. Shall replaced by will

y

y

y

BC

I reproduced here the description from the GDIR (RD1), more accurate that the previous text. The undervoltage statement is related to the PCDU, not the instrument. Removed (see comment 109 from BH)

y

y

y

BC

OK

y

y

y

BC

This is a typo and should be 50 micro-seconds. This will be corrected undervoltage detection: see above: applicable to the LCL (& PCDU), not warm units. Removed

y

y

y

BC

IID-A 3.3

Change Notice: issue 3.1 3.2 --> 3.3

on ID issue

Ref

Com Origi Sectio title, fig, ment Page n n Nb table, or req from Chapt M.Mi er LFI 050-85 ccolis 5.9.5. 6.4

3.1

296 MM 004

3.1

mail PAC 423 Wildgruber MvB S 3/3/04

3.1

110

3.1

mail wvL 402 5/3/04

3.1

111

red team wk 7

3.1

574

mail 30-03ESA TP 2004

5.10.1 05-087 .1.2

H-P-ASPMN-4530 mail 30-032004 mail 30-032004 HFI/IAS/JC h 04-008

5.10.1 .1.2 5.10.1 .2 5.10.2 .2 5.10.2 .2

red team wk 7

ASP BH HIFI

AN

ASP BH

ASE SI D

Remarks

Industry Reply, or ref

Modify reply IID-A (Y/N)

Done in Reply by IID-A

This new requirement cannot be accepted without a deep analysis considering that DC/DC converters design inside the instrument is already completed.

see above. Removed

y

y

y

BC

y

y

y

BC

OK

y

y

y

BC

OK

y

y

y

BC

replace by "Power connections can also use circular connectors e.g. type 38999 series II."

y

y

y

BC

was an explanation on the conclusion related to the itteration on cryogenic connectors. Removed

y

y

y

BC

done

y

y

y

BC

done

y

y

y

BC

yes. Details to be setled. See below

y

n

y

BC

same as comment 193

y

n

y

BC

n

y

BC

n

y

BC

y

n

y

BC

y

n

y

BC

y

n

y

BC

y

n

y

BC

y

n

y

BC

y

n

y

BC

OK, Figure changed, but time of 50 usec in Figure 5.9.5- 2 and 50 ms in §5.9.5.6.4, first bullet do not match. More time is needed to check this new detailed ms to be replaced by micro s descriptions.

5.9.5. Inrush 6.4./ 050-85 Current 5.94 5.9.5. 050-87 7

Dire "The internal instruments converters.."

Instrument 5.9.5. 050-87 converter HIFI = HIFI units FHWEH and FHWEV 7 synchronisat CANNON ITT connectors répondent en fait à la spec 5.10.1 050-87 SCC 3401. Pourquoi parle-t-on d'un coté du SCC .1.1 3401, de l'autre de connecteurs CANNON Relevance of the qualification programme?? remove "50 ohms male" (for SMA connectors) refer to annex 8 for the connector types. Add ‘between prime and redundant’ at the end of last sentence.

3.1

349

3.1

575

3.1

576

3.1

208

3.1

248 CB 007

3.1

403

3.1

mail wvL 404 5/3/04

3.1

New Tables added: This tables are new and not yet approved with PACS. The check of this tables needs mail PAC 5.10.2 Table 5.10.2- more time and therefore they have to be rejected by 05-089 424 Wildgruber MvB 2 PACS. Furthermore there is no agreement that WEU S .2 3/3/04 should be painted by instruments. Therefore there is no possibility to require paint free areas for WEUs.

3.1

249 CB 008

3.1

405

mail wvL 5/3/04

3.1

209

HFI/IAS/JC HFI h 04-008

3.1

210

HFI/IAS/JC HFI h 04-008

mail wvL 5/3/04

ESA CS ESA TP HFI

LFI

HIFI

HIFI

LFI

HIFI

05-087 05-088 05-089

Is the resp. distribution agreed by the instr.??

Table 5.10.2- Paint-free areas are not known, some HFI CQM units 2 are already fully painted ! Same comment as to Table 5.6.2-2. No requirements have been given to LFI for any unit for regions that Table 5.10.2Butle 5.10.2 05-089 shall not be painted. ASPI must close this issue now r .2 2 giving the actual requirements needed on each of the LFI units. JC

05-089

5.10.2 Table 5.10.2- Production drawings for the semi rigid harness are 05-089 .2 2 missing

AN

HIFI cannot take responsibility for the WIH intermediate connectors on brackets, as the 5.10.2 Table 5.10.2- harnesses on the lower platform form an integral part Sorry, this was the agreement 05-089 2 with the brackets. The connector back-shell .2 combination has to be dismounted before the bracket can be assembled to it.

250 CB 009

LFI

Sec. Butle 5.10.2 05-092 r .4

3.1

251 CB 010

LFI

Sec. Butle 5.10.2 05-092 r .4

Why is it stated that the harness will generally be 3.1 needed to be constructed in 3 sections and then only 2 sections are foreseen?

3.1

297 MM 005

LFI

3.1

211

3.1

Exception mail for separate PAC 5.10.2 425 Wildgruber MvB 05-093 bundles for S .6 3/3/04 CVV int. And ext.

3.1

3.1

3.1 3.1 3.1

Sorry, it is required in section 5.7.3 that all instrument warm units shall have an emissivity >0.8 for thermal control. Could be black paint or black anodization.

ASPI need to clarify what is so unusual in the detailed Butle 5.10.2 Table 5.10.2- definition of the LFI waveguides in comparison with all Just because this is considered as a "LFI 05-091 6 p 5-91 the other instrument interfaces that they need to be cryoharness" r .2 explicitly involved here. 5.10.2 Table 5.10.2- Instead of CAD models we like to receive production AN 05-089 no .4 2 drawings as industry is responsible of the routing and fixation of the cables (not the internal wiring), § HFI was never informed that manufacturing drawings manufacturing drawings of the cables cannot be JC 5.10.2- 05-091 of WIH are not provided by ASPI, only CAD provided: only CAD models, 2D scale 1 drawings 4 (pattern), and tables with cables length will be provided. § Paint-free areas are not known, some HFI CQM units same as comment 193 & 208 JC 5.10.2- 05-091 are already fully painted ! 4

3.1

3.1

paint free areas related to WIH are defined in the WIH drawings & cad models (annex 10). Paint free areas for the fixation of the MLI are not y yet defined. (see comment 193 from HFI & 248 from LFI) Scale 1 drawings, electronic version (pdf) + CAD models have been distributed. It is not foreseen to y deliver more.

AN

LFI is in agreement with HFI that insufficient information is available to manufacture tha warm 3.1 harness eg. No manufacturing drawings will be supplied.

HFI/IAS/JC HFI h 04-008

Page 14

Chapt M.Mi er 05-092 ccolis 5.10.2 .4 5.10.2 JC 05-092 .5.2

see reply given to HFI (comment 209). Our task was the routing of the WIH, not its detailed definition (wiring) and cannot provite more than the routing (CAD, drawings, length)

y

n

y

BC

3 section is the maximum for instrument accomodated on 2 openable lateral panels (HIFI). y I will modify the text to indicate up to 3 sections.

y

y

BC

LFI currently hasn't non-painted areas on any of the units to glue the harness locks

see comment 297, 248 from LFI & 193 from HFI)

y

n

y

BC

Replace "Refere" by "Refer"

Typo, will be corrected, thank you

y

y

y

BC

So separation and separate routing for PACS is only for the SVM( int) harness. A comment is missing that Comment confusing, ref changed to 5.10.2.6 & every bundle is routed via a separate CVV page 5-93. Every bundle routed via separate CVV y Feedthrough connector. This is regarded as critical w. feedthrough this was included in version 3.1 r. t EMC aspects. This is in contradiction to 5.14.2.3. Comment to §5.14.2.3 not treated therefore still valid .

n

y

BC

y

n

y

BC

y

y

y

BC

y

y

y

BC

y

y

at pdf output

BC

mail Twisted pair PAC 5.10.2 426 Wildgruber MvB 05-093 lines NOT This will cause higher coupling and can ’t be accepted. Too late to modify this. S .6 3/3/04 on adjacent reference to Annex 8 instead: " For Herschel, mail 30-035.10.2 Second para “the number off ..” – give the real 577 ESA TP 05-093 cable types used for the ISO mission are a 2004 .6 selection in this chapter!! baseline. They are described in annex 8." No. I rephrase as: "The implementation of Herschel cryoharness is described in annex 8, mail wvL 5.10.2 Design complemented by the detail pin allocation in 406 HIFI AN 05-093 Delete the last sentence, because IID-B is ruling! 5/3/04 .6 criteria HPLM EICD's: RD10 (FM) & RD11(QM). It is compliant with the instrument demand as specified in IID-B's." §> HFI/IAS/JC Yes, this has been identified ((MS word problem) 212 HFI JC 5.10.3 05-094 Sections numbering is wrong up to § 5.11 & will be corrected (see comment 29) h 04-008 .3 mail 30-035.10.3 Except of the first two, all numbers of sections are Yes, this has been identified ((MS word problem) 578 ESA CS 05-094 2004 .4 wrong (i.e. 5.1.1.3 shall be 5.10.3.4). & will be corrected (see comment 29) red team 5.10.3 Yes, this has been identified ((MS word problem) 377 ASP BC 05-094 section numbering reset to 5.1.1.4, up to 5.11 wk 7 .4 & will be corrected (see comment 29)

y

y

y

y

at pdf output at pdf output

BC BC

IID-A 3.3

Change Notice: issue 3.1 3.2 --> 3.3

on ID issue 3.1

3.1

407

427

Ref

Com Origi Sectio ment n n Nb from

mail wvL 5/3/04

HIFI

mail Wildgruber 3/3/04 red team wk 7 red team wk 7 red team wk 7 mail Wildgruber 3/3/04 HFI/IAS/JC h 04-008

3.1

43

3.1

309

3.1

310

3.1

443

3.1

213

3.1

3.1

257 CB 016

3.1

256 CB 015

AN

Page

5.10.4 PAC MvB 05-096 S .4 ASP AL

5.10.4 05-096 .5

Industry Reply, or ref

Modify reply IID-A (Y/N)

Done in Reply by IID-A

Add the following sentence (ref. EMC-WG meeting #14): For digital circuitry distributed grounding to chassis of ground planes should be utilized.

OK

y

y

y (check) BC

Replace Equipment by Warm Unit to clarify

Bonding philosophy here applies for warm unirts on the SVM, not for FPU's

y

n

y

BC

title, fig, Remarks table, or req

Secondary 5.10.3 05-094 Power .6 Grounding

Page 15

in the "following paragraphs" instead of the "previous 3.1 paragraphs"

OK

y

y

y

BC

ASP PC

5.11

05-098

replace ref to fig 5.6-1 by fig 4.6-1

done

y

y

y

BC

ASP PC

5.11

05-098

inser fig 5.11.1 (missing)

done

y

y

y

BC

PAC ohb-1 5.11 S

05-098

Table 5.11- 1 is missing

yes. Forgotten. Is now included. See 310

y

y

y

BC

HFI

5.11

05-099

Page number do not include chapter prefix up to page there is a return line on page numbering from p 6-1 100. Will be corrected

y

y

at pdf output

BC

mail PAC 448 Wildgruber hf- 1 S 3/3/04

5.11

05-099

PACS does not have a Standby mode anymore. For PACS, Standby mode can be replaced by Safe mode in this column.-->replace

This has been changed only very recently in PACS IID-B. Standby is a generic term (used by y all other instruments) representing the instrument state when it is not observing but powered on.

n

y

BC

LFI

Butle r

5.11

05-100

y

n

y

BC

LFI

Butle r

Sec. 5.11

05-100

y

n

y

BC

n

y

PC

The essential HK will be the only TM downloaded in real time when the S/C TM rate is 500bps or 5kbps. The table 5.11-3 gives the spacecraft y mode in which this will be the case : in S/C Sun Acq Mode and S/C Survival Mode.

n

y

PC

done

y

y

y

BC

RD6 (SOFDIR)

y

y

y

BC

When the S/C transitions to EAM or SAM, the instruments will be commanded accordingly in some Standby Mode (to be agreed) by the CDMU SW at Mode initialisation (see answer to 301), as shown in Table 5.11-3. The same piece of SW may change the Bus Profile as well. The new Bus y profile will anyway be set to comply with the instruments need in their defined Standby Mode (this need is expected to be HK only), but no command is currently planned to be sent to the instrument.

n

y

PC

y

BC

JC

It is interesting to note that option for the ground to use the Low Gain Antenna require that the satellite is This is not a mistake. Both antenas MGA/LGA) Table 5.11-3 not in Nominal Mode or Earth Aquisition Mode. I are connected in parallele: the nominal MGA will p 5-100 suspect this is a mistake. If not a mistake please be used unless the signal/nois ration is too bad. justify.

3.1

The comments of M Miccolis in closing the Action 16 of the DMWG have not been considered in the updating of the section. Alcatel need to rspond on this issue. Comments of Miccolis are attached again.

comments have beein included in this list under the name M.Miccolis (preceded by their original sequence number), under the ref DMWG-16 with the reference 301 to 308, and are answered

3.1

301 DMWG-16 LFI

M.Mi colis

5.11

The status of the instrument is either : - commanded by ground command in line with the modes table - commanded from the MTL (unlikely case, but possible) - commanded by the sequence which initialises the satellite mode ; eg ;, when the satellite enters 1. Table 5.11.3 and Figure 5.11-4: it is not clear how it in sun acq mode, the instruments which are OFF y 05-100 Table 5.11.3 is decide the status of the instruments when the remain OFF, those which are in Science Mode are transitions are not commanded from ground commanded into a standby Mode (the details of the mode has to be agreed between instr. and ESA/ASP while the corresponding commanding has to be described by the instrument teams). Note that the commanding into this standby mode could be performed by a CDMU SW function, or more probably via an OBCP.

3.1

302 DMWG-16 LFI

M.Mi colis

5.11

05-100

3.1

311

3.1

red team ASP PC wk 7 HFI/IAS/JC 214 HFI JC h 04-008

5.11.1 05-100 5.11.1 05-100

3.1

252 CB 011

LFI

Butle Sec. 05-101 r 5.11.1

3.1

253 CB 012

LFI

Butle Sec. 05-101 r 5.11.1

3.1

red team 312 wk 7

ASP PC

3.1

313

red team wk 7

ASP PC

5.11.1 05-101

5.11.1 05-101

2. Table 5.11.3: it is not clear here the use of the essential HK remove shall in "the CDMS shall hense has the capability to:" "The 1553 Bus DLL FDIR is described in RDxx section 3.2.2,…", specify RD number

What command is being sent to the instrument to inform it that the subframe allocation has changed when the satellite changes mode autonimously to SAM and EAM.

3.1 What document contains the 1553 FDIR? replace RDxx by RD6

RD6 (SOFDIR)

y

done

y

y

y

BC

y

y

y

BC

done

y

y

y

BC

removed

y

y

y

BC

table updated by PC has 32 for Planck & 33 for y herschel (46 in busr mode). No changes expected

n

y

BC

replace "For Planck Satellite instruments in normal mode of operation, a total of 32 subframes is allocated ; this allocation is inclusive of ALL telemetry packets generated by Planck instruments, ie :" by "For Planck Satellite in nominal mode of operation, a done total of 32 subframes is allocated to the instruments; this allocation is inclusive of ALL telemetry packets generated by Planck instruments, ie :" Same change for herchel

3.1

314

red team wk 7

ASP PC

5.11.1 05-101

3.1

579

mail 30-03ESA PE 2004

5.11.1 05-101

3.1

37

red team wk 7

5.11.1 05-101

ASP YR

add before planck subframe allocation table: "It is pointed out that the allocation is dependent upon the satellite modes. Detaies are provided in the table hereunder: The burst mode for Planck has disappeared. DMWG will check if this is correct (TBC). - P instruments are allocated 33 subframes for TM and 2 for TC. - H instruments are allocated 46 subframes for TM and 2 for TC. The tables for H and P should be updated from System Budget Report issue 6.

IID-A 3.3

Change Notice: issue 3.1 3.2 --> 3.3

on ID issue

3.1

3.1

Ref

Com Origi Sectio ment n n Nb from

303 DMWG-16 LFI

304 DMWG-16 LFI

3.1

305 DMWG-16 LFI

3.1

580

3.1

Page

M.Mi 5.11.1 05-101 colis

Only 2 instruments modes are specified to us : instrument is in science or instrument is not in science (and only generates housekeeping). The only S/C mode in which the instruments are in 4. Chapter 5.11.1: in the table with the allocation of subframes the available subframes are intended to be science mode is the Nominal Mode ; in all the other modes, the allocation is given and the maximum allowable in a certain satellite mode. corresponds to the generation of HK only. We Here is still missing an allocation of subframes don’t believe it necessary to refine the allocation, against the instrument's modes. considering that in S/C Nominal Mode, both HFI and LFI are allocated much more slots than requested via the IID B data rates requirements.

M.Mi 5.11.1 05-101 colis

5.11.1 05-102 5.11.1 05-102

mail PAC 449 Wildgruber hf- 2 5.11.1 05-102 S 3/3/04

3.1

643

254 CB 013

LFI

3.1

315

red team wk 7

3.1

215

HFI/IAS/JC HFI h 04-008

3.1

306 DMWG-16 LFI

3.1

316

3.1

red team wk 7

P.Co 5.11.1 05-102 uzin

Butle Sec. 05-102 r 5.11.2

ASP PC

JC

307 DMWG-16 LFI

Done in Reply by IID-A

n

y

PC

y

n

y

PC

The answer to 301 and 302 should respond to this. Note that the concept of essential HK is y linked only to the constraints on the downlink, not to the instruments modes.

n

y

PC

ok

y

y

y

BC

ok

y

y

y

BC

updated. See 643

y

y

y

BC

action ASP AI 15 from DMWG18

y

y

y

PC

See answer to 303 : the usage of packet stores will be described by ESOC which are the “ It is all well an good to now that the packet storage is programmers of the mission ” (there is already a flexible, but there neds to be a set of requirements TN on that). We understand your concern, given on how it will actually be structured to ensure y however it is impossible to us to commit on the 3.1 there is a coherent framework inwhich the satellite, use ESOC will make of the spacecraft instruments, ground segment are designed and tested capabilities. Discussions on this issue have - and then operated in orbit. started during last DMWG, and are not closed yet ...

n

y

PC

y

y

y

PC

5. Chapter 5.11.1: in the discussion about the introduction of the essential HK (somewhere they are still called "critical"). Here shall be inserted the concept that they are used when, due to non-critical situations, the satellite is forced to reduce the download capability. This situation must be completely transparent to the instruments that don't experience any change in the interfaces toward the satellite. The Essential HK could be used also when the satellite is forced to change the mode of the instruments, but in this case, since the instrument management passes under the CDMS control (and not the MTL uploaded from ground), the operating scenario is completely different and TBD for some aspects. last sentence before section 5.11.2: typo "1 over 11" should be "1 over 10" TBC can be removed from Medium Rate TM. 150 kbps is confirmed as per SG-ICD. This is the same comment as made previously: "PACS has to insist that while PACS is the prime instrument, other instruments non- prime data does not exceed 2 kbit/ s, i. e. for HIFI and SPIRE together not more than 4 kbit/ s. " While this data rate limits were in previous issues of the IID- A they now have disappeared. This may cause a problem for PACS, since if the other instruments use the full 3 subframes each, they have once PACS is prime instrument, only 80 kbits/ sec for PACS will be left. For the IID- A it is not sufficient to just limit the data rate as such, but give the exact detail of its distribution among prime and non- prime instruments. The PACS science data compression/ reduction scheme is designed to work at rates up to 120 kbits/ sec. With 4 + 2 + 2 kbit/ s HK and ~1 kbit/ sec for TC verif. and Events this is compatible with the 130 kbit/ sec as limit. add: For Herschel, the average data rate for non prime instruments, ie. generating only HK data, shall NOT exceed 2kbps each.

5.11.2 05-102

replace 3rd paragrap by: "The storage is organised in packet stores (partitions). The stores are sized to record the expected TM packets production rate over 48h operation. Event Telemetry packets from all instruments and spacecraft are stored in a dedicated packet store done (TBC) NB: It is possible to redefine the packets store size and/or their TM allocation, at each ground contact; any combination is therefore possible as far as the stores allocation per instrument is concered. The implementation is an operation issue.

§ 05-102 5.11.2

Last word isTBC, is it still true at this stage?

yes. (event TM packets in dedicated packet store). This will be defined by the operations (esoc), and can be easily programmed by TC.

y

n

y

BC

6. Chapter 5.11.4: according to PS-ICD (req. 4050TFL of appendix 9) the BC shall be capable to distribute up to 12 TC per second. Then it could not exceed the rate of 2 TC per second to each RT.

There are in total 4 intelligent RT’s (packet terminals) on the bus. With 12 TC packets per y second, one could then distribute more than the 2 TC’s/s per packet user.

n

y

PC

telemetry: replace "normal" with "nominal"

done

y

y

y

PC

7. Chapter 5.11.5: the TC transfer protocol is already defined in the PS-ICD. This is intended to take the precedence over the IID-A for these issues.

The part of §5.11.5 strictly dealing with the transfer protocol is in line with the PS ICD (as stated in the beginning of the paragraph), and will y be maintained in line ; it however provides some more details and addresses the FDIR. We prefer to leave the section as is for consistency.

n

y

PC

M.Mi 5.11.4 05-103 colis

ASP PC

Modify reply IID-A (Y/N)

The comment is relevant, and the design allows to implement the non propagation feature ; however the decision on where (in which packet store) to store a given data is an operational issue : ESOC has the capability to decide by simple TC ’s to mix y HFI and LFI data , and in that case of course a TM rate failure will propagate ... We cannot therefore put your statement in the IID A ; it does not depend on us !

M.Mi 5.11.1 05-101 colis

3.1

3.1

Industry Reply, or ref

3. Chapter 5.11.1: in the note on the limitation of the TM rate by the instrument should be indicated also: that the satellite shall not be damaged by an accidental TM overflow and the SSMM shall guarantee that the exceeding TM will be eventually lost, but shall not "propagate" the failure to other storage in the SSMM (e.g. shall not occupy the space dedicated to other data).

mail 30-03ESA AE 2004 mail 30-03581 ESA PE 2004

ASP

title, fig, Remarks table, or req

Page 16

5.11.5 05-104

M.Mi 5.11.5 05-104 colis

IID-A 3.3

Change Notice: issue 3.1 3.2 --> 3.3

on ID issue

Ref

Com Origi Sectio ment n n Nb from

3.1

308 DMWG-16 LFI

3.1

317

3.1

3.1 3.1

red team 25 wk 7 583

27

3.1

216

217

red team wk 7

title, fig, Remarks table, or req

M.Mi 5.11.5 05-104 colis

ASP PC

5.11.5 05-107

ASP DG

5.11.6 05-107 3.1d .2

mail 30-03ESA JT 2004

red team 26 wk 7

3.1

3.1

red team wk 7

Page

ASP DG

ASP DG

HFI/IAS/JC HFI h 04-008

HFI/IAS/JC HFI h 04-008

JC

JC

Page 17

Industry Reply, or ref

8. Chapter 5.11.5: the TM transfer procedure for Nominal and Burst mode is already defined in the PSsame as 307 ICD. This is intended to take the precedence over the IID-A for these issues. add at the end of section:add after SA1T (ref PS-ICD done annex 9, fig 4.4.1).

Modify reply IID-A (Y/N)

Done in Reply by IID-A

y

n

y

PC

y

y

y

PC

start of scan : qui garantit les 5 ms ?

Subject to be clarified with SPIRE. What is needed exactly. Add TBC and clarify with SPIRE

y

y

y

PC

5.11.6 05-107 .3

The slew start flag needs to be delivered to BOTH instruments, not only to HFI.

LFI mission timeline management is different than the on eof LFI. However, this information can also y be sent to LFI

y

y

BC

5.11.6 05-107 3.1d .3

typo providse

done

y

y

y

BC

5.11.6 05-107 3.1d .3

not new. Has been agreed with HFI. Is now In addition, an indication of the Start of slew time, and modified to: "In addition, an indication of the End of the estimated slew duration will be sent to the of slew time, and of the estimated time of next y instruments (HFI) by the spacecraft CDMU as a slew will be sent to the Planck instruments (HFI & dedicated TC packet, through the Mission Timeline. LFI) by the spacecraft CDMU as a dedicated TC => c'est nouveau ! packet, through the Mission Timeline. "

y

y

BC

5.11.6 05-107 .3

"providse" should read "provides"

Typo, will be corrected, thank you

y

y

y

BC

5.11.6 05-107 .3

2d sentence should be: "In addition, a TC shall provide the End of Slew time, and…"

as agreed in data management WG n° 18. changed to "In addition, an indication of the End of slew time, and of the estimated time of next y slew will be sent to the Planck instruments (HFI & LFI) by the spacecraft CDMU as a dedicated TC packet, through the Mission Timeline. "

y

y

PC

n

y

PC

y

y

PC

3.1

582

mail 30-03ESA AE 2004

5.11.8 05-107

Given the definition of APID in AD5 (PS-ICD) "The Application Process ID uniquely identifies the onboard source of the packet." we probably need to give comment is valid, and section 5.11.8 remains in a unique APID for the nominal unit and another for the line with this : the APID shall uniquely identify the y redundant unit. This in order to correctly interpret the source of the packet. TM with the associated data base entries (e.g. calibration curves are different between A and B units.

3.1

584

mail 30-03ESA PE 2004

5.11.9 05-108

Observation Identifiers are only relevant for Herschel. true; paragraph shall be updated by adding "On Herschel, observation identifiers are used ....."

3.1 3.1

red team 12 wk 7 red team 14 wk 7

3.1

13

3.1

585

3.1

red team wk 7

ASP DG

5.12.1 05-109 3.1d .2

ASP DG

5.12.2 05-110 3.1d

ASP DG

5.12.2 05-111 3.1d

mail 30-03ESA PE 2004

5.12.3 05-111

15

red team wk 7

ASP DG

5.12.3 05-111 3.1d

3.1

16

red team wk 7

ASP DG

5.12.1 05-115 3.1d 0

3.1

586

3.1

3.1 3.1 3.1 3.1

mail 30-03ESA PE 2004

5.12.5 05-112

17

red team wk 7

ASP DG

5.12.5 05-112 3.1d .1

18

red team wk 7

ASP DG

5.12.5 05-112 3.1d .1

red team 19 ASP DG wk 7 red team 20 ASP DG wk 7 HFI/IAS/JC 218 HFI JC h 04-008

5.12.5 05-112 3.1d .1 5.12.5 05-112 3.1d .1 5.12.5 05-114 .2

3.1

275 FV008

3.1

587

3.1

LFI

F.Vill 5.12.5 05-114 a .2

mail 30-035.12.5 ESA CS 05-114 2004 .2 A. 5.12.5 286 AM_008 LFI Menn 05-114 3.1 .2 ella

Ajouter une puce sur APE around LOS (améliore la OK lisibilité) Faut-il préciser qqch sur les contraintes op érationelles not in this issue. en cas d'éclipse de lune ?

y y

y

y

BC

y

n

n

BC

y

y

y

BC

by analysis.

y

n

y

BC

OK

y

y

y

BC

add "(minus the actual APE on each end)"

y

y

y

BC

reworded. See comment 21. Calibration will be performed by instruments.

y

y

y

BC

This was the case

y

n

y

BC

this is not and will not be a ref document. Peak up y sequence included in IID-A

y

y

BC

mettre des TBC sur les durées de calibration

no TBD at CDR…

y

n

y

BC

préciser que la fonction peak doit marcher au moins jusqu'à 10 arcsec

this is included (end of 3dr paragraph

y

n

y

BC

y

y

at pdf output

BC

y

n

y

BC

y

y

at pdf output

BC BC

dernière ligne du paragraphe : la précision ne concerne pas forcément la donnée qui est en TM car add " (eventually after ground processing)" il peut y avoir des outils sol qui permettent d'obtenir la précision d'AME demandée. Reworder dans ce sens. requirements on the forces generated by HFI 0.1 K cooler helium exhaust jet: how will this be enforced? tested? Modifier "Instrument teams will perform LoS calibrations by receiving ACMS raw attitude information" par "Instrument teams will perform LoS calibrations wrt ACMS sensor LoS by receiving ACMS raw attitude information" Préciser quelque part que la zone opérationelle prend en compte l'APE. The section on calibration is weak (except for the peak-up). Needs to be updated. Possible source for Herschel is SCI-PT-19552. No known source yet for Planck, work in progress. Format de peak up : se mettre en conformité avec l'exigence IAC-060-H de la SVM IS (IS-0042) issue 5.0. En particulier type de packet, normal au plan focal… pour la procédure et la séquence des évenements liès au peak se repporter à l'exigence GOF-165-H c de la SVM RS issue 4.1

Yes, this has been identified ((MS word problem) Sections numbering is wrong up to § 5.13 & will be corrected (see comment 29) the ACMS is designed against the ESA spec: Herschel Planck System requirement It seems to me that the requirements on the LOS specification, which is included here in IID-A 3.1 accuracy (1.5°) w.r.t. ACSM LOS is not compilant with (5.12.3 for Planck). The instrument pointing the pointing requirements (sec. 5.12.3) requirements are not considered to design the ACMS. All numbers of sections are wrong (i.e. 5.1.1.2 shall Yes, this has been identified ((MS word problem) be 5.12.5.2). & will be corrected (see comment 29) Section numbering is inconsistent in pages 5-114 and Yes, this has been identified ((MS word problem) 5-115 & will be corrected (see comment 29)

y

y

at pdf output

y

y

y

BC

3.1

21

red team wk 7

ASP DG

5.12.1 05-114 3.1d .2

Je propose de reworder de la façon suivante : during the instrument LoS calibration wrt ACMS sensor LoS, the instrument team shall take into account that The Planck Instrument LOS will be aligned with the ACMS OK LOS with an accuracy of 1.5° maximum (including ground error sources, and in-orbit effects (gravity release, launcher effects, cooling)"

3.1

22

red team wk 7

ASP DG

5.12.8 05-114 3.1d

rajouter info en cohérence avec spec SVM "in case wheels are autonomously off-loaded, Herschel ACMS OK shall not violate Science Mode pointing requirements for more than five minutes" (ACF-006)

y

y

y

BC

3.1

588

5.12.9 05-114

need to define what "jitter strip" is

y

n

y

BC

mail 30-03ESA PE 2004

read definition in top of paragraph 5.12.1.2

IID-A 3.3

Change Notice: issue 3.1 3.2 --> 3.3

on ID issue

Ref

Com Origi Sectio ment n n Nb from

Page

title, fig, Remarks table, or req

Page 18

Industry Reply, or ref

Modify reply IID-A (Y/N)

Done in Reply by IID-A

3.1

38

red team wk 7

ASP YR

5.12.1 05-115 0

H allowed zone: 30.3° TBC => 30.6° H figure to be updated from SVM spec. P transient: 2° (TBC) => 1.7°

OK

y

y

y

BC

3.1

23

red team wk 7

ASP DG

5.12.1 05-115 3.1d 0

Herschel attitude domain : Se mettre en conformité avec exigence ACP-010-H a de la SVM RS issue 4.1 (en particulier 30.3=>30.6) et ACP-015-H

OK see comment 38

y

y

y

BC

3.1

24

red team wk 7

ASP DG

5.12.1 05-115 3.1d 0

y

y

y

BC

3.1

589

y

y

y

BC

3.1

329 ESA CCB

ASP BC

5.13.2 05-116

y

y

y

BC

3.1

mail 30-03590 ESA PE 2004

5.13.2 05-116 .5

y

y

y

BC

red team 318 wk 7 red team 319 wk 7

5.13.2 05-117 .5 5.13.2 05-117 .5

3.1 3.1

3.1

3.1

3.1

3.1 3.1 3.1 3.1 3.1

3.1 3.1 3.1 3.1 3.1 3.1

3.1

3.1

3.1 3.1

320

mail 30-03ESA PE 2004

red team wk 7

ASP PC ASP PC

ASP PC

5.13.2 05-115

5.13.2 05-117 .5

y

y

y

PC

6th paragraph: replace "shall" by "will"

OK

y

y

y

PC

add at the end of section: "The spacecraft CDMU will monitor the communication via the MIL-1553 bus for both TM acquisition and TC distribution, as specified in RD6, appendix 1. In case a communication anomaly is evidenced with an instrument, the instrument shall define the safe configuration it shall be put in."

OK

y

y

y

PC

y

y

y

BC

y

n

n

BC

y

y

at pdf output

BC

y

at pdf output

BC

y

y

at pdf output

BC

y

y

at pdf output

BC

y

n

y

BC

y

n

y

BC

y

y

y

BC

y

y

y

BC

y

n

y

BC

mail Allowed PAC 5.14.1 A comment should be added that this is not valid for 428 Wildgruber MvB 05-119 Interface added in the table legend S .4 the scientific data analogue signals. 3/3/04 Technologie “This is not valid for solid cryo harness multicore mail cables, about 60 to 70 cm are needed” can’t be PAC 5.14.2 Shield Open point 429 Wildgruber MvB 05-121 accepted. Not treated, therefore still valid. Design S .9 Coverage Verification Analysis required to show that the CH is in3/3/04 line with PACS- MA- SP- 001. §> HFI/IAS/JC Yes, this has been identified ((MS word problem) 219 HFI JC 5.14.2 05-121 Sections numbering is wrong up to § 5.15 h 04-008 & will be corrected (see comment 29) .11 5.14.2 the paragraph numbering is out of synch from here for Yes, this has been identified ((MS word problem) mail 30-03591 ESA AE 05-121 2004 .12 the rest of chapter 5.14 & will be corrected (see comment 29) A. 5.14.2 Section numbering is inconsistent from end of page 5- Yes, this has been identified ((MS word problem) 287 AM_009 LFI Menn 05-121 3.1 .12 121 to the end of section 5.14 & will be corrected (see comment 29) ella 5.14.2 Yes, this has been identified ((MS word problem) red team 379 ASP BC 05-121 section numbering reset to 5.1.1.12, up to 5.15 wk 7 .12 & will be corrected (see comment 29) mail Cable The Astrium proposal for the PACS SVM - Harness PAC 5.14.2 430 Wildgruber MvB 05-121 Shield made of Copper with different cable types will be in No. Copper parts are insulated. S .13 3/3/04 Insulation contradiction to this. mail As mentioned several times before: Daisy chaining PAC 5.14.2 I thought there was an agreement on the 431 Wildgruber MvB 05-122 and shield connection wires with a total length of 8 cm S .16 cryoharness definition. 3/3/04 CAN NOT BE ACCEPTED! mail wvL 5.14.3 408 HIFI AN 05-124 5.14.3-2 EMC Fig. 5.14.3-2 is missing OK Thank you- retreived & included. 5/3/04 .1.2 red team 5.14.3 44 ASP AL 05-124 3.1 figure 5,14,3,2 is missing same as 408 wk 7 .1.2 red team wk 7 red team 46 wk 7 red team 47 wk 7 45

592

ASP AL ASP AL ASP AL

mail 30-03ESA JT 2004

mail 432 Wildgruber 3/3/04 mail 433 Wildgruber 3/3/04 mail wvL 409 5/3/04 red team wk 7

3.1 pourquoi "Bulk Current Injection"? 3.1 D'où provient cette exigence? 3.1

5.14.3 05-130 .13

ajouter "10 V/m from 8,45 GHz to 8,5 GHz (spacecraft TM)" Regarding Arc Discharge Susceptibility the requirement is not made applicable to Herschel instruments, but should also not be applicable to Planck instruments (the LFI receivers will not survive such arc discharges)

PAC MvB 5.14.7 05-131 fig 5.14.7- 1 Does not match to Figure 5.9.5.- 2 S HIFI

HJ

149

3.1

mail PAC 450 Wildgruber js-1 S 3/3/04

3.1

147

red team wk 7 red team 148 wk 7

5.14.3 05-126 .4 5.14.3 05-.126 .7 5.14.3 05-129 .10

Plug- in and PAC DI / dt < 2A / us with LISN and dI / dt < 1 A / us with MvB 5.14.7 05-130 Inrush S LCL ? Current

3.1

3.1

Planck attitude domain : se mettre en conformité avec exigence ACP-020-P et ACP-022-P de la SVM RS (en OK see comment 38 particulier 12=>11,7) replace N/A by "The instrument (DPU's) are On-Board hardware: Why is this NA? I would have connected to the Satellites CDMS by 1553 serial assumed that specific hardware features are relevant bus lines, and some of them are connected to a for the IID-A. synchronisation line." includes ref to PSS-05-02 + BSSC 96(02), correct Done also AD 8 accordingly replace OIRD by: "IID-B's (section 5.13)." (in fact Process control: what does the text mean? The OIRD will be as the activity to define the interface FDIR merely specifies requirements. is starting). 3rd paragraph: after RD6 add:" Conditions for mode OK transition are shown in fig 4.6-1

ASP PS

ASP PS ASP PS

3.1

mail 30-03593 ESA TP 2004

3.1

mail PAC 451 Wildgruber js-2 S 3/3/04

5.15

Instrument 05-132 handling

NOT AGAIN! copy IID-B 3.1 (section 5.15.2.3)

What about pipes ? I assume 4K, 0,1 K pipes will be delivered in containers ? To add a 5.15.1.3, or to write 5.15.1 05-132 3.1 a chapter common for all containers (need is the same) No delivery of a transport container for the FS 5.15.1 foreseen, QM container will be used. Transport No shock recorder are foreseen, only shock indicators container 5.15.1 05-132 (type tbc) 5.15.1.1 Focal Plane No witness samples will be installed (ESA refused up to now to supply samples) Internal Unit 5.15.1 units shall provide adequate hoisting provisions if > 05-132 3.1 .1 20kg, otherwise operators can handle by hand 5.15.1 05-132 3.1 Idem .1 This chapter is not really an answer to the IID B 5.15.2 05-133 requirements and gives no idea on special .3 implementation aspects Particle EOL for the FPU now 1200 ppm (old value The was 75 ppm) expected • Molecular contamination increased from 27 *e-7 Herschel instrument g/cm^2 to82.8 *e-7 g/cm^2.(for 27 *e-7 g/cm^2 we had 5.15.2 already 0.6%loss per mirror @63µm if contamination 05-133 FPU .3 cleanliness is water ice. degradation Please note, that PACS requirement is 60 *e-7 during AIV g/cm^2 (EOL @FPU level).The verification of this and launch requirement stays unclear.

modified by LT. No reasons to update untill you have alternative modified by LT. No reasons to update untill you have alternative

y

n

y

BC

OK, added at end of section

y

y

y

BC

May be, but Planck instrument are outside the satellite and do are exposed to radiations. Therefore this requirement cannot be waved for Planck. Solution is in their grounding philisophy.

y

n

y

BC

What is the question ?

y

n

y

BC

yes

y

n

y

BC

What is the question ? HIFI IID-B 5.15.2.3 does not exist

y

n

y

BC

include in 5.15.1.2

y

y

y

BC

This is your organisation, and can be accepted if cleanliness is OK

y

n

y

BC

included at the end of 5.10.3

y

n

y

BC

included at the end of 5.10.3

y

n

y

BC

agreed. Will be implemented in a next issue

y

n

n

BC

Tables have been clarified, but reflects the current estimation. Non compliances have been y highlighted

y

y

BC

IID-A 3.3

Change Notice: issue 3.1 3.2 --> 3.3

on ID issue

3.1

3.1

3.1

3.1

3.1

3.1

51

Ref

Com Origi Sectio ment n n Nb from

red team wk 7

ASP PM

title, fig, Remarks table, or req

150

red team wk 7

red team wk 7

ASP PS

151

ASP PS

3.1

mail PAC 453 Wildgruber js-4 S 3/3/04

3.1

595

3.1

mail PAC 455 Wildgruber js-6 S 3/3/04

3.1

mail PAC 454 Wildgruber js-5 S 3/3/04

mail 30-03ESA TP 2004

mail PAC 456 Wildgruber js-7 S 3/3/04

Modify reply IID-A (Y/N)

Done in Reply by IID-A

y

y

y

BC

This requirement is a standard requirement for optical instrument. If you can demonstrate that you have no problem with the relaxed version, we y are ready to accept your waiver. This is not very consistant with your rigid position on EOL contamination….(451)

n

y

BC

the statement refers to 5.15.2.5. True. There is no bakout for Planck. The first sentence will be y removed.

y

y

BC

irrelevant for this section. Removed.

y

y

y

BC

same as 149: add pipe in the title

y

y

y

BC

y

y

y

BC

included as:"Each unit weighing more than 10 kg shall be equipped with handles, or if mass of equipment > 20 kg hoisting points shall be provided (with ancillary tools provided as eyebolts y or even the hoisting device when applicable). The geometry of the MGSE shall be compliant with layout at satellite level when mounted."

y

y

BC

check please. This is pretty obvious, even for your y own operations.

y

y

BC

LFI purging requirements are still not confirmed (ref IHDR)

y

n

y

BC

PACS did not required any purging in IID-B, therefore no purging will be provided to PACS (only HIFI LOU & may be LFI)

y

n

y

BC

no purging for PACS. see comment 455

y

n

y

BC

y

n

y

BC

the agreement was not to duplicate the EVTR, but y to refer to it.

n

y

BC

Yes, delivered after the PDR, updated continuously on ftp server next to IID-A

y

n

y

BC

BC

Industry Reply, or ref

Remplacer les budgets de contaminations par les tableaux du fichier word joint, note: pas done de nettoyage de la cavité optique Planck en baseline

5.15.2 05-133 .3

5.15.2.4 Our Comment on Issue 3/ draft- 2 was: Outgassing The NEW out gassing requirements for the FPU properties of cannot be accepted. This would affect our black paint material (there is no paint with such low out gassing values). Part TML mail We could even have problems with the PACS feet, PAC 5.15.2 452 Wildgruber js-3 05-134 CVCM the distribution board, our capacitors, and filters. The S .4 FPU 20 kg, geometry compliant with lay-out at satellite level when mounted.

5.15.3.2 Warm 5.15.3 New handing points required. Do we need a redesign. 05-134 electronic .2 M.v B.: Inform E- units supplier units and interconnect What means “provision of purging equipment ” to be 5.15.4 05-135 provided by instr.? I understood there is a requirement to purge LFI?? Who is responsible for the: definition of purging connection 5.15.4 5.15.4 05-135 provision of purging equipment Purging detail purging requirements and procedures assistance in commissioning purging procedures 5.15.4 05-135

5.15.4 Purging

It is not foreseen to provide purging equipment together with any PACS unit.

5.15.5 Mechanism positions Sometimes mechanisms should be placed in a certain position, to avoid possible damage caused by vibration during transport. Should this be the case There is currently no demand for PACS active Mechanism then this position shall be listed in the IID- B (AD 1- 1 locking system poweredd by S/C during Launch. 5.15.5 05-135 to 1- 6) positions This is much too late to ask for that. Task to be performed: Release of the grating launch Needed equipment and procedure Requirement needs to be implemented into the IID- B (CR)

mail 30-03ESA TP 2004

3.1

596

3.1

mail PAC 457 Wildgruber js-8 S 3/3/04

3.1

112

3.1 3.1

red team wk 7 red team 113 wk 7 mail wvL 410 5/3/04

5.16

5.16

I would propose to enter environmental interfaces in chapter 9 if they are considered to be better placed there! We did not check RD2: Environment & Tests Environment Requirements 05-135 requirement Do we have this document s 05-135

ASP PR

5.16.2 05-136

Supprimer la phrase sur l'équivalent aluminium shield .

OK. Covered by the 10krad requirement at unit level

y

y

y

ASP PR

5.16.2 05-136

Dire 'The maximum total dose …."

OK

y

y

y

BC

no. This is not in the RD list, and instruments are not supposed to have it

y

y

y

BC

OK add RD13 Solid Particle Environment for Herschel and Planck", EMA/02-027/GD/PLCK, 08/03/2002-ESA/TOS-EMA. See comment 662

y

y

y

BC

n

y

BC

y

y

BC

HIFI

HJ

Radiation Replace RD2 by H-P-I-ASPI-AN-0321V1 environment L'EVTR réferre à un doc ESA pour les micrométéorites. On pourrait le mettre en AD de l'IID5.16.3 05-136 A. C'est "Solid Particle Environment for Herschel and Planck", EMA/02-027/GD/PLCK, 08/03/2002ESA/TOS-EMA 5.16.2 05-136

3.1

114

red team wk 7

3.1

597

mail 30-03ESA TP 2004

3.1

598

mail 30-03ESA JT 2004

6.2

06-01

3.1

350

red team wk 7

6.2

06-01

3.1

mail PAC 444 Wildgruber ohb-2 S 3/3/04

6.2

06-01

ASP PR

ASP DM

5.16.4 05-136

yes, it exists, but has been masked by the There is no chapter like this – numbering problem in numbering probem (see p 9.36, 37, 38). This will y chapter 9 be corrected at next pdf production The descriptions of EGSE equipments apply to Description of satellite EGSE has been included Herschel only. A similar y (H & P) description for Planck should be included. 3rd paragraph, 2nd bullet add"to be used for analysis). Add O.Bauer's drawing Add: For Planck, each instrument is delivered with its own EGSE. EGSE Better: The EGSE shall be supplied with each instrument model. Modify

BC

BC

IID-A 3.3

Change Notice: issue 3.1 3.2 --> 3.3

on ID issue

Ref

Com Origi Sectio ment n n Nb from

3.1

mail 30-03599 ESA PE 2004

3.1

351

red team wk 7

3.1

626

3.1

645

3.1

mail 30-03600 ESA CS 2004

3.1

352

red team wk 7

3.1

353

red team wk 7

3.1

354

3.1

355

3.1

356

3.1

357

3.1

358

Page

title, fig, Remarks table, or req

06-01

6.3.1

06-02

mail 30-03ESA JT 2004

7

07-01

ASP BC

7

07-01

7.1.2

07-03

ASP DM

7.1.2

07-03

ASP DM

7.1.2

07-03

Note , 2nd bullet. After "SVM contractor", insert "for integratiion into the AVM satellite". End of bullet, replace "Launch" by "IOCR" (In orbit commissioning Review) (acronym to be added in section 2)

ASP DM

7.1.3

07-04

3rd line: replace QM by CQM

ASP DM

7.1.3

07-04

ASP DM

7.1.4

07-04

red team wk 7 red team wk 7 red team wk 7 red team wk 7 red team wk 7 red team wk 7

ASP DM ASP DM

3.1

359

3.1

mail PAC 441 Wildgruber rk- 3 S 3/3/04

3.1

220

HFI/IAS/JC HFI h 04-008

3.1

360

red team wk 7

ASP DM

3.1

361

red team wk 7

ASP DM

3.1

red team 362 wk 7

ASP DM

3.1

red team 363 wk 7

ASP DM

ASP DM

JC

7.2.1. 1 7.2.1. 1

Modify reply IID-A (Y/N)

Done in Reply by IID-A

BC

last line: replace should by shall, and add at the end:"and as specified in the EGSE IF spec (RD3) There is no requirement on the diconnectability of the HFI cryostat (I.e. cooler pipes and harness, which I This is new, and currently needed only for QM. believe is now an assumption made by Industry in the integration sequence. add ref to AIT plans - Herschel RD 28, 29, Planck RD 26-1..4 Second note shall include, that also the SPIRE CQM JFETs will be returned to the instrument team at the Agreed end of the EQM test campaign. 2nd paragraph 1st bullet: replace -> by "including" Agreed before EMC testing

BC

BC

y

y

y

PR

y

y

y

BC

y

Y

Y

BC

Agreed

y

Y

Y

BC

Agreed

y

Y

Y

BC

y

Y

Y

BC

y

Y

Y

BC

note, end of 2nd bullet, add ", and will remain here Agreed until IOCR" table last line 1st column p 7-4, replace "Leak test" by Agreed "RCS leak test"

07-05

title: replace CQM by EQM

Agreed

y

Y

Y

BC

07-06

1st bullet: add "simulating the SVM."

Agreed

y

Y

Y

BC

y

Y

Y

BC

y

n

y

BC

y

y

y

BC

y

Y

Y

BC

7.2.1. 1

07-06

7.2.1. 2.1

07-07

7.2.2

07-08

7.2.2. 1

07-08

7.2.2. 1 7.2.3 & 7.2.4 7.2.5. 1

Industry Reply, or ref

contains virtually no information on Planck. On Herschel it is fairly vague. The text seems to indicate that a total of 2 EGSEs is required for the 3 instruments, whereas each instrument shall provide 2 EGSEs (I think...). The usefulness of chapters 6.3.2 and 6.3.3 in an IID-A is questionable (p. 6-3)

6.3

ASP DM

Page 20

after last phrase, add: "Note: Some advanced tasks regarding cryogenic operations are performed prior to Agreed this sequence to provide more confidence in the behavior of the cryostat." Current definition is using the AVM. (except for (SFT using WE units would be preferred by PACS, to HIFI who delivers the QM's for CQM tests in be checked by MPE) parallele to AVM for SVM AVM. Start of Planck CQM with acoustic tests is is the What about an acoustic test prior to thermal test ? baseline now. TV test step one becomes an option (in case HFI is late) note 2 correct typo (iare-->are) Note 3: replace "(TBC)" by "during this phase", corrected replace "mechanical test" by "mechanical & thermal tests"

07-08

1st bullet replace "pipes" by "pipes MTD"

corrected

y

Y

Y

BC

07-09

replace section by "Not relevant for instruments: The instruments warm units will be integrated od dedicated corrected panels during the spacecaft integration"

y

Y

Y

BC

07-09

title: replace integration by mating

corrected

y

Y

Y

BC

y

Y

Y

BC

3.1

364

red team wk 7

ASP DM

7.2.5. 1

07-09

1st paragraph: replace by:"The PLM is on the SVM STM used as MGSE. The SVM STM structure and the instrument panels are mounted to the PLM. The first step is therefore to remove the instrument STM panels. The mating of the SVM includes the mechanical mounting and the electrical re-connection corrected of the warm units to the PLM units. The four panels involving the WU ’s will be delivered earlier in order to start the integration in parallel with the completion of the SVM. The SVM will be delivered with the remaining panels involving the platform equipment's."

3.1

365

red team wk 7

ASP DM

7.3

07-11

replace 1st paragraph by "After completion of the integration, be it at the level of the PLM, SVM, S/C, a corrected series of verification tests will be carried-out."

y

Y

Y

BC

3.1

366

red team wk 7

ASP DM

7.3

07-11

add "The instrument input for thr EQM and FM testing corrected are compiled in RD30 (QM) and RD31 (FM)"

y

Y

Y

BC

y

Y

Y

BC

y

n

y

BC

y

n

y

BC

y

Y

Y

BC

y

Y

Y

BC

y

y

y

BC

y

y

y

BC

3.1

367

red team wk 7

ASP DM

7.3.1

07-11

3.1

601

mail 30-03ESA PE 2004

7.3.1. 1

07-13

3.1

411

mail wvL 5/3/04

7.3.1. 1

PLM EQM 07-13 Test sequence

3.1

368

ASP DM

7.3.4

07-18

ASP DM

7.3.4. 3

07-19

3.1

red team wk 7 red team 369 wk 7

HIFI

WvL

3.1

mail 30-03602 ESA JT 2004

3.1

258 CB 017

3.1

red team 370 wk 7

LFI

7.4.1

07-20

Butle Sec. r 7.4.1

07-20

ASP DM

7.4.1

2nd paragraph 1st phrase, replace "This optical bench is assumed to be the Herschel Optical bench" by corrected "This optical bench is assumed to be similar to the Herschel Optical bench" Tables 7.3.1-1, 7.3.1-2 and 7.3.1-3 (p. 7.13, 7.15 and 7.18) would be much more useful if (expected/rough) Test duration have been removed from IID-A, and durations of the test sequences were given (as it is will be included in test specifications/prodedures. done for Planck) Yes. This is part of instrument IMT as we have no Straylight test deleted?! detectors inside the cryostat, apart the instruments. in table, for IST2, column remark, replace "He I" by corrected "He II". Also for mass measurement add"note: an advanced test (SVT 0) is performed with the AVM." The "blank test" mentioned here and in 7.4.1.4.1 is from what I hear - no longer planned.

3.1

At which point the PACE is integrated in to the PLM CQM is not explicitly shown

corrected QM test 1 is not any more the baseline, but remains an option in case HFI is late. Text has been updayed accordingly PACE in integrated in the first step (with the cryostrucure) (described as pipes). I've included a RD32: Planck assembly sequence

07-20

2nd paragraph: replace "the CQM cryogenic test is split" by "the CQM cryogenic test could be split"

corrected

y

Y

Y

BC

y

Y

Y

BC

y

Y

Y

BC

3.1

371

red team wk 7

ASP PA

7.4.1

07-20

between 3rd & 4th bullet, insert: "acoustic test (early test at PPLM level, with LFI MTD and HFI STM FPU's) corrected 4th bullet cryogenic test step 1: add TBC

3.1

372

red team wk 7

ASP DM

7.4.1

07-20

last paragraph: replace"the two instruments" by "the HFI instrument"

corrected

IID-A 3.3

Change Notice: issue 3.1 3.2 --> 3.3

Com Origi Sectio title, fig, ment Page n n Nb table, or req from HFI/IAS/JC § 221 HFI JC 07-21 h 04-008 7.4.1 red team 7.4.1. 373 ASP DM 07-21 wk 7 3 red team 7.4.1. 374 ASP DM 07-21 wk 7 3

on ID issue 3.1 3.1 3.1

Ref

LFI

259 CB 018

LFI

Butle 7.4.1. r 4.2

07-21

3.1

290 LV_001

LFI

L. Vale 7.4.1. nzian 4.2 o

07-21

Butle 7.4.1. r 4.3

Sec. Butle 7.4.1. r 4.3 mail 30-037.4.1. 604 ESA CS 2004 5 LFI

Sec. Butle 7.4.1. r 5

3.1

263 CB 022

LFI

3.1

291 LV_002

LFI

3.1

376

3.1

mail 30-03605 ESA JT 2004

3.1

288 AM_010

L. 7.4.1. Vale 5 nzian 7.4.1. ASP BC 5

LFI

end of 1st phrase, add:", acoustic and shock test"

corrected

y

Y

Y

BC

the situation has changed. Now the test sequence starts with an acoustic test. The cryogenic test y step one remains as an option. The baseline is all cryo tests in one shoot.

y

Y

BC

corrected

y

Y

Y

BC

y

Y

Y

BC

y

Y

BC

y

Y

BC

Yes. There is a microvibration test. It is perfomed first at room temperature, and will be repeated at cryo temperature in parallele with instruments functional tests (this statement shall be included) y Few test accelerometers will be installed on the CQM at relevant locations (on SVM near the 4K compressor , at the PLM/SVM interface, at PPLM FPU interface (triax) , one on LFI main frame (triax)

y

Y

PA

Agreed, but please, provide the relevant input if any.

n

y

BC BC

The FPU load is not a "flat coat of Eccosorb" but a set of pyramidal Agreed. Corrected structures. It would be best here not to describe it at all but just put in the requirement (20 dB reflection)

ASP DM

3.1

red team wk 7

BC BC

07-21

mail 30-03ESA JT 2004

3.1

Y Y

7.4.1. 4.2

603

262 CB 021

y Y

add- optional, remove last phrase of 1st paragrapgh (not accepted by CSL)

3.1

3.1

y y

07-22

red team wk 7

LFI

same as 220 corrected

7.4.1. 4.1

375

7.4.2

A. 7.4.3. Menn 1 ella

07-22

07-23 07-23

07-23

Done in Reply by IID-A

What about an acoustic test prior to thermal test ?

07-21

3.1

Modify reply IID-A (Y/N)

title: replace "vibration test" by "mechanical tests"

Butle 7.4.1. r 4.1

260 CB 019

261 CB 020

Industry Reply, or ref

Details have not been included of the cryogenic test 3.1 1. Include details of the test so that it can be clearly seen how it compliments Cryogenic test 2.

3.1

3.1

Remarks

Page 21

there are no requirements on the cold sky load on HFI nor LFI IID-B's. The only original requirement for this item was in IID-A. The baseline is a The cold load described does not correspond with the design of the cold sky load similar to LFI test requirements given by HFI and LFI. Rewrite including y facility (ie ecosorb CR110 pyramids 3.1 the cold load that meets the requirements of HFI and (h=30mmxsquare base 5mm) + 10mm bulk LFI. base.on an Al disk fixed on the copper passive Helium bath at temperature at about 4.2K). This can be included in IID-A The shroud in front of Planck FPU will be covered with a panel made of ECCOSORB CR110. The panel see comment 259. IID-A has been modified to reflectivity shall be lower than -25 dB in the Planck 3.1 include a sky load similar to the one of LFI test y detectors' operating band (27-900 GHz). Shroud facility. dimensions shall be such to cover an inscripetd circle of 600 mm in diameter. Is the vibration test mentioned in the "Vacuum Phase" a micro vibration test (or sensitivity test) against the HFI requirements? If it is a sensitivity test including HFI should it not be done when HFI is in thermal equilibrium at cryo temperatures? Please specify 3.1 clearer what the test is. Note that if it is a microvibration test using accelerometers it would be good to include it also in Cryogenic Test 1 so that the overall status of the facility etc could be checked prior to the inclusion of HFI and its coolers. The possibility of using the PACE from a higher 3.1 temperature than 60K should be investigated to accelerate the cool-down. All numbers of sections are wrong (i.e. 7.1.2 shall be 7.4.2).

y

Yes, this has been identified ((MS word problem) & will be corrected (see comment 29)

y

y

at pdf output

Title of Sec. 7.4.4. Is Planck PLM Testing but what is shown is the full test sequence once the Planck satellite is fully integrated. In Sec. 4.4.5 in the test list at the start of the section the thermal balance test and agreed. PLM & SC tests are merged in the IID-A 3.1 issue 3.2 the PPLM Cryogenic test (which is being done at satellite level are not explicitly shown. I would suggest you review both sections and should show the full integration and test flow for clarity.

y

y

y

PA

Yes, this has been identified ((MS word problem) & will be corrected (see comment 29)

y

y

at pdf output

BC

y

at pdf output

BC

y

y

BC

y

y

PA

07-23

Section numbers need to be updated

07-23

section numbering reset to 7.1.1.5, up to 7.5

PFM testing (btw the section numbering is obviously screwed up): the final test (after cryo) which consists of an end-to-end RF verification using the reference horn is not described. This is not a trivial test and must be included.

07-23

Yes, this has been identified ((MS word problem) y & will be corrected (see comment 29) Agreed: The PLM and Spacecraft section of IID-A have to be merged, and the 30GHz RF test is still part of the baseline. However, there is still no agreement on the outcome of the test (usefull), nor on the definition (where are the horns) which y has been re-included. We have demonstrated that test horns at the peripherie of LFI are useless, and LFI is not ready to modify the FPU to have them in it.

07-24 3.1

Section 7.4.3.1. Functional test of the instruments. How long is this testing phase. Where are the details of this phase reported?

Functional tests of the instrument will be based on instrument input: this shall be clarified for LFI: PL-LFI-PST-PL-010: Testing Plan of the LFI instrument during the Planck FM testing phase for HFI: LI-PH410-300354-IAS : HFI test requirements sheet list y These input are included in a top level document (which will be the input for the test specification) new RD 33: H-P-3-ASP-PL-0675: HFI testing on CQM SM level new RD 34: H-P-3-ASP-PL-0676: Planck instruments testing at FM level (see comment 643)

The details of the tests will be included in the Planck QM and FM test specification, not yet issued. IID-A includes a summary of these tests specifications.

y

n

y

PA

The fact that LFI is also tested in FM test is obvious from the test sequence. In your input, LFI is switched off during warm up. y Satellite and EGSE will continue data acquisityion during warm up phase

n

y

PA

n

y

PA

3.1

289 AM_011

LFI

A. 7.4.4. Menn 6 ella

07-26 3.1

Planck FM test sequence. The reported sequence clearly represents a summary of the foreseen plan. I suppose that the plan details are reported in the Planck AIT plan (RD26). Is this correct? In the test list reported in the IID-A there is no mention of a test of the temperature stabilisation assembly that will be mounted at the interface between the sorption cooler LR2 cold end and the LFI instrument. Is it foreseen?

3.1

292 LV_003

LFI

L. Vale 7.4.4. 6 nzian o

07-26

Include the fact that LFI will be tested simultaneously to the HFI testing. Add the possibility to acquire data during the instrument warm-up phase. A proposed sequence after HFI functional test: - LFI test III; - cryo shield turn-off (warm up); - cooler's off; - LFI test IV

3.1

264 CB 023

LFI

Sec. Butle 7.4.4. r 6

07-26

3.1

Justify not switching on HFI with the second cooler to Not foreseen, not justified. Covered by test 1 as verify that the full cryo-chain functions. SCS are fully redundant

y

IID-A 3.3

Change Notice: issue 3.1 3.2 --> 3.3

on ID issue

Ref

Com Origi Sectio ment n n Nb from

mail 30-03ESA PE 2004

OK

y

y

y

BC

09-02

add section 9.1.1.12 related to shock test definition

OK

y

y

y

BC

09-05

The CQM requirements for LFI and 20K cooler need to be updated

ok add note 2 below table 9.2.1-1: Note 2: LFI and SCS compressors QM not delivered, replaced y by MTD's

y

y

BC

3.1

mail 30-03607 ESA JT 2004

9.2.1. 2

3.1

red team 382 wk 7

ASP DM

9.2.1. 2

3.1

Mail 1 A.Heske 1/9/03

ESA BG

9.2.1. 2

3.1 3.1

mail wvL 412 5/3/04 red team 383 wk 7

HIFI

WvL

ASP DM

table 9.2.1-1 CQM warm electronics: replace TBD by 09-05 OK "can be AVM" Table 9.2.1-1 has to be updated concerning the Model Planck HFI/LFI FPU’s and Planck HFI/LFI Coolers. It 09-05 OK see comment 607 Philosophy: would be better to add a footnote to refer to the table 9.2.3.4 for the details. SPIRE JFETs shall be included in the list OK: add Note 3: SPIRE FPU includes 2 JFET 09-06 (integrated with FPU)

y

y

y

BC

y

y

y

BC

y

y

y

BC

9.2.2. 1

Avionics 09-06 Model

AVM limited to ICU and resistors

OK. Add Note 4: HIFI AVM limited to ICU & resistor networl to simulate loads

y

y

y

BC

9.2.3

09-07

update instruments hardware matrices

OK Done for HFI/LFI

y

y

y

BC

OK Corrected. MTD (*) refers to Mass thermal dummies

y

y

y

BC

OK Included.

y

y

y

BC

y

y

BC

y

y

y

BC

9.2.2

3.1

609

mail 30-03ESA CS 2004

9.2.3. 1

09-08

3.1

610

mail 30-03ESA PE 2004

9.2.3. 1

09-08

3.1

611

mail 30-03ESA CS 2004

Done in Reply by IID-A

9.1.1. 11

3.1

mail 30-03ESA CS 2004

Modify reply IID-A (Y/N)

7.5 and 7.6 should be deleted. They bring nothing. Consequently "Operations" should be deleted from the title on page 7-1.

red team 381 wk 7

608

Industry Reply, or ref

07-27

606

3.1

title, fig, Remarks table, or req

7.5

3.1

ASP DM

Page

Page 22

9.2.3. 2

1) Product tree id 111125 is twice in the table and wrong. Please correct: Description: Local Oscillator Radiator STM: FM (There will be no MTD for the radiator) 2) Last two columns are not readable 3) What does the ‘(*)’ mean in the STM column? Clarify EGSE and OGSE? missing from the delivery table.

1)Clarify the STM harness deliveries. According my understanding no MTD will be build of product tree 112131 & 112132 (harness between SPIRE FPU and MTD's are provided by industry, including harness JFETs). y if required. 2) Clarify EQM/AVM harness deliveries. Who provides QM1 harness?

09-09

3.1

267 CB 026

LFI

Butle 9.2.3. r 4

09-10

It is interesting to note that HFI supplies all it's filght units as PFM and LFI and the SCS supply all thier flight units as FM. Normally the name FM or PFM would imply a test level approach used during instrument development - but this is probably not the there is no difference in the terms. LFI /SCS 3.1 case here e.g. the document gives no guidelines for deliveries can be brought to PFM. PFM testing of a unit. Independent of what title a unit is given (FM or PFM) it is important that we agree the test levels that each unit shall expirience based on it's specific build logic and the ytests that will be peformed after supply.

3.1

265 CB 024

LFI

Sec. Butle 9.2.3. r 4

09-10

3.1

y

y

y

BC

09-10

You can do so, but do it via Change Request to IID-B (to include the AVM ICD), as your proposal As alread mentioned to ESA we will have to rediscuss to use the REBA QM (sililar to the stacked PACS) the model choice from the REBA set to include in the lead to some adaptation on the AVM. Our y 3.1 LFI AVM, on the basis of schedule and the fact that requirement is an AVM form/fit & function, the REBA QM is probably fit but not form. allowing also to perform EMC testing (therefore representative harnesses)

y

y

BC

266 CB 025

3.1

224

HFI/IAS/JC HFI h 04-008

JC

3.1

HFI/IAS/JC 225 HFI h 04-008

JC

3.1

red team 384 wk 7

ASP DM

3.1

Mail 2 A.Heske 1/9/04

ESA BG

red team wk 7

LFI

Sec. Butle 9.2.3. r 4

3.1

3.1

126

3.1

166 100204-14 ASP JBR

3.1

167 100204-15 ASP JBR

3.1

168 100204-16 ASP JBR

3.1

230

HFI/IAS/JC HFI h 04-008

3.1

239

red team wk 7

3.1

240

3.1

127

3.1 3.1 3.1

3.1

red team wk 7

red team wk 7 red team 128 wk 7

ASP PhC

JC

ASP DJS

ASP DJS

§ 9.2.3. 5 § 9.3.1

This table is to be put in agreement with HFI IID-B, Splitting between mech. Model and AVM also

agreed. Table will be updated

y

y

y

BC

09-12

Non delivery of LFI CQM is not reflected

agreed. Table will be updated

y

y

y

BC

9.3.1

09-12

table shock: add ref to note (**) on CQM only correct note (*) "those instruments" becomes "those PFM instruments"

OK

y

y

y

BC

9.3.1

09-12

9.4.1. 2

9.4.1. 2.4 9.4.1. 2.4 9.4.1. 2.4 9.4.1. 2.4 9.4.1. 2.4 9.4.1. 2.4

ASP PhC

mail 30-03ESA CS 2004

"MTD" means "Mass & Thermal Dummies". Note (*) to be included below the tables.

09-11

9.4.1. 2.4 9.4.1. ASP PhC 2.4 9.4.1. 169 100204-17 ASP JBR 2.5 red team 9.4.2. 84 ASP BdM wk 7 1.2. 612

In the STM column (MTD)(*) is not defined - What does it mean - please.

9.4.2. 1.2

Instrument Verification

Concerning the CQM/PFM table, differentiate HFI and OK See 225 LFI for the CQM S/C test campaign.

y

y

y

BC

09-13 3.1

la phrase suivante n'a pas de sens: Structural analysis of instrument units shall be performed in order to show that the stiffness and mechanical environment requirements as well as general requirements (are achieved) and shall be performed in NASTRAN.

replace by: Structural analysis of instrument units shall be performed in order to show that the stiffness and mechanical environment y requirements as well as general requirements are achieved, and shall be performed in NASTRAN.

y

y

BC

09-15 3.1

Niveau de qualif, non pas limit loads

No. Check with DR

y

n

y

BC

y

y

y

BC

y

y

y

BC

y

n

y

BC

y

y

y

BC

OK add note for that

y

y

y

BC

OK

y

y

y

BC

Not modified

y

y

y

BC

Definition des axes longi et lat : pas clair : est ce les no. Longi=perp to mounting plane, lat = monting axes satellites plane. Add note Charge sur le 0.1K et le 4K on the PR panel :manque 09-15 3.1 OK modified (add X, Y, Z) les cas Y et Z (cf LT 4281) no. These are 2 load cases to be used by you. We 09-15 REQ 0080 Case 1 & 2 should be explicited (old requirement !) do not need give their origin (from system worst case analysis) dans la table: Herschel SVM -> Herschel SVM warm 09-15 table 9.4.1-1 OK units? 09-15 3.1

09-15

09-15 09-15 09-16

dans la table: les axes "longitunal" et "lateral". Ce n'est pas très clair pour les warm units ou les pipes o ù table 9.4.1-1 les specs sont dans le plan du panneau ou hors du plan. Il faudrait préciser oop ou ip. les Herschel LOU Wave Guides sont une fourniture 3.1 ASED. Doit être enlevé IID-A. charges sub-plt: 25g axial / 20g lateral - à confirmer 3.1 P.Lodereau. rajouter "excepted for the 0.1K and4K which shall be 3.1 > 130 Hz

09-18 3.1

09-18

Document RD 53 is not in the reference docs list Last sentence of the section: RD 53 is not existing (at least not according section 2.2 Reference Documents) Clarify

OK

y

y

y

BC

to be replaced by RD 88: reduced thermal model requirements for coupled analysis.

y

y

y

BC

sse comment 84 (-> RD88)

y

y

y

BC

IID-A 3.3

Change Notice: issue 3.1 3.2 --> 3.3

Com Origi Sectio title, fig, ment Page Remarks n n Nb table, or req from red team 9.4.4. 321 ASP PC 09-20 req 145: replace shall by will wk 7 2 req 145 add: the instrument shall define red team 9.4.4. ASP PC 09-20 representative operational configurations in line with 322 wk 7 2 the IST objective red team 9.4.4. 323 ASP PC 09-20 req 150: replace shall by will wk 7 3 req 150: add: the instrument shall define red team 9.4.4. 324 ASP PC 09-20 representative operational configurations in line with wk 7 3 the IST objective HFI/IAS/JC 9.4.4. 231 HFI JC 09-20 REQ 0155 Specify doc TBD for software test h 04-008 4.1 HFI/IAS/JC 9.4.4. HFI JC 09-20 Specify TBD for software verification approach 235 h 04-008 4.2 replace req 160 by"The instrument shall demonstrate by analysis that their equipment will survive the red team 9.4.5. 325 ASP PC 09-21 ionizing environment during the mission if the wk 7 1 components used are susceptible to total dose level lower than 10krads." The requirement IIDA-DV-REQ-0160 is new and is M.Mi 9.4.5. 298 MM 006 LFI 09-21 under evaluation. For the time being no radiation ccolis 1 analysis is foreseen at instrument level. HFI/IAS/JC All § names between 9.5.1 and Chapter 10 have 222 HFI JC 9.5 09-21 h 04-008 wrong numbering sttarting by 9.1 H-P-ASP643 ASP JBR 9.5 update HFI pipes mechanical requirements LT-4623

on ID issue 3.1 3.1 3.1 3.1 3.1 3.1

3.1

3.1 3.1 3.1

Ref

3.1

129

red team wk 7

ASP PhC

9.5.2

09-22 3.1

à mettre à jour comme EVTR Système §4.1.3:

3.1

130

red team wk 7

ASP PhC

9.5.2

09-22 3.1

mise à jour non répercutée dans EVTR Système §4.1.3 pourt leak rate:

3.1

613

mail 30-03ESA CS 2004

9.5.3

09-23

All numbers of sections are wrong (i.e. 9.1.3 shall be 9.5.3).

3.1

170 100204-18 ASP JBR

9.5.3

09-23 3.1

PB de numérotation

3.1

380

9.5.3

09-23

section numbering reset to 9.1.3, up to 5.16

ESA BG

9.5.3

Cryo-Struts Interfaces: The loads in table are nor Table really in line with the loads defined in the cryo09-27 9.5.3.3.2.1.1 structure specification HP-3-ASPI-SP-0021 .4 (requirement CRY-ENV-025).

ASP PhC

9.5.3. 4

09-32 3.1

ASP PhC

9.5.3

09-33

Table 9.5.3.6

ESA BG

9.5.3

09-34

Random Vibration for Planck The random loads for Table 9.5.3pipes are not yet fully finalised and agreed with 7 ESTEC.

3.1

3.1 3.1 3.1

red team wk 7

Mail 3 A.Heske 1/9/05 red team wk 7 red team 132 wk 7 Mail 4 A.Heske 1/9/06 131

ASP BC

3.1

3.1

3.1 3.1

red team wk 7

ASP BC

9.5.3. 4

y

y

OK

y

y

y

OK

y

y

y

TBD will be replaced by AD8 (now either ECSS-Ey 40-B or PSS05 + Bssc(96)02)

y

y

BC

software verification approach is defined in AD8

y

y

y

PC

ok

y

y

y

true.

y

n

y

BC BC

Yes, this has been identified ((MS word problem) & will be corrected (see comment 29)

y

y

at pdf output

OK Done

y

y

y

BC

Power spectral density (g2/Hz) QUAL: -1dB/+3dB ACC: -3dB / +1.5dB y Overall g RMS +10%

y

y

BC

y

y

y

BC

y

y

y

y

BC

y

y

at pdf output at pdf output at pdf output

y

y

+/-10-5 Pa.m3/s of Helium at 1013hPa pressure differential +/-10-10 Pa.m3/s for cryogenic parts Yes, this has been identified ((MS word problem) & will be corrected (see comment 29) Yes, this has been identified ((MS word problem) & will be corrected (see comment 29) Yes, this has been identified ((MS word problem) & will be corrected (see comment 29) This has been modified. Accetation confirmed bu HFI on 31/3/04. See comment 223 from HFI

y

BC

BC

BC

y

BC BC

Updated (Planck)

y

y

y

BC

Linear combination. Add note

y

y

y

BC

These values is the summation of the stability requirements ( TEL 037) and the manufacturing requirement specified to CSAG

y

n

y

JBR

09-28

The requirements for the cryostrut interface is going to be modified. The proposition for update A D. Rebuffat mail was giving much higher levels (ex: table from section 9.5.3.3.2.1.1.4 has been by DR y 16g in 60-75Hz). Who is correct ? to HFI for agreement. Feedback has been received on 31/3/04. Table updated with your agreement.

y

y

DR

09-27

The JFET vibration levels need to be re-evaluated (?) No

y

n

y

BC

09-28 3.1

erreur dans les valeurs du tableau. Cf DR pour les bonnes valeurs

updated (mail DR 31/3)

y

y

y

BC

09-28

update loads of bellow on cryo-stru interface

updated (mail DR 31/3)

y

y

y

DR

09-28 3.1

Valeurs en cours de maj pour prendre en compte le comportement de la upper and lower structure

updated mail DR 1/4

y

y

y

DR

09-29

The waveguide case for vibration testing is no longer applicable.

May be not according to the new LFI testing philisophy, but this remain a design case, to be used for analyses.

y

n

y

BC

09-29

Tables 9.5.3- replace wave guide sinus loads by new sinus design 2, 3, 4 loads for RAA & WG

OK Done Mail DR 1/4

y

y

y

DR

OK. But provides also random levels.

y

y

y

BC

OK Done

y

y

y

BC

the table is related to SVM load. This should be Sufficient

y

n

y

BC

09-41

3.1

y

y

9.5.3

3.1

OK

y

ESA BG

9.5.3. 3.2.1. 1.1 9.5.3. JBR/ 171 100204-19 ASP 3.2.1. DR 1.4 9.5.3. Mail DR 644 ASP DR 3.2.1. 31/3 1.4 9.5.3. JBR/ 172 100204-20 ASP 3.2.1. DR 2 9.5.3. mail 30-03615 ESA JT 3.2.1. 2004 2 9.5.3. mail DR 640 ASP DR 3.2.1. 1/4/04 2 JBR/ 9.5.3. 173 100204-21 ASP DR 4

y

y

Mail 6 A.Heske 1/9/08

mail 30-03ESA JT 2004

y

y

3.1

614

y

y

1K and 4K Cooler Pipes: How are the displacements Table to be combined? RSS and simply added? Some 09-40 9.5.3.7.1.2.2 directives should be given of how to combines the &3 displacements to avoid too conservative cases.

3.1

OK

Updated (Planck)

9.5.3

JC

Done in Reply by IID-A

this has been updated in table 9.5.3-6

ESA BG

3.1

Modify reply IID-A (Y/N)

pts ouverts: random 4K CRU/ HeTank

Mail 5 A.Heske 1/9/07

9.5.3. 3.2.1. 1.4

Industry Reply, or ref

random / shock à confirmer calculs

3.1

HFI/IAS/JC 223 HFI h 04-008

Page 23

Displacements at the FPU/Telescope Interface: How Table are these displacements consistent with the Planck 9.5.3.7.2.1.4 telescope specification (HP-3-ASPI-SP-0004) requirement TEL-037?

"Wave Guide" à remplacer par Wave Guides and 09-32 3.1 support structures add HFI Helium tank random vibration loads. Reduce 4K/REU panel from 0.3/0.15 g2/Hz to 09-33 table 9.5.3-6 0.2/0.1g2/Hz include 4K CRU on shear web to 0.3/0.15G2/Hz "For planck cooler pipes" à remplacer par "for Planck 09-33 3.1 SC cooler pipes only"

3.1

385

3.1

174 100204-22 ASP

3.1

226

HFI/IAS/JC HFI h 04-008

JC

09.05. Table 9.5.3- REU name should be moved to box containing 4K 09-33 03.04 6 Cooler Units

agreed

y

y

y

BC

3.1

227

HFI/IAS/JC HFI h 04-008

JC

09.05. Table 9.5.3- What are the levels for the 4K Cooler Current 09-33 03.04 6 Regulator (4KCCR) ?

this will be 0.3g2/Hz normal to fixation plane, and y 0.5 lateral

y

y

BC

3.1

228

HFI/IAS/JC HFI h 04-008

JC

09.05. Table 9.5.3- Values for 4K Cooler units and REU are not up to 09-33 03.04 6 date see 19 Feb mail from J6P. Chambelland

REU + 4K reduced to 0.2g2/Hz normal 0.1 lateral y

y

y

BC

3.1

229

HFI/IAS/JC HFI h 04-008

JC

09.05. Table 9.5.309-33 In this same area, 4K unit names are not correct. 03.04 6

agreed, to be corrected

y

y

BC

JBR/ 9.5.3. DR 4

y

IID-A 3.3

Change Notice: issue 3.1 3.2 --> 3.3

on ID issue

Ref

Com Origi Sectio ment n n Nb from ASP DJS

09-36 3.1

Rajouter valeurs de déplacements dynamiques pour le WG

y

y

y

JBR

09-36 3.1

Rajouter valeurs de déplacements dynamiques pour le WG

y

y

y

JBR

y

y

y

DR

y

y

y

DR

3.1

3.1

3.1

Mail 7 A.Heske 1/9/09

JBR/ 9.5.3. DR 7.1.2

9.5.3. 7.2.1 9.5.3. 7.2.1 9.5.3. 7.2.1. 4

9.5.4. ASP BdM 2.

ESA BG

BC

BC

JBR/ 9.5.3. 644 100204-23 ASP DR 7.1.2

red team 85 wk 7

y

y

175 100204-23 ASP

3.1

y

n

3.1

mail 30-03616 ESA JT 2004

y

y

HFI/IAS/JC HFI h 04-008

JC

OK Corrected. Grms drop drom 24 to 22.5 grms

Table 9.5.3-1 is wrong / already exist. Should be 9.5.3- no. In req 250 is figure 9.5.3-1, and not table (the 9 TBC first figure in this section). Numbering is correct.

232

JC

Done in Reply by IID-A

09-35 REQ 250

3.1

3.1

Modify reply IID-A (Y/N)

9.5.3. 6

red team wk 7

3.1

Industry Reply, or ref

random in plane pour V-groove3 09-34 table 9.5.3-7 niveau : 0.4 g²/Hz sur [70,250] et non sur [70,170] 1.3 g²/Hz sur [250,350] et non sur [170,350]

238

HFI/IAS/JC 233 HFI h 04-008 HFI/IAS/JC HFI 234 h 04-008

title, fig, Remarks table, or req

9.5.3. 4

3.1

JC

Page

Page 24

9.5.4. 6

09-39 REQ 275 09-39 REQ 275

OK Included in new section 9.5.3.7.1.2.4 LFI Wave-guides. Mail from JBR 8/4/04 OK Included in new section 9.5.3.7.1.2.3 HFI bellow. From T note H-P-ASP-MO-2583 p 4 bottom

All 3 "Integration displacements" tables are from issue has been updated 3.0 and different from the one we received by email a long time ago. "Thermo-elastic ones are has been updated the one we received. Please correct.

09-41

The table of max. displacements is not complete and contains tbc's.

has been updated

y

y

y

BC

IIDA-DV09-42 REQ-0295

Thermal gradient of 2°C/min stands for transitions between different temperature limits

agreed. Change to "The temperature drift dT/dt must be < 2°C/min for electronics boxes inside the SVM (for transition between hot & cold y cases)". (value is 20°/mn in ECSS-E 10 (testing), comment from HIFI. 2°/mn has been kept in IID-A, after discussion with Test engineers

y

y

BC

Thermal 09-44 Bake-out Test:

It is noted that there is no dedicated temperature and time specified for the Planck FPU bake-out.

There is no bakeout for Planck. (specific for Herschel cryostat MLI & material outgassing). To be explained.

y

y

y

BC

OK

y

y

y

OK

y

y

N

3.1

618

mail 30-03ESA PE 2004

10.8.2 10-11 .1

3.1

619

mail 30-03ESA JT 2004

10.8.2 10-12 .5

replase 1st phrase by "In order to demonstrate compliance of the instrument design with the radiation environment in space, the following requirements shall be satisfied:" replace 2nd bullet by: "components shall be selected, depending on their type and the effects, according to RD12 (radiation requirements)" Prime Contractor Responsiblity Instrument schedules are no longer under the responsibility of the PRIME. >change The ICDR shall be renamed into IQR (in list on top of p. 10-11) Date for the Instrument CDR shall be changed in conjunction with chapter 10.8.2.6 (objectives) The objectives of the IHDR de not seem compatible with the planned dates.

3.1

620

mail 30-03ESA AE 2004

10.8.2 10-12 .6

Rename into Instrument Qualification Review and replace "S/C CDR" by "S/C QR" on the first text line.

3.1

Ref# 117 not settled: mail 3.0-> 3. 1 Schedules are not yet stable at the edition of the PAC 10.13. CQM return from ESA 10/ 2005? 442 Wildgruber rk- 4 10-16 modification document. Latest available (at the IID-A edition S 2 -> FS at earliest available Q3/ 2006 3/3/04 list date) system schedules have been included -> FS Philosophy and Launch Date are contradictory .

3.1

621

3.1

326

red team wk 7

ASP PC

9.5.7

09-63

3.1

327

red team wk 7

ASP PC

9.5.7

09-63

3.1 3.1

3.1

mail PAC 445 Wildgruber ohb-3 10.2.3 10.02 S 3/3/04 mail 30-0310.8.2 617 ESA AE 10-11 2004 .1

mail 30-03ESA PE 2004 mail 30-03622 ESA JT 2004 HFI/IAS/JC HFI h 04-008

10.13. Table 10-17 2 10.13.2-1

updated

y

y

Y

BC

include the IQR

y

y

y

BC

This is ESA responsibility to define objectives & dates

y

y

y

BC

updated

y

y

Y

BC

y

y

Y

BC

delivery dates shall be updated as agreed between the H/P PM and the PIs.

Updated from ESA fax SCI-PT-027979 (11/06/04) y

y

Y

BC

Delivery dates need to be updated

Updated from ESA fax SCI-PT-027979 (11/06/04) y

y

Y

BC

Table is not up to date, & SCS FM delivery not coherent with "Planck PFM"

yes, this will be corrected according to ESA input: for Planck HFI, delivery dates are y QM: 31/08/04 FM: 15/04/05

y

Y

BC

3.1

236

3.1

mail 10.13. PAC 446 Wildgruber ohb-4 10-17 S 2 3/3/04

Baseline Schedule of Deliverables Should be updated.

Schedules are not yet stable at the edition of the document. Latest available (at the IID-A edition date) system schedules have been included

y

y

Y

BC

3.1

mail PAC 10.13. 447 Wildgruber ohb-5 10-17 S 2 3/3/04

Herschel schedule should be updated.

Schedules are not yet stable at the edition of the document. Latest available (at the IID-A edition date) system schedules have been included

y

y

Y

BC

3.1

623

Schedules are not yet stable at the edition of the document. Latest available (at the IID-A edition date) system schedules have been included

y

y

Y

BC

3.1

mail Annex PAC 438 Wildgruber ng- 2 1 S 3/3/04

Document will be updated for the H-PLM CDR (may 04)

Y

next issue

BC

3.1

277 FV010

LFI

Annex F.Vill 03 a 5.1.2. 1

28

3.1

276 FV009

LFI

F.Vill a

Annex 03 6.3.4

42

3.1

625

3.1

52

3.1 3.1

3.1

mail 30-03ESA PE 2004

mail 30-03ESA JT 2004

red team wk 7 red team 53 wk 7 red team 54 wk 7 55

JC

10.13. 10-16 2 10.13. 10-17 2

BC

red team wk 7

ASP YR ASP YR ASP YR

ASP YR

schedules are out of date (July 2003). Schedules should probably not be included in the body of the IID-A.

10.13. 10-18 2 Herschel Alignment concept

Annex 3

annex 5 annex 5 annex 5 annex 5

1 1 1

1

is from 6/ 2002, contains various obsolete numbers. should be updated to agreed numbers accordingly. FPU requirements shall be updated on the basis of 2 the Thermal elastic LFI model. The revision is in progress Alignment requirements at FPU level shall be updated 2 on the basis of the Thermal elastic LFI model. The revision is in progress The Planck Alignment Plan has at least two major problems: 1) the budget included allocations for FPU alignment which have not been verified or even analysed by instruments; 2) the plan makes no reference to the so-called reference horn which is an integral part of the alignment verification. The existence of this horn makes some requirements on the instruments, mainly LFI. H +Y-Z panel (PACS): Figure HP300000-21-1 sh2/2 revA (30 Oct 03) => page 6 of DCN 14 H -Z panel (SPIRE): Figure HP300000-22-1 sh 1/2 revA (30 Oct 03) => page 7 of DCN 14 H -Y-Z panel (HIFI#2): Figure HP300000-23-1 sh 1/2 revA (30 Oct 03) => page 8 of DCN 14 The applicable drawing on cryo connectors should be added (ALS should update it in their next DCN, due date 13 Feb). See SVM List of Appl Drawings, issue 4.3.:

Planck alignment plan is not new (PDR). Compliance of FPU with the alignment requirements are expected from instruments since y ages. Alignment plan has been updated at PPLM CDR and is included here

n

y

BC

same as 276

y

n

y

BC

Planck alignment plan has been updated to CDR issue

y

y

y

BC

annex 5 updated wrt SVM ICD issue 5

y

y

y

BC

annex 5 updated wrt SVM ICD issue 5

y

y

y

BC

annex 5 updated wrt SVM ICD issue 5

y

y

y

BC

annex 5 updated wrt SVM ICD issue 5

y

y

y

BC

IID-A 3.3

Change Notice: issue 3.1 3.2 --> 3.3

on ID issue 3.1 3.1

Ref red team wk 7 red team 57 wk 7 56

Com Origi Sectio ment n n Nb from annex ASP YR 5 annex ASP YR 5

Page

title, fig, Remarks table, or req P +Z panel (HFI REU/DPU): Figure HP300000-21-2 sh 1/3 revA (30 Oct 03) => page 17 of DCN 14 P +Z panel (HFI REU/DPU): Figure HP300000-21-2 sh 2/3 revA (30 Oct 03) => page 18 of DCN 14 P +Y+Z panel (HFI 0.1 K + LFI REBA): Figure HP300000-22-2 sh 1/2 revA (30 Oct 03) => page 19 of DCN 14 P +Y- Z(+ Y) web (HFI 4K CRU): Figure HP30000013- 2 Sh. 1/ 1 Rev. B (30 JUL 03) SORPTION COOLER PANELS: Figure HP300000-242 Sh. 1/ 8 Rev. / (16 DEC 02) => page 20 of DCN 14 (sheet is 1/13) SORPTION COOLER PANELS: Figure HP300000-242 Sh. 2/ 8 Rev. / (16 DEC 02) => page 21 of DCN 14 (sheet is 2/13) SORPTION COOLER PANELS: Figure HP300000-242 Sh. 3/ 8 Rev. / (16 DEC 02) => page 22 of DCN 14 (sheet is 3/13)

2 2

Page 25

Industry Reply, or ref

Modify reply IID-A (Y/N)

Done in Reply by IID-A

annex 5 updated wrt SVM ICD issue 5

y

y

y

BC

annex 5 updated wrt SVM ICD issue 5

y

y

y

BC

annex 5 updated wrt SVM ICD issue 5

y

y

y

BC

annex 5 updated wrt SVM ICD issue 5

y

y

y

BC

annex 5 updated wrt SVM ICD issue 5

y

y

y

BC

annex 5 updated wrt SVM ICD issue 5

y

y

y

BC

annex 5 updated wrt SVM ICD issue 5

y

y

y

BC

3.1

58

red team wk 7

ASP YR

annex 5

2

3.1

59

red team wk 7

ASP YR

annex 5

2

3.1

red team 60 wk 7

ASP YR

annex 5

2

3.1

61

red team wk 7

ASP YR

annex 5

2

3.1

62

red team wk 7

ASP YR

annex 5

2

3.1

63

red team wk 7

ASP YR

annex 5

2

SORPTION COOLER PANELS: Figure HP300000-24annex 5 updated wrt SVM ICD issue 5 2 Sh. 5/13 Rev. A (04 DEC 03) => page 23 of DCN 14

y

y

y

BC

3.1

64

red team wk 7

ASP YR

annex 5

2

SORPTION COOLER PANELS: Figure HP300000-24annex 5 updated wrt SVM ICD issue 5 2 Sh. 7/13 Rev. A (04 DEC 03) => page 24 of DCN 14

y

y

y

BC

annex 5 updated wrt SVM ICD issue 5

y

y

y

BC

annex 5 updated wrt SVM ICD issue 5

y

y

y

BC

annex 5 updated wrt SVM ICD issue 5

y

y

y

BC

annex 5 updated wrt SVM ICD issue 5

y

y

y

BC

IID-B is ruling!

agreement of the interface is made through the acceptance by both parties of the IF drawings. Instruments ICD's are in the IID-B, satellite ICD's are in IID-A. We were expecting a more "technical" response tou our proposed ICD. In addition, I'm afraid that this is the type of interfaceyou will get.

y

n

y

BC

OK, With the given poor drawing quality the check could be only skin- deep.

?

y

n

y

BC

Document is not up-to-date in terms of the L0 Cooler I/F. See also CR H-P-PACS-CR-0042_1, Mechanical Support for the Pump & Evaporator L0 S/C Cooling Strap

Yes. This was the latest information availabble at the time of publication. Has been updated

y

y

y

BC

Needs to be updated Needs to be updated Needs to be updated

updated

y

y

y

BC

Annex 6 : le plan à mentionner pour les WG n'est pas updated draft mais ID-0082-01-01.

y

y

y

BC

IID-B is ruling!

y

y

y

BC

y

y

y

BC

y

y

y

BC

Yes. This has been corrected on the server (new issue of the annexe 6). However annex 6 should be updated by ASED for 15/4 (with CDR DP)

y

y

y

BC

updated

y

y

y

BC

Within the given timeframe it is NOT possible to crosscheck this ANNEX 8 with PACS- MA- SP-001. Furthermore the PACS- MA- SP- 001 is the relevant document whose requirements have to be met by the this is still the case real harness design. Therefore a Design Verification Matrix has to be released by the manufacturer (Astrium). This Matrix should show that all requirements from the CH Specification are met.

y

n

y

BC

A Design Verification Matrix has to be released by the It has been proposed by ASED to check the manufacturer (Nexans). This Matrix should show that harness database with the instrument version of all requirements from the WIH Specification are met. the harness

y

n

y

BC

y

y

y

BC

3.1

65

red team wk 7

ASP YR

annex 5

2

3.1

66

red team wk 7

ASP YR

annex 5

2

3.1 3.1

red team 67 wk 7 red team 68 wk 7

mail wvL 5/3/04

ASP YR ASP YR

413

3.1

mail Annex PAC 434 Wildgruber MvB 5- 8 ff S 3/3/04

3.1 3.1 3.1

WvL

Annex 5

3.1

3.1

HIFI

annex 5 annex 5

3.1

3.1

mail PAC annex 461 Wildgruber js-12 S 6 3/3/04

3.1

mail PAC annex js-13 462 Wildgruber S 6 3/3/04

3.1

415

mail wvL 5/3/04

HIFI

WvL

annex 6

Annex 8

3.1

Annex mail PAC 435 Wildgruber MvB 8- 17 S ff 3/3/04

3.1

ANNE mail X PAC 436 Wildgruber MvB conce S 3/3/04 rning WIH 8

3.1

9

3.1

10

3.1

416

3.1

3.1

2 2

Interface control drawings SVM

HP-2-ASEDmail IC-0007 PAC annex 459 Wildgruber js-10 A6-29 Mass S 6 3/3/04 restriction at the PACS mail Figure annex A6-43 PAC 460 Wildgruber js-11 4.4.3.1-3, S 6 44 45 3/3/04 Figure red team annex 125 ASP DF wk 7 6 Interface mail wvL Annex 414 HIFI WvL control 5/3/04 6 drawings

mail PAC 458 Wildgruber js-9 S 3/3/04

3.1

SORPTION COOLER PANELS: Figure HP300000-242 Sh. 11/13 Rev. / (04 DEC 03) => page 25 of DCN 14 SORPTION COOLER PANELS: Figure HP300000-242 Sh. 13/13 Rev. / (04 DEC 03) => page 26 of DCN 14 HFI Helium Tank Interface drawings: the dates should be added (=> not verified...): The foot note is somehow polemic (ALS did not have all the inputs).:

Please note in the drawing, that for the treads of the PACS fastening screws self locking Heli-Coils, Drawing: HP- LN9449 06120, shall be used. Pleas note also that the updated 2-ASED-ID- crews are KT provided. Only these screws can be 0042-04-0A used with the torque of 23Nm @ 20°C. ASED: Check whether Heli-Coils DIN 65536-06120 are identical to LN9449 06120 Drawing: HP2-ASED-ID- Needs to be updated updated 0042-09-0A Pages from Issue 3 and issue 2 are mixed See page 43 after page 49 and drawings Herschel Cryoharness IID-B is ruling! interfaces

PACS Internal and External Cryo Harness

new drawing IF cryo-harness on SVM ME.HES.S14H.S.001FA in A (28/1/04) new drawing IF cryo-harness on SVM ME.HES.S14H.S.001SA ind D (27/1/04) new drawing IFSVM:PLM LOU wave-guides ME.HES.A180.S.001SA ind C (27/1/04)

ASP BC

mail wvL 5/3/04 mail wvL 417 5/3/04

11

annex 9 annex ASP BC 9 annex ASP BC 9 Annex HIFI WvL 9 Annex HIFI WvL 10

mail PM 12/2/04

ASP PM

annex 11

again new ICD's…. Compliant with IID-B.

updated updated

y

y

y

BC

updated

y

y

y

BC

System ICD IID-B is ruling!

updated

y

n

y

BC

WIH ICD

updated

y

n

y

BC

y

y

y

BC

IID-B is ruling!

on vient de recevoir la nouvelle issue de l'ICD optique du télescope Herschel. elle se trouve sous first_pl/Herschel Telescope updated with new optical ICD Interfaces/optique/HER.NT.0167.T.ASTR Issue 3 Rev 0 OICD 03-Jan04.pdf

IID-A 3.3

Change Notice: issue 3.1 3.2 --> 3.3

on ID issue

Ref

Com Origi Sectio ment n n Nb from

NW

Annex 11

667

ASP BC

03.02

3.2

1

ASP BC

02.02

3.2

2

ASP BC

02.02

3.2

3

ASP BC

02.02

3.2

4

ASP BC

02.02

3.2

5

ASP NCR 05.07

3.2

6

ASP BC

3.2

VCD 7 analysis

05.07. ASP PCh 01.01

3.1

418

3.1

mail wvL 5/3/04

3.2

8

VCD analysis

3.2

9

VCD analysis

3.2

VCD 10 analysis VCD analysis

HIFI

ASP PCh

05.07. ASP PCh 01.01. 02 05.07. ASP PCh 03

HIFI

05.07. 05

VCD analysis

ASP PCh

05.07. 05

VCD analysis

ASP PCh

05.08. 01.03

HIFI

05.09. 05

VCD analysis

ASP PCh

05.11. 01

VCD analysis

ASP PCh

05.13. 02.05

3.2

HP-HIFI12 CR-0087V1

3.2

13

3.2

14

3.2

H-P-HIFI15 CR-0090 V1

3.2

16

3.2

17

3.2

18

VCD analysis

ASP PCh

05.14. 03

3.2

19

VCD analysis

ASP PCh

05.15. 01.01

3.2

20

ASP JPC

05.16

3.2

21

ASP BC

07

3.2

22

ASP BC

07.01. 01

ASP BC

07.01. 01.08

ASP BC

07.01. 03

3.2 3.2

23 24

Industry Reply, or ref

The drawing shows a design which is discrepant with agreed proposal communicated by email D. de Chambure (020128): 0.2 mm edge champhur, 0.018 max height step between scatter cone and rest of Herschel mirror, and 30mm offset of scatter cone centre of telescope updated with new optical ICD mechanical curvature are not acceptable. I understood industry and optical are making, or have made, the M2 and scattercone in a single piece (email D. de Chambure 020927). The ICD’s diameter of the scatter cone does not agree with the number in IID-A Table 4.3.1-1 or HOSWG meeting 021016 as endorsed by the HST (021021). 02-05

Some Acronyms to add Move 4 documents (Instruments testing at System Levels) from RD List to AD List, following recommendation from HPLM CDR (RD 30-->AD13 (Herschel, QM), RD31-->AD14 (Herschel FM) RD 33->AD15(Planck QM), RD34--> AD16 (Planck FM). Reorganise numbering after RD29 add Microvibration analysis documents (H&P, RD 92, 93), add Herschel random analysis documents (RD91). Add HIFI Fine thermal control document (RD76) Add RD94 - H-P-2-ASPI-TN-0177_2_0 - Herschel Cryostat Shielding Efficiency Assessment Consolidation Programme: HP Meeting: CCB #59 Reference: HP-ASP-MN-4957 / 4 Description: H-P-2-ASED-RD-0020: IIDA to be updated accordingly NCR from ASED on FPU interface temperatures: Update IID-A with results from thermal analysis issue 4 Action from H-PLM CDR: Update thermal table to be consistant with IID-B's Replace "Three different thermal interface levels have been defined (see table 5.7.1-1), …" with "Four different thermal interface levels …" Specify, in IID-A, the responsibility of the instrument for the electrical insulation of HSFPU and both of the JFET racks from the Optical Bench.(req IID-B Spire, paragraph 5.10.2)

5-48

05.07. 01.01

05.07. 03

11

title, fig, Remarks table, or req

05.07

ASP PCh

3.2

Page

Page 26

5-51

updated

Done in Reply by IID-A

y

y

y

BC

y

y

y

BC

y

y

y

BC

y

y

y

BC

y

y

y

BC

y

y

y

BC

Add table 5.7.1-2: Thermal requirements and estimated IF temperatures from RD81

y

y

y

BC

done

y

y

y

BC

Done

y

y

y

BC

include a paragraph in 5.6: Note: For all mechanical or thermal interface, if electrical insulation is neede, it should be provided by instruments

y

y

y

BC

Above figure 5.7.1-2, replace "The details of level 1 Done interfaces…" with "The details of level 0 interfaces…"

y

y

y

BC

Add the PACS Non-operating temperture description. Added for all instruments

y

y

y

BC

y

y

y

BC

y

y

y

BC

y

y

y

BC

y

y

y

BC

y

n

y

BC

y

y

y

BC

y

y

y

BC

add this doc as RD 94

y

y

y

BC

add:"Humidity shall be monitored in the transport containers"

y

y

y

BC

no- this is local arangements with HFI/Air Liquide, y to be handled by NCR

n

y

BC

A requirment in the IID-B Spire, paragraph 5.7.3, specify that, "during the nominal operation in-flight, Included now in the table 5.7.3-1 the SVM units will not move at more than 3K/hour". A justification in IID-A should be added. As a consequence of the discussion at the Interface Meeting dd 22-5-03 and the acceptance by Carsten Schamberger (mail dd 26-5-03) the conclusions now can be formalized, as requested. Agreed The following text shall be added to Chapter 5.7.5 Temperature Monitoring: "For the HIFI SVM units, the SVM TCS will provide monitoring during flight to verify the thermal slope for timescales >= 100s." The verification of the following statement :"The temperature acquisition during the thermal balance test shall demonstrate the compliance with the slope Included requiremensts defined in present document Section 5.7.3" (IID-B HIFI paragraph 7.2) shall be added in IIDA The verification of the minimum transmission of 80% Included. + add ref to new RD 95: RD95 - H-Pat EOL condition of the windows/filters described in ASPI-TN-0344_2_0 - Herschel Optical paragraph 5.8.2.3 of IID-B HIFI shall be added in IIDPerformances - Transmission Budgets.pdf A The class of the LCL’s for the FHHRH and FHHRV is not in accordance with the requested load on the main bus in the IID-B (issue 2/0), section 5.9.5.The figure for the maximum average is 69.7 W, which is above Change already implemented in issue 3.2 the 2.5A at 26V for class II.The long peak (76W) is near the lower limit of 3.0A at 26V.The short peak (95W) is even above this limit.We therefore request to change the LCL class for the FHHRH and FHHRV into class III. add the paragraph: Add the description of the parallel observation mode The PACS/SPIRE parallele mode is compatible (see HP-PACS-5.11-0030) with the bominal TM transmission modes. Add the following requirement : The instrument shall defined under a comprehensive format the action they paragraph added in 5.13.2.5 request to the spacecraft to support their failure isolation and recovery processes The verification of the radiated emission / susceptibility described in IID-B HIFI, paragraph 5.14.2 shall be added in IID-A. This is verified by document H-P-2-ASPI-TN-0177 (Cryostat Shielding Efficiency Assessment Consolidation) The verification of an internal humidity monitor in the transport container shall be added in IID-A. (IID-B Spire, paragraph 5.15.1.1) Update 0.1K Pipes displacements according to mail from JPC on 12/7/04 Update test plan to take into account deletion of Planck SVM STM

Fig 7.1.1-2

Modify reply IID-A (Y/N)

done

y

y

y

BC

Replace STM by STM Herschel Only

done

y

y

y

BC

Update figure (remove Planck STM)

done

y

y

y

BC

remove ref to Planck STM, remove Planck STM mechanical tests after Planck QM cryo test

done

y

y

y

BC

IID-A 3.3

Change Notice: issue 3.1 3.2 --> 3.3

on ID issue 3.2

Ref 25

VCD analysis

Com Origi Sectio ment n n Nb from 07.01. ASP BC 04

Modify reply IID-A (Y/N)

Done in Reply by IID-A

y

y

y

BC

modify 7.2.1.2.1:Instrument integration to optical bench and Instrument Short Functional Test (SFT) Add the verification of the requirement HP-PACS-5.15at ambient temperature (functional check) 0040: Each instrument FPU is mounted separately to y The program and control to prevent ESD shall be in the optical bench. The integration is done line with MIL-HDBK-263 and MIL STD-1686 or according common practice on ESD protection(in equivalent. line with MIL-HDBK-263 and MIL STD-1686 or equivalent) in the class 100 clean-room.

y

y

BC

update Planck CQM integration sequence (Acoustic model & Planck CQM)

y

y

y

BC

y

y

y

BC

y

y

y

BC

y

y

y

BC

07.03. 06

add new section 7.3.6: Herschel Cryostat orientation during Instrument testing The Herschel EQM & PFM and its MGSE are compatible with the instruments tilting requirements (cooler recycling and SPIRE Add in IID-A the justifications about the tilt of the CVV Spectrometer tests) in ground lifetime conditions. During the TV test, the Herschel satellite PFM can y around the +Z-axis, necessary for PACS cooler only be tilted to max 23° (TBC) from vertical recycling and for PACS specific operations. position for cooler recycling purposes (ie SPIRE Spectrometer test can only be performed out of the TV test chamber, and cooler recycling can be performed during TV test, but not with full condensation efficiency which would require 30°).

y

y

BC

07.04. 01 07.04. 02 09.05. 09-033 table 9.5.3-6 03

Update Planck CQM test sequence (Acoustic & Cryotest) Split TV test into TV1 (early, SCS Redundant only) & TV2 HFI coolers (01K & 4K Pipes): replace "primary Reflector Panel" by "frame & Lower beam"

y

y

y

BC

y

y

y

BC

y

y

y

BC

09.05. 06

In page 224 section 9.5.6.14 "Radiated Emission Tests" there is a "cutand paste" error as the sentence "...A minimum of 10 discharges shall beperformed." is clearly to be moved to section 5.14.3.13 "Arc DischargeSusceptibility" in page 149. It is not clear why in page 224 section 9.5.6.15 and in page 225 there isthe same figure 9.5.6-11 "Arc source schematic capable of generating thedischarge" (by the way of very bad quality...). I suppose another "cut andpaste" error. A final suggestion is also to put the various set-ups for the different measurements just after the specifications and limits of the same measurements. It is very time consuming to find the suggested set-up in acompletely different section of the document.

point 1 (5.9.6.14) already corrected in issue 3.1 Point 2 (5.9.6.15) Obsolete (corrected in 3.1) Point 3: Too late to modify the structure of the document. (impact on the requirement chains)

y

n

y

BC

annex 11

Update Herschel Telescope OICD to issue 3.0 (small scatter cone included)

Done

y

y

y

BC

26

3.2

27

ASP BC

07.02. 02.01

3.2

28

ASP BC

07.03

3.2

Page

title, fig, Remarks table, or req

07.02. ASP PCh 01.02. 01

3.2

3.2

HP-ASEDASE 07.03. 29 FX-0423SI D 05 04 VCD 07.03. 30 ASP PCh analysis 06

VCD analysis

3.2

31

ASP PCh

3.2

32

ASP BC

3.2

33

ASP BC

3.2

34

ASP DR

3.2

HP-HIFI35 CR-0073 v.1

HIFI

3.2

36

ASP

wvL

Page 27

Industry Reply, or ref

Update table, Split into HP Satellites, SVM's, Modules done

done

update averahe heat flows on Herschel levels 0, 1, 2, 3 from HP-2-ASED-RP-0011_4.0: HEPLM thermal done report p 132 New section 7.3.5 included, with the text of teh Add Ground testing conditions for Herschel ASED fax. To be clarified why the Level 1 pump instruments inside the cryostat interface is different for SPIRE & PACS. Rotation of the EQM is to be add in the IID-A. See ref new section 7.3.6 chapter 7.2.1 of IID-B Spire, end of page 7-2

IID-A

section

title

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : xi

Applicability responsibility for section edition

10.6.2

IID Configuration Control

H-P

ASP

10.7

Configuration Status Accounting

H-P

ASP

10.8

Reviews and reporting

H-P

ASP

10.8.1

General

H-P

ASP

10.8.2

Instrument Reviews

H-P

ASP

10.9

Instrument Progress Meetings

H-P

ASP

10.10

Reporting

H-P

ASP

10.11

Deliverable Items

H-P

ASP

10.11.1

Mathematical Models

H-P

ASP

10.11.2

Instrument Models

H-P

ASP

10.12

Review Data Packages

H-P

ASP

10.13

Baseline schedule

H-P

ASP

10.13.1

Overall Herschel/Planck Baseline Schedule

H-P

ASP

10.13.2

Baseline Schedule of Deliverables

H-P

ASP

Annex 1

Herschel Alignment Plan

H

ASED

Annex 2

Planck Scanning Strategy (from SRS)

P

ESA

Annex 3

Planck Alignment Plan

P

ASP-PPLM

Annex 4

Herschel Pointing Modes (from SRS)

H

ESA

Annex 5:

Interface control drawings SVM

H-P

AL

Annex 6:

Interface control drawings Herschel PLM

H

ASED

Annex 7:

Interface control drawings Planck PLM

P

ASP-PPLM

Annex 8

Herschel Cryoharness Interfaces.

H

ASED

Annex 9:

System ICD

H-P

ASP

Annex 10:

WIH ICD

H-P

AL

Annex 11:

Herschel telescope mechanical & optical ICD’s

H

ESA

Annex 12

SVM Harness Interfaces

H-P

AL

IID-A SECTION 1

1

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE :1-1/1

INTRODUCTION

The purpose of the Instrument Interface Documents (IID’s) is to define and control the overall interface between each of the Herschel/Planck scientific instruments and the Herschel/Planck spacecraft. The IID’s consist of two parts, IID-A and IID-B. There is one part A, covering the interfaces to all Herschel and Planck instruments, and one IID-B per instrument: The IID-A describes the implementation of the instrument requirements in the design of the spacecraft and will be a result of the spacecraft design activities performed by the Contractor. Each IID-B defines in its ‘interface’ section (chapter 5) the requirements of the instrument and the resources to be provided by the spacecraft. In its ‘performance’ section (last section of chapter 4) it defines the scientific performance requirements of the instrument as part of the scientific mission requirements and as agreed between the Principal Investigators and ESA. After issue 2/0 by ESA the Contractor will be responsible for maintenance and configuration control of the IID’s in agreement with, and after approval by, the Instruments Principal Investigators and ESA. In case of conflict between the contents of the IID-A and the IID-Bs, the agreement or definition in the IID-B shall take precedence. The IID’s will not cover any of the interfaces of the Instrument Control Centres (ICC’s for Herschel), the Data Processing Centres (DPC’s for Planck) or the Herschel Science Centre (HSC).

IIDA - SECTION 2

2

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 2-1/11

APPLICABLE/REFERENCE DOCUMENTS

2.1 APPLICABLE DOCUMENTS These documents contain requirements, specifications and rules imposed on the project in addition to the contents of the present document. type

Ref.

title

ref

Issue

Date

IID

Applic ability (H, P, HP)

AD 1-1

IID-B SPIRE

SCI-PT-IIDB-SPIRE-02124

3.2

01/03/04

H

AD 1-2

IID-B HIFI

SCI-PT-IIDB-HIFI-02125

3.2

05/03/04

H

AD 1-3

IID-B PACS

SCI-PT-IIDB-PACS-02126

3.2

02/03/04

H

AD 1-4

IID-B HFI

SCI-PT-IIDB-HFI-04141

3.1

05/03/04

P

AD 1-5

IID-B LFI

SCI-PT-IIDB-LFI-04142

3.0 draft 4

30/04/04

P

AD 1-6

Sorption Cooler ICD

PL-LFI-PST-ID-002 (Annex to LFI IID-B)

3.0 draft 3

28/05/04

P

ESA ITT Documents AD2

Product Assurance Requirements for Herschel/Planck Scientific Instruments

SCI-PT-RQ-04410

2.0

01/08/00

HP

AD3

OIRD - Herschel-Planck Operations Interface Requirements Document -

SCI-PT-RS-07360

2.2

31/09/03

HP

AD4

(removed: was SIRD’s)

AD5

Herschel/Planck Packet Structure Interface Control Document - PSICD

SCI-PT-ICD-07527

4.0

07/11/03

HP

Additional requirements AD6-1

Herschel telescope Specification

SCI-PT-RS 04671

6.0

22/10/02

H

AD6-2

Planck telescope Specification

H-P-3-ASPI-SP-0004

2.0

04/02/03

P

AD7-1

Alignment Method, Plan, and Results (included in annex 1)

HP-2-ASED-TN-0097

1.0

13/04/04

H

AD7-2

Planck Alignment Plan (included in annex 3)

H-P-3-ASPI-PL-0078

3.0

09/04/04

P

AD8

ECSS Software standard ECSS E 40 B Or ESA software engineering standards + ESA PSS-05-0+ Guide to applying the ESA software Bssc(96)2 engineering standards to small software projects

draft

28/07/00

HP

2.0 1.0

feb 91 May 96

IIDA - SECTION 2

type

Ref.

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

Date

Applic ability

H-P-1-ASPI-SP-0141

2.1

20/02/04

HP

AD10_1 CSG Safety regulation Vol 1-General Rules.

CSG-RS-10A-CN

5_3

03/06/02

HP

AD10_2 CSG Safety regulation Vol 2 Part 1 Specific rules Ground installations

CSG-RS-21A-CN

5_3

02/12/02

HP

AD10_3 - CSG Safety regulation Vol 2 Part 2 Specific rules Spacecraft

CSG-RS-22A-CN

5_4

2/12/02

HP

AD11

SCOS-2000 Import ICD

s2k-mcs-icd-0001-tos-gci

5.1

26/10/01

HP

AD12

Delivery review procedure for ESA Furnished Item

SCI-PT-284SCI-PT-27760

AD13

Herschel Instrument testing on PLM EQM level

HP-2-ASED-PL-0021

2.0

06/06/03

H

AD14

Herschel Instrument Testing on PLM PFM and Satellite level

HP-2-ASED-PL-0031

1.0

10/06/02

H

AD15

HFI Testing at CQM & SM Levels

H-P-3-ASP-PL-0675

1.0

09/04/04

P

AD16

Planck Instrument Testing at PFM S/C Level

H-P-3-ASP-PL-0676

1.0

09/04/04

P

Issue

Date

Applic ability

Naming convention specification

ref

PAGE : 2-2/11

Issue

AD9

title

REFERENCE :

HP

2.2 REFERENCE DOCUMENTS

type

Ref.

title

ref

Requirements / Specifications RD1

General Design & Interface Requirements

H-P-1-ASPI-SP-0027

4.2

25/11/03

HP

RD2

Environment & Tests Requirements

H-P-1-ASPI-SP-0030

4.2

08/12/03

HP

RD3

EGSE Interfaces Requirements Specification

H-P-1-ASPI-IS-0121

4.0

08/04/03

HP

RD4

Safety requirements for subcontractors

H-P-1-ASPI-SP-0029

2.1

26/04/02

HP

RD5

EMC Specification

H-P-1-ASPI-SP-0037

4.0

19/02/2004

HP

RD6

System Operations and FDIR Requirements

H-P-1-ASPI-SP-0209

4.3

27/11/03

HP

RD7

Cleanliness Requirements Specification H-P-1-ASPI-SP-0035

2.2

26/09/03

HP

RD8

EGSE General Requirements Specification

3.0

10/06/02

HP

H-P-1-ASPI-SP-0045

IIDA - SECTION 2

type

Ref.

title

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

ref

PAGE : 2-3/11

Issue

Date

Applic ability

LIENHYP ERTEXTE 2.0

01/07/02

P

RD9

Planck Telescope optical & RF system specification

RD10

H-PLM Electrical ICD PFM (contains pin HP-2-ASED-IC-0001 allocation for FM cryo-harness)

4.0

04/05/04

H

RD11

H-PLM Electrical ICD EQM (contains pin HP-2-ASED-IC-0012 allocation for QM cryo-harness)

1.0

04/05/04

H

RD12

Radiation Requirements

1.0

11/06/01

HP

RD13

Solid Particle Environment for Herschel ESA-TOS-EMA/02and Planck 027/GD/PLCK

1.0

08/03/02

HP

RD14

Planck System EICD (contains allocation for Planck SVM harness)

pin H-P-ASPI-ID-0259

2.0

30/3/04

P

RD15

Herschel System EICD (contains pin H-P-ASPI-ID-0260 allocation for Herschel SVM harness)

2.0

30/04/04

H

H-P-3-ASPI-SP-0274

H-P-1-ASPI-SP-0017

Plans , test specifications RD21-1 Planck Cleanliness control plan

H-P-1-ASPI-PL-0253

3.0

16/07/04

P

RD21-2 Herschel Contamination Control Plan

HP-2-ASED-PL-0023

2.0

09/07/04

H

RD22

EMC/ESD control plan

H-P-1-ASPI-PL-0038

3.1

27/05/02

HP

RD23

HPLM EMC Control & Verification Plan HP-2-ASED-PL-0013

3.0

05/02/04

HP

RD24

Herschel System alignment plan

H-P-2-ASPI-PL-0276

2.0

16/02/04

H

RD25

HP design & development Plan

H-P-1-ASPI-PL-0009

4.0

19/07/04

HP

RD26-1 Planck FM AIT Plan

H-P-3-ASPI-PL-0208

3.0

23/07/04

P

RD26-2 Planck CQM AIT Plan

H-P-3-ASPI-PL-0668

1.1

01/07/04

P

RD26-3 Planck RFQM AIT Plan

H-P-3-ASPI-PL-0669

1.0

09/04/04

P

RD27

Planck RF Verification Control for Planck Telescope

H-P-3-ASPI-PL-0137

3.0

09/04/04

P

RD28

Herschel PLM/EQM AIT Plan

HP-2-ASED-PL-0022

2.1

29/04/04

H

RD29

Herschel AIT Plan - Part 2 EPLM & S/C- HP-2-ASED-PL-0026 PFM Acceptance Phase

2.0

15/04/04

H

RD30

Satellite AIT Software Management Plan H-P-1-ASP-PL-0420

2.1

16/01/04

HP

RD31

Planck Cryogenic Test Operation Plan (CQM)

H-P-3-ASP-PL-0502

2.0

15/03/04

P

RD32

Planck Assembly Sequence

H-P-3-ASP-TN-0521

2.0

09/04/04

P

RD33

TN Planck Cryogenic & Thermal Test Program

HP-3-ASPI-TN-0185

3.0

26/03/04

P

IIDA - SECTION 2

type

Ref.

title

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

ref

PAGE : 2-4/11

Issue

Date

Applic ability

RD34

Planck CQM Cryogenic & Thermal Test H-P-3-ASP-TS-0645 Specification

1.0

23/07/04

P

RD35

Planck CQM Acoustic Test Specification H-P-3-ASP-TS-0728

2.0

30/06/04

P

RD36

Planck CQM EMC test requirement specification

H-P-3-ASP-TS-0650

1.0

02/07/04

P

RD37

Herschel EMC Test Plan

HP-2-ASED-PL-0037

1.0

16/02/04

H

Design descriptions / reports / drawings RD41

System Design Report (CDR)

H-P-1-ASP-RP-0666

1.0

21/07/04

HP

RD42

Herschel grounding diagram

H-P-2-ASPI-TN-0199

2.0

18/06/04

H

RD43

Herschel PLM Grounding Scheme

HP-2-ASED-DW-0001

1.0

22/04/02

H

RD44

Planck grounding diagram

H-P-3-ASPI-TN-0200

2.0

18/06/04

P

RD45

H/P frequency plan

H-P-1-ASPI-PL-0201

2.0

09/07/04

HP

RD46

SVM Design Report

H-P-RP-AI-0005

3.0

23/07/04

HP

RD47

PPLM Design Report

H-P-3-ASPI-RP-0313

2.0

09/04/04

P

RD48

H-EPLM Design Description

HP-2-ASED-RP-0003

3.0

30/04/04

H

RD49

Herschel EQM Design Description

HP-2-ASED-RP-0028

2.0

29/04/04

H

RD50

Cleanliness Team Report

H-P-1-ASPI-RP-0314

1.1

08/11/02

HP

RD51

Herschel Cryo-harness description

H-P-2-ASED-TN-0103

1.0

19/04/04

H

1.0

15/06/02

HP

Operations RD61

Operation Concept

H-P-1-ASPI-TD-0263

Analyses & technical notes RD71

CDR Thermal analysis report

H-P-1-ASPI-RP-0692

1.0

15/07/04

HP

RD72

Herschel/Planck EMC analyses

H-P-1-ASPI-AN-0202

2.0

2/07/04

HP

RD73

ESD analyses for Herschel and Planck Satellites

H-P-1-ASPI-AN-0268

2.0

5/07/04

HP

RD74

Time adjustment

H-P-1-ASPI-TN-0153

1.0

28/11/01

HP

RD75

Instruments Data Rates Allocation (out of date)

H-P-1-ASPI-TN-0204

1.0

25/06/02

HP

RD76

Herschel-SVM - Fine (thermal) Control law analysis

H-P-TN-AI-0060 -

2.0LIEN HYPERTE XTE

31/3/04

H

RD77

SVM TCS Thermal analysis report

H-P-TN-AI-0040

2.0

26/03/04

HP

RD78

PPLM Thermal analyses

H-P-3-ASPI-AN-0330

2.0

09/09/04

P

RD79

Planck RFDM modelling & analyses

H-P-3-ASPI-AN-0324

1.0

19/06/02

P

IIDA - SECTION 2

type

Ref.

title

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

ref

PAGE : 2-5/11

Issue

Date

Applic ability

RD80

EMC Analysis (HPLM Internal RS test option)

HP-2-ASED-AN-0001

1.0

22/04/02

H

RD81

H-PLM Thermal model & Analysis PFM

HP-2-ASED-RP-0011

4.0

15/04/04

H

RD82

H-PLM Thermal model & Analysis EQM HP-2-ASED-TN-0041

2.0

10/06/02

H

RD83

HPLM Straylight Calculation Results

HP-2-ASED-TN-0023

3.0

2/04/04

H

RD84

PPLM RF Analysis

H-P-3-ASPI-AN-0323

2.0

09/04/04

P

RD85

PPLM Optical Analysis

H-P-3-ASPI-AN-0331

09/04/04

P

2.0 RD86

CAD Data Exchange rules

H-P-1-ASPI-TN-0211

1.0

30/01/02

HP

RD87

Mechanical Mathematical Model Specification

H-P-1-ASPI-SP-0014

1.0

07/06/01

HP

RD88

Reduced Thermal Models requirements H-P-1-ASP-SP-0515 for Coupled Load Analysis

1.0

30/04/03

HP

RD89

End of Life Cleanliness Analysis

H-P-1-ASP-AN-0269

4.0

01/07/04

HP

RD90

PPLM Mechanical & Thermo-Elastic analyses

H-P-3-ASPI-AN-0329

2.0

09/04/04

P

RD91

Herschel FPU's Local vibro-acoustic analysis

H-P-ASP-TN-5021

1.0

08/06/04

H

RD92

CDR Herschel micro-vibration analysis report

H-P-3-ASP-AN-0773

1.0

25/06/04

H

RD93

CDR Planck micro-vibration analysis report

H-P-3-ASP-AN-0774

1.0

25/06/04

P

RD94

Herschel Cryostat Shielding Efficiency Assessment Consolidation

H-P-2-ASPI-TN-0177

2.0

28/05/04

H

RD95

Herschel Optical Performances Transmission Budgets

H-P-ASPI-TN-0344

3.0

23/07/04

H

H-P-1-ASPI-RP-0122

1.4

30/11/03

HP

Management RD100

Organisation of the Herschel-Planck Instrument interface management

Note 1: These documents will be updated. Instruments will be informed of the updates as they become available. Note:2: Most of the industry reference documents are available on the instrument ftp site (column "issue" contains hyperlinks to documents) ftp://ftp.hp-instruments.as-b2b.com/industry_to_instruments/IID’s/IID-A/Applicable and Reference documents/

IIDA - SECTION 2

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 2-6/11

2.3 LIST OF ACRONYMS ABCL ACC ACMS AD ADS AIV ALS AME APE ARE ASED ASP ASPI AVM AXT BEM BEU BOL BOLC CAU CCB CCE CCE CCR CCS CCU CCU CDMS CDMU CDR CE CIDL CoG Co-I CQM CR CR CS CTR CVV DC DAE DCE DCPU DCCU DCU DDVP DECMEC

As-Built Configuration List Attitude Control computer Attitude Control and Measurement Subsystem Applicable Document Amplitude Spectral Density Assembly, Integration and Verification Alenia Spazio Attitude Measurement Error Absolute Pointing Error Absolute Rate Error Astrium Space Earth Division Alcatel SPace Alcatel Space Industries (not existing any more) Avionics Verification Model (Herschel CQM) AuXiliary Tank Back End Modules (LFI) Back End Unit (LFI) Beginning of Life Bolometer Control (PACS Photometer) (4K) Cooler Ancillary Unit (HFI PHDB) Configuration Control Board Central Check-out Equipment (4K) Cooler Cold End(HFI PHDD) (4K) Cooler Current Regulator (HFI PHDJ) Central Check-out System Cryostat Control Unit (Herschel PLM control electronics) (4K) Cooler Compressor Unit (HFI PHDA) Command and Data Management Subsystem Central Data Management Unit Critical Design Review Conducted Emission Configuration Item Data List Centre of Gravity Co-Investigator Cryogenic Qualification Model Change Request Clean Room Conducted Susceptibility Central Time Reference Cryostat Vacuum Vessel Direct Current Data Acquisition Electronics (LFI) Dilution Cooler Electronics (HFI) Dilution Cooler Pneumatic Unit Dilution Cooler Control Unit Detector Control Unit (SPIRE) Design, Development and Verification Plan DEtector (photometer) Control / MEchanisms Control (PACS)

IIDA - SECTION 2

DPC DPOP DPU DTCP DSPG ECR ECSS EGSE EM EMC EMI EOL EQM ESA ESD ESOC ESTEC FAR FCS FCU FEM FEM FEU FHFCU FHFPU FHIFH FHIFV FHHRH FHHRV FHICU FHLCU FHLOR FHLOU FHLSU FHWEH FHWEV FHWOH FHWOV FM FMECA FOV FPBOLA FPBOLC FPDECMEC FPDPU FPFPU FPSPU1 FPSPU2 FPU FS GSE GSU HACS

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 2-7/11

Data Processing Centre Daily Prime Operational Period (Data (or Digital) processing Unit Daily Tele-Communication Period Distributed Single Point Grounding Engineering Change Request European Co-operation for Space Standardization Electrical Ground Support Equipment Engineering Model Electro-Magnetic Compatibility Electro-Magnetic Interference End Of Life Engineering-Qualification Model European Space Agency Electro Static Discharge European Space Operations Centre European Space Research and Technology Centre Flight Acceptance Review Flight Control System Focal Plane Control Unit (SPIRE, HIFI) Front End Modules (LFI) Finite Element Model Front End Unit (LFI) Herschel HIFI Focal Plane Control Unit Herschel HIFI Focal Plane Unit Herschel HIFI IF up-converter Horizontal Herschel HIFI IF up-converter Vertical Herschel HIFI HRS ACS Horizontal polarisation Herschel HIFI HRS ACS Vertical polarisation Herschel HIFI Instrument Control Unit Herschel HIFI Local Oscillator Control Herschel HIFI Local Oscillator Radiator Herschel HIFI Local Oscillator Unit Herschel HIFI Local Oscillator Source Unit Herschel HIFI WBS Electronics for Horizontal Polarisation Herschel HIFI WBS Electronic for Vertical Polarisation Herschel HIFI WBS Optic for Horizontal Polarisation Herschel HIFI WBS Optic for Vertical Polarisation Flight Model Failure-Modes, Effects and Criticality Analysis Field Of View Herschel PACS Bolometer Buffer Amplifier Herschel PACS Bolometer Cooler Control unit Herschel PACS Detector & Mechanism Control (DEC/MEC) Herschel PACS Data Processing Unit Herschel PACS Focal Plane Unit Herschel PACS Signal processing unit Nominal Herschel PACS Signal processing unit Redundant (stacked with 1) Focal Plane Unit Flight Spare Ground Support Equipment Gas Supply Unit Herschel Alignment Camera System (LOU alignment cameras)

IIDA - SECTION 2

He I He II He3 He4 HCM HDR HFI HIFI HK HOB HOT HPLM HRH, (V) HRS HSC HSDCU HSDPU HSEC HSFCU HSFPU HSJFP HSJFS HSVM HTT IAR IBDR IHDR ICC ICD ICU ICDR IF IFAR IFH, (V) IID IIDR ILT IMT IOCR IQR IST ISVR ITT JFET JFP JFS L0 L1 L2 L2 L3 LCL LCU

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 2-8/11

Normal Fluid Helium Helium II (Superfluid Helium) Helium 3 (Isotope used in HFI dilution cooler) Helium 4 (natural isotope of Helium) Angular Momentum Correction Mode (ACSM mode) Hardware Design Review High Frequency Instrument (Planck) Heterodyne Instrument for the Far Infrared House Keeping Herschel Optical Bench Helium One Tank (Herschel cryostat auxiliary tank) Herschel Payload Module High Resolution spectrometer Horizontal (Vertical) polarisation Herschel HIFI High Resolution Spectrometer Herschel Science Centre Herschel SPIRE Detector Control unit Herschel SPIRE Digital Processing Unit Herschel Science Evaluation Committee Herschel SPIRE Focal Plane Control unit Herschel SPIRE Focal Plane Unit Herschel SPIRE JFET (Spectrometer) Herschel SPIRE JFET (Photometer) Herschel Service Module Helium Two Tank (Herschel cryostat main He tank) Instrument Acceptance Review Instrument Baseline Design Review Instrument Hardware Design Review Instrument Control Centre Interface Control Document or Drawing Instrument Control Unit (HIFI) (same as FHICU) Instrument Critical Design Review Intermediate Frequency (HIFI) Instrument Flight Acceptance Review IF up-converter Horizontal (Vertical) polarisation Instrument Interface Document Instrument Intermediate Design Review Instrument Level Test Integrated Module Test In Orbit Commissioning Review Instrument Qualification review Integrated Satellite Test Instrument Science Verification Review Invitation To Tender Junction Field Effect Transistor, Pre-ampli (SPIRE, HFI) JFet amplifier Photometer (SPIRE, HSJFP) JFet amplifier Spectrometer (SPIRE, HSJPS) Herschel FPU’s Level 0 Thermal interface (on He Tank 1.8K) Herschel FPU’s Level 1 Thermal interface (on vent line, 4K) Herschel FPU’s Level 2 Thermal interface (on vent line, 15K) 2nd Lagrangia point (for Herschel & Planck Lissajou Orbits) Herschel FPU’s Level 3 Thermal interface for SPIRE JFET Latch Current Limiter Local oscillator Control Unit (HIFI) (same as FHLCU)

IIDA - SECTION 2

LEOP LGA LISN LNA LO LOU LOR LoS LSU LVDE MGA MGSE MLI MOC MoI MOIS MOS MPS MTL NCR NOM OBA OCM OIRD OP PACE PACS PAU PCS PCDU PDE PDR PFM PGSE PHA PHBA-N PHBA-N PHCA PHCBA PHCBC PHDA PHDB PHDC PHDD PHDJ PHEAAA PHEAAB PHEAAC PHEAAD PHEB PI PL4K PLA10

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 2-9/11

Launch and Early Orbit Phase Low Gain Antenna Line Impedance Stabilisation Network Low Noise Amplifier Local Oscillator (HIFI) Local Oscillator Unit (HIFI FHLOU) Local Oscillator Radiator (HIFI FHLOR) Line Of Sight Local oscillator Source Unit (HIFI FHLSU) Low Vibration Drive Electronics Medium Gain Antenna Mechanical Ground Support Equipment Multi-Layer Insulation Mission Operations Centre Moment of Inertia Mission Operation Information System Margin Of Safety Mission Planning Subsystem Mission Time-Line Non Conformance Report Nominal Mode (ACSM mode) (Herschel) Optical Bench Assembly Orbit Control Mode (ACSM mode) Operations Interface Requirements Document Observation Period Sorption cooler Pipes Assembly & Cold End Photo-detector Array Camera and Spectrometer Planck HFI Pre-Amplifier Unit (HFI PHCBA) Power Control Subsystem Power Control & Distribution Unit Pointing Drift Error Preliminary Design Review Proto Flight Model Pneumatic Ground Support Equiment (Planck coolers gas supplies) Planck HFI Focal Plane Unit (FPU) Planck HFI Data Processing Unit (DPU) Nominal Planck HFI Data Processing Unit (DPU) Redundant Planck HFI JFET Box Planck HFI Pre-Amplifier Unit (PAU) Planck HFI Readout Electronics Unit (REU) Planck HFI 4K Cooler Compressor Unit (CCU) Planck HFI 4K Cooler Ancillary Unit (CAU) Planck HFI 4K Cooler Electronics Unit (4K-CDE) Planck HFI 4K Cooler Cold End (CCE) Planck HFI 4K Cooler Current Regulator (CCR) Planck HFI 0.1K Dilution Cooler 3He Tank (D3T) Planck HFI 0.1K Dilution Cooler 4He Tank (D4T) #1 Planck HFI 0.1K Dilution Cooler 4He Tank (D4T) #2 Planck HFI 0.1K Dilution Cooler 4He Tank (D4T) #3 Planck HFI 0.1K Dilution Cooler Control Unit (0.1K-DCCU) Principal Investigator Planck LFI 4K Reference load (Mounted on HFI) Planck LFI Heat switch

IIDA - SECTION 2

PLBEU PLCB PLFEU PLM PLREN PLRER PLWG PM PPLM Ppm PR PRE PSEC PSF PSVM PSS PT PTC PTD PTR QLA QM QR RAA RAM RCS RD Rdp RE REBA REU RF RFD RFW RH Rms ROD RPE RTA RS SAM SBM S/C SCC SCCE SCE SCS SCOS SCP SF SFT SIN SIRD

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

Planck LFI DAE Back End Unit (BEU) Planck LFI DAE Power Box Planck LFI Front End Unit (FEU) Payload Module Planck LFI REBA Nominal Planck LFI REBA Redundant Planck LFI Wave Guides (WG) Project Manager Planck Payload Module partie per million (Planck) Primary Reflector Pointing Reproducibility Error Plank Science Evaluation Committee Point Spread Function Planck Service Module ESA Procedures, Standards and Specifications Product Tree Packet Transfer Confirmation Packet Transfer Description Packet Transfer Request Quick Look Analysis (software) Qualification Model Qualification review Radiometer Array Assembly (LFI) Random Access Memory Reaction Control Subsystem Reference Document reference frame for Planck FPU Radiated Emission Radiometer Electric Box Assembly (LFI) REad-out Electronics (HFI PHCBC) Radio Frequency Request For Deviation (affects 1 model) Request for Waiver(affects all models) Reference Hole Root Mean Square Review Of Design Relative Pointing Error Real Time Assessment (software) Radiated Susceptibility Sun Acquisition Mode (ACSM mode) Stand-By Mode (ACSM mode) Spacecraft Sorption cooler compressor Sorption Cooler Cold End Sorption Cooler Electronics Sorption Cooler Subsystem Spacecraft Control and Operations System Sorption Cooler Pipes Safety Factor Short Functional Test Straylight Induced Noise Science Implementation Requirements Document

PAGE : 2-10/11

IIDA - SECTION 2

SIST SLE SM SPIRE SPU SR SRPE SSR SST STM STMM SVM SVMD TBC TBD TCS TM TMM TMU TT&C TTC VSWR VG VG1 VG2 VG3 WBS WBS WEH, V WFE WOH, V WG WIH WU

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 2-11/11

Short Integrated Satellite Test Standard Laboratory Equipment Survival Mode (ACSM mode) Spectral and Photometric Imaging Receiver Signal processing Unit (PACS) (Planck) Secondary Reflector Spatial Relative Pointing Error Solid State Recorder Stainless Steel Structural/Thermal Model Simplified Thermal Model Service Module SVM Dummy (for planck QM tests) To be confirmed To be determined Thermal Control System Telemetry Thermal Mathematical Model Thermo Mechanical Unit (Sorption cooler) Telemetry, Tracking and Command Telemetry, Tracking and Command Voltage Standing Wave Ratio V-Groove (Planck thermal shields between SVM & payload) V-Groove 1 (Warmest V-groove shield, near SVM) V-Groove 2 (intermediate V-groove shield) V-Groove 2 (coldest V-groove shield, near payload) Work Breakdown Structure Herschel HIFI Wide Band Spectrometer (WEH, WEV, WOH, WOV) Wide band spectrometer Electronic unit Horizontal, Vertical, (HIFI) Wave Front Error Wide band spectrometer Optical unit Horizontal, Vertical (HIFI) Wave-guides (Planck LFI or Herschel LOU) (Instruments) Warm Interconnecting Harness Warm Units

IID-A Section 3 3

Reference : Date : Issue :

SCI-PT-IIDA-04624 30/06/2004 PAGE :3-1/4 3.3

KEY PERSONNEL AND RESPONSIBILITIES

3.1 ESA PERSONNEL Address ESTEC PO Box 299 2200 AG Noordwijk The Netherlands Switchboard +31 71 565 6555 project fax +31 71 565 5244 Secretary phone number +31 71 565 3473 project mail [email protected] generic e.mail [email protected] NAME

RESPONSIBILITY

Thomas. Paßvogel

Herschel-Planck Manager

Gerald Crone

Herschel-Planck Manager

Astrid. Heske

Carsten Scharmberg

Javier Marti-Canales

TELEPHONE FAX EMAIL Project Tel: +31-(0)71-565 5962 Fax: +31-(0)71-565 5244 Email: [email protected] Payload Tel: +31-(0)71-565 3934 Mobile:

Fax: +31-(0)71-5655244 Email: [email protected] Herschel PACS and Planck Tel: Sorption cooler payload engineer +31-(0)71-565 5467 Fax:: +31-(0)71-565 5244 Email: [email protected] Herschel HIFI & SPIRE payload Tel: engineer +31-(0)71-565 5786 Fax:: +31-(0)71-565 5244 Email: [email protected] Planck HFI & LFI Payload Tel: engineer +31-(0)71-565 4532 Fax:: +31-(0)71-565 5244 Email: [email protected]

IID-A Section 3

Reference : Date : Issue :

SCI-PT-IIDA-04624 30/06/2004 PAGE :3-2/4 3.3

3.2 CONTRACTOR PERSONNEL

3.2.1 Alcatel Prime contractor. Address: Alcatel Space Industries 100, Bd du Midi, BP 99, 06156 Cannes La Bocca Cedex France Switchboard +33 04 92 92 70 00 Project fax +33 04 92 92 30 10 Secretary phone number +33 04 92 92 30 85 Project e-mail address [email protected] generic e.mail [email protected] NAME

RESPONSIBILITY

Jean-Jacques Juillet

Project Manager

Bernard Collaudin

Instrument Interface Manager

Jean-Philippe Chambelland

Planck Instrument engineer

Guy Doubrovik

Herschel Instrument engineer

TELEPHONE FAX EMAIL Tel:+33 49292 3423 Fax:+33492923010 Email: [email protected] Tel:+33 4 9292 3021 Fax:+33 4 9292 3010 Email: [email protected] Tel:+33 4 9292 7448 Fax:+33 4 9292 3010 Email: [email protected] Tel:+33 4 9292 6927 Fax:+33 4 9292 3010 Email: [email protected]

IID-A Section 3

Reference : Date : Issue :

SCI-PT-IIDA-04624 30/06/2004 PAGE :3-3/4 3.3

3.2.2 Astrium Herschel PLM and Herschel AIT contractor Address: • ASTRIUM GmbH • 88039 Friedrichshafen • GERMANY Switchboard +49 7545 80 project fax +49 7545 8 42 43 Secretary phone number +49 7545 8 42 40 project mail [email protected] generic e.mail [email protected] NAME Wolfgang Ruehe

Juergen Kroeker

Siegmund Idler

Horst Faas Dietmar Schink

RESPONSIBILITY

TELEPHONE FAX EMAIL Herschel PLM Project Manager Tel: +49 7545 8 3058 Fax: +49 7545 8 42 43 Email: [email protected] Payload Engineering Manager & Tel: +49 7545 8 3 9984 Telescope I/F Engineer Fax: +49 7545 8 42 43 Email: [email protected] Tel: +49 7545 8 4671 HIFI FPU engineer Fax: +49 7545 8 42 43 + ASED Instruments Interface Email: coordination [email protected] SPIRE FPU engineer Tel: +49 7545 8 3990 Fax: +49 7545 8 42 43 Email: [email protected] PACS FPU engineer Tel: +49 7545 8 9414 Fax: +49 7545 8 42 43 Email: [email protected]

IID-A Section 3

Reference : Date : Issue :

SCI-PT-IIDA-04624 30/06/2004 PAGE :3-4/4 3.3

3.2.3 : Alenia SVM contractor Address: ALENIA SPAZIO Strada Antica di Collegno, 253 10146 Torino ITALY Switchboard +39 01171801 project fax +39 0117180637 Secretary phone number +39 0117180581 project mail generic e.mail [1st Letter of FirstName][up to 7 first Letters of FamilyName]@to.alespazio.it NAME

RESPONSIBILITY

Paolo Musi

SVM Project Manager

Marco Sias

SVM System Engineer

Marco Cesa

Instrument engineer

TELEPHONE FAX EMAIL Tel: +39 011 7180 916 Fax: +39 0117180 637 Email: [email protected] Tel: +39 011 7180 697 Fax: +39 0117180 637 Email: [email protected] Tel: +39 011 7180 934 (alenia) Tel: +39 011 440 5708 (sofiter) Fax: +39 0117180 637 (alenia) Email: [email protected]

IID-A Section 4

4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-1/34

SATELLITE DESCRIPTION

This chapter contains descriptive information and background data necessary to fully and mutually understand the interface constraints imposed by spacecraft. It is not to be considered as containing any requirement, nor to imply any particular interpretation or meaning other than the one explicitly stated in the other chapters of this document and is therefore not applicable in contractual sense.

4.1 INTRODUCTION The Herschel/Planck programme combines two missions of the ESA Horizon 2000 Science Programme within one project. Both missions perform astronomical investigations in the infrared, sub-millimetre and millimetre wavelength range: -

Herschel Space Observatory (Herschel), formerly known as the Far InfraRed and Submillimetre Telescope (FIRST), is a multi user observatory type mission;

-

Planck (previously named COBRAS/SAMBA), is a Principal Investigator survey mission.

Both missions will be carried out with their specific spacecraft, and will be operated in a similar orbit around the second Lagrangian point L2. The present concept is to have the two spacecraft launched on a single ARIANE 5 ESV-type launcher. For the Herschel payload, composed of three instruments and mounted in the Herschel Payload module (HPLM), the Herschel spacecraft provides the environment for astronomical observations in the infrared wavelength range from 60 to 670 micron (480 GHz – 5 THz). For the Planck payload, composed of two instruments and mounted in the Planck Payload Module (PPLM), the Planck spacecraft provides the environment for full sky surveys in the frequency range from 25 to 1000 GHz.

4.2 SYSTEM DESCRIPTION The Herschel satellite configuration is completely modular and is made up of: -

the Herschel Payload Module (HPLM) which comprises the 3.5 meter Herschel telescope, the cryostat, the Herschel focal plane units inside the cryostat and the instrument units mounted externally on the cryostat

-

the Herschel Service Module (HSVM) which comprises the conventional spacecraft subsystems, the “warm” instrument units and the sunshield. Instrument warm units are accommodated on dedicated SVM panels, 1 or 2 panel per instrument.

The Planck satellite configuration shows a lower level of modularity due to the various connections between the cryogenic payload module and the units mounted on the payload module. However one can clearly distinguish -

the Planck Payload Module (PPLM) which comprises the Planck optical bench with the offset Aplanatic telescope and the two instruments focal plane unit, the SVM upper platform with the LFI Backend Unit and the HFI Readout Unit. The compressors of the sorption coolers, 4 K coolers and further cooler equipment is mounted on the PSVM radiator.

-

the Planck Service Module (PSVM) which comprises, aside the conventional spacecraft subsystems and the “warm” instrument units and the solar array.

Figure 4.3.1-1 through figure 4.3.1-4 show the general configurations of the Herschel and Planck satellites in the dual launch configuration.

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-2/34

The selected satellite operational orbits are different Lissajous orbits around the second Lagrangian Libration Point (L2) in the Earth/Moon - Sun system. This point lies approximately on the Earth-Sun line at 1.5 × 106 km from the Earth in anti-Sun direction. Planck, due to stringent requirements on straylight, will be injected into a Lissajous orbit with a maximum sun-s/c-earth angle of 10°. Herschel will be sent into a larger Lissajous orbit. Herschel will have a nominal lifetime of 3.5yrs from launch until end of mission, where the duration includes a maximum of 6 months for transfer to the operational orbit around L2. Planck will have a lifetime which allows to carry out two full sky surveys (at least 95% of the whole sky) in the operational orbit around L2., plus a maximum of 6 months for the transfer to the operational orbit. The prime ground station is the 35 m station at New Norcia. The Kourou station is used during LEOP, Commissioning and PV, and may be used as emergency station. During normal operations the prime ground station will receive the spacecraft telemetry and up-link the telecommands during a period of 3 hours per day for each spacecraft (the Daily Telecommunications Period, DTCP). Two different operation scenarios are foreseen: -

During the Herschel observation period of 21 hours per day the spacecraft will collect scientific data which will be stored in an on-board mass memory for transmission towards the ground station during the subsequent telecommunications phase. “Limited” scientific observations could also be conducted during the telecommunications period.

-

For the Planck operation, the spacecraft will collect the scientific data 24 hours per day, which means that the observation phase will continue during the telecommunications period.

The telecommunications period will be used for up-linking the commands for later execution and dumping of the stored data. The data acquired at the ground station(s) from both spacecraft will be routed through ESA’s operational communications network to the Mission Operations Centre (MOC) at ESOC for subsequent storing and distribution to the Herschel Science Centre (HSC) and the Instrument Control Centres (ICC’s) or to the Planck Data Processing Centres (DPC). Conversely, the HSC, ICC’s and PSO (Planck Science Office) will provide the MOC with observation schedules and instrument information, which inputs will be used by the Mission Planning System (MPS) at the MOC to prepare the command sequence to be up-linked to both spacecraft.

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-3/34

Sunshade

Telescope

PLM Sunshield / solar array

Ysat

HIFI LOU + Radiator SVM shield SVM

Figure 4.2-1: Herschel satellite

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-4/34

Telescope

PPLM Radiator

FPU's PPLM

V-Groove Shields

SVM

Solar Array

Figure 4.2-2: Planck Satellite.

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

Figure 4.2-3: Herschel/Planck Satellites in stacked Launch Configuration

PAGE : 4-5/34

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-6/34

4.3 Herschel PAYLOAD MODULE (HPLM) The HPLM will accommodate all cold Herschel instrument units supplied by the Principal Investigators. The HPLM comprises the following two major elements, described in more detail below: -

the 3.5 m Herschel Telescope

-

the Helium Cryostat.

The Herschel payload module configuration is shown in Figure 4.3-1

Telescope Mounting Structure

Cryocover

Cryostat Baffle

CVV Upper Bulkhead CVV Radiators

CVV Cylinder

Cryoharness Connector ring

Nozzles

CVV Lower Bulkhead

SVM Struts

Figure 4.3-1: Herschel Payload Module.

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-7/34

4.3.1 Herschel Telescope The telescope is an axi-symmetric, 3.5 m diameter Cassegrain telescope consisting of (RD 01): -

a primary reflector

-

a secondary reflector

-

a reflector support structure (tripod, bipods etc.)

-

an interface triangle (tbc) and mechanical fixation devices to the primary reflector

-

baffles as necessary

A telescope heating system will be included for in-orbit contamination release from optical surfaces and for bake-out of the telescope. The Sunshield, which is functionally part of the SVM, protects the telescope from direct solar radiation and provides a stable thermal environment, which minimise temperature variations across the telescope. The opto-mechanical dimensions of the Herschel optical system are given in Table 4.3.1-1 and the configuration shown in Figure 4.3-2. The position of the telescope with respect to the satellite is shown in Figure 4.3-3. Herschel Telescope Optical Parameters Operating wavelength Focal length Entrance pupil diameter Deff f-number Primary vertex to best focus Primary vertex to fixation plane Aperture stop Field of View Area obscuration ratio (tripod + M2) Overall WFE Relative spectral transmission

Primary reflector Vertex to telescope interface plane (tv) Vertex to paraxial focal plane (tf) Distance M1 to M2 Radius of curvature Conic constant f-number (Free) diameter Useful diameter Central hole diameter Distance of best focus from mechanical interface

Axi-symmetric 3.5 m diameter Cassegrain telescope 80-670 µm 28500 mm 3283 mm f/8.68 1050 mm 250 mm on M2 ±0.25 deg 7.7% < 6 µm (rms) > 0.97 BOL > 0.98 BOL (goal) > 0.95 EOL

250 mm 1050.16 mm 1588 mm 3500 mm -1 f/0.5 3500 mm 3470 mm 560 mm 800 mm

Specified tolerance or comment

Tolerance 150 mm Tolerance 0.02 Tolerance 10 mm Tolerance 1 mm

Non uniformity of spectral transmission < 0.01

1mm 10 mm 2 mm

Tolerance 0, +2 mm

relative

IID-A Section 4 Herschel Telescope Optical Parameters

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

Axi-symmetric 3.5 m diameter Cassegrain telescope

Secondary reflector Radius of curvature Conic constant Diameter Scattering cone diameter

345.2 mm -1.279 308.1 mm 33mm

Image surface Radius of curvature Conic constant Diameter Distance from M1 Height above optical bench

- 165 mm -1 246 mm -1050 mm 202 mm

PAGE : 4-8/34

Specified tolerance or comment

0.4 mm Tolerance ±0.2 mm Small scatter

Corresponds to 0.25 deg Tolerance (2 sigma) for Telescope/PLM/Instruments ± 7.1mm (PACS) ± 7.7mm (SPIRE) ± 8.5mm (HIFI)

Table 4.3.1-1: Herschel Telescope Opto-mechanical Dimensions (at operating temperature)

The central hole diameter and the position of the hexapod interface points and the M2 support structure dimensions will be given after the preliminary design activities.

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

Figure 4.3-2: Telescope configuration (see complete telescope ICD in annex 11)

PAGE : 4-9/34

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

Figure 4.3-3: Herschel Telescope positions with respect of the satellite

PAGE : 4-10/34

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-11/34

4.3.2 Helium Cryostat The Helium Cryostat of the HPLM accommodates the Herschel focal plane units (FPU) of the three scientific instruments: - the Heterodyne Instrument for the Far Infrared (HIFI) - the Photodetector Array Camera and Spectrometer Instrument (PACS) - the Spectral and Photometric Imaging Receiver (SPIRE). The cryostat provides an adequate thermal environment to these focal plane units and provides the optical interface between the focal plane units and the telescope. The Helium cryostat also provides interfaces with the HSVM, the Herschel Telescope, the sunshield. The cryostat consists of: -

Structural and insulation components featuring an outer vessel, a suspension system to minimise heat conduction from outer vessel to the cryogenically cooled elements and the adequate shielding and thermal insulation to minimise the heat radiation from the outer vessel to the cooled elements

-

A helium subsystem to provide the adequate cryogenic environment. This passive, single cryogen, cooling system features a main He tank, containing superfluid helium, a passive phase separator and the cryogenic components to operate it. It also features an additional helium tank designed to provide the required autonomy of the cryogenic system on the launcher.

-

The Herschel Optical Bench (HOB), which accommodates the instrument Focal Plane Units in the Focal Plane Assembly (FPA) and provides the necessary thermal and structural interfaces.

-

A cryo cover which closes the cryostat on ground and preserves the sensitive optical components inside the cryostat from contamination during the first days on orbit.

The Cryostat also accommodates the following payload equipment: -

the Local Oscillator Unit (LOU) of the HIFI, its beam injection optics and the LOU waveguides to the SVM

The PLM electrical subsystem harness provides all electrical connections between all electrical equipment in the Payload Module and between the Focal Plane Units and the warm electronics of the payload instruments. The Helium Cryostat configuration is shown in Figure 4.3-4

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-12/34

CVV Baffle Entrance Baffle CryoCover

Cryostat Vacuum Vessel (CVV) SPIRE FPU

HIFI FPU LOU window baffles

Level 1 Vent line Optical Bench Assembly (OBA)

Level 0 Thermal straps Tank Support Structure

Thermal Shields Cryo-harness Vacuum feed through Helium Two Tank (HTT) Helium One Tank (HOT)

Figure 4.3-4: Herschel Payload Module

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-13/34

A schematic view of the He control subsystem is shown in Figure 4.3-5

SV121

SV922

SV921

T504

T503

V506

CVV

E601

P501 P502

Filling port

V501

V503

T501 S101 P101

SV123

H502/ H503

V103

S501

OBA RD124

E201

V106

V104

SV521

H501 T505

T502

V102

T111

L101

HTT

E421

T112

E441

E461

L102

PPS111

V502

V505

V504 T506

N511 N513

T106,107

T103 H101

H102

HS1 HS2

A101 - A1XX

HS3

SV723 H103

V702

H104 T101

T102

T105

T104

L701

P701 V701

V105

L702

HOT

T701, 704

H701

H702

T702, 703

Non-CCU components

RD724

VG901

VG902

Figure 4.3-5: Schematic view of Helium Control System

4.3.3 Herschel PLM Optical Bench Assembly (OBA) Instruments FPU are mounted on the Optical Bench Assembly (OBA) The OBA is defined as the assembly which consists of the following items: •

Optical Bench Plate (OBP,) with mounting brackets to the Spatial Framework (SFW)],

•

Optical Bench Shield (OBS), including entrance and LOU baffles,

•

Optical Bench Helium Cooling Loops, including mounting brackets (OBHCL),

•

Thermal Interface Links to Scientific Instruments (OBTL) L0

THERMAL LINKS ‘L0TL’

L1 THERMAL LINKS ‘L1TL’

Legend: A adsorber E heat exchanger H heater HS heat shield L liquid level probe N exhaust nozzle P pressure sensor PPS passive phase separator RD rupture disc S filter SV safety valve T temperature sensor V valve VG vacuum gauge

N512

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-14/34

L3 THERMAL LINKS ‘L3TL’ •

Optical Bench Instrumentation interfaces

•

Scientific Instrument and Cryostat Instrumentation Harness (SIH & CIH) interfaces (*)

The basic function of the Optical Bench Assembly (OBA), is to provide through the Optical Bench Plate (OBP) itself a solid and alignment stable support of the Scientific Instruments FPU's (PACS, HIFI, SPIRE FPU, SPIRE-JFETs) within the Herschel cryogenic environment. The OBP is a light aluminium plate, which is supported at four I/F points and provides I/F for the instruments and associated parts of instrument harness as well as for Optical Bench Instrumentation (OBI). The OBP and OBS are thermally coupled to the Level 2 (12-15K) The OBA is described in the following figures, and OBA ICD's are attached in annex 6

Figure 4.3-6 Herschel OBA (upper: with ½ OBS, lower without OBS)

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-15/34

Figure 4.3-7 Optical Bench Shield (OBS)

4.3.4 Herschel PLM Optical Baffle design The optical path between the Herschel Telescope and the instrument FPU's is composed of the following: The enclosure between the Cryostat cover and the telescope, protected with the cover baffle (Al coated). The enclosure between the cryostat cover and the instrument shield, protected by 2 cylindrical baffles: One attached to the 2nd shield, and one attached to the instrument shield. The baffle of 2nd shield is black anodised. Both the Baffle on the 2nd Shield and on the instrument shield have a closing plate, with a hole shaped to the envelope of the optical beams

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-16/34

Cryostat Cover

Cryostat Cover Baffle

2nd shield baffle

Instruments shield baffle Focal Surface

Figure 4.3-8: Overall configuration of beam entrance

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-17/34

HIFI Beam SPIRE Beam

PACS Beam

Figure: 4.3-9: Instrument Beam at CVV Aperture (x=648.33mm from focal plane)

Figure 4.3-10: Instrument Beams at Instrument Shield Aperture (x=495.86 from focal plane)

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-18/34

4.3.5 Herschel PLM Cryo Cover The Herschel cryostat cover (shown in ) together with its shielding serves for following main cryogenic purposes. • Close and tighten the CVV during ground and launch operations to maintain the insulation vacuum • Safe single opening in orbit to provide sufficient free entrance for the telescope beam into cryostat • Provide an internal temperature as low as possible on ground, by a passive shielding • Provide a low thermal background for instrument testing on ground by active cooling The cryostat cover assembly consists of: A dome shaped aluminium part closing the CVV vacuum tight with an o-ring containing electrical and fluid feed through and supports for the inner shielding A cover opening mechanism supported of the CVV outside A thermal shield assembly consisting of piping, an active cooled plate with a heat exchanger facing the focal plane and a passive shielding behind it

Figure 4.3-11: Design of the cryo cover and the optical shield Inside the cover is attached an optical shield which has been designed to reflect each instrument Focal point

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-19/34

The Cover shield can be actively cooled with LN2 or Lhe to reach a temperature compatible with instruments IMT's. Detail ICD of the cryo-cover can be found in annex 6.

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-20/34

4.4 Planck PAYLOAD MODULE (PPLM) The Planck Payload Module (PPLM) will accommodate the Planck instrument units supplied by the Principal Investigators. The Planck instruments are split into a common Focal Plane Unit (FPU) and HFI JFET box that shall be located close to the FPU, mounted to the Planck Telescope Support at 50-60K and ambient temperature units, mounted to the SVM panels. The instruments elements mounted into the PPLM are directly and permanently connected to their counterparts in the PSVM and a clean separation is not possible. However, considering the mounting panels of the PSVM that carry these units as part of an extended Payload module, one can minimise the set of interfaces and achieve a nearly independent module. This can be integrated and tested separately from the rest of the spacecraft. It comprises the following major elements, described in more detail below: -

The Planck Telescope and the V-groove insulation system

-

The PSVM upper Platform

-

The PSVM Radiators panels, carrying the Sorption Cooler Compressors.

The “extended” PPLM exhibits the following external interfaces •

Mounting interfaces to the SVM

•

Electrical interfaces between the electronic units mounted on the equipment platform and the corresponding units on the SVM panel.

The extended PPLM configuration is shown in Figure 4.4-1 below.

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-21/34

PR Panel & HFI JFET

LFI WaveGuides & support structure Baffle V-Groove Thermal shields

LFI BEU

SCS & SCO on heat pipes

HFI DCCU HFI Dilution tanks

HFI & LFI FPU's

Primary Reflector (PR)

Secondary Reflector (SR)

Figure 4.4-1: Planck Payload Module with instrument warm units & pipes

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-22/34

4.4.1 Planck Telescope and FPU The Planck Telescope Support Structure is the mounting base for the common Planck instrument FPU, HFI JFET box and the reflectors of the telescope. The main parameters of the Planck telescope are given in Figure 4.4-2 below and in Table 4.4.1-1 (RD 02).

Figure 4.4-2: Definition of design parameters of the Planck telescope

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-23/34

Figure 4.4-3: Planck Telescope: Structure (upper) and conceptual view of PPLM including V-Grooves (lower)

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

Angle of centre of FOV (line of sight) with ZM1 Field of view Primary mirror Surface shape Radius of curvature Circular projected aperture 1,3 Real aperture dimensions in the rim plane3 Conic constant Offset distance at centre Secondary mirror Surface shape Radius of curvature Conic constant Major axis of projected contour3 in the YM2 direction) Minor axis of projected contour3 (in the XM2 direction) Aperture dimensions in the rim plane3 offset distance at centre Relative position of Angle between major axes (Θ1) primary and Ztop secondary mirrors Zbot Position of reference Position of centre of detector plane detector plane with respect to the secondary axis system Angle between ZRDP and Zm2 (Θ2) M2 (see Figure 4.4.13)

-3.751°

Telescope

1

in a plane perpendicular to the major axis of the primary ellipsoid

2

See figure for a sketch on how to derive the secondary mirror surface

PAGE : 4-24/34

± 5° Ellipsoid 1,440 mm 1,500 mm 1555.98 mm x 1886.79 mm -0.869417 1,038.85 mm Ellipsoid 643.972 mm -0.215424 1,018.6 mm 780.6 mm 1,018.6mmx1,043.23 mm XcM2 = -328.15 mm 10.1° 481.737 mm 706.027 mm X = -108.42 mm Y = 0 mm Z = -1,026.83 mm -21.27°

3

Dimensions of apertures and contours are the optical definition. Physical dimensions of mirror shall take into account possible misalignments

Table 4.4.1-1: Opto-mechanical Definition of the Planck Telescope

In order to provide the required temperatures at the Focal Plane Unit active cooling is implemented as part of the instruments. The active cooling units are mounted on dedicated PSVM radiator panels, and need a number of interfaces to the intermediate V-groove insulation system. These interfaces are thermal interfaces used for pre-cooling / thermalisation of the cooler pipes, harness and wave-guides and serve also as mechanical interfaces. The detailed interfaces are described in the respective chapter below.

4.4.2 PSVM Units The PSVM Upper Platform carries those ambient temperature units of the Planck instruments that are either required to be nearby the focal plane unit or that should not be disconnected after initial

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-25/34

integration. Those units are the back-end unit of the LFI instrument (connected to the FPU via Waveguides, forming the RAA: Radiometer Array Assembly) and the PAU of the HFI instrument (connected to the JFET/FPU via a bundle of cables integrated inside a bellow). These unites (FAA & PAU/JFET)are delivered already integrated. Active cooling is required for both instruments and comprises the following sets of coolers: -

Sorption cooler (1 nominal and 1 cold redundant) for LFI cooling and HFI pre-cooling (no disconnection between compressor, pipes & cold end)

-

4 K mechanical cooler for HFI and pre-cooling of dilution cooler (disconnectable on upper platform, and on FPU)

-

HFI dilution cooler.(disconnectable on upper platform)

The sorption cooler compressors require a maximum temperature of 270 K and need dedicated radiator area. SVM panels are foreseen as Radiator. The further units of the Planck instruments are placed mainly on other SVM panels (see Figure 4.4-1).

4.5 SERVICE MODULES (SVM) Both Herschel and Planck SVM are under the responsibility of Alenia. A common modular architecture has been followed for the Herschel and Planck SVM. The core of the avionics is similar, with dedicated plug-in for specific functions (Instruments, ACMS sensors).

4.5.1 Herschel Service Module The Herschel Service Module (HSVM) consists of the following elements: •

a primary load carrying structure (Cone carrying the interface structure to Launcher on one side, and PLM on the other side)

a secondary structure carrying warm units and parts of the subsystems necessary for the Herschel mission (Instrument warm units, and avionics) (See Figure 4.5-3)

4.5.2 Planck Service Module The Planck Service Module (PSVM) consists of the following elements: •

a load carrying primary structure

•

a secondary structure carrying the units and parts of the subsystems necessary for the Planck mission.

The PSVM provides the interface to the ARIANE V launcher. (see

Figure 4.5-4)

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-26/34

4.5.3 SVM’s Subsystems There are 4 major SVM subsystems (covered by a specification and a specific subcontractor): •

Structure

•

Thermal control

•

ACMS

•

Propulsion

In addition, 4 subsystems are directly managed by the SVM contractor Alenia: •

Power distribution (PCDU, Batteries and solar array)

•

TTC Telemetry/Tracking and Command

•

On-board Data management (ACC, CDMU computers)

•

Harness

The overall avionics architecture is described in the 2 following figures (Figure 4.5-1 and Figure 4.5-2). The part common to both spacecraft is inside the blue delimited surface.

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-27/34

Figure 4.5-1 Herschel Avionics organisation chart

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-28/34

Figure 4.5-2: Planck Avionics organisation chard

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-29/34

4.5.3.1 Structure Subsystem The structure subsystems of the SVM supports the SVM units, carries the PLM’s, and provide interface to the launcher. A modular approach is also used for the accommodation of units on the lateral panels: the avionics on Herschel is concentrated on 3 of the 8 panels, the avionics on Planck is concentrated on 2 of the 8 panels (almost similar for both spacecraft). The instrument warm units have dedicated panel(s) per instrument, sharing 4 panels (Herschel) or 6 panels (Planck).

4.5.3.2 Thermal Control Subsystem The thermal control subsystem (TCS) maintains the required SVM and PPLM thermal environment for proper operations of equipment, taking into account the different environmental conditions.

4.5.3.3 Attitude Control and Measurement Subsystem The Attitude Control and Measurement Subsystem (ACMS) provides the hardware and associated onboard software to acquire, control and measure the attitude of the satellite during all mission phases and modes according to the system requirements. The attitude and orbit control thrusters, used as actuators, are part of the Reaction Control Subsystem (RCS), but their operation is controlled by the ACMS. The ACMS comprises the following elements: -

attitude sensors for attitude measurement during all mission phases

-

actuators to generate control torques for attitude manoeuvres and for compensation of perturbing torques

-

electronics and software to manage the attitude measurement and control functions, to detect and isolate failures and reconfigure if necessary, and to provide the interfaces with the CDMS and TT&C subsystems.

4.5.3.4 Propulsion Subsystem The propulsion subsystem comprises the propellant storage tanks, pipes, necessary valves and pressure transducers and the thrusters. The thrusters are commanded by the ACMS.

4.5.3.5 Telemetry, Tracking and Command Subsystem The Telemetry, Tracking and Command (TT&C) subsystems manage the reception and transmission of radio frequency signals for science and housekeeping data telemetry, telecommand and tracking. It is able to operate in both ways (up-link and down-link) during all mission phases when there is ground station contact. The frequencies are in the X-band frequency range.

4.5.3.6 Command and Data Management Subsystem The Command and Data management Subsystem (CDMS) collects all telemetry data from the satellite. These data include the scientific data, the science instrument housekeeping (HK) and the spacecraft housekeeping data. The data will be conditioned, digitised and encoded for transmission to ground via

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-30/34

the TT&C subsystem. The CDMS will also process the up-link command signals received by the TT&C subsystem and decode, validate and distribute the commands to the users for execution. During the observation period (OP) the collected telemetry data will be stored in a Solid State Recorder (SSR). During the Daily Telecommunications Phase (DTCP) the stored data, together with real time data, will be transmitted to ground. The CDMS will be the source for: •

Telemetry and telecommand services to and from the ground station

•

On-board timing and synchronisation

•

Autonomous satellite monitoring and recovery

•

Ground satellite checkout.

The CDMS supports an average bit rate of the instruments during scientific observations as defined in 5.11.

4.5.3.7 Power Control Subsystem The Power Control Subsystem (PCS) conditions, controls and distributes the electrical power generated by the solar array to all payload instruments and spacecraft subsystems/units.

4.5.3.8 Solar Array and Sunshield The combined sunshield/solar array provides the necessary electrical power via a solar cell network and protects the payload module from direct solar radiation. For Herschel it is mounted on one side of the spacecraft. For Planck it is attached to the lower end of the PSVM.

4.5.3.9 Harness The SVM harness provides all electrical connections between all electrical equipment in the service module. It includes harnesses for power supplies, signals and synchronisation. It includes also harnesses for connections with the PPLM, the HPLM, the umbilical and test connectors. The layout of the Herschel and the Planck SVM are given in Figure 4.5-3 and

Figure 4.5-4.

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

HIFI Vertical Polarization SPIRE

HIFI Horizontal Polarization Reaction Wheels panel

PACS

Power, ACC,

PAGE : 4-31/34

Skin

+Z Panel RF panel

Figure 4.5-3: Herschel Service Module

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-32/34

Upper Plateform (LFI BEU, DAE Pwr Box, HFI PAU SCC panels

SCC N

SCE

RF panel

Power, ACC, CDMU

SCC R 4K CCR on shear web

Skin

HFI DPU’s HFI (4K panel + REU)

HFI DDCU & & LFI REBA

Figure 4.5-4: Planck Instrument deployment on SVM

Reference : SCI-PT-IIDA-04624

IID-A Section 4

Date :

30/06/2004

Issue :

3.3

PAGE : 4-33/34

4.6 OPERATING MODES The following modes are defined for the Herschel & Planck Spacecraft: the launch mode identifies the S/C state until separation from the launcher the Sun Acq Mode is first reached after separation, then reached in case of ACC or ACMS level failure the Nominal Mode is the normal mode of operation during science observations and commissioning the Earth acquisition mode is reached in case of CDMU anomaly the Survival Mode is reached in case of major power problem the following diagram give the mode transition

launch Mode To survival Ground TC Mode

CDMS Level 4

Ground TC ACC (Level 3) or ACMS alarm (Level 4)

Separation from the Launcher

From Earth Acq Mode

Sun Acq Mode

Ground TC

Earth Acq Mode

TC

ACC (Level 3) or ACMS alarm (Level 4)

TC

CDMS Level 4

Ground TC

Ground TC

TC

Ground TC

Survival Mode TC

TC

Ground TC CDMS Level 4

CDMU alarm (level 3)

ground TC

TC

Nominal Mode TC

Figure 4.6-1: Satellite Modes transition logic

IID-A Section 4

Reference : SCI-PT-IIDA-04624 Date :

30/06/2004

Issue :

3.3

PAGE : 4-34/34

4.6.1 Launch During Launch of the two satellites the scientific instruments will be nominally switched off. Currently, only the Planck 4K Cooler is in Launch lock Mode (meaning that the 4K compressors drives are powered by activating the relevant LCL (through the 4K CDE)), and the Herschel Cryostat Control Unit (CCU) is ON.

4.6.2 Herschel The Herschel spacecraft will be three axes stabilised. The instantaneous sky coverage is defined by the allowed sun aspect angles of ±30° in the x-z plane and ±1° in the y-z plane. The orbit operation is characterised by the observation time and the down-link time. The duration of the Observation Periods will be 21 hours during which the scientific data will be stored on-board. Limited scientific observations will also be conducted during the telecommunications periods, subject to restrictions imposed by the telecommunications and other spacecraft maintenance activities. During the DPOP the spacecraft will support a number of scientific pointing modes, such as fine pointing, raster scanning and line scanning modes (see annex 4). The spacecraft supports the Herschel instrument operation with any instrument in prime mode. Both PACS and SPIRE will operate in a coordinated way such that they share the available science data rate. At the end of the Observation Period the stored data will be sent to ground and the observation/schedule parameters for the next 48 hrs will be up-linked. In addition, the second half of the up-linked observation/ schedule parameter will be updated during next (24 hours) ground contact. Within this period also spacecraft operations like reaction wheel unloading and star-tracker calibration checks will be performed. The spacecraft can support, during this time period, limited instrument operations. In addition, a serendipity mode could be defined, where SPIRE will be operated in a fixed configuration during a slew from one target to the next.

4.6.3 Planck The Planck observation programme basically consists of two scans of the full sky each carried out over the period of half an orbit around the sun and as such covering the full sky. The satellite is spinning with one revolution per minute around the –x-axis that is pointing continually to the sun. In order to properly cover the full sky, the spin axis is repointed to up to 10° from the sun direction The instruments will take data for the full 24-hour period and the data will be stored on-board. As for the Herschel spacecraft the data will be sent to ground within a period of nominally 3 hours, the downlink time. The spacecraft will support, during this time period, full instrument operations. The spacecraft supports the Planck instruments being operated simultaneously. However, it is also possible to operate only one instrument. In this case, the operating instrument may be allocated the sum of the data rates of LFI and HFI nominal allocation.

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-1/149

5. INTERFACE WITH INSTRUMENTS 5.1

IDENTIFICATION AND LABELLING

Each instrument unit is required to bear a unit identification label containing the following information: −

Project code

−

Unit identification code

−

Model (e.g. AVM, CQM, PFM, FS)

The identification label shall be attached to each instrument unit at a location that guarantees maximum visibility. The location and content of the instrument unit’s identification label shall be shown on the external configuration drawing(s) of the respective unit. The identification label shall be clearly legible.

5.1.1 Project code For each instrument the Project code, which is the normal reference used for routine identification in correspondence and technical descriptive material, is defined in chapter 5.1 of the IID’s part B (AD 1-1, 1-2, 1-3, 1-4, 1-5 for respectively SPIRE, HIFI, PACS, HFI, LFI).

5.1.2 Unit identification code The unit Identification code is allocated in accordance with a computerised configuration control system and also for connector and harness identification purposes. The first 5 characters of this code are the allocated Project code. The unit identification code is composed of 3 parts: −

2 characters for instrument identification, i.e. FH, FP and HS for the Herschel instruments HIFI, PACS and SPIRE respectively, PH and PL for the Planck instruments HFI and LFI respectively

−

3 characters for unit identification, e.g. FPU, FCU, DPU, SPU

−

2 characters for model identification, i.e. AV for Avionics Model, CQ for Cryo-Qualification Model, PF for Proto-Flight Model, FS for Flight Spare Model.

For connector and harness this code is limited to the characters up to unit identification, followed by the connector identification (see below) For information, for H-PLM items, the code consists of six digits. The first three digits identify the subsystem (e.g. PLM, Instruments, etc.), the last three digits identify the item within the subsystem. This includes all mechanical and electrical items in a subsystem (Self-standing parts like Electronic Boxes, brackets, harness, etc). For instance, the harness identification code will be attached to the unit and corresponding harness.

5.1.3 Connector identification Each equipment box is required to bear visible connector identification labels closely adjacent to the appropriate connector. Spacecraft philosophy is to locate a «J» character to all units fixed (hard mounted) connectors and a «P» character to all harness mounted connectors, followed by a 2 or 3 digits number. Each unit is treated individually in this respect, starting at «J01"for unit fixed connectors. Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-2/149

For full connector identification these three alphanumeric characters are preceded by the S/C identification code of the instrument unit, e.g. connector «J03"on box the SPIRE FPU will have the full reference «HSFPUJ03", the mating harness connector will have the reference «HSFPUP03". Since the S/C identification code already appears on the unit identification label however, unit fixed connectors are not required to bear the full connector identification code; in the example above «J03" would suffice. The same rules apply for supplied instrument interconnect harnesses, and harness from an instrument EGSE if it requires connection to test connectors on an instrument unit. The location and content of the above described identification labels shall be included in the external configuration drawing. Herschel Cryoharness connector identification relies on Product tree Identifier, followed by Connector identification label as described here. Refers to H-PLM Electrical ICD RD10 (FM) and RD11 (QM).

5.2

COORDINATE SYSTEM

5.2.1 Spacecraft Coordinate system

The basic co-ordinate system shall be a right-handed Cartesian system with its origin located at the point of intersection of the longitudinal launcher axis and the satellite/launcher for each satellite Figure 5.2.1-1: Definition of Herschel spacecraft axes For Herschel the basic coordinate system is a right handed orthogonal system with its origin located at the intersection point of the longitudinal launcher axis and the separation plane of the Herschel satellite. −

the positive XHSC-axis is perpendicular to the separation plane and nominally coincides with the longitudinal launcher axis (or optical axis), oriented toward the payload..

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-3/149

−

the ZHSC-axis is in a plane through the XHSC-axis and perpendicular to the separation plane such, that nominally the Sun will lie in the XZ-plane (zero roll angle with respect to the Sun), positive towards the Sun.

−

the YHSC-axis completes the right handed orthogonal reference frame.

The Herschel PLM Coordinate System (HPLM) is parallele to the Herschel satellite coordinate system. The origin of the HPLM coordinate system is derived by the shift of the HSC to XHSC=946,5mm, YHSC=0,0mm, ZHSC=-60mm. The Service Module coordinate system (HSVM) is identical to the Herschel spacecraft Coordinate System (HSC). For Planck the Spacecraft X-axis nominally coincides with the longitudinal launcher axis (= the nominal antisun direction, i.e. the spin axis). The Planck telescope line of sight, which is defined as the direction in which the projection of the main mirror rim is circular, is tilted 85° from the X-axis in the Z direction. The Z-axis is in the plane normal to the X-axis such that nominally the telescope line of sight will lie in the XZplane, positive towards the target source. The Y-axis completes the right-handed orthogonal reference frame. There are 3 additional frames associated to the PPLM, to the Telescope, and to the FPU, which are defined in annex 7, chapter 2, having their origins respectively in Opplm, Otel, and Ordp.

Figure 5.2.1-2: Definition of Planck spacecraft axes The X-axes of both satellites nominally coincide with the longitudinal launcher axis.

5.2.2 Instrument unit co-ordinate system In order to provide a reference for the Instrument Focus (Focal Plane Units), Centre of Gravity (CoG) and (possibly) Moment of Inertia (MoI) measurements, each instrument unit is required to have a right-handed Cartesian system. Its origin shall be in a reference hole (RH) in the unit mounting plane, which is the attachment to the S/C. The RH is defined as one of the unit fixation holes. The principal axis of the instrument units shall be parallel to those of the S/C co-ordinate system, as far as practical The instrument unit co-ordinate system and the RH location shall be defined in the unit’s external configuration drawing. Note that his convention is not fully compatible with the GDIR (RD1).

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

5.3

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-4/149

LOCATION AND ALIGNMENT

5.3.1 Instrument location 5.3.1.1

Herschel Instruments

The Herschel instruments are located in the cryostat on the optical bench (Focal Plane Units, SPIRE JFET boxes), mounted to the cryostat HIFI Local Oscillator Unit and Wave-guides) and on the SVM (Electronic units). The instrument units shall be compatible with maximum instrument envelopes as defined in Figure 5.3.1-1 to 5.3.1-2 and in Table 5.3.1-1 Interface

Max. envelope

Optical Bench

Remarks

Non symmetric See Figure 5.3.1-1, 2

All FPU’s (including SPIRE JFET boxes)

Cryostat

LOU, including LOU radiator (see Figure 5.3.1-3)

SVM

As defined in ICD's attached to IID-B's

LOU has 2 baseplates: LOU baseplate for the HIFI delivered LOU baseplate LOU support Plate for the ASED delivered plate. The LOU support Plate and the LOU struts form the LOU structure

Table 5.3.1-1: Maximum allocated envelope for Herschel instruments

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-5/149

+Z PACS

+Y

HIFI

+X

SPIRE

Figure 5.3.1-1: Herschel Optical Bench with Instrument FPU's (+Z view (top) and +X view)

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-6/149

Figure 5.3.1-2: :Herschel Optical Bench equipped with instruments and Cryoharness (PACS front left, HIFI front right and SPIRE in the back).

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-7/149

Figure 5.3.1-3:LOU CVV support frame (see interface drawing in annex 6) The LOU interfaces with the spacecraft via a specific mounting structure (LOU support Plate provided by industry), which shall also carry the LOU radiator. The LOU mounting structure forms part of the thermal path between LOU and LOU radiator (incl. its supports/thermal links). Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-8/149

The LOU delivered by HIFI includes a baseplate (LOU baseplate) which is an optical bench. The LOU radiator and its supports/thermal links will be provided byHIFI (see IID-B) The LOU wave-guides are provided by the spacecraft.

5.3.1.2

Planck Instruments

The Planck instruments are treated in a slightly different way to the Herschel instrument units. The combined HFI and LFI Focal Plane Unit is mechanically mounted to the Planck telescope structure. Connected to the FPU via wave-guides and cooling lines are the ambient temperature elements of the instrument coolers and the LFI Backend Unit. There is a predefined maximum distance between the FPU and the HFI JFET box and Readout Electronics. All the above units, as they are strongly linked to the FPU, are treated in a dedicated way, different to «normal» warm boxes. Although they are physically mounted to the SVM they are logically considered part of the PPLM, i.e. they are discussed as «PPLM warm units». The «normal» electronic boxes are treated in a more general way as SVM units. The instruments shall be compatible with maximum instrument envelopes as defined in Table 5.3.1-2. Interface

Max. enveloppe

Remarks

FPU

See Radiometer allocated volume drawing in annex 7

HFI/LFI merged FPU*

Wave guides

See Radiometer allocated volume drawing in annex 7

Wave guide and harness support structure

See Wave guide and cables It includes the upper and lower supports allowed volume in annex 7 parts of the wave guide support structure

Wave guide thermal hardware

See Radiometer allocated volume drawing in annex 7

BEU

See Radiometer allocated volume drawing in annex 7

Jfet – Bellow - PAU

See Jfet and bellow IF drawing in annex 7

PPLM 0.1 K cooler piping

See 0.1 K cooler drawing in annex 7

PPLM 4 K cooler piping

See 4 K cooler drawing in annex 7

PPLM 18-20 K cooler piping

See 18-20 K sorption cooler drawing in annex 7

SVM Units

See annex 5

The wave guide thermal hardware** includes the thermal link and thermal screens implemented between the wave guide and the grooves 1, 2 and 3.

JFET on the back of the PR panel, PAU on Planck subplateform

Helium tanks accommodated and numbered as follows: 3He: +Z 4He #1 +Y 4He #2 -Z 4He #3 -Y

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-9/149

Table 5.3.1-2: Maximum allocated envelope for Planck instruments Note: * the mounting struts from the telescope structure to the FPU are included in the RAA allocated volume. They are part of the FPU and are delivered by the instrument. ** The wave guide thermal hardware allocated volume is included in the RAA one. It is part of the instrument and is delivered by the instrument.

5.3.2 Instrument alignment 5.3.2.1

Herschel Focal Plane Units

The alignment of the Herschel telescope to the Herschel Optical Bench reference is defined in the Herschel Alignment Concept (AD 7.1 , see Annex 1). The requirements for the FPU’s are included in the Herschel alignment concept (AD7-1), where references are required on the outer surface of the box. The positions of the focal plane units will be measured w.r.t. a reference point on the Herschel CVV during integration of the unit. Due to the use of dowel pins only a correction in x-direction will be possible using shimming plates (see annex 1). Instruments are requested to provide position of their optical reference (FPU alignment cube) wrt the reference FPU dowel pin (at room & cryo temperatures). After telescope integration the telescope reference will be measured to the same reference point on the CVV.

5.3.2.2

Local Oscillator Alignment

Alignment of the HIFI Focal Plane Unit with the local oscillator with the required precision will be performed through the two alignment windows in the Herschel cryostat. The positions for these two windows are adjacent to the first and last of the seven sub-millimetre LOU windows, in positions 0 and 8. Alignment devices mounted on the +Z and –Z faces of the LOU (HIFI provided Pentaprisms) and of the FPU (mirrors), will be used. If the mirrors on the LOU are partially transparent then the alignment can also be checked after integration by measurements along the Y-axis through the devices on the LOU and through the two alignment ports. For that measurement a special camera system to monitor the alignment of the two units will be used. It is planned to monitor the alignment of the LOU with the FPU at various stages of ground testing as described later in section 7.3. The camera system will consist of two camara heads mounted temporarily on the LOU baseplate. The FPU-LOU alignment requirements specified in the HIFI IID-B are assumed to be applicable for the in-orbit operation only. I. e. during on-ground tests (outside the TV chamber) the alignment may deviate from the inorbit alignment by about 5 mm due to thermal shrinkage of the CVV.

5.3.2.3

Planck Focal Plane Unit

The alignment between the FPU (LFI) and the telescope along Xrdp and Yrdp, at ambient will be obtained by design (without adjustment) with 2 bushes per foot and 2 calibrated pins on telescope side and 13 calibrated hole plus 1 extended hole one FPU side. The alignment between the FPU (LFI) and the telescope along Zrdp at operational temperature will be done through a shimming operation at ambient on the basis of the knowledge of the telescope and FPU actual focal surface position at operational temperature. The position of the Ordp at operational is defined in annex 7. Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-10/149

The actual average FPU focal surface is defined in §5.8 and in AD 7-2. The position of actual average FPU focal surface wrt the FPU/telescope mechanical interface at operational temperature will be provided by the instrument with accuracy as defined in the Planck alignment plan AD 7-2. The stability of the horn position and orientation (or of the actual FPU focal surface) wrt the FPU/telescope mechanical interface shall be as defined in AD 7-2 when the environment and interfaces instabilities defined in the chapter 9 are applied. The horns phase centres position along ZRDP at operationnal shall be known with the acuracy required in the Planck alignment Plan(AD 7-2).

5.4

EXTERNAL CONFIGURATION DRAWINGS

For each instrument unit, a configuration drawing is required to establish the mechanical interfaces with the spacecraft structure, harnesses and thermal hardware. These drawings shall contain the following information: −

Dimensions and associated tolerances (at ambient temperatures), including feet, internal connectors and their dedicated clearance

−

Focus position w.r.t. instrument coordinate system (dimensions and tolerances at operational temperatures)

−

Identification of a reference hole

−

Mounting hole pattern dimensions and hole patterns

−

Dimensions of mounting feet and contact area (base-plate and mounting feet)

−

Spot-faced area for seating of the mounting screw washers (if and where applicable)

−

Dimensions and location of dowel pins (where applicable)

−

Mass and associated tolerances (precise if estimated, calculated or weighted)

−

Location, naming, type and function of all connectors

−

Connector key shape orientation, the identification of connector contact «1», showing connector in front view and the connector center line

−

Information about connector fixation

−

Identification of bonding studs

−

Identification of non-flight items

−

Location of unit and connector identification labels

−

Details of instrument provided mounting hardware, thermal/electrical isolation provisions

−

Location and routing of any harness interconnecting modules of a «stacked» box configuration

−

Identification of free areas for harness fixation

−

Location of cold strap interfaces to Helium tank, level 1 and level 2 (Table 5.7.1-1)

−

Calculated Centre of Gravity location in instrument unit co-ordinate system and Moments of Inertia and its co-ordinate system if different from instrument unit co-ordinate system

−

Location of transport/storage purging connections (if applicable)

−

Material of housing and surface finish

−

Flatnes and roughness of contact area

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

−

Eigen-frequency if below 140 Hz (warm units only)

−

Base plate material and surface treatment

−

Surface coating (IR Emissivity and Solar absorptance if external location)

−

Specific heat (J/Kg/K) (calculated or measured)

−

Design and location of handling points

−

Location dimensions of bonding stub (see §5.10.4 for specifications)

PAGE : 5-11/149

Drawings shall clearly specify the unit they represent and the responsible design authority; they shall be subject to a properly controlled numbering and revision updating system. Each revision of a drawing shall be accompanied by a list detailing all changes that have been incorporated since the previous revision on the drawing itself. 2D Drawings shall be submitted to the Project as computer readable and editable files, preferably in a vectorial file format ( .hgl, .drw or .cgm (compatible MS word) , or pdf avoid definition loss) together with one hard copy of each file. CAD drawings shall be submitted to the project according to RD86 (CAD Data Exchange rules) The Metric Standard (SI-SYSTEM INTERNATIONAL) shall be used for design and manufacturing of all instruments. For components and equipment, the dimensions shall be given in millimetres and the angles in degrees.

5.5

SIZES AND MASS PROPERTIES

5.5.1 Mass tolerances −

Cryogenic Qualification Model (CQM): The mass of each of the CQM units shall be within 1% or 100 grams (whichever is less) for unit weighing less than 20 kg and within 0.5% for unit weighing more than 20 kg of the estimated mass for that unit. On no account shall the instrument unit mass exceed the Project agreed maximum for that unit, current at the time of delivery to the Project.

−

Proto-Flight Model (PFM): The mass of each of the PFM units shall be within 1% or 100 grams (whichever is less) for unit weighing less than 20 kg and within 0.5% for unit weighing more than 20 kg of the estimated mass for that unit. On no account shall the instrument unit mass exceed the Project agreed maximum for that unit, current at the time of delivery to the Project.

−

Flight Spare (FS): In order to ensure free interchangeability of PFM and FS units the mass of each of the FS units shall be within 1% or 100 grams (whichever is less) for unit weighing less than 20 kg and within 0.5% for unit weighing more than 20 kg of the mass measured for the equivalent PFM units.

5.5.2 Centre of Gravity Location and Tolerances In interpreting the figures below, the Centre of Gravity (CoG) should be taken not to include any external harness or connectors other than those hard-mounted on the unit. −

Cryogenic Qualification Model (CQM): The CoG of each unit shall be within a sphere of 1.0 mm radius around the best estimated location given in the unit’s external configuration drawing and Interface Data Sheet, current at the time of delivery to the Project. Following delivery of the CQM units to the Project, the external configuration drawings of the unit shall be updated to show the actual CoG location based on QM experience.

−

Proto-Flight Model (PFM): The CoG of each unit shall be within a sphere of 1.0 mm radius around the best estimated location given in the unit’s external configuration drawing and Interface Data Sheet,

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-12/149

current at the time of delivery to the Project. These shall be the drawings updated from CQM experience. −

Flight Spare (FS): In order to allow free interchangeability of PFM, or CQM, and FS units, the CoG of the FS shall be within a sphere of 1.0 mm radius around the CoG measured for the other models.

The centre of mass location shall be measured with an accuracy of +/- 0.5 mm.

5.5.3 Moments of Inertia and Tolerances Nominal Moments of Inertia (MoI) of each unit are to be provided in the IID’s part B (AD 1-1 to 1-6) The MoI of all instrument models must not deviate from the nominal value by more than 10 %. Calculated values may be supplied for units for which the MoI is lower than 0.1 kg m2. The MoI must be measured to an accuracy of ±5 %. The maximum inertia for the LOU radiator shall be: Iy 30 mm. The distance of each attachment hole centre w.r.t. the Reference Hole, shall be within a 0.2 mm diameter circle centred on the theoretical position. The attachment points and the clearance for mounting shall be dimensioned as shown in Figure 5.6.3-1. No part of the box shall be in the volume above the attachment points indicated as «free access required». The contact area shall be specified in the configuration drawing for each attachment point. The attachment point edge shall be rounded-off to a minimum radius of 0.2 mm to avoid structural damage. The co-planarity of the attachment points shall be within 0.1 mm/100 mm. Each box on the SVM shall have an eigen-frequency of > 140 Hz.

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-33/149

Figure 5.6.3-1: Definition of attachment points of SVM mounted units and dimensioning requirements

5.6.3.3

Herschel SVM Warm Units configuration

This paragraph describes the mechanical interfaces of the HPLM warm units set in the Herschel SVM. More detailed drawings and position of inserts can be found in annex 5.

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

HIFI Vertical Polarization

PAGE : 5-34/149

HIFI Horizontal Polarization

SPIRE

Reaction Weels panel

PACS

Power, ACC,

Skin

+Z Panel RF panel

Figure 5.6.3-2: Herschel SVM and HPLM warm units The following units are to be considered.

5.6.3.3.1

HIFI warm units

HIFI warm units are accommodated on two lateral radiative panels (-Y and –Y-Z panels); the assumptions made are: −

the 3db coupler has been recently updated to IF up-loaders

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-35/149

−

All Horizontal polarisation units on the -Y panel

−

All Vertical polarisation units on the –Y/-Z panel

−

A Connector Bracket to support the semi-rigid cables which link the HRH to the HRV has been defined on both panels (bottom); the allocated area/volume on the Upper PLT for the cable jumpers has also been defined.

−

LSU: The LSU ICD proposed by Alcatel (covering envelope volume, footprint, and position of connectors (including wave-guides) is applicable both for HIFI and the satellite (see annex 9, drawing ME.HES.114F.S.002SA). A bracket supports the wave-guides flanges at the interface (distant of about 10cm from the LSU). Flexible bridging wave-guides Interface to LSU unit are to be delivered by HIFI.

Figure 5.6.3-3: HIFI SVM Units layout: Upper: -Y-Z panel HIFI Vertical polarisation units Lower: -Y panel, HIFI Horizontal polarisation units

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 17:17

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

5.6.3.3.2

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-36/149

SPIRE Warm units

SPIRE warm units are accommodated on .-Z. panel with the CCU unit.The two Star Trackers and one LGA are accommodated on the outside of the panel.

Figure 5.6.3-4: SPIRE SVM Units layout

5.6.3.3.3

PACS Warm units

PACS warm units are accommodated on .+Y -Z. lateral radiative panel. The accommodation is based on the following: −

DECMEC ICD is the ASP one, as no PACS DECMEC ICD was available on time. Refer to annex 9 drawing ref ME.HES.114P.S.001SA aimed to freeze the minimum boundary conditions: volume, footprint and connector location. This ICD is applicable both to PACS and to the satellite.

−

SPUs are stacked, as a single box with nominal and redundant units inside and one single thermal I/F to the SVM panel..

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 17:17

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-37/149

Figure 5.6.3-5: PACS SVM Units layout

5.6.3.4

Planck SVM Warm Units configuration

This paragraph describes the mechanical interfaces of the PPLM warm units set in the Planck SVM. More detailed drawings can be found in annex 5.

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-38/149

Upper Plateform (LFI BEU, DAE Pwr Box, HFI PAU SCC panels

SCC N

RF panel

SCE

Power, ACC, CDMU

SCC R 4K CCR on shear web

Skin

HFI DPU’s HFI (4K panel + REU)

HFI DDCU & & LFI REBA Figure 5.6.3-6: SVM and PPLM warm units

The following units are to be considered:

5.6.3.4.1

Sorption coolers Compressors

The sorption cooler compressor assemblies are two cold redundant, sets of units that exhibit mechanical interfaces to the main Planck spacecraft radiators located on +Y-Z and –Y-Z side of the SVM. The mechanical mounting requirements are defined here after, whereas specific thermal mounting requirements are defined in Figure 5.6.3-7 to guarantee good units power dissipation towards space.

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-39/149

SCE (nom)

vertical Heat pipes

SCC (nom)

SCC (Red)

vertical Heat pipes cut-out for TT&C Wave Guides SCE (red)

UP thr’s cut-out

UP thr’s cut-out horizontal Heat Pipes (long type)

horizontal Heat Pipes (short type)

Figure 5.6.3-7: Mounting for Sorption Coolers compressors and Electronics on heat pipes (harness not shown)

5.6.3.4.1.1

Compressor description

Compressors are understood to be a set of individual sorption beds, Low and high pressure stabilization beds, valves, pressure transducers,…, attached together by a network of pipes, and also connected to the low temperature pipes, heat exchangers, liquid reservoirs, and harnesses. A Handling frame is used to transport and integrate on the spacecraft. The Compressors elements are individually connected to the radiator. All the HW mounted on the panels will be covered by MLI after being attached to the Radiator.

5.6.3.4.1.2

Location / Orientation

On lateral radiator panels, located on faces +Y-Z and -Y-Z −

FM1 SCC (Nominal) is on SVM panel -Y -Z

−

FM2 SCC (redundant) is on SVM panel +Y-Z

−

FM1& FM2 SCE are on SVM panel-Z (FM1 on top)

The Philosophy for location is the following: The FM2 (redundant) compressor, pipes and heat exchangers are located on the same side as dilution & 4 K Cooler heat exchangers on 60K V-Groove shield. This is proposed because the proximity of these heat exchangers will slightly increase the temperature of the Sorption Cooler 60K interface, and this reducing the performances of this redundant unit. The FM1 should have slightly better performances.

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

5.6.3.4.1.3

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-40/149

Mechanical fixation

Compressor delivered with handling frame, aimed to manipulate the compressor as a unit (together with pipes) and compatible with positioning the compressor on the radiator. Each compressor fixed independently on the radiator. Probably similar for other components. Base-plate required for other components.

5.6.3.4.1.4

Screws

Currently 257 screws M4 per compressor (including 2x15 Screws per Sorption bed, distance 25mm). Screws are provided by Alenia. Torque/tension in bolt are defined by JPL (AD1-5 Sorption cooler ICD annexed to LFI IID-B)

5.6.3.4.1.5

Interface drawings

The Sorption Cooler Compressors and Electronics are mounted to the SVM panels over the Heat Pipes network The following interface drawing is extracted from annex 9, drawing ME.PLS.A11F.S.001SA.

Figure 5.6.3-8: Sorption cooler Radiator +Y-Z with Heat pipes network (ICD in annex 9 and 5)

5.6.3.4.1.5.1 Sorption cooler fixation on SVM panel The attachment solution proposed by Alenia (aiming to reduce the number of I/F points and to de-couple the I/Fs to the SCC) is as follows: −

the horizontal heat pipes will be directly fixed to the SVM panels, by making use of a limited number of inserts by and leaving a number of through inserts free (fig 5.3.6-9 a), b))

−

then the vertical heat pipes and the spacer panels will be mounted onto the SCC (fig 5.3.6-9 c))

−

finally the SCC plus heat pipes and spacers assembly, will be connected to the SVM panels by means of screws mounted from the external side through the through inserts. (fig 5.3.6-9 d))

The current baseline is based on stilts to connect structurally the sorption cooler to the panel through the heat pipe network, a 1mm baseplate between the compressor and the HP network to help on the lateral stiffness and to meet the imposed gap between SCC panel and SCC equipment. Panel external ribs are implemented to guarantee the maximum stress on the SCC pipes. Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-41/149

a)

b)

c)

d)

Figure 5.6.3-9: Sorption cooler fixation scheme. upper: Fixation of long (a) & short (b) longitudinal heat pipes on the SVM panels. c): fixation of crossing heat pipes andt stilts on compressor assembly d): Assembly of compressor on panel (panel not shown for clarity, only longitudinal heat pipes)

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-42/149

SVM lateral panel

anchor-nut (riveted on horizontal heat pipe wing)

horizontal Heat pipe

vertical Heat pipe

M4 screw

through insert

SVM lateral panel

M5 stilt

SCC

Figure 5.6.3-10: Sorption cooler Attachment scheme on the heat pipe network cut throug longitudinal & crossing heat pipes The SCC beds are connected to the vertical heat pipe network via a large number of connections. The SCC plus heat pipes and spacers assembly is attached to the panel (on top of the horizontal heat pipes network). Both SCC and SCE shall provide threaded holes M4 with a minimum depth of 9 mm. During the integration phase, the mechanical compatibility between −

the Sorption Cooler Compressors / Electronics

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

−

the Heat Pipes network

−

the SVM -Y-Z/-Z/+Y-Z panels

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-43/149

is granted by the tolerances chain. In order to prevent any integration risk, the through holes on the heat pipes will be drilled/milled with sufficiently loose tolerances (φTBD) and/or will be slotted. The same shall apply for the through inserts on the SVM panels (φTBD tolerance). On the other hand, the SCC/SCE mounting holes pattern will need to be drilled to comply with a 0.2 mm tolerance - as a minimum.

5.6.3.4.1.6

Assumed dimensions for Compressor

−

Individual sorption bed element base-plate footprint: 374.6 mm * 50.8 mm

−

Individual sorption bed element base-plate flatness: < 0.05 mm over 100 mm

−

interface global flatness : < 0.1 mm / 100 mm

−

interface roughness: < 3.2 µm (this is what we expect on both side of the network.

−

distance between fixation holes in the sorption bed length direction : 25 mm

−

distance between fixation holes perpendicular to the bed length direction : 41 mm

Compatibility of dissipative element base-plate material with thermal filler DC 93500 (Dow Corning) and Grafoil

5.6.3.4.1.7 −

Validation of the mechanical design

Due to the fact that the sorption cooler compressor is far from a rigid box, the mechanical design verification is based on a coupled analysis. The verification is based on a maximum stress (110MPa) on some mutually agreed points in the SCC finite element model (defined in the SCC ICD, annex to AD1-5). The current design is compliant with these stresses.

5.6.3.4.2

Sorption cooler electronics

The SCE units are two identical boxes, located on the -Z panel of the SVM, adjacent to the sorption cooler compressor assemblies to minimise the lengths of interconnecting cables. The SCE have no special thermal interface requirements. The SCE units are set on the SVM keeping a sufficient clearance with regard to the nearby Helium tank, drawing is given in Figure 5.6.3-7. The mechanical fixation will follow the same rules as SVM units. The fixation hardware will be provided by the spacecraft. Refer to §5.6.3.4.1 for details about SCE accommodation and interfaces on SCC radiators, and to annex 5 for ICD.

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-44/149

Figure 5.6.3-11: SCE interface

5.6.3.4.3

HFI 4K cooler and REU

The 4 K cooler is a set of units that exhibit standard mechanical interfaces to the spacecraft. The 4K warm units are mounted on the spacecraft radiator +Y, together with the HFI REU, and a shear web. Mounting rules as for SVM units apply. The pipes from/to the 4K cooler compressors and 4K CAU are routed in the SVM along the panels and cone, up to a connector bracket located on the upper platform, allowing to mate it with the 4K pipes located on the PPLM. The spacecraft defines the routing of the lines. The lines and thermalisation devices (heat exchangers) are provided by the instrument. The fixation screws are provided by the spacecraft, as described in table 5.6.2-2. The following Figure 5.6.3-12 show the 4K panel with 4CCU, 4CAU, 4KCDE and the 4K Current PreRegulator. 4CCU (compressor) to 4CAU (Ancillary unit) connection pipes are defined by the Instrument, while other pipes/harness routing is defined by ALS on the basis of the information provided by ASP. Access to the connector used to lock the compressor during transportation has been taken into account Access to pump-out port of the 4K cooler CAU is possible as long as upper closure panel is not integrated A recent change in the SVM configuration, necessary to balance the Planck spacecraft (for inertia ratio and spin stability) required the displacement of the REU on the 4K panel. The 4K current regulator is on a the shear web. Thermal and EMC impacts have been evaluated.

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-45/149

The contact area on the panel of Thermal strap of the 4K compressor has been increased to reduce the compressor temperature. A mu metal magnetic shield (provided by ASP) has to be implemented around the 4K compressor near the REU (TBC).

Figure 5.6.3-12: Interface drawing for the 4K Cooler units on the SVM panel.

5.6.3.4.4

Dilution cooler

The dilution cooler consists of the 3He and 4He tanks, the necessary valves and pipes. The tanks are mounted to the spacecraft via balls bearing (ref ICD in annex 5). The spacecraft defines the position of the tanks. The pipes routing on the SVM is given in annex 9. The spacecraft defines the routing of the lines. The lines and thermalisation devices (heat exchangers) are provided by the instrument. The fixation hardware is provided by the spacecraft (ref table 5.6.2-2). The spacecraft will not provide any further mechanical interface/fixation to the dilution cooler. The DCCU is connected to the PLM by means of 5 pipes and to the He-Tanks by means of 4 pipes. Accessibility to a number of valves/connectors must be guaranteed at all times (also with the upper closure PLT closed) An exhaust pipe will be mounted to the DCCU base-plate, through a dedicated cut-out on the +Y/+Z panel (near the centre of the panel, see annex 9, drawing PLS.140.010SA, Planck 0.1K accommodation & access)

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-46/149

Figure 5.6.3-13: Interface drawing for Dilution units on SVM 0.1K Dilution panel (view from inside SVM) Also shown the LFI REBA.

5.6.3.4.5

LFI REBA

The LFI REBAs are set inside the SVM on the «+Y +Z» panel with DCCU. (see Figure 5.6.3-13 above) The mechanical fixation will follow the rules as for SVM units and no special thermal interface requirements are considered on the SVM platform. The fixation hardware will be provided by the spacecraft.

5.6.3.4.6

HFI DPU

On this +Z panel there are the two Star Trackers and two DPU (nom + red); the 2 DPU's are located as in Figure 5.6.3-14. For the mechanical fixation will follow the rules as for SVM units and no special thermal interface requirements are considered on the SVM platform. The fixation hardware will be provided by the spacecraft (as per table 5.6.2-2).

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-47/149

Figure 5.6.3-14:HFI panel: Location of DPU (seen from inside SVM)

5.6.3.4.7

DAE Power Box

The DAE Power Box is accommodated below the sub-platform on .+Z -X. side. The DAE Power Box is connected to the BEU which is located on top of the sub-platform,-Z+X. side. For the mechanical fixation will follow the rules as for SVM units and no special thermal interface requirements are considered on the SVM platform. The fixation hardware will be provided by the spacecraft (as per table 5.6.2-2).

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-48/149

Figure 5.6.3-15: View P/M sub Platform with LFI DAE Control Box (see appendix 6 for more details)

5.6.3.4.8

REU and PAU

The PAU and REU are connected by WIH, and the length of their harness will not exceed 5000 mm.

5.6.3.5

Planck cooler pipes on the SVM.

The Planck cooler pipes are routed on the SVM between the cooler warm unit to a dedicated connector bracket located on the upper platform (except for the soption cooler). −

Sorption cooler pipes (nominal & redundant) between SCC and FPU.

−

4K cooler pipes between 4K ancillary panel and the connector bracket.

−

0.1K cooler pipes between the DCCU and the connector bracket.

Routing of the pipes on the SVM has been made by Alcatel. Detailed ICD's of the pipes routing on the SVM can be found in Annex 9 The spacecraft will provide the inserts for the fixation of the pipes on the panels. The following table give the responsibility sharing for pipes routing and fixation hardware

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

Approval Preliminar of prelim. y Definition Def.

ITEM Routing on SVM (pipes routing, length, attachment pitch & support definition). Routing on PPLM (pipes routing, length, attachment pitch & support definition). Planck Fixation of pipes: Attachment Instrument part on SVM (inserts, paint coolers pipes on free areas) the SVM Fixation of pipes: Attachment part on PPLM (inserts, paint free areas) Fixation of pipes: Attachment part on the pipe and support Pipes hardware

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

Approval Detailed before Procureme Integration Integration Herschel Planck definition procureme nt nt

ALS

ASPI / Instrum

Instrum

ASPI

Instrum

ASPI

ALS

ASPI / Instrum

ALS

ASPI

Instrum

ASPI

ASPI/Instru m ASPI

Instrum Instrum.

PAGE : 5-49/149

ASPI

ASPI / Instrum

Pipes :Instrum

ASPI

Pipes : Instrum

ASPI

ALS

ALS

Instrum

ASPI

Instrum

N/A

Instrum

ASPI

Instrum

N/A

Instrum.

ASPI

Table 5.6.2-1: Planck instruments pipes fixations responsibilities

5.6.3.6

Fixation hardware for warm units on the SVM

The following table gives the responsibility sharing for the definition and procurement of the fixation hardware of warm units on the SVM Approval Preliminar of prelim. y Definition Def.

ITEM Bonding stud (M4*6) Washer, nut & max torke value on bonding stud (warm unit side)

Warm unit external Interfaces (fixation & grounding)

Instrum.

ALS / ASPI

Instrum

ALS / ASPI

Approval Detailed before Procureme Integration Integration definition procureme nt Herschel Planck nt Instrum. ALS / ASPI Instrum. N/A N/A Instrum.

ALS/ASPI

Instrum.

Bonding strap and fixation on SVM (insert + screw) for WU grounding.

ALS

N/A

ALS

N/A

ALS

WU fixation screws and inserts on SVM, paint-free areas.

ALS

ASPI

ALS

ASPI

ALS

Paint, surface treatment of WU, paint-free areas.

Instrum.

ALS / ASPI

Instrum.

ALS / ASPI

Instrum.

ALS

Instrum

ALS / Instrum. for paint-free areas

ALS

ALS

Paint-free areas for MLI attachment points on WU Paint-free areas for MLI attachment points on SVM MLI (including attachment points)

ALS

Instrum

ASED

ASPI

ALS for ALS for SVM SVM inserts, inserts, ASED for ASPI for WU WU bonding bonding strap. strap. ASED, for ASPI, for fixation fixation screws. screws. N/A

N/A

ASED for ASPI for MLI MLI attachment attachment points. points.

ASPI/Instru m

Instrum

ALS

N/A

ALS

ALS

ALS

ALS

ASPI/Instru m

ALS

ASED

ASPI

Table 5.6.2-2: Warm units fixations and grounding responsibilities

5.7

THERMAL INTERFACES

5.7.1 Thermal interfaces on Herschel Payload Module Refer to RD 81 for detailed development of HPLM thermal analyses, coupled analyses with instruments thermal models, and performances of the thermal interfaces with instruments. Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-50/149

The resources provided by the cryostat and the details of the interfaces are defined below for the different thermal interfaces to the instruments: −

PACS, SPIRE & HIFI Focal Plane Units and SPIRE FFETs boxes on Optical Bench of Herschel cryostat

−

HIFI Local Oscillator Unit to cryostat vacuum vessel

−

All Herschel instruments thermal mathematical models are annexed to the instruments IID-B's, including typical transient dissipation timelines. These are the base of the coupled thermal analysis Instruments + Cryostat performed at H-PLM level. The assumption and results are presented in the HPLM Thermal model and Analysis, ref RD81.

5.7.1.1

Focal Plane Units

The focal plane units of the Herschel instruments are mechanically mounted to the Herschel optical bench and shall exhibit as far as possible standardised thermal interfaces. Four different thermal interface levels between the Herschel cryogenic system and the instruments FPU are proposed: Thermal Interface

Typical temperature

Level 0

1.8 to 2K

Thermal interface to the He II tank : Sorption coolers pump & evaporator, PACS red & blue photodetectors, SPIRE detector enclosure, HIFI mixers

5. to 6.5 K

First thermal interface to the He II vent-lines: PACS and SPIRE FPU enclosure, HIFI mixers (4K box)

10 to 20K

Level 2 vent line is bolted to the Optical Bench on which is connected HIFI FPU. PACS & SPIRE FPU's are insulated from OBA by means of carbon fibre compound feet.

15 to 20 K

Level 3 added for SPIRE JFET boxes (P&S), now thermally insulated from OBA, to allow a reduction of the temperature of the Optical Bench

Level 1

Description

Level 2

Level 3

Table 5.7.1-1: Definition of thermal interface levels The thermal interface requirements are expressed at these interfaces are expressed by instruments in the IIDB's. The following table sumarizes the temperature requirements applicable to these interfaces during the mission.

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

SPIRE FPU thermal I/F

level

L0

thermal interface

L3

Min °C

Max °C

Nonoperating Min. K

Bakeout Stab Estimated max operating T (72h max) ility

Max. °C

°C

K/s

K

uncertai nty (K)

1.71 K @ 1 mW

Operating

60

80

1.74

0.06

Operating

60

80

1.69

0.06

10 K @ 500 mW peak

10 K @ 500 mW peak

Recycling

60

80

9.77

0.06

Cooler Evaporator

1.85 K @ 15 mW

1.75 K @ 15 mW

Recycling

60

80

1.7

0.06

5.5 K @ 15 mW

3.7 K @ 13 mW

Operating

60

80

4.22

0.18

Optical bench / FPU legs

12 K @ no load

8 K @ no load

Operating

80

10.6

0.5

HSJFP (JFET Photometer)

15 K @ 50 mW

15 K @ 50 mW

-

80

15.1

0.5

? HSJFS (JFET Spectrometer)

15 K @ 25 mW

15 K @ 25 mW

-

80

13.7

0.5

Temp @ Heat Load Requirement in Operating Comments conditions

FPFPU Red Detector

1.75 K @ 0.8 mW

FPFPU Blue Detector

2 K @ 2 mW

Cooler Pump

10 K @ 500 mW peak 5 K @ 2 mW

Cooler Evaporator

1.85 K @ 15 mW (*)

FPFPU Photometer

5 K @ 10 mW (**)

FPFPU Spectrometer

5 K @ 10 mW (**)

FPFPU Collimator (1)

5 K @ 10 mW (**)

HOB

12 K @ no load

HIFI thermal I/F

Max Mixers of FHFPU (Level 0) Parts of FHFPU ** (Level 1) FHFPU (Level 2)

Min

SwitchBakeou Stability Non-operating off t (72h Min. Max. Min °C Max °C °C K/S K °C

Start-up

(i) Min temperature for all L0 I/F Peak during pump cooling 1.6 K (i) Low temp.operation (*) During 200s at end of condensation (**) : Assuming 12 K at L2 (the sum of 30 mW may be distributed as appropriate)" : Min temperature for all L1 I/F

2K

NA

Temp @ Heat Load Requirement in Operating Comments conditions

level thermal interface

L2

Cooler State

PAGE : 5-51/149

2 K @ 2 mW

L0

L1

3.3

2 K @ 4 mW

Max

L0

ISSUE :

2 K @ 2 mW

PACS thermal I/F

L2

30/06/2004

Cooler Pump

level thermal interface

L1

DATE :

Detector Box

L1 L2

Goal

SCI-PT-IIDA-04624

Start- Switc up h-off

Temp @ Heat Load

Requirement

REFERENCE :

Min (K)

Estimated max operating T uncertaint K y (K)

60

85

1.68

0.06

60

85

1.73

0.06

60

85

12

0.06

60

85

1.73

0.06

60

85

1.796

0.06

60

85

3.55

0.18

60

85

4.24

0.18

60

85

4.43

0.18

60

85

10.9

0.5

Start- Swit Bakeout Non-operating up ch-off (72h max) Min Max Min. Max. °C °C °C K °C

Stability Max K / 100s

Estimated max operating T uncertai K nty (K)

0

NA

40

0

60

80

0.006

1.96

0.06

0

NA

40

0

60

80

0.006

5.37

0.18

0

NA

40

0

60

80

0.015

12.4

0.5

20K@22mW

[email protected] [email protected]

Table 5.7.1-2: Herschel Instrument FPU thermal requirements together with estimated worst case temperature at interface (from RD81) In case electrical insulation of the thermal connection from the structure is required, this shall be implemented as part of the Instrument.

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-52/149

Figure 5.7.1-1: Herschel Level 0 and Level 1, 2, 3 thermal interfaces: Top Level 0: Most interface are external pods, except PACS & SPIRE cooler evaporator where an open pod is implemented Bottom: Level 1 (upper loop), Level 2 (attached to OBA), level 3 (SPIRE JFET). ref annex 6 for details

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

5.7.1.1.1

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-53/149

Mounting interface of the focal plane unit to the optical bench

The optical bench will be thermally linked to level 2. The primary thermal links of the instruments are at Level 0 and Level 1 and will be implemented by means of thermal straps . HIFI FPU has conductive feet to get good thermal contact between FPU and OBA. PACS and SPIRE FPU's are thermal insulated from the optical bench by means of instrument provided carbon fibre feets, in order to get an FPUinsulated from OBA, at a temperature close to the one of level 1.

5.7.1.1.2

Interface to He tank: Level 0

The requirement of this temperature to be below the maximum temperature given in Table 5.7.1-1 is valid for instrument dissipation as given in paragraph 5.9.1. The interface of the instrument to the level 0 is a direct interface with a thermal link to the Helium II tank of the cryostat. The thermal contact at Instrument Thermal interface is included in the industry part of the strap (see note at end of section 5.7.4.1.1.4). The details of the level 1 interfaces are described in annex 6 (HPLM drawings), HP-2-ASED-ID-0042 (Optical Bench assembly IF drawings, sheet 7).

Figure 5.7.1-2 - level 0 thermal interfaces (ref annex 6)

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

5.7.1.1.3

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-54/149

Interface to Vent Line: Levels 1, 2, & 3

HIFI

[830]

[939]

514

520

522

523

524

525

527

528

529

530

532

533

534

535

536

538 539

540

542 543

544

545

SPIRE

[800]

541

SPIRE

[783]

537

PACS Spectrometer

[782]

531

5012

PACS Collimator

[781]

526

512 513

PACS Photometer

521

510 511

5010

The levels 1, 2, 3 are provided via thermal straps between the instruments and the vent line (mass flow rate 2.1mg/s) The sequence of connection of the instruments interfaces to the vent line are as follows: Level 1: PACS photometer --> PACS colimator --> PACS Spectrometer --> SPIRE Photometer --> SPIRE Spectrometer level -->HIFI level 1 --> --> Level 2 : Optical Bench & instrument shield--> --> Level 3: SPIRE SM JFET --> SPIRE PM JFET This is illustrated by the following figure 5.7.1-2.

550

546

Optical Bench Plate(L2)

551

5050

5046

5045

5044

5043

5042

5041

5040

5039

5038

5037

5036

5035

5034

5033

5032

5031

5030

5029

5028

5027

5026

5025

5024

5023

5022

5021

5020

5014

5013

5000

5011

HTT

5051 [371-381]

586

584 583

582

580

SM JFET

PM JFET

[832]

[831]

571

570

563

562

561

560

552

5053

5054

5060

5061

5062

5063

5070

5071

5080

5081

5082

5083

5084

5085

5086 590

581

591

585

592

5090

5091

5092

5052

554

553

[Instrument / Optical Bench Node] Ventline Wall Node Gaseous Helium Node

Figure 5.7.1-3 -Sequence of connection of instruments levels 1, 2, and 3 on Vent line Level 1 thermal interface are shown on the following figure, details in annex 6

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-55/149

Figure 5.7.1-4-1 -level 1 thermal straps (ref annex 6, )

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-56/149

Figure 5.7.1-4-2 -level 3 thermal straps (ref annex 6, )

5.7.1.1.4

Thermal contact at Herschel instruments FPU thermal interfaces

For the Herschel FPU's, it has been agreed that the thermal interfaces conductance between the Herschel spacecraft, and the thermal interfaces (for levels 0, 1, 2, and 3) shall include the thermal contact (on the industry side). In order to guarantee that the conductance of the contact, on various models are similar to the tests, the contact area shall respects some constrains, given in the list below: −

Surface roughness < 0.4 micron

−

Surface Flatness < 0.05 mm (over the strap contact area).

−

Gold coating > 10 microns on both sides of the Interface

−

Mounting / dismounting at least 6 times (for System level integration and tests)

−

In case electrical insulation is needed at the thermal interface, the contact conductance becomes the responsibility of the instrument.

5.7.1.1.5

Radiative Environment tof the FPU's

The radiative environment temperature of the focal plane units is defined by the temperature of the surrounding instrument shield (maximum 2 K above the optical bench temperature and emissivity of 0.05), the optical channel from the telescope to the instruments and the optical channels from the LOU windows to the HIFI FPU. These optical channels will be designed to fulfil the straylight requirements, but no thermal load Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-57/149

requirements are placed on their design except that the above temperature levels are fulfilled including the thermal load from these interfaces.

5.7.1.2

SPIRE JFET boxes

The SPIRE JFET boxes are insulated (thermal & Electrical) from the Optical Bench (via SPIRE provided supports), and connected to the Vent Line Level 3 via Thermal straps (provided by Astrium). To achieve a good enough thermal isolation (and reduce the Optical Bench temperature), the thermal conductance between the JFET box and the Optical Bench shall be below 0.005W/K (goal 0.002W/K).

5.7.1.3

Local Oscillator Unit

HIFI is responsible of the LOU thermal control (design of the radiator, temperature monitoring, and heaters control). However, the thermal environment of the LOU is also driven by the spacecraft temperature map, deep space heat sink, and the parasitics heat loads from the LOU cryo-harness and the LOU wave-guides. The temperatures are shown on figure 5.7.1-5. Detail temperature maps and Harness cross sections are given in RD 81. The LOU radiator is fixed on the "LOU support Plate" (which is then part of the Thermal path). The thermal conductance through the LOU support Plate (between HIFI LOU baseplate interface and radiator interface) is 2 W/K at operating temperature. The Envelope Volume for the LOU radiator is defined in figure 5.6.1-3. The "LOU support Plate" is thermally isolated from the colder CVV by means of the glass fibre struts.

5.7.1.4

PACS Bolometer Amplifier Unit

Removed

5.7.1.5

HIFI LOU Wave-guides

NA

5.7.1.6

Expected temperature environment in Herschel PLM

The following figures give the temperature environment expected in the Herschel PLM (from RD 84): Cryostat external surfaces (applicable for the LOU) (fig 5.7.1-5) and cryostat internal thermal environment and heat flows for nominal life-time conditions (fig 5.7.1-6)

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-58/149

192K

196K

182K

182K

88K 191K CVV Upper Bulk MLI 84K-137K

202K 267K

+Y Radiator 68K

LOU Support Plate 136K LOU Radiator 120K – 130K

-Z Radiator 68 K

CVV Main Radiator 70K

SVM Thermal Shield MLI 95K-119K

255K 269K -Y Radiator 69K

SVM Thermal Shield 132K-138K

SVM 293K

SVM Top MLI 230K

Figure 5.7.1-5 Typical Temperatures of the Herschel-PLM external surfaces during steady state hot case in L2 (ref RD81)

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-59/149 2.13 mg/s

Beam Entr.

CVV 70 K 127

MLI

0.3*

49

55

69

3

107

10.1

168

Thermal Shield 1 35K

5.4

0.5

122

1.1

63

0.1

221 Harness

0.4

Thermal Shield 2 45K 39

1.9

4.3

12

16.2

0.1

14

2.7

up Susp.

13

L0 links

12 lo SFW 19K

up SFW 11K

0.2*

0.4

lo Susp.

11 Fill. tubes

13.3

128

0.9

HTT MLI (up) 4 K

1.7

248

62.6

6.2

0.5

TSS

Harness

Optical Bench & Instr. Shield 11 K

31 0

Fill. Tubes 15.7

TSS

0.50 Thermal Shield 3 W 56 K

24

9

208

1.6

HOT MLI 23K

1.8 HOT 20K

0.1

2.2 0.7

HTT MLI 5K

GHe Ventline

LO Wd. 70 K

0.1* 9.7

4.8

0.2

13.5

2.8

17.6

He II Tank (HTT) 1.65 K

Figure 5.7.1-6 HPLM typical internal temperatures and Heat Flow Chart for Average Instrument Dissipation (as specified here) and Hot Case Environment at L2 (ref RD81)

5.7.2 Thermal interfaces on Planck Payload Module Refere to RD 78 for detailed development of PPLM thermal analyses, coupled analyses with instruments, and performances of the thermal interfaces with instruments. The resources provided by the Planck Payload Module and the details of the interfaces are defined below for the various thermal interfaces to the instruments: −

Focal Plane Unit to PR panel

−

HFI JFET to PR panel

−

Sorption Cooler to spacecraft radiator (see SVM)

−

4 K Cooler interfaces to spacecraft radiator (See SVM)

−

Dilution Cooler He bottle interfaces to spacecraft (see SVM)

−

Sorption cooler pipes to V-groove shields

−

4 K cooler pipes to V-groove shields

−

Dilution Cooler pipes to V-groove shields

−

Wave-guides and cryoharness to V-groove shields

An overview of the thermal design and interfaces is given in Figure 5.7.2-1, and the thermal interface requirements are given in table 5.7.2-1 to 5.7.2-3.

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

Sorption Cooler

4K Cooler

2 redundant units µ

µ µ

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

Dilution cooler 4He tank

µ 485K 80b

REFERENCE :

3He tank

280K 0.4b

Radiator µ

PAGE : 5-60/149

SVM (room Temperature) V-Groove Shields

µ

µ

µ

µ

µ

1.

50K Radiator

20K stage

µ 2

4K Stage 1.6K Stage

LFI

HFI

0.1K Stage

Cold Payload

Figure 5.7.2-1: Planck PLM Thermal Interfaces Schematic

Operating mode

Location at which the required temperature must be guaranteed

Min T (K)

Max T (K)

VG1

N/A

170

VG2

N/A

120

VG3

N/A

60

VG1

150

170

VG2

100

120

VG3

45

60

JFET box

40

60

on PR panel side

LFI FPU

40

65

on PR panel side

Primary Reflector

30

50

average PR temperature

Secondary Reflector

30

50

average SR temperature

LFI WG

Sorption Cooler

on interface shield side

at exchangers and on exchangers side (at exchanger 3C on shield 3)

Table 5.7.2-1: Planck PLM Operating temperatures Interfaces requirements

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

Non operating mode

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-61/149

Location at which the required temperature must be guaranteed

Min T (K)

Max T (K)

VG1

N/A

N/A

VG2

N/A

N/A

VG3

N/A

N/A

VG1

150

323

VG2

100

323

VG3

40

323

JFET box

30

333

on PR panel side

LFI FPU

N/A

323

on PR panel side

Primary Reflector

30

323

average PR temperature

Secondary Reflector

30

323

average SR temperature

LFI WG

Sorption Cooler

on interface shield side

at exchangers and on exchangers side

Table 5.7.2-2: Planck PLM Non Operating temperatures Interfaces requirements PPLM thermal stability requirements

Max amplitude (µK)

Comments

Circular central part Primary Moon illuminated part Reflector Circular outer part

1 15

Secondary Reflector

1

active face

Baffle

100

internal surface

Shield 3 (internal)

100

inside of optical enclosure

Shield 3 (external)

13

outside of optical enclosure

active face

3

Table 5.7.2-3: Planck PLM temperature stability requirements (derived from straylight requirements)

5.7.2.1

Focal Plane Unit

The combined focal plane unit of LFI and HFI is mechanically mounted to the Planck telescope PR panel (fig 5.6.2-1 and ICD in annex 7). The insulation between the 60K panel and the 20K FPU relies on the 3 LFI provided carbon fibre bipods The originally foreseen LFI heat switch between the PPLM and the LFI FPU has been removed from the FM. Another thermal interface of the FPU to the optical bench is thermal connection of the HFI JFET unit. This unit is mounted as well to the back of the Primary reflector panel. It needs to be thermally coupled to the radiator and mechanically isolated from the spacecraft. The JFET box is mounted by means of 4 flexible metallic blades (part of JFET box) to provide sufficient thermal contact and avoid deformation of the Primary Reflector (optical) panel. The maximum supported heat load is given in paragraph 5.9. Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-62/149

The environment/radiative thermal interface to the focal plane is given by the surface properties and the temperature of the inner enclosure of the Planck Telescope Baffles bench. The details of these parameters are given in Figure 5.7.2-2

Figure 5.7.2-2: Typical Temperature distribution for Planck (Nominal case) (ref RD78) The thermal interface of the FPU with the PPLM is the same that the mechanical interface (Figure 5.6.2-1).

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-63/149

PPLM COATING ________: Low emissivity 0.05+/-0.005 Polished Aluminium --------------: High Emissivity 0.85+/-0.1 Black painted open honeycomb

Figure 5.7.2-3: Thermal environment of PPLM Baffles to FPU (continuous red line is low emissivity (Polished Al coating), Dashed blue line is radiator Area (Black open honeycomb)

5.7.2.2

Planck Instrument Units on Spacecraft Radiators

In this paragraph the thermal interfaces of the units mounted on the s/c radiator are discussed. The following units are to be considered:

5.7.2.2.1

Sorption cooler Compressor

The sorption cooler compressor dissipates 570 W average (SCC+SCE) (1.2k W peak) and needs a specific thermal interface (heat pipes) to evacuate the dissipated power from the unit and spread it on the whole radiator area.. The mounting interface is defined in section 5.6. and the thermal dissipation is listed in section 5.9.

5.7.2.2.2

4 K cooler warm units

The 4 K cooler compressor, ancillary panel, and electronics are directly hard mounted on a dedicated radiator (see figure 5.6.3-12.), allowing to evacuate directly the heat to space.

5.7.2.2.3

Dilution cooler

The dilution cooler consists of the 3He and 4He tanks, the DCCU, and the pipes to the tanks, and to the cold end. Only the DCCU is mounted on the radiator

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

5.7.2.3

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-64/149

Pipes / Wave-guides / Harness

This paragraph defines the thermal interfaces of the instrument hardware other than harness, that has to be routed from the Planck SVM radiator equipment, respectively the SVM upper platform to the Planck FPUand have thermal interfaces (heat exchangers for coolers, thermal anchoring for wave-guides and harnesses) to the V-grooves and the PPLM. The routing of the pipes and interface of the heat exchangers is described in annex 7 in the PPLM and annex 9 in the SVM.

5.7.2.3.1

Sorption cooler pipes

The PPLM accommodates SCS heat echangers interfecs on all 3 V-Groove shields. The thermal interface of the heat exchanger is defined by the spacecraft and described in details in annex 7 (PLAPIP2S0000A).

5.7.2.3.2

4 K cooler pipes

At the level of the v-groove shields, the instrument will provide heat exchangers for the 4 K cooler pipes. The 4 K cooler pipes are heat sunk V-Groove shields 3 (ICD in annex 7 PLAPIP4S1000A) and mechanically attached to the other shields.

5.7.2.3.3

Dilution cooler

At the level of the v-groove shields, the instrument will provide heat exchangers for the dilution cooler pipes. The dilution cooler pipes are heat sunk V-Groove shields 3 (ICD in annex 7 PLAPIP1S1000C) and mechanically attached to the other shields.

5.7.2.3.4

Wave-guides

The thermal interface for the LFI wave guide (and cryoharness) on the V-groove is a set of 6 inserts on each of the 3 V-Grooves, 3 on each sides +/-Y of the wave-guides bundles. Thermal straps between these insets and the wave-guides are provided by LFI. It is shown on the figure below, and detailed in the Annex 7 (drawing PLA-FPUIS8000A sheet 4).

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-65/149

Thermal interfaces for WG

Figure 5.7.2-4 Thermal interface for wave guide

5.7.2.3.5

Harness

The Planck instrument cryo-harness is of the responsibility of the instruments. Cryoharness shall have heat intercept on each V-groove shield. The HFI bellow between PAU and JFET is routed along a SVM-PLM strut through the 3 shields, attached to the frame, and to the JFET box.

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-66/149

Figure 5.7.2-5 : routing of the HFI bellow The LFI harness is routed and fixed on the Waveguide support structure. Thermal interfaces to the intermediate V-Grooves is comined with the one of the Wave-guides..

5.7.2.4

Planck Telescope

The qualification temperature range In orbit the operating range is 40K to 65K

for

the

Planck

telescope

is:

40K

to

325K.

5.7.3 Thermal interfaces on Service Modules Refere to RD 76, 77 for detailed development of SVM thermal analyses, coupled analyses with instruments, and performances of the thermal interfaces with instruments. The nominal temperature range for units mounted onto the Herschel or Planck SVM as required by instruments are defined in Table 5.7.3-1. Acceptance temperatures are 5°C below minimum and 5°C above maximum operating temperatures. Qualification temperatures are 10°C below minimum and 10°C above maximum operating temperatures. Instrument units that are not compliant with the nominal temperature ranges shall be clearly identified in the IID-B

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

Instrument SCS

LFI

Planck

HFI

HIFI

Herschel

PACS

SPIRE

Satellite

Instrument

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-67/149

Temperature required by Instrument Operating

Project code

REFERENCE :

Unit

Stability (slope)

T Guaranteed by TCS

NonStart- Switchoperating off up

Operating

T Stability

Nonoperating

Min °C

Max °C

DT/dt K/h

°C

°C

Min °C

Max °C

Min °C

Max °C

DT/dt K/h

Min °C

Max °C

HSDPU

Digital Processing Unit

-15

45

N/A

-30

50

-35

60

-15

45

3

-35

60

HSFCU HSDCU FPDECMEC FPBOLC FPDPU FPSPU1/2 FPWIH FHFCU FHLCU FHIFH FHIFV FHLSU FHHRV FHHRH FHWEV FHWEH FHWOV FHWOH FHICU FHWIH FHLWU

FPU Control Unit Detector Control Unit Detector (spectro) & Mechanism Control Bolometer (photometer)&Cooler Control Data processing Unit Signal Processing Unit (stacked) Warm Intercinnecting Harness FPU Control Unit Local Oscillator Control Unit IF up-converter Horizontal IF up-converter Vertical Local Oscillator Source Unit High Resolution Spectometer - Vertical Polarisation High Resolution Spectometer - Horizontal Polarisation Wide Band Spectrometer Electronics - Vertical Polarisation Wide Band Spectrometer Electronics - Horizontal Polarisation Wide Band Spectrometer Optics - Vertical Polarisation Wide Band Spectrometer Optics - Horizontal Polarisation Instrument Control Unit Warm interconnecting Harness LOU wave-guides (LSU side)

-15 -15 -15 -15 -15 -15

45 45 45 45 45 45

N/A N/A N/A N/A N/A N/A

-30 -30 -30 -30 -30 -30

50 50 50 50 50 50

-35 -35 -30 -30 -30 -30

60 60 60 60 60 60

-15 -15 -15 -15 -15 -15

45 45 45 45 45 45

3 3 3 3 3 3

-35 -35 -30 -30 -30 -30

60 60 60 60 60 60

-10 -10 -10 -10 10 -10 -10 0 0 5 5 -25 -10 -10

40 40 40 40 40 40 40 30 30 15 15 40 40 40

5.0 1.1 1.1 1.1 1.1 1.1 1.1 1.1 1.1 1.1 1.1 5.0 5.0 1.1

-25 -25 -25 -25 -25 -25 -25 -25 -25 -25 -25 -30 na na

40 40 40 40 40 40 40 40 40 30 30 50 na na

-25 -25 -25 -25 -25 -25 -25 -25 -25 -25 -25 -30 -25 na

55 55 55 55 55 55 55 55 55 55 55 60 55 na

-10 -10 -10 -10 10 -10 -10 0 0 5 5 -25 N/A N/A

40 40 40 40 40 40 40 30 30 15 15 40 N/A N/A

5 1.1 1.1 1.1 1.1 1.1 1.1 1.1 1.1 1.1 1.1 5 N/A N/A

-25 -25 -25 -25 -25 -25 -25 -25 -25 -25 -25 -30 -25 na

55 55 55 55 55 55 55 55 55 55 55 60 55 na

PHBA-N

DPU N (Data processing Unit - Nominal)

-10

40

-20

-20

50

-10

40

3

-20

50

PHBA-R PHCBC PHCBA PHDA PHDB PHDC PHDJ PHEAA PHEAB1 PHEAB2 PHEAB3 PHEC

DPU R (Data processing Uni - Redundantt) REU (Read Out Electronics) PAU (Power Amplifier Unit) 4KCCU (4K Compressor Unit) 4KCAU (4K Ancillary Unit) 4KCDE (Cooler Drive Electronics) 4K CRR (current regulator) He3 Tank (+Z) He4 Tank +Y He4 Tank -Z He4 Tank -Y DCCU (Dilution Cooler Control Unit) Cables and Pipes REBA Nominal REBA Redundant DAE Power box (Data acquisition Electronics BEU (Back end Unit) SCC (Sorption Cooler Compressor Nominal) SCC (Sorption Cooler Compressor Redundant) SCE (Sorption cooler Electronics Nominal) SCE (Sorption cooler Electronics Redundant)

-10 -10 -10 -10 -10 -10 -10 -10 -10 -10 -10 -10 -10 -20 -20 -20 -20 -13 -13 -10 -10

40 40 30 40 40 40 40 40 40 40 40 40 40 50 50 50 40 7 7 40 40

-20 -20 -20 -20 -20 -20 -20 N/A N/A N/A N/A -20 N/A -30 -30 -30 -30 -20 -20 -10 -10

-20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -30 -30 -30 -30 -20 -20 -20 -20

50 50 50 40 50 50 50 50 50 50 50 50 50 50 50 50 50 60 60 60 60

-10 -10 -10 -10 -10 -10 -10 -10 -10 -10 -10 -10 N/A -20 -20 -20 -20 -13 -13 -10 -10

40 40 40 40 40 40 40 40 40 40 40 40 N/A 50 50 50 40 7 7 40 40

3 3 1.1 3 3 3 3 3 3 3 3 3 3 3 3 3 0.2 7,4.7,4.7 7,4.7,4.7 3 3

-20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -30 -30 -30 -30 -20 -20 -20 -20

50 50 50 40 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50

PLREN PLRER PLAEF PLBEU PSM3 PSR3 PSM4 PSM4

N/A N/A 1.1 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A 0.2 3, 1, 0.5K 3, 1, 0.5K N/A N/A

(*) never accepted due to 1.2 kW peak and limited radiator size & mass

Table 5.7.3-1: Summary of Instrument temperature requirements, versus industry proposed commitments The thermal control subsystem is designed in such a way to guarantee these requirements, except for Planck PAU temperature level (-20,+40°C), and SCS (non agreed) temperature stability requirement.

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-68/149

Planck Instrument warm units Operating Temperature requirement

Herschel Instrument warm units Operating Temperature requirement

FHLWU SCE (Sorption cooler Electronics Redundant)

FHWIH FHICU

SCE (Sorption cooler Electronics Nominal)

FHWOH

SCC (Sorption Cooler Compressor Redundant)

FHWOV

SCC (Sorption Cooler Compressor Nominal)

FHWEH

BEU (Back end Unit)

FHWEV

DAE Power box (Data acquisition Electronics REBA Redundant

FHHRV

REBA Nominal

FHLSU

Cables and Pipes

FHIFV

DCCU (Dilution Cooler Control Unit)

FHIFH

He4 Tank -Y

Units

Units

FHHRH

FHLCU

He4 Tank -Z He4 Tank +Y

FHFCU FPWIH

He3 Tank (+Z)

FPSPU1/2

4K CRR (current regulator)

FPDPU

4KCDE (Cooler Drive Electronics)

FPBOLC

4KCAU (4K Ancillary Unit)

FPDECMEC

4KCCU (4K Compressor Unit)

HSDCU

PAU (Power Amplifier Unit)

HSFCU

REU (Read Out Electronics)

HSDPU

DPU R (Data processing Uni - Redundantt) DPU N (Data processing Unit - Nominal)

-40

-20

0

20

40

60

-30

-20

-10

0

10

20

30

40

50

60

Temperature (°C)

Temperature (°C)

Figure 5.7.3-1 :Operating temperature requirement for instruments warm units on SVM The contact area between boxes and structure shall be at the area of the mounting feet. This area shall be flat with no protrusion below the mounting plate. All units operating in the 270-350K range shall have a flat base-plate contact: these are all the dissipating units i.e. those where the skin dissipated power of faces not in contact with support structure is more than 50W/m2 . In the case of a flat base-plate contact area, this area must meet the following requirements for warm units on SVM: −

Flatness of 0.1mm/100mm (for mounted box and structure)

−

Overall flatness < 0.2mm

−

Roughness < 3.2micron

−

Use of an thermal -filler or equivalent (provided by TCS)

For improving radiative exchange with the SVM environment, all warm unit boxes (except the Planck sorption cooler) will have to be coated with high emissivity coating. Emissivity shall be > 0.8 HIFI units will be will be covered with MLI (baseline). High emissivity is however also required on HIFI in case adjustments would have to be made later.

5.7.4 Temperature Stability Temperature stability requirements from instruments on SVM (understood to be the maximum slope of the temperature drift) are summarised in Table 5.7.3-1.

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

5.7.4.1

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-69/149

Herschel

SVM The temperature stability requirement on Herschel SVM and PLM are expressed by HIFI only. A temperature drift lower than 30mK/100s (1K/h) is required on the spectrometers (HRS & WBS), and Local oscillator units (LCU, LSU), and 140mK/100s (5K/h) for the other units (ICU, FCU). The current worst case for temperature stability is the maximum tilt of the satellite when the Solar Aspect angle moves from +30° to –30° (End of life conditions) and the solar radiation illuminates the back of the SVM. An active thermal control system (based on adjustemnt of the duty cycle for cycles of 10s) has been implemented for the HIFI units to reach the temperature stability requirement. PLM The requirements expressed by HIFI are −

15mK/100s on level 2

−

6mK/100s on levels 1 and 0 (except the effect of HIFI heat peaks, and under the assumption for FPU thermal behaviour used in RD81).

Level 0 is a direct connection to the He tank, which can be considered as a very stable buffer. However, level 1 & 2 are cooled by the gas, with very little heat capacitance. Therefore the temperature stability on these levels can be guarantees only if the power dissipation on these levels are stable. Results of thermal analysis on the Herschel cryostat, base on the simplified thermal model of the instruments (including the dissipation timeline), showing in details the temperature evolution, stability, and heat flows at each of the individual interfaces can be found on RD81, section 7.4 (7.4.1 for PACS, 7.4.2 for SPIRE, and 7.4.3 for HIFI). Overall effects of the instrument (typical) dissipation timeline on the tank temperature and He mass flow rate is reported in RD 81 section 7.4.4. For HIFI, the temperature stability expressed can be considered as fullfiled, except during the sharp HIFI heat peaks (magnets heaters)

5.7.4.2

Planck

SVM: The temperature stability required by Planck instruments are both related to the equipment's mounted on the SVM sub-platform: −

HFI PAU requires 1.1K/h

−

LFI BEU requires 0.2K/h.

−

SCS requires +/-3K/1K/0.5K (or 6K/2K/1K peak-peak) for the next beds adjacent to the cooling bed (ie this concerns the 3 first beds which are adsorbing H2, and which drive the pressure/temperature stability of the 20K levels).

These stability requirements from instruments have been included in IID-B 2.1 and are not formally accepted as requirements but as goals, as no specific temperature stabilisation is feasible given the amplitude of the equipment dissipation. Originally 3K/h were proposed in the TCS subsystem (before the expression of theses new requirements). The main perturbation on Planck is the operation of the sorption cooler, with heat peaks of the order of 1.2kW, on the nearby lateral panels. However, SVM thermal analysis shows that the goals can be respected for the units on the subplatform, but not for the sorption cooler compressor (1st adjacent 7K peak to peak, other: 4.7 K peak to peak). Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-70/149

temperature (°C)

Sorption cooler permanent regime Temperature evolution on the beds (EOL 8) 25

cooling bed

20

1st adjacent to cooling bed

15

2nd adjacent to cooling bed

10

3rd adjacent to cooling bed

5

4th Adjacent to cooling bed

0

5th Adjacent to cooling bed

-5 0

1000

2000

3000

4000

Crossing Heat pipes

Time (s)

Sorption cooler permanent regime Temperature evolution on the beds (EOL 8) 1st adjacent to cooling bed 2nd adjacent to cooling bed 3rd adjacent to cooling bed Crossing Heat pipes

8 7

Temperature (°C)

6 5 4 3 2 1 0 -1 -2 0

100

200

300

400

500

600

700

Time (s)

Figure 5.7.3-2 : Expected temperature fluctuations for Planck Sorption cooler, at interface beds/heat pipes: 1st adjacent 7K peak to peak, other: 4.7 K peak to peak (data from Planck SVM Thermal control analysis, taking into account 10% margin on mass x heat capacitance) Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-71/149

PLM: The temperature stability requirements for the PPLM given in section 5.7.2 are derived from internal straylight requirements. The temperature fluctuation results are therefore processed to evaluate their impacts on the straylight (ref RD 84).. The sources of fluctuation which are analysed are: −

the temperature fluctuation of the SVM (from Sorption cooler compressor cycle, 667s/4000s cycle), highly damped in the PPLM by the thermal insulation.

−

The fluctuation of the heat loads of the sorption cooler on the V-grooves, induced by the mass flow variations (period 667s/4000s).

−

The fluctuations of the illumination of the upper part of the primary reflector by the moon (at spin frequency)

The current estimated peak to peak temperature fluctuations on the PPLM are as follows: PPLM thermal stability study results

Perturbation source 2; Sorption Cooler JPL 2002 data

1: SVM Amplitude

Period

Shield 3 internal

negligible

-

Shield 3 external

negligible

-

Sec. Reflector

negligible

-

Prim. Reflector

negligible

-

Baffle internal

negligible

-

Amplitude

Period

7880 µK

# 4000 s

4088 µK

# 667 s

1200 µK

# 4000 s

# 100 µK

# 667 s

# 0.4 µK

# 4000 s

negligible

# 667 s

# 0.2 µK

# 4000 s

negligible

# 667 s

400 µK

# 4000 s

# 30 µK

# 667 s

3: Moon illumination Amplitude

Period

-

-

-

-

-

-

0.1 µK

60 s

30 µK

60 s

5.7.5 Temperature monitoring The instrument require temperature monitoring from the spacecraft at some of the thermal interfaces. The following Table 5.7.4-1 summarises the need from instruments, expressed in IID-B's. For Herschel PLM, the CCU will monitor all thermal interfaces (FPU feet, thermal straps, LOU interfaces) in a similar way for all 3 Herschel instruments. The request for such a monitoring was expressed only by SPIRE in IID-B is extended to other instruments. This information will be available in the TM. For SVM's, and Planck PLM, the temperatures will be monitored by the CDMU The temperature monitoring requests expressed by instrument will be satisfied. In addition, the thermal control subsystem will have a certain number of sensors for temperature control and temperature monitoring used to guarantee that the temperature is in the required range. These temperature information will be available in the TM. Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

Unit

not specified not specified PFU thermal On Instrument Shield, close to SPIRE I/F L0; Cooling Strap 5; to PFU thermal "SPIRE SM Detector enclosure" I/F L0; Cooling Strap 6; to PFU thermal L0; Cooling Strap 7; to PFU thermal "SPIRE Cooler Evaporator HS" I/F L1; on Ventline upstream strap 4 to PFU thermal "SPIRE Optical Bench" I/F L1; on Ventline downstream strap 4 PFU thermal to "SPIRE Optical Bench" I/F L3; on Ventline to JFET-Phot PFU thermal L3; on Ventline to JFET-Spec PFU thermal L1; on Strap 4 on SPIRE FPU side PFU thermal On Spire JFET-Spec PFU thermal (Pos on Structure or L3 strap) I/F On Spire JFET-Spec PFU thermal (Pos on Structure or L3 strap) I/F On Spire JFET-Phot PFU thermal (Pos on Structure or L3 strap) I/F On Spire JFET-Phot PFU thermal (Pos on Structure or L3 strap) I/F OB Plate near SPIRE foot (center) PFU thermal OB Plate near SPIRE foot (center) PFU thermal OB Plate near SPIRE foot (-z+y) PFU thermal OB Plate near SPIRE foot (-z+y) PFU thermal OB Plate near SPIRE foot (-y-z) PFU thermal H-SVM not specified H-PLM FPFPU FPDECMEC FPBOLC FPDPU FPSPU1 FPSPU2 FPU PHA JFET PHCA Primary reflector Primary reflector secondary reflector secondary reflector SC baffle SC baffle DPUs PHBA PAU PHCBA REU PHCBC 4K Compressor Unit PHDA PHDB 4K Ancillary Unit 4KCDE PHDC 4K Cold End PHDD 4K regulator PHDJ He3 Tank PHEAA He4 Tanks PHEAB 0.1K Control Unit PHEC PPLM “Cold” – FEU Interface PLFEU FEU PLFEU Waveguide Interfaces PLFEU PLWG PPLM “Warm” - WG (*) Interface PPLM “Warm” – BEU Interface PLBEU SVM – REBA Nom. PLREN SVM – REBA Red. PLRER PPLM “Warm” – BEU/DAE PLBEU DAE Power box PLAEF SCCE-HFI Interface PSM/R1 SCCE- LFI Interface PSM/R1 SCP - Coldest Shield PSM/R2 SCP – Intermediate Shield PSM/R2 SCP – Warmest Shield PSM/R2 SCC Radiator PSM/R3 P-SVM SCE PSM/R4

H-PLM P-PLM

P-SVM

HFI

P-SVM P-PLM

Sorption cooler

LFI

P-PLM

Planck

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

Powered by

S/C EGSE

Instr

Temp. Range min

max

1

3.0K

20.0K

1

1.6K

2.0K

1

2.0K

10.0K

1

1.5K

2.2K

1

2.0K

1 1 1 1

PAGE : 5-72/149

To be Resolutio Accurac meas n y ured

Acro nym

H-PLM H-SVM

HSVM

SPIRE PACS

Herschel

HIF I

Location

REFERENCE :

± 0.1K ±< 0.001K ± 0.01K ±< 0.01K

CCU

T213

CCU

T225

CCU

T226

CCU

T227

10.0K

± 0.01K

CCU

T235

2.0K

10.0K

± 0.01K

CCU

T236

3.0K 3.0K 2.0K

20.0K 20.0K 10.0K

± 0.1K ± 0.1K ± 0.01K

CCU CCU CCU

T246 T247 T248

13.0K

370.0K

± 1K

egse

T249

3.0K

20.0K

± 0.1K

CCU

T250

1

13.0K

370.0K

± 1K

egse

T251

3.0K

20.0K

± 0.1K

CCU

T252

1

13.0K 3.0K 13.0K 3.0K 3.0K

370.0K 20.0K 370.0K 20.0K 20.0K

± 1K ± 0.1K ± 1K ± 0.1K ± 0.1K

egse CCU egse CCU CCU CDMU

T253 T254 T255 T256 T258

1.5K -40°C -40°C -40°C -40°C' -40°C Adjust 40.0K 40.0K 40.0K 40.0K 40.0K 40.0K 40.0K 1 -30°C 12 -30°C 14 -30°C 1 -30°C 1 -30°C 1 -30°C 1 -269°C 1 -30°C 1 -30°C 1 -30°C 1 -30°C 40.0K 1 18.0K 1 20.0K 40.0K 240.0K 1 240.0K 1 240.0K 1 240.0K 1 240.0K 1 17K 1 17K 1 40K 1 80K 1 140K 1 220K 1 250K

30.0K +70°C +70°C +70°C +70°C +70°C Adjust 70.0K 70.0K 350.0K 70.0K 350.0K 70.0K 350.0K 70°C 70°C 70°C 70°C 70°C 70°C 27°C 70°C 70°C 70°C 70°C 353.0K 353.0K 353.0K 353.0K 353.0K 353.0K 353.0K 353.0K 353.0K 24K 24K 70K 150K 190K 350K 350K

1 1

1 1 1 1 1 0 2 2 2 2 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 3 1 1 1 1

1 1 1 1

14 0 0 0 0 0 1 1

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU

CDMU CDMU CDMU CDMU

TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-73/149

Table 5.7.5-1 : Temperature monitoring required by instruments (from IID-B's) In the following tables 5.7.4-2 to 4, the temperature monitoring that will be implemented in the spacecraft, together with the reference TM: −

For the Warm units in the SVM, the measurement will be performed by the CDMU.

For the HIFI SVM units, the SVM TCS will provide monitoring during flight to verify the thermal slope for timescales >= 100s. −

For the Planck PLM, the measurement will be performed also by the CDMU.

−

For the Herschel PLM, the measurement will be performed by the CCU

Instr ume nt HIFI HIFI HIFI HIFI HIFI HIFI HIFI HIFI HIFI HIFI HIFI HIFI SPIRE SPIRE SPIRE PACS PACS PACS PACS PACS LFI LFI LFI LFI LFI LFI LFI LFI HFI HFI HFI HFI HFI HFI HFI HFI HFI HFI HFI HFI HFI

description

code code

Focal Plane Control Unit Instrument Control Unit IF upconverter Horizontal IF up converter Vertical Local Oscillator Control Unit Local Oscillator Source Unit HRS ACS Horizontal polarisation HRS ACS Vertical polarisation WBS Electronics for Horizontal Polarisation WBS Electronic for Vertical Polarisation WBS Optic for Horizontal Polarisation WBS Optic for Vertical Polarisation Focal Plane Control unit Detector Control unit Digital Processing Unit Detector & Mechanism Control (DEC/MEC) Bolometer Cooler Control unit Data Processing Unit Signal processing unit Nominal (stacked wit Signal processing unit Redundant DAE Back End Unit (BEU) DAE Power Box REBA Nominal REBA Redundant SC Compressor (SCC) Nominal SC Electronics (SCE) Nominal SC Compressor (SCC) Redundant SC Electronics (SCE) Redundant Data Processing Unit (DPU) Nominal Data Processing Unit (DPU) Redundant Pre-Amplifier Unit (PAU) Readout Electronics Unit (REU) 4K Cooler Compressor Unit (CCU) 4K Cooler Ancillary Unit (CAU) 4K Cooler Electronics Unit (4K-CDE) 4K Cooler Current Regulator (CCR) 0.1K Dilution Cooler Control Unit (0.1K-DC 0.1K Dilution Cooler GSU 3He Tank (D3T) 0.1K Dilution Cooler GSU 4He Tank (D4T) 0.1K Dilution Cooler GSU 4He Tank (D4T) 0.1K Dilution Cooler GSU 4He Tank (D4T)

FH FH FH FH FH FH FH FH FH FH FH FH HS HS HS FP FP FP FP FP PL PL PL PL PS PS PS PS PH PH PH PH PH PH PH PH PH PH PH PH PH

TM id

FCU ICU IFH IFV LCU LSU HRH HRV WEH WEV WOH WOV FCU DCU DPU DECM BOLC DPU SPU1 SPU2 BEU CB REN RER M3 M4 R3 R4 BA-N BA-R CBA CBC DA DB DC DJ EB EAAA EAAB EAAC EAAD

TM id

73 74 71 76 70 72 69 67 68 66 63 62 60 96

121 122 119 124 118 120 117 115 116 114 111 110 108 144

TM id

169 170 167 172 166 168 165 163 164 162 159 158 156

70 118 166 63 65 113 161 53 101 149 55 49 92 90 50 91 51 93 52 89 64 94 95 96

103 97 140 138 98 139 99 141 100 137 112 142 143 144

151 145 146 147 148

Tmin

Tmax

-40 -40 -40 -40 -40 -40 -40 -40 -40 -40 -40 -40 -40 -40 -40 -40 -40 -40 -40

80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80

-40 -40 -40 -40 -40 -40 -40 -40 -40 -40 -40 -40 -40 -40 -40 -40 -40 -40 -40 -40 -40

80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80

monitore d by CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU CDMU

Table 5.7.5-2 :Instrument warm units Temperature monitoring in the SVM provided by CDMU (TM refers to the Telemeasure ID) Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

Position Groove 1 Groove 1 Groove 1 Groove 1 Groove 1 Groove 1 Groove 2 Groove 2 Groove 2 Groove 2 Groove 3 Groove 3 Groove 3 Groove 3 Groove 3 Groove 3 Groove 3 Groove 3 Groove 3 Groove 3 PR panel PR panel PR panel PR panel PR panel PR panel PR panel PR panel Baffle Baffle Baffle Baffle Baffle Baffle Baffle Baffle Reflectors Reflectors Reflectors Reflectors Reflectors Reflectors Reflectors Reflectors

Description SC heat exchanger 1

Location On Groove (-Y), close to HX "input" side On Groove (-Y), close to HX "input" side SC heat exchanger 2 On Groove (+Y), close to HX "input" side On Groove (+Y), close to HX "input" side +Z External edge On petal ext edge -X +Z On petal ext edge -X +Z SC heat exchanger 1 On Groove (-Y), close to HX "input" side On Groove (-Y), close to HX "input" side SC heat exchanger 2 On Groove (+Y), close to HX "input" side On Groove (+Y), close to HX "input" side SC heat exchanger 1 On Groove (-Y), close to HX3C "output" side On Groove (-Y), close to HX3C "output" side SC heat exchanger 2 On Groove (+Y), close to HX3C "output" side On Groove (+Y), close to HX3C "output" side Wave Guides Interface1 On Groove (-Y), between WG and DC I/F On Groove (-Y), between WG and DC I/F Wave Guides Interface2 On Groove (+Y), between WG and 4KC I/F On Groove (+Y), between WG and 4KC I/F Optical cavity On Groove (-Y+Z) close to optical cavity edge On Groove (-Y+Z) close to optical cavity edge JFET interfaces On Doubler panel, close to +X-Y JFET foot On Doubler panel, close to +X-Y JFET foot FPU interface 1(lower beam) On Lower beam, between -X bipod feet On Lower beam, between -X bipod feet FPU interface2 (+Y) Between +Y bipod feet Between +Y bipod feet FPU interface3 (-Y) Between -Y bipod feet Between -Y bipod feet Baffle 1 (Front face) On Baffle +Z-Y, close to frame attachment On Baffle +Z-Y, close to frame attachment Baffle 2 (Lateral face medium) On Baffle -Y, above braids attachment On Baffle -Y, above braids attachment Baffle 3 (Lateral face upper po On Baffle +Y, close to upper edge On Baffle +Y, close to upper edge Baffle 3 (Rear face) On Baffle -Z, central position, upper edge On Baffle -Z, central position, upper edge PR1 On PR rear face On PR rear face PR2 On PR rear face On PR rear face SR1 On SR rear face On SR rear face SR2 On SR rear face On SR rear face Total of small range sensor Total of wide range sensor Total

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

Quantity 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1

PAGE : 5-74/149

ID Type Nominal T 1 N 135K 101 R 135K 2 N 135K 102 R 135K 3 N 113K 103 R 113K 4 N 80K 104 R 80K 5 N 80K 105 R 80K 6 N 50K 106 R 50K 7 N 50K 107 R 50K 8 N 50K 108 R 50K 9 N 50K 109 R 50K 10 N 50K 110 R 50K 11 N 40K 111 R 40K 12 N 40K 112 R 40K 13 N 40K 113 R 40K 14 N 40K 114 R 40K 15 N 40K 115 R 40K 16 N 40K 116 R 40K 17 N 40K 117 R 40K 18 N 40K 118 R 40K 19 N 40K 119 R 40K 20 N 40K 120 R 40K 21 N 40K 121 R 40K 22 N 40K 122 R 40K

Range Accuracy (1) Sub total 40-350K ±2.5 K 6 40-350K ±2.5 K 40-350K ±2.5 K 40-350K ±2.5 K 40-350K ±2.5 K 40-350K ±2.5 K 40-350K ±2.5 K 4 40-350K ±2.5 K 40-350K ±2.5 K 40-350K ±2.5 K 40-70K ± 1K 10 40-70K ± 1K 40-70K ± 1K 40-350K ±2.5 K 40-70K ± 1K 40-350K ±2.5 K 40-70K ± 1K 40-350K ±2.5 K 40-70K ± 1K 40-350K ±2.5 K 40-70K ± 1K 8 40-70K ± 1K 40-70K ± 1K 40-350K ±2.5 K 40-70K ± 1K 40-70K ± 1K 40-70K ± 1K 40-350K ±2.5 K 40-70K ± 1K 8 40-350K ±2.5K 40-70K ± 1K 40-350K ±2.5K 40-70K ± 1K 40-350K ±2.5K 40-70K ± 1K 40-350K ±2.5K 40-70K ± 1K 8 40-70K ± 1K 40-70K ± 1K 40-70K ± 1K 40-70K ± 1K 40-70K ± 1K 40-70K ± 1K 40-70K ± 1K 24 20 44

Table 5.7.5-3 :PPLM Temperature monitoring relevant to instruments provided by CDMU

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

Cryostat component He tank He tank He tank He tank He tank OB OB OB OB OB OB L0

Instrument

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3 Sensor Type C100 C100 C100 C100 C100 C100 PT1000 C100 PT1000 C100 C100 C100

Mounting Position

PAGE : 5-75/149

Acronym T101 T102 T107 T111 T112 T202 T207 T208 T211 T212 T213 T221

Functional ORBI GR T OU 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1

CCU Meas range 1,5K - 2,2K 1,5K - 2,2K 1,5K - 2,2K 1,5K - 2,2K 1,5K - 2,2K 3,0K - 20,0K

All All All All All PACS HIFI HIFI HIFI PACS SPIRE PACS

DLCM 1 tank lower side -X-Y, Integrated in DLCM housing DLCM 2 tank lower side -X+Y, Integrated in DLCM housing Tank upper side+x-z+y nearby outlet Tank upper side +x-y-z integrated int PPS housing Tank upper side +x-y-z integrated int PPS housing OB Plate near PACS mounting foot (+z) OB Plate near HIFI mounting foot (+z/-y) OB Plate near HIFI mounting foot (+z/-y) On Instrument Shield, close to HIFI On Instrument Shield, close to PACS On Instrument Shield, close to SPIRE L0; Cooling Strap 1; to "PACS RED Detector"

L0

PACS

L0; Cooling Strap 2; to "PACS Sorption Cooler Evaporator"

C100

T222

1

1

1,5K - 2,2K

L0

PACS

L0; Cooling Strap 3; to "PACS Sorption Cooler Pump"

C100

T223

1

1

2,0K - 10,0K

L0

PACS

L0; Cooling Strap 4; to "PACS BLUE Detector"

C100

T224

1

1

1,6K - 2,0K

L0

SPIRE

L0; Cooling Strap 5; to "SPIRE SM Detector enclosure"

C100

T225

1

1

1,6K - 2,0K

L0

SPIRE

L0; Cooling Strap 6; to "SPIRE Cooler Pump HS"

C100

T226

1

1

2,0K - 10,0K

L0

SPIRE

L0; Cooling Strap 7; to "SPIRE Cooler Evaporator HS"

C100

T227

1

1

1,5K - 2,2K

L0

HIFI

L0; Cooling Strap 8; to "HIFI L0"

C100

T228

1

1

1,5K - 2,2K

L1 L1 L1 L1 L1 L1 L1 L1 L1 L3 L3 L1 OB OB OB OB OB OB OB OB OB Telescope Telescope Heat shields

PACS PACS PACS PACS SPIRE SPIRE HIFI PACS HIFI SPIRE SPIRE SPIRE SPIRE SPIRE SPIRE SPIRE SPIRE SPIRE SPIRE SPIRE SPIRE All All All

L1; on Ventline upstream strap 1 to “PACS Photometer Optics" L1 Inlet Temperature L1; on Ventline downstream strap 1 to "PACS Photometer Optics" L1; on Ventline downstream strap 2 to "PACS Collimator" L1; on Ventline downstream strap 3 to "PACS Spectrometer Housing" L1; on Ventline upstream strap 4 to "SPIRE Optical Bench" L1; on Ventline downstream strap 4 to "SPIRE Optical Bench" L1; on Ventline downstream strap 5 to "HIFI L1-interface L1; on Strap 1 on PACS FPU Side L1, on Strap 5 on HIFI FPU side L3; on Ventline to 6-JFET (JFET-Phot) L3; on Ventline to 2-JFET (JFET-Spec) L1; on Strap 4 on SPIRE FPU side On Spire 2-JFET (JFET-Spec) On Spire 2-JFET (JFET-Spec) On Spire 6-JFET (JFET-Phot) On Spire 6-JFET (JFET-Phot) OB Plate near SPIRE foot (center) OB Plate near SPIRE foot (center) OB Plate near SPIRE foot (-z+y) OB Plate near SPIRE foot (-z+y) OB Plate near SPIRE foot (-y-z) on telescope M1, exact position TBD on telescope M2, exact position TBD Heat shield 1 Outside, on upper cone close to beam entrance under MLI, +X+Y

C100 C100 C100 C100 C100 C100 C100 C100 C100 C100 C100 C100 PT1000 C100 PT1000 C100 PT1000 C100 PT1000 C100 C100 PT1000 PT1000 PT1000

T231 T232 T233 T234 T235 T236 T237 T242 T244 T246 T247 T248 T249 T250 T251 T252 T253 T254 T255 T256 T258 T331 to T340 to T424

1 1 1 1 1 1 1 1 1 1 1 1

1,5K - 2,2K 1,5K - 2,2K 2,0K - 10,0K 2,0K - 10,0K 2,0K - 10,0K 2,0K - 10,0K 2,0K - 10,0K 2,0K - 10,0K 2,0K - 10,0K 3,0K - 20,0K 3,0K - 20,0K 2,0K - 10,0K

1 1 1 1 1

1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1

Heat shields

All

Heat shield 2 Outside, on upper cone close to beam entrance under MLI, +X+Y

PT1000

T444

1

1

13K, 370K

Heat shields

All

Heat shield 3 Outside, on upper cone close to beam entrance under MLI, +X+Y

PT1000

T464

1

1

13K, 370K

Cover Cover Cover Cover baffle baffle CVV CVV CVV CVV

All All All All All All All HIFI HIFI HIFI

On Cover heat shield On Cover heat shield On Cover heat shield On Cover heat shield On CVV telescope Baffle, Outer cylindre -Z On CVV telescope Baffle, Outer cylindre +Z CVV Outside LOU baseplate LOU WG near LOU LOU WG near LOU

PT1000 C100 PT1000 C100 PT1000 PT1000 PT1000 PT1000 PT1000 PT1000

T601 T602 T603 T604 T651 T652 T901 to T931 T934 T935

1 1 1 1 1 1

1 1 1 1 1 1 1 1 1 1

13K, 13K, 13K, 13K, 13K, 13K,

1 1 1

3,0K - 20,0K 3,0K - 20,0K 3,0K - 20,0K 1,6K - 2,0K

3,0K - 20,0K 3,0K - 20,0K 3,0K - 20,0K 3,0K - 20,0K 3,0K - 20,0K 50K - 370K 50K - 370K 13K, 370K

370K 370K 370K 370K 370K 370K

Table 5.7.4-4 :HPLM temperatures relevant to Instruments monitored by CCU

5.8

OPTICAL INTERFACES

5.8.1 Herschel Instruments 5.8.1.1

Herschel Telescope Interfaces

The Herschel telescope is described in chapter 4.3.1, and the telescope Mechanical and optical ICD is now included in Annex 11. Herschel telescope specification is AD6-1.. Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5-76/149

The optical interfaces are controlled via a set of mechanical interfaces defined w.r.t. spacecraft co-ordinates. The focal plane units will be mechanically mounted to the Herschel optical bench. This optical bench is aligned to the telescope in accordance with the alignment requirements as defined in Annex 1. Optical bench and telescope will be aligned to the same reference cube, mounted at the CVV.

5.8.1.1.1

Optical Interface Requirements

The following optical interface requirements will be fulfilled by the telescope: − pupil:

limited by the secondary reflector

− aperture stop:

at the secondary mirror

− unvignetted telescope field of view:

+/- 0.25°

− linear central obscuration:

about 8.7% (Eliptical hexapod legs & small scatter cone)

− system f/D (D = effective aperture):

8.68

− diffraction limits of telescope:

at 150 microns (goal: 80 microns)

− relative spectral transmission:

97% at BOL

− maximum operational temperature:

70K 10 Oersted) DC hard-magnetic fields should be avoided or compensated by proper component arrangement to achieve self-cancellation.

−

the use of very soft magnetic materials with high permeability should be avoided as far as possible and practicable

Exact values for the various parameters are currently being defined. To this effect it is planned to set-up a socalled frequency plan.

5.14.1

Electrical Interfaces

This section provides the EMC/EMI requirements for the Subsystem electrical interfaces to accomplish grounding requirements, to enhance Electromagnetic Compatibility and to maintain the necessary common methodology and implementation within the Project. The internal interface arrangement (i.e. the interfaces inside the same equipment) shall follow the rules established for external interfaces (i.e. interfaces between different equipment) to the maximum extent possible.

5.14.1.1

Signal Interface Grounding

For external interfaces, all the signal driver outputs shall be referenced to the signal ground and all the input terminals of the signal receivers shall be isolated from the ground. Only exceptions are the RF interfaces using coaxial cables and the low-level telemetry and telecommand lines that are permitted to have single/endedsingle/ended interface (as dictated by the PSS).

5.14.1.2

Signal Isolation (Common Mode Isolation)

The receiver interface circuitry shall be designed to provide isolation between its input terminals and the receiver grounding reference that shall not be less than the mask given in Figure 5.14.1-1.

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5130/149

Common Mode Signal Isolation IMPEDANCE - [OHM]

10000 7000

1000

200 100 1,E+01 1,E+02 1,E+03 1,E+04 1,E+05 1,E+06 1,E+07 1,E+08 Frequency - [Hz] Figure 5.14.1-1: Common mode Signal Isolation versus frequency

5.14.1.3

Signal Reference

Signals shall never use the primary power ground as reference. The secondary power reference shall constitute the user signal reference unless a further galvanic isolation stage is implemented.

5.14.1.4

Allowed Interface Topologies

The allowed interface topologies are listed in Table 5.14.1-1: TYPE OF INTERFACE

TRANSMITTER

RECEIVER

Analogue, Unit /Subsystem, ext.

Balanced

Differential

Digital, Unit/Subsystem, ext.

Single-ended

Differential

Single-ended

Opto-coupler

Single-ended

Isolation Transformer

Digital, unit/subsystem,

Balanced

Differential

Sync & clock signals, unit, ext.

Balanced

Differential

RF Transmission (coaxial cable)

Single Ended

Single ended

Table 5.14.1-1: Allowed interface topologies (not valid for the scientific data analogue signals). Exception to the above Table 5.14.1-1 is the low-level telemetry and telecommand lines (as specified in the PSS), that are permitted to have the single-ended /single-ended topology. Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

5.14.1.5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5131/149

Noise Immunity

Discrete and digital interfaces shall be designed for noise immunity with both level and time discrimination.

5.14.1.6

In Band Response

Analogue and digital circuits shall be designed to not respond to signals out of their own intentional frequency bandwidths.

5.14.1.7

In Band Transmission

The transmission bandwidths shall be limited to the minimum extent possible.

5.14.1.8

Filter Location

Filters shall be placed at the source end of the interface if it is dictated so by the receiver time response or if additional noise suppression is required.

5.14.2

Harness, Connectors and Shielding

5.14.2.1

Definition of EMC Classes

Power and signal lines shall be grouped into the following EMC classes: −

Class 1:

Primary/Secondary Power

−

Class 2:

Digital Signals

−

High Level Analogue Signals

−

Class 3:

Low Level Sensitive Analogue Signals

−

Class 4:

RF Signals (via coaxial cables, tri-axial cables, etc).

5.14.2.2

Wire/Bundle Coding

Wires/Cables belonging to the same EMC class can be assembled together in a bundle. In any case cable bundles or separate wires shall be coded reporting the EMC classes of the circuits which it contains. The wire type, twisting, shielding and shield grounding requirements shall be reflected on all the schematics, wiring diagrams and Interface Control Documents in which the circuit appears.

5.14.2.3

Cable Separation of Different EMC Classes

Bundles belonging to different EMC Classes shall be routed separately. Bundles belonging to class 2, 3 and 4 shall be shielded and separated by metallic barriers. The height of those barriers shall not be less than the largest cable bundle diameter requiring separation. If separation barriers are not practical, the bundles shall be separated by at least 10 cm. This requirement is not applicable to the subsystem equipment internal cabling or close to connector brackets. Note: Aluminium shielding is considered as metallic barrier. Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

5.14.2.4

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5132/149

Harness Routing and Crossing

All cable bundles shall be routed as close as possible to the hosting Spacecraft structure, which constitutes the ground plane. Where bundle must cross each other, the crossing angle between different categories shall be as close as possible to 90o (not applicable for solid wire harness and in connector bracket areas.).

5.14.2.5

Twisting

Twisting of the active wire around its relevant return wire shall be used in order to reduce magnetic susceptibility and emission. In case several lines share the same return line they shall be twisted with the return line. The minimum twist rate shall be as specified in Table 5.14.2-1: AWG Size Number

Minimum Twist/meter

8

8

10

9

12

10

14

12

16

14

18

16

20

19

22

23

24

26

26

30

28

35

Note: One twist is a full rotation around the cable axis. Table 5.14.2-1: Minimum Twist Rate If different AWG (> 28) are used that are not reported in the above Table 5.14.2-1, they shall be twisted in such a way to preserve the mechanical characteristics of the wires.

5.14.2.6

Pin Allocation on Connectors

Allocation of wires with different EMC Classes to the same connector shall be avoided to the maximum possible extent. When wires with different EMC Classes have to be allocated to the same connector, they shall be physically separated as much as possible within the connector.

5.14.2.7

Twisted Wire Allocation

Covered by Section 5.10.2.4

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

5.14.2.8

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5133/149

Tri-axial Cable

Tri-axial cables, if any, shall use the centre and the inner shield conductor for unbalanced transmission, referenced to the ground plane at a single point with the outer shield multiple-point grounded as a overshield. The PACS triax cable shield (outer) is routed isolated through SVM and CVV I/F connectors.

5.14.2.9

Shield Coverage

Uninterrupted shields, unless at connector location, with at least 85% optical coverage shall be used. The maximum unshielded length of wire at the connectors shall not exceed 8 cm. Shields shall not intentionally carry current (i.e. they shall not be the return path for power and signal) except for coaxial cables used with RF and PACS triax.

5.14.2.10

Cable Shield Terminations

Cable shield shall be grounded at both the ends to the equipment case at each end. The preferred method of grounding shields is through a conductive backshell that makes good electrical contact to the equipment case.

5.14.2.11

DC Resistance between Cable Shield and Connector Back-shell

The DC resistance between any shield and the connector backshell shall be less than 5 mΩ.

5.14.2.12

DC Resistance between the Back-shell and the Structure

The DC resistance between the plug connector backshell and the structure in the vicinity of the equipment shall be less than 10 mΩ.

5.14.2.13

Cable Shield Insulation

Individual cable shields shall be insulated to prevent uncontrolled grounding.

5.14.2.14

Shield Termination of Overall Shield

Overall shield shall always be circularly terminated or shield terminations shall be at the connector backshell.

5.14.2.15

DC Resistance between Shield Ground Pin and Equipment Chassis

If the shielding ground is implemented via dedicated pin, the DC resistance between any shield ground pin and the equipment chassis shall not exceed 2.5 mΩ. The connection of the shield ground pin to case shall be as short as possible. The maximum allowable length is 8 cm.

5.14.2.16

Non-RF Shield Termination of individual Wire Shields

Where dictated for practical reasons, up to 4 (four) shield may be grouped together on one ground wire for termination. The shielding termination shall be as low inductive as possible, however not exceeding 8 cm in length. RFI backshells with individual shield ground provisions shall be used for multiple RF shield terminations, with the maximum termination length not exceeding 8 cm. Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

5.14.2.17

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5134/149

Shielding through Intermediate Connectors

When intermediate connectors are used, shields shall be individually continued via the intermediate connector pins while shielding for RF wires or overall shields shall be circularly terminated to the RFI backshells.

5.14.2.18

Conductive Caps

All electrical connectors not engaged shall be covered with a conductive cap..

5.14.2.19

Equipment Chassis Apertures

The equipment case shall not contain any apertures other than those that are essential for connectors, sensor viewing or out-gassing vents. If out-gassing vents are required, they shall be as small as possible (less than 5 mm diameter) and shall be located close to the equipment mounting plane, i.e. the spacecraft structure ground.

5.14.2.20

Grounding Diagram

Grounding diagrams shall be established at both Equipment and Subsystem level. The minimum extent of each diagram shall be: −

Primary/secondary power grounding.

−

Interface circuit grounding.

−

EMI filters.

−

Shielding Grounding

−

Equipment Grounding

−

Principal Interface Circuit Diagram

5.14.3

EMC Performance Requirements

Commentary: Some EMC performance requirements depend strongly on both the power quality and on the power system architecture (e.g. protection provisions, power regulation, voltage etc.), especially as far as conducted requirements are concerned. Moreover, radiated EMC performance requirements need tailoring to particular frequency notches typical of the hosting spacecraft. This information may not be available at the time of the design. The EMC requirements specified in the following paragraphs have been derived and tailored to meet the demands of most spacecraft known to the writer that could accommodate the Subsystem. They also allow a strict control of the EMC quality of the Subsystem per se. Those requirements have been specified with the idea of avoiding unnecessary stringent demands that might impact costs and technical solutions. However, the requirements might be further refined as soon as information on the hosting spacecraft will be known. Presently, the ESA Power Standards are assumed as a reference. Specific requirements are made applicable to equipment or subsystem in order to enhance meeting the spacecraft overall compatibility requirement. These requirements are normally applicable at the equipment level, however they can be made applicable to a set of equipment which operates together (i.e. Subsystem level). When the following requirement state that they are applicable to subsystem equipment, it should be

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5135/149

understood that the requirement could be applicable at either the equipment or subsystem level. The levels are applicable when the subsystem equipment is set to the operational condition yielding the maximum emission.

5.14.3.1

Conducted Emission on Power Lines

Conducted emissions on power lines generated by the subsystem equipment shall be controlled as follows:

5.14.3.1.1 Mode, NB

Conducted Emission on Primary Power Lines, Frequency Domain, Differential

Narrow Band conducted emission Differential Mode in the frequency range 30 Hz to 50 MHz generated by the subsystem equipment on each primary power line shall not exceed the following adjustable limit: For nominal DC input current less than 1 A, use the curve of Figure 5.14.3-1as shown. For nominal DC input current greater than 1 A, the curve of Figure 5.14.3-1shall be relaxed by the factor 10*log [I (A)]. I (A) is the nominal input current in Ampere.

100 90

NB CE Power Lines - Differential M d 94

dBuA r.m.s

80 70 60 50 40

34

30 20 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 1.E+08 Frequency - [Hz] Figure 5.14.3-1:Narrow Band Conducted Emission Current – Differential Mode

5.14.3.1.2 Mode, NB

Conducted Emission on Primary Power Lines, Frequency Domain, Common

Narrow Band conducted emission Common Mode in the frequency range 10 kHz to 50 MHz generated by the subsystem equipment on the primary power lines shall not exceed the following adjustable limit: For nominal DC input current less than 1 A, use the curve of fig. 5.14.3-2 as shown.

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5136/149

For nominal DC input current greater than 1 A, the curve of fig. 5.14.3-2 shall be relaxed by the factor 10*log [I (A)]. I (A) is the nominal input current in Ampere.

NB CE Power Lines - Common Mode 80 68

dBuA r.m.s

70 60 50

40

40 30

20 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 1.E+08 Frequency - [Hz] Figure 5.14.3-2 Narrow Band Conducted Emission Current – Common Mode

5.14.3.1.3

Current Ripple, Time Domain, Differential Mode

Differential mode, time domain current ripple and spikes on the primary power bus of the subsystem equipment shall be: For nominal DC input current less than 1 A: Ripple: less than 20 mApp. Spikes, including ripple: less than 60 mApp. For nominal DC input current greater than 1 A: Ripple: relax 20 mApp by a factor √I (A), I (A) being the nominal input current in Ampere. Spikes, including ripple: relax 60 mApp by a factor √I (A), I (A) being the nominal input current in Ampere. Ripple and spikes shall be measured on both the primary and return lines with at least 50 MHz bandwidth.

5.14.3.2

Conducted Emission Common Mode Current on Signal Bundles

The Conducted Emission Common Mode on individual Signal Bundles of the subsystem shall be measured from 10 kHz to 50 MHz. Measurement shall be used to establish the limits for Conducted Susceptibility Common Mode current injection on the same bundles.

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

5.14.3.3

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5137/149

Conducted Susceptibility Power Lines – Differential Mode – Steady State

The subsystem equipment shall not exhibit any malfunction, degradation of performance or deviation beyond the tolerance indicated in its specification when sinusoidal voltages with amplitude specified in Fig.5.14.3-3 is injected into the subsystem equipment power leads in the frequency range 30Hz-50MHz. The frequency sweep rate shall not be faster than 5 min/decade.

Amplitude - Vrms

Conducted Susceptibility Power - DM 1.2 1.1 1 1 0.9 0.8 0.7 0.6 0.5 0.5 0.4 0.3 0.2 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 1.E+08 Frequency - [Hz] Figure 5.14.3-3:– Conducted Susceptibility Power Lines – Differential Mode In the frequency range 50 kHz – 50 MHz, the applied sinusoidal voltage shall be 1 kHz amplitude modulated (30% AM). The requirement shall be considered to have been met when: 1)

Frequency range 30 Hz – 50 kHz

The specified test voltage level cannot be generated but the injected current has reached 1 Arms and the subsystem equipment is still operating without malfunctions within its specified tolerances. 2)

Frequency range 50 kHz – 50 MHz

A power source of 1 Watt, 50 Ω impedance cannot develop the required voltage at the equipment power input terminals and the subsystem equipment is still operating without malfunctions within its specified tolerances.

5.14.3.4

Conducted Susceptibility Power Lines – Common Mode – Steady State

The subsystem equipment shall not exhibit any malfunction, degradation of performance or deviation beyond the tolerance indicated in its individual specification when a sinusoidal common mode signal from 10kHz to 50MHz (30% AM modulated by 1kHz square wave between 50kHz and 50MHz) is injected in both the subsystem equipment power leads via Bulk Current Injection (BCI) until: Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

−

2 Vpp is achieved between return line and chassis.

−

The injected current shall be monitored and limited to 1A peak.

5.14.3.5

PAGE : 5138/149

Conducted Susceptibility Common Mode Current on Signal Bundles

The subsystem equipment shall not exhibit any malfunction, degradation of performance or deviation beyond the tolerance indicated in its individual specification when a sinusoidal common mode current of amplitude 6 dB higher than the common mode measurement (specified in the paragraph 5.14.3.2) is injected into the signal bundles.

5.14.3.6 Conducted Susceptibility Common Mode Voltage on Signal Reference – Steady State The subsystem equipment shall not exhibit any malfunction, degradation of performance or deviation beyond the tolerance indicated in its individual specification when sinusoidal voltages with 2 Vpp amplitude are applied between the subsystem equipment signal reference and the ground plane in the frequency range 50 kHz – 50 MHz. The sweep rate shall not be faster than 5 min/decade.

5.14.3.7 Transient

Conducted Susceptibility Common Mode Voltage on Signal Reference -

The subsystem equipment shall not exhibit any malfunction, degradation of performance or deviation beyond the tolerance indicated in its individual specification when transient voltages typically shaped as shown in fig 5.14.3-5 are applied between the equipment signal reference and the ground plane. With reference to Fig. 5.14.3-5, the peak amplitude shall be calibrated to ± 3 V and Td shall be between 150 ns and 250 ns when the source having output impedance of 50 Ω is connected to a 50 Ω resistor. Then the source is applied to the equipment after it is detached from the ground plane. The pulse repetition frequency of the waveform shall range from 5 Hz to 10 Hz and the test duration shall be at least 5 minutes

5.14.3.8

Conducted Susceptibility on Power Lines – Transients

5.14.3.8.1

Differential Mode

The unit shall not exhibit any malfunction, degradation of performance or deviation beyond the tolerance indicated in its individual specification when transient voltages typically shaped as shown in Fig. 5.14.3-4 are superimposed on the steady state bus voltage at the unit input power leads. With reference to Fig. 5.14.3-4 the peak amplitude shall be ±2.5V, the rise time between 10µs and 100µs, the flat portion of the pulse ≈ 300µs and the time constant 2ms. The pulse repetition frequency of the waveform shall range from 5 Hz to 10 Hz and the test duration shall be at least 5 minutes.

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5139/149

100% Voltage Transient (Volts)

80% 60% 40% 20% 0% -2

0

2

4 Time (msec)

6

8

10

Figure 5.14.3-4– Typical transient waveform for DM Transient on PL

5.14.3.8.2

Common Mode

Amplitude - V

The subsystem equipment shall not exhibit any malfunction, degradation of performance or deviation beyond the tolerance indicated in its individual specification when transient voltages shaped as shown in Fig. 5.14.3-5 are applied between the power return line and the unit case. With reference to Fig. 5.14.3-5 the peak amplitude shall be 28 V, the rise time less than 100ns and the length (Td) at least 5µs. Repetition rate shall range from 5 Hz to 10 Hz and the test duration shall be at least 5 minutes

Td

0

T im e

Figure 5.14.3-5: Typical transient waveform for CM Transient

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

5.14.3.9

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5140/149

NB E-Field Radiated Emission

Commentary: The following requirements assume that the instruments OFF when the spacecraft is connected to the launcher and therefore do not account for specific frequency notches that may be requested by the hosting spacecraft and launcher. The requirement is defined here for the frequency range 14 kHz – 18 GHz. If the instruments are ON then the requirements given the ARIANE 5 User Manual plus any requirements from the spacecraft shall be applicable. Narrow-band electric fields generated by the subsystem equipment and measured at 1 m distance shall not exceed the limits shown in Fig. 5.14.3-6 in the frequency range 14kHz – 18GHz:

Radiated Emission - E Field 90 80

74

70

dBµV/m

60 50

50 40 30 20 10

7.19 to 7.235 GHz

0 -10 10E+3

100E+3

1E+6

10E+6

100E+6

1E+9

10E+9

100E+9

Frequency - [Hz]

Figure 5.14.3-6:Narrow-Band Radiated Emission Limit – E Field. Around the spacecraft telecommand receive band, the electric field emitted by the subsystem equipment under test, including intentional and unitentional radiation from the test harness, shall not exceed the limits shown in Fig. 5.14.3-6b :

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5141/149

Radiated Emission, E-field 80 7133

70

RE-E (dBµV/m)

60 50 7186

7218

40 30 20 10 7193

7211

0 7.10E+9

7.12E+9

7.14E+9

7.16E+9

7.18E+9

7.20E+9

7.22E+9

Frequency(Hz)

Figure 5.14.3-6b : Radiated Emission E-field limit, TC notch

5.14.3.10

NB E-Field Radiated Susceptibility

Commentary: The following requirement does not account for specific frequency notches that may be requested by the hosting spacecraft. This information will be unequivocally available when the launch opportunity will be defined. The subsystem equipment shall not exhibit any malfunction, degradation of performance or deviation beyond the tolerance indicated in its individual specification when it is irradiated with 2 V/m, 1 kHz amplitude modulated (30% AM), in the frequency range 14 kHz – 18 GHz, and 10 V/m from 8.45 GHz to 8.5 GHz (spacecraft TM).

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

7.24E+9

IIDA - SECTION 5

5.14.3.11

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5142/149

H Field Radiated Emission

Narrow-band electric fields generated by the subsystem equipment and measured at 1 m distance shall not exceed the limits shown in Fig. 5.14.3-7 in the frequency range 30Hz – 50kHz.

NB Radiated Emission - H Field 65

60

60 55 dBpT

50 45 40 35 30 25 20 1.E+01

1.E+02

1.E+03

1.E+04

1.E+05

Frequency - [Hz] Figure 5.14.3-7– Narrow-Band Radiated Emission Limit – H Field. Commentary: Requirements on Pulsed Magnetic field are currently (TBC). If dictated so, they can be introduced at a later version of this document

5.14.3.12

H Field Radiated Susceptibility

The subsystem equipment shall not exhibit any malfunction, degradation of performance or deviation beyond the tolerance indicated in its individual specification when it is irradiated with a magnetic field of 140dBpT in the frequency range 30Hz–50kHz

5.14.3.13

Arc Discharge Susceptibility

The following statement is not applicable for Herschel cryogenic units as they are not directly exposed to ESD. No malfunction, degradation of performance or deviation beyond the tolerance indicated in its individual specification shall occur when the subsystem equipment and its interface lines are exposed to a repetitive electrostatic arc discharge of at least 15 mJ energy/ 15 kV. The current rise time shall be less than 10 ns. If damage risks are envisaged for interface circuits, the voltage can be reduced down to 4 kV but the energy shall remain 15mJ.

5.14.4

Conducted Emission/Susceptibility

(deleted) Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

5.14.5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5143/149

Radiated Emission/Susceptibility

(deleted)

5.14.6

Frequency Plan

(deleted, see RD 45)

5.14.7

Plug-in and Inrush current measurement

The inrush current shall be measured on the positive power line of the user connected to its 28V power supply through the LISN defined in § 9.5.6.9, when switching it ON with an external bounce-free relay (e.g. laboratory mercury relay) installed between the LISN and the user on the positive power line. The recorded inrush current (measured with an oscilloscope in single shot mode) shall show the following 2 distinct aspects : −

A current transient corresponding to the charge of the primary filter capacitors

−

A DC/DC converter start current transient

The primary filter charge current transient shall be compliant with the following requirements : −

S(I*dt) < 2 mC

−

dI/dt < 2 A/µs

−

I peak < 30 A

The DC/DC converter start current transient : −

shall not exceed the user line LCL current limitation value for a total time higher than 5ms (TBC)

−

shall comply with : S(I*dt) < (LCL current limitation value)*5ms (TBC)

The test shall be repeated with the unit nominally switched on by the LCL, and shall comply with the following mask : dI/dt < 1A/µs

LCL I LIMIT INOM

50 µs

5ms (TBC)

Figure 5.14.7-1 inrush current template

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5144/149

In the case, illustrated here-below, where the Instrument design is such that some 28 V power line user (Instrument unit or subsystem) can be switched on not only by the LCL but also by an additional switching function implemented in the unit/subsystem of interest or in another Instrument unit, the inrush current corresponding to this switch ON scenario shall be measured and shall comply with the same mask.

Instrument

PCDU

LCL load

5.15 INSTRUMENT HANDLING

5.15.1

Transport container

5.15.1.1

Focal Plane Unit

For all deliverable units, transport containers shall be provided. The containers shall be vacuum tight, be purged and slightly over-pressurised with dry nitrogen gas. The containers shall be equipped with a mounting platform supported by a shock absorber. Shock recorders shall be mounted at a relevent location proposed by instruments. The containers shall be made of material compatible with cleanliness requirements of Section 5.15.2 and shall be equipped with witness devices. The units shall provide adequate hoisting provisions for crane suspension. Electrical grounding provision/bonding provisions from the units to the outside of the container (ESD protection) shall be available (tbc).Protections for unit openings, optical apertures and electrical connectors shall be provided. Protection for unit openings, optical apertures and electical connectors shall be provided. Humidity shall be monitored in the transport containers The IID-B (AD 1-1 to 1-6) shall list size and mass of the containers as well as the overall mass including the instrument package.

5.15.1.2

Warm electronic units, pipes and interconnecting harness

For all deliverable units, transport containers shall be provided. The containers shall be slightly over-pressurised with dry nitrogen gas, if necessary. Hygrometry will be recorded with witness devices. The containers shall be equipped with a mounting platform supported by a shock absorber. Shock recorders shall be mounted at a TBD location. Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 5145/149

The containers shall be made of material,compatible with cleanliness requirements of Section 5.15.2 and shall be equipped with witness devices. The IID-B (AD 1-1 to 1-6) shall list size and mass of the containers as well as the overall mass including the instrument package.

5.15.2

Cleanliness

5.15.2.1

Focal Plane Unit

Herschel FPU: The container opening will be performed in CR 100.000 with a relative humidity of 50% +/10%. The Herschel FPU shall be double packed in suitable foil (e.g. Cleanliness, EMC antistatic, humidity, ...). First foil removal will be performed in CR100.000 and the second foil in the CR100. For Planck FPU, the container opening will be performed in CR 100 000 with a relative humidity of 50% +/10%. Any other requirements (including the expected level of contamination of the FPU at instrument delivery)shall be specified in the IID-B (AD 1-1 to 1-6).

5.15.2.2

Warm electronic units and interconnecting harness

The Warm Electronics container may only be opened in a clean room environment of class 100 000 with a relative humidity of 50 %. Any other requirements, including the expected level of contamination of the warm units at instrument delivery shall be specified in the IID-B (AD 1-1 to 1-6).

5.15.2.3

Expected instrument cleanliness degradation during AIV and launch phases

The expected Planck instrument cleanliness degradation during AIV and launch phases will be lower than: Molecular

Particulate (ppm) Reflectors

FPU

At delivery

300

900

30

5

5

End of AIV Before encapsulation Before launch After launch Beginning of life End of life

830 1900 2500 4800 4810 5000

1430 1900 2500 4800 4810 5000

31.4 31.4 31.7 35.7 40.1 60

6.4 6.4 6.7 10.7 63.7 63.7

6.4 6.4 6.7 10.7 16.6 16.6

level

FPU

(10-7 g/cm2) PR

Phase

SR SRS/IID-B’s Cleanliness control plan Cleanliness team SRS 3.2 SRS 3.2 Contamination analysis SRS values when sum is lower

The expected Herschel instrument FPU cleanliness degradation during AIV and launch phases will be lower than:

Référence Fichier :IID-A-05-3-3.doc du 14/07/2004 16:28

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 5

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

Molecular

Particulate

level

(ppm) LOU LOU Wind. ext. wind. (& LOU Int. mirror)

Phase

FPU

At delivery

300

300

End of AIV (before encapsulation) Before launch After launch BOL EOL

375 375 375 375 1200

PAGE : 5146/149

(10-7 g/cm2) LOU LOU wind. Wind. Int. Ext. (& LOU mirror) 1 1

Tel

Tel

FPU

300

300

40

400(*)

400

1900

82.5

15.6

37.6

2.9

700 3000(**) 3000 3000

400 400 400 400

2200 4500 4500 4500

82.7 82.7 83.0 83.0

17.8 21.8 516.8 516.8

37.6 37.6 40.0 60

3.1 7.1 14.7 40

2

SRS Cleanliness team annex 2.2 + permeation + on ground outgassing SRS 3.2 SRS 3.2 Contamination analysis SRS values when sum is lower

(*) TBC by ASED (**) TBC – pessimistic value because does not consider any view factor

5.15.2.4

Outgassing properties of material

The material used to build the instruments shall be below the following outgassing properties Part

TML

CVCM

FPU

PLM compatibility test (including EMC testing)

−

Integration of the PFM units in the PFM cryostat -> PLM PFM integration and tests -> Integration (mating) with complete PFM SVM and satellite integration-> System PFM tests

Notes: −

For the mechanical and thermal qualification (STM sequence) of the Herschel satellite, instruments will be simulated by Mass & Thermal Dummy (MTD) not part of the instruments delivery.

−

At the end of the PLM EQM test campaign, the FPU CQM (including attached elements such as SPIRE JFET) and the HIFI LOU will be returned to the instrument teams.. The warm units will be sent to SVM contractor for integration into the AVM satellite, and will remain there until the IOCR (In Orbit Commissioning Review).

The test campaign identified w.r.t. the specific activities on the Herschel Instruments (i.e. warm units) that will be in the Satellite AVM is summarised by: Herschel AVM Instrument integration in the AVM satellite in Herschel configuration --> EMC Conducted test (TBC vs representativity of Instruments) --> Herschel AVM units electrical and software interface validation with system environment

7.1.3 Planck AIV Sequence Overview The Planck AIV sequence, as far as related to the instruments, consists of three main test campaigns, two related to tests with PLM at satellite level (QM & PFM) and one separate for the AVM testing . This is directly reflected in the hardware model philosophy of instruments including their respective EGSE and MGSE (refer to chapter 9.2.2). There are two separate hardware models of the Planck Payload module (P-PLM): −

a Cryogenic Qualification Model (CQM) which accommodates the HFI CQM instruments

−

a FM which accommodates PFM instruments,

The PPLM are associated with relevant models of the SVM for system test purposes (SVM dummy for Planck CQM, SVM FM for Planck FM). The two test campaigns identified w.r.t. the activities of the instruments on the Planck PLM are summarised by: −

Planck instrument CQM and PLM CQM integration (with PACE QM, HFI FPU STM, LFI RAA MTD) -> Integration (mating) with dummy SVM -->System acoustic test -->Integration of HFI QM (replace STM)--> System Thermal/cryogenic testing

−

Planck instrument PFM and PLM FM integration --> Integration (mating) with complete PFM SVM --> System PFM tests

Notes: −

For CQM sequence, instruments not compatible of such testing will be simulated by Mass & Thermal Dummy (MTD) not part of the instruments delivery. The current situation is that all LFI units (warm & cold), Sorption cooler compressor are replaced by MTD for the thermal test.

−

At the end of the CQM test campaign, the HFI FPU CQM will returned to the instrument teams when the Warm Units CQM (or AVM) will be integrated on the AVM satellite in Planck configuration, and will remain here until IOCR.

The test campaign identified w.r.t. the specific activities on the Planck Instruments (i.e. warm units) that will be in the Satellite AVM is summarised by: −

Planck AVM Instrument integration in the AVM satellite in Planck configuration --> EMC Conducted test (TBC vs representativity of Instruments) --> Planck AVM units electrical and software interface validation with system environment

Référence Fichier :IID-A-07-3-3.doc du 12/07/2004 18:45

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 7

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 7-5/32

7.1.4 Satellite Test Plans - Summary The following tables give the test matrices preformed at Spacecraft, SVM and & PLM levels Test Sine & Acoustic Shock test Fit check Balancing Mass properties Alignments Thermal Balance w/o Sun Simul. Thermal cycling He Leak test RCS Leak test Functional tests of instruments in Cryogenic env. ESD EMC CS EMC CE EMC RE-RS RF perfos. TTC RF diagram IST SFT SVT

AVM -

Herschel S/C STM PFM Q A X (**) X M, C, I M, C in plane X X ∆Q on SVM A on PLM

-

X X -

X (*) X SVT 0

-

A X X X

STM -

Planck S/C PFM Q (**) X X M, C, I X Q on SVM A on PLM

-

On equipment On equipment X X on RF mock-up X X SVT 1 & 2

A X X X

-

On equipment On equipment X X LFI low freq. on RF mock-up X X SVT 1 & 2

X = test performed with: Q= qualification level when relevant A = acceptance level when relevant “-“ = no test (*) = if relevant according test performed at unit level (**) Q on equipment and final qualification achieved by analysis M = Mass measurement, C = Centring measurement (CoG), I = Inertia measurement. = test performed at lower level Table 7.1.1-1 Herschel & Planck Satellites - Test matrices

Référence Fichier :IID-A-07-3-3.doc du 12/07/2004 18:45

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 7

Test Static test

AVM -

Mass properties Alignments TV/TB test with Sun Simulation RCS Leak test ESD EMC CS EMC CE I&T and UFT SIT IST SW compatibility SVT

-

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

Herschel SVM STM PFM at Primary Structure level X X X Q -

X (*) X X X X SVT 0

X -

PAGE : 7-6/32

Planck SVM STM PFM -

X On equipment On equipment X X X X X -

-

X -

-

X On equipment On equipment X X At S/C level X -

X = test performed with: Q= qualification level when relevant “-“ = no test (*) = if relevant according test performed at unit level = test part of the system qualification Table 7.1.1-2 Herschel & Planck SVM's - Test matrices

Test Acoustic Alignments Thermal Balance w/o Sun Simul. He Leak test Functional tests of instruments in Cryogenic env. EMC R EMC CE RF perfos.

EQM -

Herschel PLM STM X Q

FM X -

CQM Q X Q

Planck PLM RFQM X -

PFM X -

X X

X -

X X

X X

-

-

X (*) -

-

X -

X -

X

-

X = test performed with: Q= qualification level when relevant “-“ = no test (*) with external source = test part of the system qualification Table 7.1.1-3 Herschel & Planck PLM's - Test matrices

Référence Fichier :IID-A-07-3-3.doc du 12/07/2004 18:45

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 7

7.2

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 7-7/32

Integration

Procedures detailing the individual integration steps will be prepared and reviewed in due time.

7.2.1 HPLM Integration 7.2.1.1

HPLM EQM Integration

The integration sequence summarised in this Section 7.2.1.1 is considered as information only. The exact integration sequence will be optimised by Astrium. All details are given in the EQM AIT plan (RD28) and will be updated following the optimisation of all integration steps This paragraph reflects the integration of the CQM instruments into the test cryostat. The Herschel EQM used for this test is based on the ISO QM cryostat. The integration of the CQM instruments into this test cryostat starts with the open cryostat that has been adapted to this test before. The interface for the optical bench is the same as for Herschel. The Herschel upper bulkhead has been reproduced for this test and will be mounted after integration of the FPU’s. The integration flow of the instruments starts with mounting of the FPU’s on the optical bench and is considered completed with the closure of the cryostat at ambient temperature. The major steps that can be identified are: −

Integration of the WU AVM’s on dummy structures simulating the SVM.

−

Instrument FPU CQM’s integration on optical bench (mechanical/thermal and electrical)

−

Instrument FPU’s ambient temperature functional check using either the warm units or a specific FPU EGSE

−

Closure of optical bench (mechanical and straylight).

−

MLI closure for optical bench

−

Subsequent integration (shield by shield)

−

Integration of cryostat vacuum vessel outer shell upper part (connection of He filling/venting system, leak test of the He system after connection)

−

LOU CQM integration

−

Closure of the cryostat with EQM cryostat cover and integral leak test of the cryostat vacuum vessel, pre-evacuation of the system

−

Transport of cryostat from integration area (clean-room class 100) to test area (clean-room class 100.000) and preparation for CQM instrument testing.

The integration is assumed to be similar to the final PFM integration sequence (apart for Alignment) and is therefore not described in detail (see next paragraph). Note: Some advanced tasks regarding cryogenic operations are performed prior to this sequence to provide more confidence in the behavior of the cryostat.

7.2.1.2

HPLM PFM Integration

The integration sequence summarised in Section 7.2.1.2 is considered as information only. The exact integration sequence will be further optimised by Astrium. All details are given in the Herschel Satellite AIT plan (RD 29) and will be updated following the optimisation of all integration steps

Référence Fichier :IID-A-07-3-3.doc du 12/07/2004 18:45

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 7

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 7-8/32

The integration of the instruments to the Herschel cryostat starts with the open cryostat at the completion of the earlier test phase, the STM programme, where instrument dummies are mounted in the PFM cryostat. The major tests completed at that point in time are: −

cryostat thermal characterisation (lifetime, ground hold time)

−

cryogenic operations verification (cooling, filling, He II production and top-up, pressure drop, launch autonomy verification)

−

satellite structural qualification (sine vibration acoustic noise and shock)

−

alignment verification

−

procedure development (also on EQM and AVM)

−

warm up.

The integration flow of the instruments starts after removal of the FPU MTD’s with mounting of the FPU PFM’s on the optical bench and is considered completed with the closure of the cryostat at ambient temperature. The major steps that can be identified are: −

integration of the warm units on the FM SVM instrument panels

−

Instrument FPU PFM’s integration on optical bench (mechanical/thermal and electrical)

−

Instrument ambient temperature short functional test using the warm units or a specific FPU EGSE

−

Alignment check of the FPU PFM’s w.r.t. HOB

−

Closure of optical bench (mechanical and straylight)

−

MLI closure for optical bench

−

Subsequent integration (shield by shield)

−

Integration of cryostat vacuum vessel outer shell upper part

−

Alignment of the HOB w. r. t. CVV Windows

−

LOU PFM integration and LOU/CVV Alignment check with open cover

−

Closure of the cryostat and integral leak test of the cryostat vacuum vessel, pre-evacuation of the system

−

Transport of cryostat from integration area (clean-room class 100) to test area (clean-room class 100.000) and preparation for PLM testing.

The sequence assumes the use of class 100 clean room and cleanliness control procedures similar to the integration of the ISO system. The following assumptions are used for the planning:

7.2.1.2.1 Instrument integration to optical bench and Instrument Short Functional Test (SFT) at ambient temperature (functional check) Each instrument FPU is mounted separately to the optical bench. The integration is done according common practice on ESD protection(in line with MIL-HDBK-263 and MIL STD-1686 or equivalent) in the class 100 clean-room. The thermal links are integrated from the tank, resp. the cooling loops. The harness is integrated from the CVV interface connectors to the FPU’s. Then it is foreseen to perform an Instrument SFT, instrument by instrument, at ambient temperature. Thus, the instrument Warm Units are needed for this test, the pre-integrated instrument panels have to be mounted together with a support structure onto the PLM. As an alternative, the short functional tests of the FPU’s can be done using a specific EGSE instead of the warm units. Herewith early delivery of the warm units could be avoided. An alignment check of the instruments FPU's w.r.t. the HOB has to be performed before closure of the HOB. Référence Fichier :IID-A-07-3-3.doc du 12/07/2004 18:45

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 7

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 7-9/32

Note: The instrument ambient temperature SFT shall clearly verify the integrity of the FPU’s. If this is not possible (e. g. due to limited operation of the FPU’s at ambient), dedicated contingency tests for the FPU’s have to be performed. If special test equipment is needed for such test (e. g. in order to avoid a potential damage of the FPU’s) , it shall be provided by the instruments.

7.2.1.2.2

Closure of optical bench

After completion of the above the optical bench can be closed. This is basically just putting the shield around the instruments. The validation of this integration approach is considered part of the CQM test sequence, so has been validated following the same lines.

7.2.1.2.3

MLI closure for optical bench and subsequent shields integration

The closure of the cryostat is systematic integration of the shields and closure of the MLI between the upper conical shield and the cylindrical part of the cryostat. One major element during the integration is the control and achievement of the cleanliness requirements.

7.2.1.2.4

Integration of cryostat vacuum vessel outer shell upper part

After integration of the insulation system the outer shell can be integrated. After that the LOU can be integrated.

7.2.1.2.5

Integration of FM cryostat cover

The cryostat cover is mounted on top of the system with the opening mechanism. The integration is completed by a SFT at ambient temperatures. Upon completion of the cover integration the system is closed and ready for the integral leak test of the insulation system. The cryostat is pre evacuated and integral leak test performed. After that a (warm) alignment check is performed. The system is now ready for transport from the integration area to the test area and the start of the test sequence.

7.2.2 PPLM Integration 7.2.2.1

PPLM CQM Integration & tests

This paragraph reflects the integration of the CQM instruments into the SVM dummy for acoustic and thermal tests. refer to RD32 (section 5 & 6) for further details.

7.2.2.1.1

PPLM Integration for acoustic tests

The Planck acoustic Model configuration for acoustic test is the following: −

PPLM CQM (with reflector dummies)

−

Sorption Cooler PACE QM

−

LFI RAA Dummy (=LFI FPU MTD + BEU MTD)

−

HFI FPU STM

−

SVM Dummy

The Integration & test Sequence is the following Référence Fichier :IID-A-07-3-3.doc du 12/07/2004 18:45

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 7

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 7-10/32

−

PACE integration

−

Cryostructure integration

−

PLM mating on SVM dummy

−

Telescope mating

−

RAA constitution : HFI integration into MTD LFI FPU & FPUs mating on telescope

−

PLANCK Acoustic Model final integration

−

Acoustic test

−

Dismounting

7.2.2.1.2

PPLM Integration for Planck PLM QM cryogenic tests

The Planck CQM Model configuration for cryogenic test is the following: −

PPLM CQM (with reflector dummies)

−

Sorption Cooler PACE QM (fed by PACE PGSE)

−

LFI RAA Dummy (=LFI FPU MTD + BEU MTD +heaters to represent wave-guides heat losses)

−

HFI QM (no redundant units)

−

SVM Dummy

The major Integration steps are: −

RAA constitution : HFI integration into MTD FPU

−

cryostructure integration with RAA dummy

−

cryostructure mating on SVM dummy Subplatform set up on PAD

−

PLM mating on SVM dummy

−

0.1K and 4K Panels preparation

−

PAU & REU integration

−

0.1K & 4K Pipes Integration

−

RAA Integration

−

JFET-PAU Integration

−

PLANCK CQM final integration (pipes connection, leak check, electrical check, closure panels, external grooves, alignment check)

−

Thermal test in CSL (incl transports)

−

Dismounting

Note: electrical integration means that AIT team will: −

check the signals at harness level before connecting to the EQM WU’s

−

connect the harness to the EQM

−

perform UFT tests.

Référence Fichier :IID-A-07-3-3.doc du 12/07/2004 18:45

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 7

7.2.2.2

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 7-11/32

PPLM PFM Integration

For the AIT team, one of the aim of the STM/CQM will be to validate the AIT sequence. So, the integration flow of the PFM will be the same than the STM/CQM one. The major steps that can be identified are (following the chronology) −

sorption cooler (SCC, SCE, harness, pipes) mechanical integration into theirs panels

−

cryo structure assembly (grooves) with the WU’s positioned on the sub platform (DAE ctrl box for LFI, PAU for HFI, FPU assembly (i.e FPU+WG+BEU)

−

WU’s integration on the SVM panels: all the wu’s will be mechanically and electrically integrated

−

0.1 K, 4 K pipes will be integrated

At this state, the PPLM is not completely integrated. The completion will be done at satellite level after the mating of the PPLM on the SVM. Note: electrical integration means that AIT team will: −

check the signals at harness level before connecting to the WU’s

−

connect the harness to the EQM

−

perform UFT tests.

7.2.3 HSVM Integration Not relevant for instruments: The instruments warm units will be integrated or dedicated panels during the spacecaft integration

7.2.4 PSVM Integration Not relevant for instruments: The instruments warm units will be integrated or dedicated panels during the spacecaft integration

7.2.5 Herschel S/C PFM Integration The items to be integrated can be listed as: −

Service module with PLM.

−

External structures

−

Herschel telescope

−

Herschel Sunshield and Sunshade

The complete integration is performed with the He tank of the cryostat in cold conditions (i.e. 4.2K) and at normal pressure conditions. One filling could be expected during the integration period. The total available time for integration without filling is about 2 months. Additional explanations for each of the major integration steps:

7.2.5.1

Mating of the Service Module with PLM

The PLM is on the SVM STM used as MGSE. The SVM STM structure and the instrument panels are mounted to the PLM. The first step is therefore to remove the instrument STM panels. The mating of the SVM includes the mechanical mounting and the electrical re-connection of the warm units to the PLM units. The four panels involving the WU’s will be delivered earlier in order to start the integration in parallel with the Référence Fichier :IID-A-07-3-3.doc du 12/07/2004 18:45

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 7

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 7-12/32

completion of the SVM. The SVM will be delivered with the remaining panels involving the platform equipment's. The warm units of the instruments as coming from the PLM PFM test sequence need to be mechanically and electrically (functionally) integrated to the Herschel SVM to be ready for the integration of the SVM to the PLM. It includes the integration and de-integration of the necessary MGSE for lifting.

7.2.5.2

External structures

The activities foreseen comprise among others the integration of the external insulation of the cryostat on the front side, i.e. the side facing the sunshield, the upper conical part and the lower interface to the SVM. This includes, to partially mount already now the interfaces to the supporting struts for the sunshield. During these activities the cryostat will be refilled to 100 % with He I. The activities include mounting of the cryogenic GSE, filling and partial removal of the GSE. During these times the system needs to be connected to EGSE for cryostat control and commanding. The instruments need not be connected during this period. The ambient temperature units of the instruments as coming from the PLM PFM test sequence need to be mechanically and electrically (functionally) integrated to the Herschel SVM to be ready for the integration of the SVM to the PLM.

7.2.5.3

Integration of the telescope

The PLM/SVM composite is mounted on the MPT (Multi-Purpose-Trolley). The telescope is mounted on the PLM via the telescope mounting structure (TMS). Some special protection is applied to the telescope to avoid contamination. The external references of the telescope will be adjusted to the PLM reference. The thermal insulation/heating of the telescope will be mounted now, after completion of the mechanical/optical integration. The telescope reference cube will now be measured with respect to the CVV cube. It is not planned to perform any real telescope performance measurements now, e.g. measurement of the WFE.

7.2.5.4

Integration Herschel Sunshield/Sunshade

The sunshield/sunshade fixation design has mechanical interfaces to the cryostat and the SVM

7.2.6 Planck S/C PFM Integration Mating will be done after delivery from Alenia of the SVM. The six panels involving the WU’s will be delivered earlier in order to start the integration in parallel with the completion of the SVM. The SVM will be delivered with the two panels involving the platform equipment's. −

after PPLM mated on the SVM, the completion of the PPLM integration will be done with the telescope (mirrors and primary structure), JFET, 0.1 K pipes completion, FPU shims.

−

The completion of the PFM will be done with the grooves extensions, SVM upper panels, MLI….

One delicate point will be the BEU assembly shimming at sub platform level (assembly will be FPU+WG+BEU)

Référence Fichier :IID-A-07-3-3.doc du 12/07/2004 18:45

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 7

SCC panels, heat pipes,

WU panels

DAE crt bx and harness subplatform

Sorption cooler (SCC,SCCE, harness)

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 7-13/32

Cryo. structure

Tanks, piping MLI

Cryo. structure assembly

Sorption cooler integration

"SVM" prepara tion

AI 3

AI 2 Pwr interface harness

PLM data base LFI (reba, harness) HFI(dpu, REU, harness)

REFERENCE :

WUs electrical integration

AI 5 LFI (raa, harness) HFI(pau, harness)

AI 1

SVM integrated

Mating

AI 6 + Z WU panel

0.1Kcooler (dcce, pipes harness)

Telescope and baffle

0.1/4 K cooler panels assembly

AI 4

REBAs harness

4K cooler (ccu,cau,ceu, pipes harness, helium)

0.1/4 K panels

HFI(jfet) 0.1 K cooler (pipes, helium)

Grooves extentions, external MLI

Telescope adjustment

AI 7

Planck satellite integration completion

Focal plane shims BEU shim plate

SVM upper panels, MLI SVM extentions (SA, antennas, baffle)

AI 8

Figure 7.2.6-1 Planck FM integration organisation chart.

7.3

Herschel Testing

After completion of the integration, be it at the level of the PLM, SVM, S/C, a series of verification tests will be carried-out. Each test will be defined in detail in a test procedure to be written by the Contractor, based on instrument group inputs. It will be reviewed and approved by the Herschel/Planck project group. The instrument input (TRS: Test Requirement Sheets) for the Herschel EQM and FM testing are compiled in AD13 (QM) and AD14 (FM)

7.3.1 Herschel PLM EQM Testing The test configuration is defined in line with the integration sequence as given in paragraph 7.2.1.1 above, i.e.: The test cryostat is the ISO QM Cryostat. The dimensions allow to mount the Herschel optical bench on top of the ISO spatial framework. This optical bench is assumed to be similar to the Herschel Optical bench, at least w.r.t. thermal, electrical and optical interfaces. The upper part of the Herschel cryostat will be copied for this test, i.e. it is assumed to get the optical bench shield, three conical shields and the outer bulkhead of Herschel. For the instruments there is no difference to the real Herschel cryostat. The harness would be the Herschel harness with feedthroughs at the same or nearly the same place. The LOU will be mounted to the outside with representative interfaces. The cryostat cover will be equipped with a mirror surface in the line of view of the instruments, which can be actively cooled in order to simulate the optical background conditions. The orbital mass flow rate of about 2.1mg/s is further assumed to be reached for this test (at least for the instrument test periods)

Référence Fichier :IID-A-07-3-3.doc du 12/07/2004 18:45

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 7

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 7-14/32

The scientific part of the outer cryostat harness will be electrically representative to the “real” Herschel harness. The instrument warm units will be mounted on an electrically representative plate (grounding etc.). The instrument units will be connected to a functionally representative CDMS and Power interfaces, which is part of the PLM EGSE. The total system will be deployed in a clean-room class 100.000 and the test will be carried out with the CVV at ambient temperature.

7.3.1.1

Herschel PLM EQM Test Sequence

The test sequence below has been defined in co-operation with the Herschel instrument teams. It is only a summary for information only. The overall test sequence, the test objectives and estimated duration will be defined in the Instrument test plan. The test sequence consists of the following major steps: −

Short Functional Check (SFT) after integration

−

Evacuation and cool-down

−

Alignment check and SFT cold after evacuation and cool-down

−

Instrument Integrated Module Tests (IMT’s) including EMC tests (radiated with source external to the CVV)

One major objective of the CQM Test Sequence is the development and execution of Instrument IMT’s as a reference for PFM testing.

Référence Fichier :IID-A-07-3-3.doc du 12/07/2004 18:45

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 7

Sequence Warm units integration, optical bench integration Short functional test (SFT) warm Cryostat final integration and closing Cryostat evacuation and leak check Short functional test (SFT) warm Cool down and filling/cold alignment

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

Objective

Remarks

SFT of instruments (HIFI, PACS and SPIRE)

At ambient condition

SFT of instruments (HIFI, PACS and SPIRE) Cool down and filling of cryostat with He I. Functional tests at He I temperature, alignment measurements during cool down, alignment adjustment after cool down, global cold leak test Short functional test SFT of instruments (HIFI, (SFT) cold PACS and SPIRE) He II production and He II production in AXT and top up He II top up of AXT Integration EQM CCU Integration of CCU to SVM dummy plate Integrated Module Test of CCU with cryo Test (IMT) instrumentation. Functional and performance testing of instruments (HIFI, PACS and SPIRE), incl. cooler recycling and PACS/SPIRE parallel operation. EMC test Instrument RS tests (HIFI, PACS and SPIRE). Incl. cooler recycling. Conversion to He I Conversion of He II to He I in AXT Depletion and warm Depletion of AXT and warm up up of cryostat

PAGE : 7-15/32

At ambient condition

At He I condition

At He II condition

At He II condition

Table 7.3.1-1:Herschel Payload EQM Test sequence (the test sequence is still under optimisation and will be updated in due time as per Herschel AIT Plan)

Référence Fichier :IID-A-07-3-3.doc du 12/07/2004 18:45

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 7

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 7-16/32

7.3.2 Herschel S/C CQM Testing At present no test are defined on Herschel S/C level with the CQM instruments.

7.3.3 Herschel PLM PFM Testing The test sequence in after integration considers the following major stages: −

Alignment check and Short Functional Check (SFT) after integration

−

Alignment check and SFT cold after evacuation and cool-down

−

Integrated Module Test (IMT)

−

EMC test (conducted & radiated)

Details see below:

Référence Fichier :IID-A-07-3-3.doc du 12/07/2004 18:45

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 7

Sequence Warm units integration, optical bench integration Short functional test (SFT 1) warm Cryostat final integration and closing Cryostat evacuation and leak check Cryostat bake out Cool down and filling/cold alignment

Short functional test (SFT 2) cold He II production and top up Short functional test (SFT 3) cold Integrated Module Test (IMT)

EMC test

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

Objective

SFT of instruments (HIFI, PACS and SPIRE)

Cool down and filling of cryostat with He I. Alignment measurements during cool down, alignment adjustment after cool down, global cold leak tests of He subsystem SFT of CCS, SFT of instruments (HIFI, PACS and SPIRE) He II production in main tank and He II top up of main tank SFT of CCS. SFT of instruments (HIFI, PACS and SPIRE). Test of CCU with cryo instrumentation. Functional and performance testing of instruments (HIFI, PACS and SPIRE), incl. cooler recycling, PACS/SPIRE parallel operation and SPIRE spectrometer test (PLM 90° tilted) Instrument CE test (HIFI, PACS and SPIRE). Incl. cooler recycling.

PAGE : 7-17/32

Remarks

At warm condition

At He I condition

At He II condition At He II condition

At He II condition

Conversion to He I Table 7.3.1-2 : Herschel Payload PFM Test sequence (the test sequence is still under optimisation and will be updated in due time as per Herschel AIT Plan) As can be seen the test sequence is dominated by activities that are related to the payload. Since the same cryogenic system has already been verified in the STM sequence the task to do here for the cryostat is reduced to validating that the performance is the same, i.e. that there is no degradation. The telescope is not planned Référence Fichier :IID-A-07-3-3.doc du 12/07/2004 18:45

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 7

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 7-18/32

to be mounted in this sequence, as part of the PLM activities, but as part of the system activities. As a performance test of the three instruments is foreseen, it is assumed that the LOU ( outside the cryostat) has been fully integrated, the control electronics are available and can be connected to appropriate EGSE. In this sequence there are a number of parallel activities, therefore further explanations are given for each step.

7.3.3.1

Evacuation and bake out

The cryostat is on its MGSE in the clean room and the vacuum pumps are finally connected (should be mounted already since needed for pre-evacuation) to evacuate the cryostat to reach high vacuum. The Helium venting system is connected to high temperature Nitrogen flow that increases the temperature of the Helium tank, piping HOB, and FPU's up to around 80°C during 3 days. Bakeout operation, including ramp-up & ramp down will take about 2 weeks. This is done in a controlled manner, to keep the instrument units always at the highest temperature (avoid to collect contamination). The purpose of the bake-out is twofold, on one side removal of contamination from the system on the other hand removal of water from the MLI to increase the later low temperature performance.

7.3.3.2

Cool-down of the system and filling with He I

After evacuation and leaktest, bake-out and a first alignment at warm conditions, the cryostat will be cooled down to He I temperatures (4.2K). This will be accompanied by alignment checks.. At this point the alignment of the LOU wrt. HIFI FPU will be checked.

7.3.3.3

Alignment check after cooling

The HOB position is now measured through the CVV windows. At this point the alignment of the local oscillator unit is performed, first via measurements of the HOB and LOU relative alignment through the dedicated alignment windows. The cryostat suspension pre-tensioning system (GSE) can now be removed.

7.3.3.4

He II production and complete filling

As a preparation of the integrated module test, the temperature of the Helium tank is reduced to 1.7 K and the tank filled up nearly completely. This is done in a sequential way, i.e. pumping the tank, filling, pumping, etc. The final condition is that the He II tank is filled with He at around 1.7 K to 1.8 K. Note: the thermal environment is not fully in-orbit representative since the CVV temperature is at ambient (see chapter 5.7).. During this time, as a parallel activity, the final electrical connection can be made to the warm electronic units. Necessary background temperatures will be ensur eby an actively cooled mirror, which is part of the cryostat cover.

7.3.3.5

Integrated Module Test

The integrated module test is the performance and functional test of the instruments, instrument by instrument and together. This includes the capability of the set-up to recycle the instrument sorption coolers. It has to be assumed that the procedures have already been validated with the CQM, so this test sequence is for validation and not procedure development. However, note that this is the first time that the PFM instruments are together. During this test some information is obtained on the performance of the cryostat, w.r.t. temperatures and lifetime, but this is gathered as a separate information and should not drive or dominate any of the sequences. At the end of the test sequence the He bath is heated to ambient pressure (He I). Latest, at the end of the sequence, the flight cavity is mounted to the cryostat.

Référence Fichier :IID-A-07-3-3.doc du 12/07/2004 18:45

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 7

7.3.3.6

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 7-19/32

Transport to system AIV

The satellite has to be transported in cold and partly filled conditions to the system test facility. This means packing into the container and shipment.

7.3.4 Herschel S/C PFM Testing After completion of the system integration the final test sequence can start. The sequence consists of all necessary major tests for system verification: −

Integrated System Test 1 (IST1)

The satellite has to be transported in cold and partly filled conditions to the system test facility. This means packing into the container and shipment. −

System Validation Test 1 (ESOC Compatibility Test, SVT1)

−

EMC test

−

Sine Vibration test (acceptance level)

−

Thermal Vacuum and Thermal Balance test

−

Acoustic noise test

−

Alignment checks (telescope/spacecraft)

−

Integrated System Test 2 (IST2)

−

Mass properties

−

System Validation Test 2 (SVT2)

Référence Fichier :IID-A-07-3-3.doc du 12/07/2004 18:45

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 7

Sequence Satellite Integration

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

Objective SVM mating, integration of sunshield/sunshade, integration telescope, completion of satellite

Satellite alignment He II production and top up IST 1 (Integrated System Test)

Remarks

He II production in main tank and He II top up of main tank At He II condition Test of satellite bus. Test of CCU with cryo instrumentation. Functional and performance testing of instruments (HIFI, PACS and SPIRE), incl. cooler recycling, PACS/SPIRE parallel operation and SPIRE spectrometer test (PLM 90° tilted).

Conversion to He I Transport to Test Facility He II production and top up SVT 1 (System Validation Test of ground station link and instrument (HIFI, Test) PACS and SPIRE) command and control. TV/TB Test Launch autonomy verification, launch simulation, alignment check during TV test. Test of instruments (HIFI, PACS and SPIRE). SFT after TV Test SFT of satellite bus and CCS. SFT of instruments (HIFI, PACS and SPIRE). EMC Test CE, RE, CS Conversion to He I SFT cold Sine vibration test SFT cold Alignment check Acoustic noise test Alignment check SFT cold IST 2 (Integrated System Test)

PAGE : 7-20/32

3 axis sine vibration test at acceptance level.

At He I condition At He II condition At He II condition At He II condition At He II condition, conversion to He I after test

At He I condition At He I condition

Functional testing of satellite bus. Test of CCU with At He II condition cryo instrumentation. Functional and performance testing of instruments (HIFI, PACS and SPIRE), incl. cooler recycling, PACS/SPIRE parallel operation and SPIRE spectrometer test (PLM 90° tilted). Mass measurement At He II condition SVT 2 (System Validation Test of ground station link and instrument (HIFI, At He II condition Test) PACS and SPIRE) command and control. Details see below. Table 7.3.1-3:Herschel Satellite PFM Test sequence (the test sequence is still under optimisation and will be updated in due time as per Herschel AIT Plan) The main tests in this sequence are the integrated satellite test, the mechanical and the thermal tests. Some additional information to the different elements of the test flow are given below: Référence Fichier :IID-A-07-3-3.doc du 12/07/2004 18:45

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 7

7.3.4.1

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 7-21/32

Alignment and Cryostat refilling

As a first step after system integration, the alignment of the different elements is verified and the system prepared for the integrated system test. This includes mounting of the cryogenic GSE, filling the system with He I, He II production and He II top-up. At the completion of this activity, the system is ready for functional test of the integrated spacecraft.

7.3.4.2

Integrated System Test (IST)

The integrated system test is, for the scientific instruments, similar to the previously performed integrated module test, however, possibly with different thermal background for the focal plane instruments. Further to the instrument tests, the total integrated spacecraft is tested at this stage.

7.3.4.3

System Validation Test (ESOC Compatibility Test, SVT)

This system validation test has been included at two stages of the Herschel System test phase. The main purpose of these tests is the verification of the ground segment operations with the real flight hardware system. note: an advanced test (SVT 0) is performed with the AVM.

7.3.4.4

Thermal Vacuum and Thermal Balance test

During the thermal test sequence the cool-down of the system (CVV, telescope, …) shall be verified. Therefore the He II bath is re-pumped to launch conditions and the system brought to launch autonomy configuration. For the integration into the facility it is assumed that this can be done in the Herschel system configuration, i.e. no dismounting of any equipment is necessary. The spacecraft integration and removal into and out of the facility is considered one of the most complicated integration sequences and need proper and detailed preparation. The actual facility test duration is taken long enough to perform the electrical functional tests of the spacecraft, integrated system test for the instruments and to verify adequate cool-down/transient behaviour of the cryostat and the telescope. It is not possible to open the cryostat cover during this test and also a cooling of the cover mirror is not possible, i.e. the thermal background from the thermal shield in the cover will be above the orbit conditions. At completion of the actual test the system is removed from the facility for the EMC test and the structural verification tests.

7.3.4.5

EMC test

The system test sequence assumes that the system radiative EMC test is conducted with He II conditions, however in a launch autonomy mode configuration.

7.3.4.6

Vibration test and Acoustic noise test

The mechanical system verification is performed through a three-axis sine vibration test and the acoustic noise test. The vibration test is performed with normal He I in the system. Consequently the He II conditions are given up and the system is heated to He I conditions and transported to the test facility. In order to achieve proper conditions the He II tank is filled prior to each run to the nominal launch conditions, i.e. > 98% filling level. After completion of each axis vibration and the acoustic test, short functional tests at He I conditions (4.2 K) demonstrate the health of the system and the instruments. The mechanical test sequence is completed by alignment checks afterwards. These are alignment checks of the instruments to the telescope and the spacecraft elements to each other. The system is transported at completion of the sequence back to the main test room for He II production and filling. Référence Fichier :IID-A-07-3-3.doc du 12/07/2004 18:45

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 7

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 7-22/32

7.3.5 Thermal interface temperatures for Instruments testing on ground This section describes the Herschel Instrument Thermal environment provided by the Herschel cryostat (EQM & PFM) "ground lifetime conditions": when the CVV is at room temperature, and the tank in HeII conditions.

7.3.5.1 Thermal interface temperatures of Herschel EPLM PFM for Instruments testing on ground The Herschel EPLM will provide the thermal environment to allow the testing of the Herschel instruments onground. In Table 1, 2 and 3 the on-ground I/F temperatures for SPIRE, PACS and HIFI instrument testing are provided for information and are valid for the H-EPLM IMT. Important Notes and Assumptions: −

The temperatures are based on analysis results obtained with H-EPLM TMM, Issue 4.0 (see Thermal Analysis Report, HP-2-ASED-RP-0011, Issue 4) and are provided without uncertainties. The predicted IMT I/F temperatures will be verified during STM testing and may require to be updated.

−

Heat flows are dominated by radiation due to ambient temperature of the cryostat vacuum vessel at 293K.

−

The He-II tank is in closed condition assuming a starting temperature of 1.7 K, increasing with a small gradient.

−

The helium flow for optical bench cooling comes out of the HOT with 4.3 K. Variation of the He flow could be possible. Current assumption is 100mg/sec for about 10 h maximum. Then a refill is necessary.

−

Cryo Cover is cooled to approximately 80 K.

−

Special operations of the Herschel cryostat are foreseen to achieve the above values for instrument testing. The radiative environment may still vary, since the temperatures will not be in stable conditions (e.g. thermal shields, harness).

On-ground thermal I/F temperature analysis results for SPIRE instrument testing (based on thermal analysis, RD-01) SPIRE FPU thermal I/F I/F I/F Temp. Cooler State node Detector Box 814 2K Operating L0 Cooler Pump 815 2K Operating 25 K peak Recycling Cooler Evaporator 816 2K Recycling L1 L2 L3 -

L1 strap I/F Optical bench / FPU legs HSJFP (JFET Photometer) HSJFS (JFET Spectrometer) Instrument shield (equivalent radiative temperature)

800

6.2 K 12 K 15 K 15 K 16 K

Operating Operating -

Table 7.3.5-1: On-ground thermal IF temperatures for instrument testing - SPIRE Référence Fichier :IID-A-07-3-3.doc du 12/07/2004 18:45

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 7

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 7-23/32

SPIRE specific notes: −

The I/F temperatures are calculated for spectrometer mode. The temperature of the FPU housing itself is calculated to 7.3 K. The L1 temperature is directly related to the absorptivity/ emissivity of the FPU instrument surface, which is outside the responsibility of ASED. The basis for SPIRE is the ITMM, Issue 2.5 and the associated geometry model assuming an FPU emissivity of 0.2.

−

Sorption Cooler Recycling phase is composed of 2 phases in sequence, as described in the SPIRE IID-B.

−

Level 0 I/F's to the He-II tank are dipped into the fluid. During recycling of the SPIRE cooler it is assumed that the cryostat is tilted such that the top of the open pod is in contact with superfluid Helium.

On-ground thermal I/F temperature analysis results for PACS instrument testing (based on thermal analysis, RD-01) PACS FPU thermal I/F I/F Temperature Cooler State I/F node Red Detector 721 1.8 K Operating L0 Blue Detector 723 2K Operating Cooler Pump 761 2K Operating 15 K peak Recycling Cooler Evaporator 762 2K Recycling L1 L2

FPU structure Optical bench / FPU legs

783

5.3 K 12 K

Operating Operating

Table 7.3.5-2: On-ground thermal IF temperatures for instrument testing – PACS PACS specific notes: −

The L1 I/F temperature (node 783) is calculated for the spectrometer mode. The L1 Node 712 (spectrometer housing) has a temperature of 7.3 K based on the analysis results. The L1 temperature is directly related to the absorptivity/emissivity of the FPU instrument surface, which is outside the responsibility of the ASED. The basis for PACS is an ASED made GMM of the FPU with an emissivity of 0.26.

−

The Evaporator I/F temperature can be only achieved when the “open pod” is filled with superfluid Helium.

On-ground thermal I/F temperature analysis results for HIFI instrument testing (based on thermal analysis, RD-01) HIFI FPU thermal I/F node I/F Temperature I/F L0 boundary 949 2.15 K L0 L1 boundary 939 5K L1 FPU structure 910 12 K L2 table 7.3.5-3: On-ground thermal IF temperatures for instrument testing – HIFI Référence Fichier :IID-A-07-3-3.doc du 12/07/2004 18:45

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IIDA - SECTION 7

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 7-24/32

HIFI specific notes: −

The L0 I/F temperature (node 949) is calculated for Helium filling of 80% and upright cryostat position.

7.3.5.2 Thermal interface temperatures of Herschel EPLM EQM for Instruments testing on ground The Herschel EQM will provide the thermal environment to allow the testing of the Herschel instruments onground. In the following Table the L0 I/F temperatures for SPIRE, PACS and HIFI instrument testing are provided for information. Important Notes and Assumptions: −

The L0 I/F temperatures are based on analysis results as reported in HP-2-AIRL-AN-0004, Issue 6, dated 19.04.04 (section 4.9). The analysis takes also into account an assumed thermal conductance of the AXT wall of 0.5 W/K. All analyses are related to material properties at 1.7 K and are provided without uncertainties.

−

The He temperature is assumed to be 1.7 K

Interface L0

I/F Requirement

Node

Conductance to AXT

Analysis Results

Heat Load

Temperature

PACS Red Detector

0.8 mW

1.6 K … 1.75 K

721

0.107 W/K

1.71 K

PACS Blue Detector

2.0 mW

1.6 K … 2 K

723

0.054 W/K

1.74 K

PACS Cooler Pump

2.0 mW

1.6 K … 5 K

761

0.100 W/K

1.72 K

500 (peak) mW

1.6 K … 10 K 1.6 K … 1.85 K 10 MHz Video < 10 Mz

10 ppm 1 ppm 0.01 ppm

Voltage

< 5 Volt > 5 Volt

≤ 0.2 % ≤ 0.5 %

Current

1A

≤ 0.5 % ≤ 0.1 % ≤ 1.0 %

DC Power Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

Parameter

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-23/65 Tolerances

Measurement Range

VSWR

0.2 dB

Leak Rate

±10-5 Pa m3s-1 of Helium at 1013 hPa pressure differential ±10-10 Pa m3s-1 for cryogenics parts

Table 9.5.2-1: Test Level Tolerances

9.5.3 Mechanical Verification and Testing #

Reference IIDA-DV-REQ-0170

Mechanical testing shall be performed to show that the CQM unit meets the stiffness and environment mechanical requirements or that the FM unit is acceptable for flight. #

9.5.3.1 #

*

Mass, Moment of Inertia, Centre of Gravity

Reference IIDA-DV-REQ-0175

The PI shall verify that all units comply with the requirements of interface control documents, that fixation points have the correct position and definition within specified tolerances. When necessary, 3D control results of the unit interface shall be supplied. The PI shall provide the following unit properties: −

Mass

−

Moments of inertia

−

Position of the centre of gravity

Except for mass and when tight balancing is required the other properties may be determined by analysis. #

9.5.3.2

*

Quasi Static Test and Strength Tests

The main objective of this test is to demonstrate that the load carrying structure is able to withstand the flight limit loads without rupture, collapse, damage, permanent deformation or misalignment. Amplitude (g level) is the flight limit loads factored by the qualification or acceptance factor (see 9.4.1.2.3) #

Reference IIDA-DV-REQ-0180

The Quasi static test is required except for the following cases (which are usually the case): −

if analysis demonstrates positive margin of safety against the limit loads

−

if the test is being covered by the sine vibration test at low frequency. #

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

*

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

9.5.3.3 #

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-24/65

Sine Vibration Tests

Reference IIDA-DV-REQ-0185

Sinusoidal tests are required to demonstrate that the instrument units can survive all stressing events whether during launch, handling, transportation or the S/C AIV program.

9.5.3.3.1

General Requirements

9.5.3.3.1.1

Facility

#

#

*

#

*

Reference IIDA-DV-REQ-0190

The vibration test facility and procedure shall satisfy the following minimum requirements: −

the shaker shall have at least 20% margin with respect to the maximum expected interface load,

−

the control equipment shall be able to maintain the specified tolerances,

−

the data handling equipment shall be sized according to the requested instrumentation.

−

in case of unexpected incidents, smooth abort shall be programmed

−

all test incidents shall be reported and fully explained before going on with the test sequence.

−

blank test using the item fixture is not mandatory but is strongly advised.

9.5.3.3.1.2 #

Test facility cleanliness

Reference IIDA-DV-REQ-0195

Every precaution shall be taken to avoid contamination by oils, greases... The test should take place in a class 100,000 clean room or better. A protection shall be used if needed. #

9.5.3.3.1.3 #

*

Fixture requirement

Reference IIDA-DV-REQ-0200

The Unit shall be hard mounted on a stiff fixture by all its spacecraft attachment points. The PI will be responsible for the definition and procurement of the test fixture. The design of the fixture shall guarantee that the major modes of the unit are not modified (as a typical value, frequency shifts should be less than 5 % on the lower frequency modes). #

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

*

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

9.5.3.3.1.4 #

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-25/65

Configuration

Reference IIDA-DV-REQ-0205

The unit shall be vibrated in the launch configuration, except possibly for thermal hardware (MLI) when it does not contribute to the test article stiffness. All non-flight items shall be removed except for optical cubes, which may be needed to monitor the unit alignment and any other low weight instrumentation control equipment. #

9.5.3.3.1.5 #

*

Vibration and control equipment

Reference IIDA-DV-REQ-0210

To control the vibration level applied to the test specimen, at least 2 three-axis accelerometers shall be rigidly attached on the test fixture near the specimen/fixture interface and shall be aligned with the excitation axis. Accelerometers shall be calibrated for frequency response in the range 5-2000 Hz. #

9.5.3.3.1.6 #

*

Recording instrumentation

Reference IIDA-DV-REQ-0215

All tests shall be fully recorded and records be properly labelled. All accelerometers shall be calibrated and show linear response in the range 5-2000 HZ for amplitudes up to 1.25 times the maximum expected during the tests. Some carefully selected accelerometers will be used for automatic notching and abort in order to protect the test article. #

9.5.3.3.2

*

Sine Vibration Test Levels and Duration

Note: The values below have been derived from PDR system level frequency response analysis and are considered as the most suitable mechanical environment expected to be experienced by the instruments. Steps are initiated within ArianEspace (Coupled Load Analysis with launcher) to further refine these values with the intention to reduce them whenever possible. #

Reference IIDA-DV-REQ-0220

Sinus vibration Qualification test levels are specified in the table 9.5.3.1 below.

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

Frequency

Herschel Longit. FPU Lateral

Longit. LOU Lateral Out of Plane SVM in plane

Hz 5 21 40 5 14 45 5 19 80 5 14 20 5 25 5 22

Hz 21 40 100 14 45 100 19 80 100 14 20 100 25 100 22 100

qualif factor

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-26/65

acceleration qualif accept g g 10 mm 8 mm 18 14.4 18 14.4 10 mm 8 mm 8 6.4 8 6.4 10 mm 8 mm 14 11.2 14 11.2 10 mm 8 mm 8 6.4 8 6.4 10 mm 8 mm 25 20 10 mm 8 mm 20 16 1.25

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

Planck Out of Plane FPU In Plane Out of Plane JFET Box In Plane

Out of Plane

20K Pipes on PPLM

In Plane 0.1K & 4K Pipes all directions on PPLM HFI bellow LFI wave-guides all Pipes on SVM

all directions Out of Plane

SCC in plane

BEU/PAU/DAE power box

Other units on SVM

Out of Plane In Plane Out of Plane In Plane

Frequency Hz 5 30 5 30 5 30 5 30 5 25 50 65 5 25 5 25

Hz 30 100 30 100 30 100 30 100 25 50 65 110 25 100 25 110

5 25 5 25 60 5 22 60 5 25 5 22 5 25 5 22

25 110 25 60 100 22 60 100 25 100 22 100 25 100 22 100

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-27/65

acceleration qualif accept g g 5 mm 4 mm 15 12 7 mm 6mm 25 20 9mm 7mm 30 24 5mm 4mm 15 12 10 mm 8 mm 25 20 60 48 25 20 10 mm 8 mm 25 20 10 mm 8 mm 25 20 see 9.5.3.3.2.1 see 9.5.3.3.2.1 10 mm 8 mm 25 20 10 mm 8 mm 25 20 25 20 10 mm 8 mm 20 16 20 16 10 mm 8 mm 25 20 10 mm 8 mm 20 16 10 mm 8 mm 25 20 10 mm 8 mm 20 16

qualif factor

1.25

Sweep rate: 2 Oct./min Table 9.5.3-1 Sine Vibration Qualification Test Levels #

*

Acceptance levels are to be derived by dividing the qualification levels by a factor 1.25. Acceptance sweep rate is 4 Oct./min.

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

#

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-28/65

Reference IIDA-DV-REQ-0225

Low level sine test shall be performed to determine resonance frequencies to evaluate the behaviour of the test fixture and item integrity. Resonance search shall be carried out before and after vibration test for each axis between 5 to 2000 Hz with a level of 0.5 g (sweep rate: 2 oct/min). #

9.5.3.3.2.1 #

*

Special case for wave-guides and HFI bellow

Reference IIDA-DV-REQ-0230

For the HFI PAU to JFET bellow, and the LFI wave-guides, the following equivalent sinus test levels shall be applied on the equipment. #

*

9.5.3.3.2.1.1 Bellow These specifications shall be applied separately for each interface. Other interface points are clamped. Each tubing shall be sized separately for each interface. That is to say : the accelerations shall be applied homogeneously on all the attachment points on the interface considered. The part of the pipe going up or down from the interface (to another interface for instance) shall be simply supported at the next attachment point, with no acceleration applied. The stiffness of this attachment point shall be introduced.

9.5.3.3.2.1.1.1

JFET interface

The results are given in the ORDP coordinate system, that is to say : Z perpendicular to the PR panel and X in the satellite (XZ) plane. X axis

Y axis

Z axis

0-6 Hz

10mm

0-7 Hz

10mm

0-6 Hz

10mm

6-20 Hz

1.7g

5-12 Hz

2.25g

6-15 Hz

1.8g

20-30 Hz

4.5g

12-20 Hz

6.45g

15-30 Hz

10.5g

30-40 Hz

5.7g

20-35 Hz

3.75g

30-40 Hz

5.7g

40-50 Hz

13.8g

35-60 Hz

1.5g

40-52 Hz

12.6g

50-70 Hz

3g

60-75 Hz

2.9g

52-65 Hz

25.5g

70-90 Hz

4.8g

75-100 Hz

0.8g

65-75 Hz

4.5g

90-100 Hz

0.6g

75-90 Hz

11g

90-100 Hz

4.2g

Acceptance levels will be obtained by dividing those values by 1.25.

9.5.3.3.2.1.1.2

PAU interface

Those results are given in the satellite coordinate system (updated in version 3.1 to take into account the behaviour of the subplateform). Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

X axis

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-29/65

Y axis

Z axis

0-8Hz

10mm

0-6Hz

10mm

0-6Hz

10mm

8-20Hz

2.0g

6-25Hz

1.6g

6-25Hz

1.6g

20-35Hz

2.5g

25-35Hz

12.9g

25-35Hz

10.7g

35-55Hz

3.5g

35-50Hz

2.3g

35-50Hz

2.4g

55-65Hz

4.7g

50-70Hz

8.4g

50-70Hz

7.4g

65-85Hz

33g

70-90Hz

8.7g

70-90Hz

6.3g

85-100Hz

14.8g

90-100Hz

3g

90-100Hz

1.7g

Acceptance levels will be obtained by dividing those values by 1.25.

9.5.3.3.2.1.1.3

Frame interface

Those results are given with respect to the plane of the frame, at the attachment point location. Out of plane

In plane

0-7Hz

10mm

0-6Hz

10mm

7-20Hz

1.8g

6-13Hz

1.5g

20-40Hz

3.1g

13-35Hz

4.4g

40-47Hz

5.9g

35-50Hz

5.4g

47-70Hz

3g

50-65Hz

3.6g

70-75Hz

1g

65-85Hz

1.9g

75-90Hz

2.6g

85-100Hz

0.6g

90-100Hz

0.9g

Acceptance levels will be obtained by dividing those values by 1.25.

9.5.3.3.2.1.1.4

Cryo-struts Interface

The results are given in the cylindrical coordinate frame of the cryo-structure (with Z axis corresponding to X satellite axis). Radial

Tangential

Longitudinal

0-10Hz

10mm

0-10Hz

10mm

0-10Hz

10mm

10-28 Hz

4g

10-27 Hz

2.7g

10-25Hz

2.0g

28-38 Hz

9.3g

27-37 Hz

9.0g

25-57 Hz

5.2g

38-55 Hz

4.5g

37-72 Hz

4.1g

57-70 Hz

10.0g

55-80 Hz

16.5g

72-100Hz

1.5g

70-100 Hz

2.4g

80-100Hz

3.6g

Acceptance levels will be obtained by dividing those values by 1.25.

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-30/65

9.5.3.3.2.1.2 LFI Wave guides The Planck cooler pipes and LFI wave guides are connecting units located on the SVM and FPU, and have mechanical and thermal interfaces on the V-Groove shields. As this mechanical environment is complex, we propose here an equivalent mechanical environment that is applied at the interface points, giving similar dynamic levels and frequencies. By running such dynamic analysis, it should allow: −

- to optimise the location of natural frequencies of the WG

−

- to optimise the WG support structure to minimise the stresses and the acceleration levels on the WG.

This environment will be applied on a rigid support on which the FPU, the BEU and the WG support structure are rigidly mounted (all degrees of rotation are clamped, only translations are free). It concerns both the wave guides and support structures. This environment shall be applied separately for each satellite axis. This environment are presented on the following table 9.5.3-2:

0-10 Hz 10-20 Hz 20-70 Hz 70-120 Hz

X satellite 10mm 30g 1.0g 2.0g

0-10 Hz 10-20 Hz 20-120 Hz

Y satellite 10mm 30g 1.0g

0-10 Hz 10-20 Hz 20-80 Hz 80-120 Hz

Z satellite 10mm 50g 1.0g 4.0g

Acceptance levels will be obtained by dividing those vals by 1.25 •

This specification has been updated on the basis of RAA / Planck coupled analysis results. It is associated to LABEN RAA FEM (delivered to ASP in January 2004).

•

The above low frequency levels (between 10 and 20Hz) correspond to quasi-static loading . Frequency range for applying these QS loads may be adjusted provided it is sufficiently de-coupled from RAA first modes.

•

High frequency levels have been determined in order to cover maximum wave guides responses at system level, as well as maximum I/F loads, generated by RAA first modes. Table 9.5.3-2 Planck PLM Load case 1 (X satellite excitation) (Table 9.5.3-3 and 9.5.3-4: have been removed)

9.5.3.4

Random Vibration Tests

Note: The values below have been derived from an early system level analysis and are considered conservative. Steps are initiated within the project to further evaluate these values with the intention to reduce them. #

Reference IIDA-DV-REQ-0235

The Random vibration test Qualification levels to be applied to instrument units are specified in the tables 9.5.3.5 to 9.5.3.7 below. Duration: 2 min. per axis.

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

Herschel Random vibration test Qualification levels Normal to fixation plane FPU Other axes HPLM

LOU

Normal to fixation plane Other axes

BOLA PACS Warm units

SVM warm units

HIFI Warm units

SPIRE Warm units

Normal to fixation plane Other axes Normal to fixation plane Other axes Normal to fixation plane Other axes

F1

F2

(Hz)

(Hz)

Slope / Level

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

Unit

PAGE : 9-31/65

g RMS (calc)

dB/Oct 20 100 3 3.47 g2/Hz 100 150 0.05 g2/Hz 150 300 0.02 300 2000 -7 dB/Oct dB/Oct 20 100 3 2.54 g2/Hz 100 150 0.02 g2/Hz 150 300 0.0125 300 2000 -7 dB/Oct dB/Oct 20 100 3 7.57 g2/Hz 100 300 0.1 300 2000 -5 dB/Oct dB/Oct 20 100 3 5.35 g2/Hz 100 300 0.05 300 2000 -5 dB/Oct removed dB/Oct 10.79 20 80 3 g2/Hz 80 300 0.2 300 2000 -5 dB/Oct dB/Oct 20 80 3 7.63 g2/Hz 80 300 0.1 300 2000 -5 dB/Oct dB/Oct 20 80 3 10.79 g2/Hz 80 300 0.2 300 2000 -5 dB/Oct dB/Oct 20 80 3 7.63 g2/Hz 80 300 0.1 300 2000 -5 dB/Oct dB/Oct 20 80 3 10.79 g2/Hz 80 300 0.2 300 2000 -5 dB/Oct dB/Oct 20 80 3 7.63 g2/Hz 80 300 0.1 300 2000 -5 dB/Oct Qualification Duration: 2 min. per axis.

Acceptance levels are to be derived by dividing the qualification levels by a factor 1.5625 . Acceptance duration is 1 min. per axis. Qualification factor 1.5625

#

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

*

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

Planck Random vibration test Qualification levels Sorption cooler compressor

Out of Plane

In Plane

Normal to Sorption fixation plane cooler Electronics Other axes

4K CCU, 4KCDE, 4KCAU, BEU

HFI DCCU, LFI REBA

Normal to fixation plane Other axes Normal to fixation plane Other axes

Normal to HFI 4K CCR fixation plane (on shear web) Other axes SVM warm units

Normal to fixation plane HFI DPU's Other axes Perpendicula r to pole axis HFI He tanks in SVM

Parallele to pole axis

Normal to Pipes in fixation plane SVM lateral panels Other axes Normal to Pipes on fixation plane shear webs (4K & 0.1K) Other axes Normal to Pipes on fixation plane Cone (4K / 0.1K / SCC) Other axes

Qualification factor

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-32/65

F1 F2 Unit g RMS Slope / Level (Hz) (Hz) (calc) 10.79 20 80 3 dB/Oct 80 300 0.2 g2/Hz 300 2000 -5 dB/Oct 7.63 20 80 3 dB/Oct 80 300 0.1 g2/Hz 300 2000 -5 dB/Oct 13.21 20 80 3 dB/Oct 80 300 0.3 g2/Hz 300 2000 -5 dB/Oct 9.34 20 80 3 dB/Oct 80 300 0.15 g2/Hz 300 2000 -5 dB/Oct 10.79 20 80 3 dB/Oct 80 300 0.2 g2/Hz 300 2000 -5 dB/Oct 7.63 20 80 3 dB/Oct 80 300 0.1 g2/Hz 300 2000 -5 dB/Oct 10.79 20 80 3 dB/Oct 80 300 0.2 g2/Hz 300 2000 -5 dB/Oct 7.63 20 80 3 dB/Oct 80 300 0.1 g2/Hz 300 2000 -5 dB/Oct 13.21 20 80 3 dB/Oct 80 300 0.3 g2/Hz 300 2000 -5 dB/Oct 9.34 20 80 3 dB/Oct 80 300 0.15 g2/Hz 300 2000 -5 dB/Oct 10.79 20 80 3 dB/Oct 80 300 0.2 g2/Hz 300 2000 -5 dB/Oct 7.63 20 80 3 dB/Oct 80 300 0.1 g2/Hz 300 2000 -5 dB/Oct 12.37 20 100 6 dB/Oct 100 1100 0.1 g2/Hz 1100 2000 -6 dB/Oct 20 150 6 dB/Oct 17.00 150 470 0.3 g2/Hz 470 550 0.01 g2/Hz 550 700 0.3 g2/Hz 700 1100 0.15 g2/Hz 1100 2000 -6 dB/Oct 10.91 20 50 3 dB/Oct 50 300 0.2 g2/Hz 300 2000 -5 dB/Oct 7.72 20 50 3 dB/Oct 50 300 0.1 g2/Hz 300 2000 -5 dB/Oct 20.26 20 70 3 dB/Oct 70 300 0.7 g2/Hz 300 2000 -5 dB/Oct 14.33 20 70 3 dB/Oct 70 300 0.35 g2/Hz 300 2000 -5 dB/Oct 10.70 20 100 3 dB/Oct 100 300 0.2 g2/Hz 300 2000 -5 dB/Oct 7.57 20 100 3 dB/Oct 100 300 0.1 g2/Hz 300 2000 -5 dB/Oct Qualification Duration: 2 min. per axis. Acceptance levels are to be derived by dividing the qualification levels by Acceptance duration is 1 min. per axis. 1.5625

Table 9.5.3-5: Random Vibration for Herschel, Qualification test levels"

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

Planck Random vibration test Qualification levels

Planck FPU (levels at LFI bipods / PPLM interface)

HFI JFET

Normal to fixation plane

Other axes

Normal to fixation plane Other axes

Wave guides & WG supports

HFI coolers (0.1K & 4K Any direction Pipes) on Primary Reflector panel

X rdp HFI coolers (0.1K & 4K Pipes) between last telescope beam IF point & FPU

Y rdp

Z rdp

SVM Subplatf orm

Normal to fixation HFI PAU, LFI plane BEU, DAE Power box Other axes

Cooler pipes on subplatform

Normal to fixation plane Other axes

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-33/65

F1

F2

Slope / Level

Unit

g RMS

(Hz)

20 100 200 300 20 100

100 200 300 2000 100 170

3 0.4 0.2 -5 3 0.1

dB/Oct g2/Hz g2/Hz dB/Oct dB/Oct g2/Hz

12.00

170

300

0.25

g2/Hz

rem. This is for X axis only (FPU ref frame)

300

2000

-5

dB/Oct

Y (horizontal) can remain at 0.1g2/Hz between 100 & 170Hz

20 100 300 20 100 300

100 300 2000 100 300 2000

3 0.4 -5 3 0.2 -5

dB/Oct g2/Hz dB/Oct dB/Oct g2/Hz dB/Oct dB/Oct g2/Hz

Normal to fixation plane

Normal to HFI coolers fixation (0.1K & 4K plane Pipes) on VGrooves 1, 2, & Other axes 3

SCI-PT-IIDA-04624

(Hz)

Other axes

PPLM

REFERENCE :

30 100 350

100 350 1000

(calc)

11.20

15.13

10.70

FPU interface: To be estimated by LFI Primary panel I/F = FPU I/F

dB/Oct

PPLM Frame= No excitation from acoustic

dB/Oct g2/Hz dB/Oct

Lower part = BEU

6 4 -6

dB/Oct g2/Hz dB/Oct

45.20

14.58

10

70

6

dB/Oct

70

350

0.4

g2/Hz

350

1000

-6

dB/Oct

30

100

6

dB/Oct

100

180

0.2

g2/Hz

180

350

0.35

g2/Hz

300

1000

-6

dB/Oct

30 105 180 300

105 180 300 1000

6 0.1 0.25 -6

dB/Oct g2/Hz g2/Hz dB/Oct

9.67

30 100 300 30 105 180 300 20 80 300 20 80 300 20 50 300 20 50 300

100 300 1000 105 180 300 1000 80 300 2000 80 300 2000 50 300 2000 50 300 2000

6 0.1 -6 6 0.2 0.15 -6 3 0.3 -5 3 0.15 -5 3 0.9 -5 3 0.45 -5

dB/Oct g2/Hz dB/Oct dB/Oct g2/Hz g2/Hz dB/Oct dB/Oct g2/Hz dB/Oct dB/Oct g2/Hz dB/Oct dB/Oct g2/Hz dB/Oct dB/Oct g2/Hz dB/Oct

6.66

12.48

update mail from JBR 28/3/2003 H-P-ASP-LT-2915 modify to to 30Hz H-P-ASP-LT 4281 (21/1/04)

ref fax H-P-ASP-LT 4281 (21/1/04) between groove 3 and FPU Boundary conditions : the last attachment point on Vgroove 3 and the one at FPU I/F are clamped. Random excitation is applied to a rigid support on which all pipe I/F points with telescope (including ref fax H-P-ASP-LT 4623 (18/3/04)

Boundary conditions : the last attachment point on Vgroove 3 and the one at FPU I/F are clamped. Random excitation is applied to a rigid support on which all pipe I/F points with telescope (including

8.45

13.21 9.34 23.15 16.37

Table 9.5.3-6: Random Vibration Qualification test levels for Planck. Acceptance levels are to be derived by dividing the qualification levels by a factor 1.5625 . Acceptance duration is 1 min. per axis. For Planck cooler pipes on V_Groove shields, the specific levels shall be used to size the pipes and supports: Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

Out of Plane

V-groove 1 In Plane

Out of Plane

V-groove 2 In Plane

Out of Plane

V-groove 3 In Plane

Qualification factor

F1 (Hz) 10 50 300 10 70 250 400 10 60 200 300 10 70 300 10 70 170 350 10 70 250 350

F2 (Hz) 50 300 1000 70 250 400 1000 60 200 300 1000 70 300 1000 70 170 350 1000 70 250 350 1000

Slope / Level 3 6 -6 6 0.4 1 -6 6 4 6 -6 6 0.3 -6 6 8 10 -6 6 0.4 1.3 -6

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

Unit dB/Oct g2/Hz dB/Oct dB/Oct g2/Hz g2/Hz dB/Oct dB/Oct g2/Hz g2/Hz dB/Oct dB/Oct g2/Hz dB/Oct dB/Oct g2/Hz g2/Hz dB/Oct dB/Oct g2/Hz g2/Hz dB/Oct

PAGE : 9-34/65

g RMS (g) 53.93

21.72

50.04

11.80

71.19

22.54

1.5625 Qualification test duration is 2 min. per axis. Acceptance test duration is 1 min. per axis. Acceptance levels are to be derived by dividing the qualification levels by a factor 1.5625

Table 9.5.3-7: Random Vibration Qualification test levels for Sorption cooler pipes on Planck V-Grooves. #

Reference IIDA-DV-REQ-0240

Low level sine test shall be performed to determine resonance frequencies to evaluate the behaviour of the test fixture and item integrity. Resonance search shall be carried out before and after vibration test for each axis between 5 to 2000 Hz with a level of 0.5g (sweep rate: 2 oct/min).. #

*

Note: Random vibration levels have been estimated from a vibro-acoustic analysis performed on the complete satellites configuration, and using ASTRYD software (with 26 distributed sources).

9.5.3.5 #

Acoustic Tests

Reference IIDA-DV-REQ-0245

The acoustic levels to be used for design and test of equipments are specified in the table 9.5.3.8 below. The are extracted from the ARIANE 5 Users Manual. Relevance level: 2 10-5 Pascal.

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

Octave Band Centre Frequency (Hz)

Qualification level (dB)

31,5 63 125 250 500 1000 2000 Overall level Duration

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

Acceptance level (dB)

132 134 139 143 138 132 128

128 130 135 139 134 128 124

146

142

2 min

1 min

PAGE : 9-35/65 Test Tolerance -2g +4g -1g +3g -1g +3g -1g +3g -1g +3g -1g +3g -1g +3g

Table 9.5.3-8:Acoustic test levels #

9.5.3.6 #

*

Shock Test Levels

Reference IIDA-DV-REQ-0250

The shock response spectrum specified below (figure 9.5.3-1) is applicable to the instrument of Planck and to the Herschel instruments accommodated in the SVM. #

*

It is to be applied along all three axes.

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

All units Frequency (Hz) Shock Level (g) 200 200 600 800 2000 2000 10000 2000

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-36/65

Pipes (Planck) Frequency (Hz) Shock Level (g) 100 25 350 350 1000 2000 4000 2930 10000 2930 IID-A 3.1

Shock Qualification at Unit Level in SVM

Acceleration (g)

10000

1000 Pipes (Planck)

100

Units 10 100

1000

Frequency (Hz)

10000

Figure 9.5.3-1: Shock Response Spectrum for units and pipes on SVM. The present assumptions are confirmed with Herschel and Planck in a dual launch configuration.

9.5.3.7

Displacements

For Planck, cooler pipes and bellows are routed between the Service module and the PPLM. These modules are behaving differently under launch loads, and displacement between Planck components are expected, with impact on the pipes and bellows. In this section are introduced the dynamic displacements (new requirements) and the integration and thermoelastic displacements have been moved from section 5.16.4 (IID 3.0) #

Reference IIDA-DV-REQ-0255

The rule for combination of displacements to design the pipes is the following: Dynamic displacements shall be combined with integration displacements Thermo-elastic displacements shall be combined with Integration displacements. #

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

*

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

9.5.3.7.1

Dynamic displacements

9.5.3.7.1.1

Dynamic displacement inside Planck SVM

#

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-37/65

Reference IIDA-DV-REQ-0260

In the Planck SVM, the cooler pipes shall be compatible with the following displacements: in plane

Item

4K Pipes 0.1K Pipes - He Tank to DCCU 0.1K pipes - DCCU to subplatform 0.1K pipes - DCCU to subplatform SCS Pipes

± Shear web ± Lateral panel ± Shear web ± ±

1.5 1.2 2.1 1.7 2

out of plane 1.5 1.6 2.1 2.2 2.5

unit mm mm mm mm mm #

9.5.3.7.1.2

*

Dynamic displacements in the PPLM

9.5.3.7.1.2.1 Sorption Cooler Pipes in PPLM The sorption cooler pipe shall be compliant with the following displacements occuring between planck VGrooves 1 to 3. Load cases (excitation) data related to SCS FEM Axis Lower Upper Pipe portion Sine X Sine Y Sine Acoust Pairi grid grid (respon mm mm Z mm ic mm ng point point se) X 2 0.6 0.7 2.9 V-Groove 1 to 3 90204 90226 Y 0.4* 0.4* 0.8* 1 V-Groove 2 Z 0.6* 1.1* 0.8* 1 X 1 0.7 0.3 2.1 V-Groove 2 to 4 90249 90273 Y 0.7* 0.7* 0.3* 0.9 V-Groove 3 Z 0.7* 0.8* 0.3* 1.1 Precooler 3B X 2.1 1.3 1 5 90374 90397 to Precooler Y 0.3 0.2 0.2 3C Z 0.4 0.3 0.2 X 2 0.9 0.4 Groove 3 pipe 6 90432 90538 Y 0.4 0.3 0.4 support to Coil Z 0.6 0.5 0.5 Load cases to be applied separately *expressed in the nodes local coordinate system For each load case, displacements shall have any sign and shall be combined. Integration displacements must be added to those load cases. These displacements have been computed with the JPL FEM provided in September 2002, ref 352G:02:024:PDM. They are expressed in the satellite Only grey-coloured load cases must be applied (other load cases are covered by the grey ones).

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

#

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-38/65

Reference IIDA-DV-REQ-0265

In addition, between the SVM, and the V-groove 1, the following displacements shall be taken into account for the sorption cooler pipes #

Axis Pipe portion (response ) X Between last cone support and 1st V-groove 1 support Y (-Y side) Z Between 1st V-groove 1 support and H.E. I/F (-Y side) Between last cone support and H.E. I/F (+Y side) Between megaphone-pipe I/F and cold end

*

Load cases (Excitation) Sine X (mm)

Sine Y (mm)

Sine Z (mm)

Acoustic (mm)

1.7

1.6

1.3

1.8

0.3

3.8

0.3

0.6

1.4

0.5

3

0.6

X

0.8

0.9

1.1

-

Y

0.1

0.2

0.1

Z

0.1

0.1

0.1

X

2.4

2.3

1.2

1.8

Y

0.3

3.9

0.3

0.6

Z

1.4

0.4

3

0.6

X

1.1

0.6

1

2

Y

0.2

5

0.3

0.8

Z 1.9 0.3 3.5 1 For each load case, displacements shall have any sign and shall be combined. Integration displacements must be added to those load cases. Note : the lateral displacement between the subplatform and the V-groove 1 of 3.5mm under sine environment, mentioned during the meeting on February 24th in Alcatel was computed with the JPL FEM that is no more valid. This explains the slight increase of the lateral displacement between the cone and the V-groove 1. These displacements have been computed directly on the PPLM FEM, because no pipe FEM corresponding to the last design issue was available. They are expressed in the satellite coordinate system. Only grey-coloured load cases must be applied (other load cases are covered the grey ones).

9.5.3.7.1.2.2: 0.1K & 4K Cooler pipes #

Reference IIDA-DV-REQ-0270

For the HFI 4K & 0.1K Cooler pipes, the following dynamic displacements shall apply (expressed in satellite reference frame):

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-39/65

Load cases (Excitation) Pipe portion

Between subplatform and V-groove 1

Between V-groove 1 and V-groove 2

Between V-groove 2 and V-groove 3

Between V-groove 3 and frame

Primary reflector panel Interface (between the last point on the lower beam, and the FPU interface)

Axis (response)

Sine X (mm) Sine Y (mm) Sine Z (mm)

X

0,7

0,9

0,4

0,6

Y

0,2

2,7

0,2

0,7

Z

1,4

0,3

2,7

0,7

X

0,5

1,2

Y

0,4

1,2

Z

1,2

1,1

X

1,5

Y

1,1

Z

1,3

X

1,2

0,5

Y

2,5

0,5

Z

2,1

2,7

X Y Z

Rem

Acoustic (mm)

0,4 2,5 0,3

combined cases ++- can be removed

Boundary conditions: The last attachment point on the lower beam is clamped, the displacement are applied at the FPU interface. ref H-P-ASP-LT-4281 21/01/04

#

*

9.5.3.7.1.2.3 HFI Bellow At PAU interface, the dynamic displacement of the HFI bellow will be: Xsat: +/-2mm Ysat: +/-0.5mm Zsat: +/-0.5mm (ref H-P-ASP-MO-2583)

9.5.3.7.1.2.4 LFI Wave-guides The following dynamic displacements have to be taken into account for the sizing of the Wave-guides (Study performed with the CSAG FEM delivery of September 2002 (H-P-3-CSAG-TN-0048), with updated struts stiffness for the cryostructure (E=52.5-20%=42Gpa, t=1.4mm). First Y lateral mode at 16.6Hz). These displacements are defined in the satellite coordinate system, with respect to the BEU location. The Wave guides and lower structure are clamped at the BEU I/F. These load cases are issued from dynamic system analyses, so each load case must be applied either as described hereunder, or multiplied by –1.

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

I/F Frame

Axis X Y Z X Y Z RX

FPU - PR panel I/F

Load case 1 0 +3.3mm 0 0 +7.2mm 0 -4.5 mrad

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

Load case 2 +1.5mm 0 +2.8mm +1.1mm 0 +4.0mm -

PAGE : 9-40/65

Load case 3 +1.9mm 0 -1.4mm +1.6mm 0 +1.2mm -

Load case 4 +2mm 0 0 +2mm 0 0 -

For instance, the differential displacement along Y, between the frame I/F and the FPU I/F, for the load case 1, equals : 7.2 - 3.3 = 3.9mm.

9.5.3.7.2

Integration and thermoelastic displacements (PPLM & SVM)

(moved from section 5.16.4 in previous version 3.0 of IID-A) #

Reference IIDA-DV-REQ-0275

The following section gives the expected displacement of the Planck PLM and SVM interface points during integration or cool-down. These displacements shall be used to size the pipes and supports, with the combination rules as given in section 9.5.3.7. #

*

9.5.3.7.2.1 : Sorption cooler Integration displacements S/C interface SVM Panel part

Subplatform

Groove 1

Groove 2

Groove 3 int.

Groove 3 ext.

FPU(*)

5th heat 2nd heat 1st heat 3rd and 4th exchanger exchanger exchanger Compressors heat Support Concerned +Support +Support +Support on panel to SC Cold End exchangers points on items points on points on points on supports on +Support Subplatform Subplatform Subplatform Subplatform Cone points on G3 G3 G2 G1 Radial transla ±1 ±0.5 ±1 ±1 Z rdp: -4.3 +3.1 Tangent trans ±2.25 ±1 ±0.5 ±1 ±1 Yrdp ±0.5 Axial translati ±1.5 ±0.5 ±1.5 ±1.5 Xrdp -0.5 +3 Radial rotation ±1 0 ±0.5 ±1 ±1 ±0.50 Tangent rotati ±1 0 ±0.5 ±1 ±1 ±0.50 Axial rotation ±1 0 ±0.5 ±1 ±1 ±0.50 (*) Tolerances of the PLM structure given at the FPU interface. The figures do not take into account the tolerances of the FPU (to be added by the instruments)

Thermo-elastic instability

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

S/C interface part Concerned items

SVM Panel

Subplatform

Groove 1

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

Groove 2

Groove 3 int.

Groove 3 ext.

Compressors

Support points on Subplatform

1st heat exchanger +Support points on G1

2nd heat exchanger +Support points on G2

3rd and 4th heat exchangers +Support points on G3

0 0 0 0 0 0

+/-0.2 +/-0.2 +/-0.2 +/-0.3 mrd +/-0.3 mrd +/-0.3 mrd

-2,3 0 +/-0,5 +/-3 mrd +10 mrd +/-0.02 mrd

-3,1 0 -1 +/-3 mrd +10 mrd +/-0.05 mrd

-3,8 0 -1,5 +/-3 mrd +10 mrd +/-0.10 mrd

Radial translation Tangent translation Axial translation Radial rotation Tangent rotation Axial rotation

PAGE : 9-41/65 FPU

5th heat exchanger SC Cold End +Support points on G3 -4,5 0 +1 +/-1 mrd +5 mrd +/-0.15 mrd

+/-1 0 -0,5 +/-0.10 mrd +/-0.10 mrd +/-0.10 mrd

Nota : the Coordinate system is a cylindrical one with Xs/c for the axial axis. Integration displacements and thermo-elastic instability shall be combined

9.5.3.7.2.2 : HFI 4 K and 0.1K cooler Integration displacements S/C interface SVM Panel part

Subplatform

Groove 1

Groove 2

Groove 3

Telescope (**)

FPU (*)

3th heat Telescope Frame Telescope HFI 18K exchanger Ancillary +Support support beam Plate IF points on G3 points Radial transla ±0.5 ±1 ±1 ±1 ±0.5 ±0.7 Z rdp: ±3.1 Tangent trans ±2.25 ±0.5 ±1 ±1 ±1 ±0.5 ±0.7 Yrdp ±0.1 Axial translati ±0.5 ±1.5 ±1.5 ±1.5 -0.5 +3 ±0.7 Xrdp ±0.1 Radial rotation / ±0.5 mrd ±1 mrd ±1 mrd ±1 mrd ±0.50 mrd ±0.50 mrd ±0.50 mrd Tangent rotati / ±0.5 mrd ±1 mrd ±1 mrd ±1 mrd ±0.50 mrd ±0.50 mrd ±0.50 mrd Axial rotation / ±0.5 mrd ±1 mrd ±1 mrd ±1 mrd ±0.50 mrd ±0.50 mrd ±0.50 mrd (*) Tolerances of the PLM structure given at the FPU interface. The figures do not take into account the tolerances of the (**) between interface plates of the lower beam:+:-0.2mm in plane & out of plane. Concerned items

Deconnexion Support Support box points on G1 points on G2

Thermo-elastic instability S/C interface SVM Panel part

Subplatform

Concerned items

Deconnexion Support Support box points on G1 points on G2

Radial transla Tangent trans Axial translati Radial rotation Tangent rotati Axial rotation

Ancillary

NA

NA

±0.2 ±0.2 ±0.2 ±0.3 mrd ±0.3 mrd ±0.3 mrd

Groove 1

-2,7 0 -2 ±3 mrd +10 mrd ±0.02 mrd

Groove 2

Groove 3

Telescope

3th heat Telescope exchanger Back Rod +Support and Frame points on G3 -3,6 -4,4 ±0.5 0 0 0 -1 -2,5 ±0.1 ±3 mrd ±1 mrd ±1 mrd +10 mrd +5 mrd ±1 mrd ±0.05 mrd ±0.10 mrd ±1 mrd

FPU

HFI 18K Plate IF ±1 0 -0,5 ±0.10 mrd ±0.10 mrd ±0.10 mrd

Nota : the Coordinate system is a cylindrical one with Xs/c for the axial axis. Integration displacements and thermo-elastic instability shall be combined

Nota : the Coordinate system is a cylindrical one with Xs/c for the axial axis. Integration displacements and thermo-elastic instability shall be combined (linear combination)

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-42/65

9.5.3.7.2.3 : HFI bellow Integration displacements

S/C interface part

SVM Panel

Subplatform

Cryostructure struts

Telescope

FPU (*)

Support points on HFI 18K Support frame, PR Concerned items PAU box I/F Plate IF points panel, JFET box I/F Radial translation ±0.5 ±1 ±0.5 Z rdp: ±3.1 N/A Tangent translation ±0.5 ±1 ±0.5 Yrdp ±0.1 Axial translation ±0.5 ±1 -0.5 / 3 Xrdp ±0.1 Radial rotation ±0.5 mrd / ±0.50 mrd ±0.50 mrd NA Tangent rotation ±0.5 mrd / ±1 mrd ±0.50 mrd Axial rotation ±0.5 mrd / ±0.50 mrd ±0.50 mrd (*) Tolerances of the PLM structure given at the FPU interface. The figures do not take into account the tolerances of the FPU (to be added by the instruments)

Thermo-elastic instability Nota : the Coordinate system is a cylindrical one with Xs/c for the axial axis. S/C interface part

SVM Panel

Concerned items

Radial translation Tangent translation Axial translation Radial rotation Tangent rotation Axial rotation

N/A

NA

Cryostructure struts

Telescope

FPU

PAU box I/F

Support points

Support points on frame, PR panel, JFET box I/F

HFI 18K Plate IF

±0.2 ±0.2 ±0.2 ±0.3 mrd ±0.3 mrd ±0.3 mrd

0 /-1 0 0 /-1 / ±1 mrd /

±1 0 0 /-1 ±1 mrd ±1 mrd ±1 mrd

±1 0 0 /-1 ±0.10 mrd ±0.10 mrd ±0.10 mrd

Subplatform

Integration displacements and thermo-elastic instability shall be combined (linear combination)

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-43/65

9.5.3.7.2.4 : Displacements at the FPU/telescope interface Maximum displacement/rotation

µm/µrd

1

Radial translation in the PR panel plane : relative displacement between the FPU and the telescope panel induced by cooling down the FPU from 293 K down 40 K when the 6 I/F areas are clamped on a support which has a CTE = 0

2

Translation in the PR panel plane : random displacement of each I/F area

± 200

3

Out the panel plane translation (along Zordp : random displacement of each I/F area

± 100

4

Rotation around the axis in the PR panel plan: random rotation of each I/F area

± 500

/

All these load cases shall be combined

9.5.4 Thermal Verification and Testing 9.5.4.1

General Test Requirements and Test Arrangement

When possible development tests will be performed with samples to demonstrate the adequacy of the selected materials and of the design. However, the qualification thermal tests will be performed with fully representative hardware. The details of the thermal tests to be performed and the logic how the thermal qualification of the units will be achieved shall be presented in the instrument Design & Development Plan. #

Reference IIDA-DV-REQ-0280

As a general requirement each instrument unit must be tested with conductive and radiative interfaces as close as possible with the spacecraft interfaces in orbit. In particular: −

each instrument unit shall be connected to the test mounting panel using identical fixation interfaces as its fixation onto the PLM or SVM (insulation washers, interface filler,...),

−

the test mounting panel temperature must be representative of the flight mounting panel temperature (margin to be added in test),

−

its external thermo-emissive properties must be identical to the flight ones,

−

the radiative environment must be as close as possible with the flight one (margin to be added in test). #

*

Because qualification and acceptance temperature range encompass in orbit temperature range, the test interface temperature and/or power must be such to ensure the margin on temperature equipment is adequate The thermal vacuum test arrangement must be designed to give the required qualification or acceptance temperatures on the equipment with approximately representative heat flows to and from the environment. A possible test set-up is that the in flight mounting panel is replaced by a thermally controlled conductive support frame used as heat sink. The equipment is directly mounted to this heat sink. A shroud surrounding the instrument unit simulates the radiative environment. The temperature of the instrument unit can be controlled both radiatively by adjusting the shroud temperature and conductively by adjusting the temperature of the fluid circulating in the mounting frame. Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-44/65

For all electronics units located into the SVM, the shroud temperature is maintained around the ambient temperature during the test. The conductive heat sink temperature is controlled to achieve the required temperature level on the instrument unit base-plate. Temperature range can be controlled using both the shroud and the heat sink temperatures.

9.5.4.2 #

General Test Condition and Instrumentation

Reference IIDA-DV-REQ-0285

The following minimum test requirements shall be satisfied: −

equipment shall be tested in a thermal vacuum environment having a pressure of 0.0013 Pa or less. The test may begin when the pressure falls below 0.013 Pa, and a pressure of 0.0013 Pa or less shall be achieved prior to startup of the units not operating during first ascent,

−

stabilisation is achieved when the equipment temperatures have been maintained within tolerance and have not changed by more than 1°C during the previous one hour period. #

#

*

Reference IIDA-DV-REQ-0290

The PI shall be responsible to define the adequate test instrumentation in order to demonstrate that temperature levels are achieved and to validate the instrument unit thermal mathematical model. This test instrumentation shall include as a minimum: −

for the shroud temperature, the instrumentation necessary to allow accurate temperature control by using fluid loop or/and electrical resistance heaters,

−

for the instrument unit at least one temperature sensor on each unit casing wall, and one temperature sensor on each unit foot,

−

for the mounting plate, at least one temperature sensor close to each unit mounting foot, and four temperature sensors to derive the lateral gradients inside the mounting panel. #

#

*

Reference IIDA-DV-REQ-0295

The general requirements for the design verification, qualification and proto-qualification tests are the following: −

During testing, the same item shall be tested in the normal post-lift-off sequence, to the thermal environments appropriate to non-operating, switch-on (start-up) and operating qualification temperature limits.

−

If preferred the temperature cycle profile can be changed to give a hot phase first. The temperature drift dT/dt must be < 2°C/min for electronics boxes inside the SVM (for transition between hot & cold cases). For instrument units mounted externally of PLM and SVM, temperature profiles with higher slopes can be defined in the equipment specification.

−

Heat dissipations: the PI shall demonstrate the units dissipate not more than the maximum values defined in IID-B (AD 04,05,06,07,08) for each unit and instrument. #

#

*

Reference IIDA-DV-REQ-0300

The general requirements for the acceptance tests are the following: Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

−

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-45/65

In order to ensure the application of the maximum stress condition, the unit shall be operated continuously throughout the test which shall comprise 8 cycles for Qualification and 4 cycles for Acceptance (ref ECSS-E-10-03A), with full functional testing at the last 2 extremes, and adequate monitoring during the remainder of the test. #

9.5.4.3

Thermal Vacuum and Balance Test

9.5.4.3.1

Thermal Vacuum Test:

#

*

Reference IIDA-DV-REQ-0305

The thermal vacuum test is required to evaluate and demonstrate the functional performance under vacuum of the instrument units. This is performed under the extreme and nominal modes of operation, with temperature conditions for the instrument more severe than the maximum and minimum temperatures predicted for the mission, namely within the acceptance or qualification temperature range. #

9.5.4.3.2 #

*

Thermal Balance Test:

Reference IIDA-DV-REQ-0310

A thermal balance test at instrument level shall be conducted on instrument units whose thermal control is under PI responsibility. The results of the thermal balance test are used to correlate and update the instrument thermal mathematical models. #

*

The thermal balance test simulates nominal conditions to verify the thermal control system. The number of energy balance conditions simulated during the tests shall be sufficient to verify the thermal design. The exposure shall be sufficient enough for the test item to reach stabilisation so that the temperature distribution in steady state condition may be verified. The PI shall establish in the Design & Development Plan how and when the thermal vacuum and thermal balance will take place and shall demonstrate what is the logic to reach the qualification/ acceptance of the instruments and its units.

9.5.4.4 #

Thermal Cycling Tests

Reference IIDA-DV-REQ-0315

Thermal cycling tests will be performed in order to demonstrate that the instruments and its units are able to withstand without degradation and under vacuum a number of thermal cycles representative of the lifetime of the instruments with margins starting from the minimal temperatures to the maximal temperatures defined in the IID-B (AD 04, 05, 06, 07, 08). Each thermal cycle shall include a soak time long enough to achieve thermal equilibrium of the instrument or the unit (T change 1°C/hour). #

*

The PI shall define in the Design & Development Plan how the demonstration of the thermal cycling test adequacy will be conducted on the basis of results with representative samples or with flight units/instruments. Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

9.5.4.5 #

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-46/65

Thermal Shock Test

Reference IIDA-DV-REQ-0320

A thermal shock test will be conducted to verify that the instruments or the units can withstand a rapid cooldown under vacuum from room temperature to the minimal temperature defined in the IID-B. The PI shall establish what is the minimal duration of the cool-down still compatible with the unit/instrument. However, this duration shall be no greater than 5 hours for Herschel, and 24 hours for Planck (interface PPLM-FPU). #

9.5.4.6 #

*

Thermal Bake-out Test

Reference IIDA-DV-REQ-0325

A thermal bake-out will be conducted for the Herschel focal plane units inside the cryostat ( 80°C for 3 days, total duration incl ramp up & down is about 2 weeks). The capability of the FPU to withstand this bake out shall be demonstrated by test. No bake-out is foreseen for Planck FPU. #

*

9.5.5 Mechanism Verification and Testing 9.5.5.1

General Test Conditions

In the Design & Development Plan, the PI shall present how he intends to demonstrate the functional performances of the mechanisms of the instruments and/or units on the basis of the results of tests at sample or of instrument/units tests and how the mechanisms will be qualified.

9.5.5.2 #

Performance Verification Testing

Reference IIDA-DV-REQ-0330

The performance validation of the mechanisms shall be established in agreement with the following requirements: −

the verification of the performances of the mechanisms shall be possible on ground at unit, assembly and system level,

−

the operation of the mechanisms at system level shall not require special jigs or special attitudes of the units/instruments. (Note that it has been agreed to accept certain attitude of the HPLM for sorption cooler recycling and for SPIRE FTS),

−

the testing shall demonstrate that all functional requirements are met with margins in representative environmental conditions. #

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

*

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

9.5.5.3

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-47/65

Lifetime Verification Testing

Because mechanisms will operate during the whole lifetime of the mission, special attention shall be devoted to demonstrate the lifetime capabilities of the mechanisms. #

Reference IIDA-DV-REQ-0335

The following requirements for lifetime verification shall be fulfilled: −

the lifetime of the mechanisms shall be demonstrated/qualified by test in a configuration representative of the realistic worst case conditions of the flight model,

−

for test demonstration, the nominal number of cycles predicted for the flight items shall be multiplied by the following factors:

Type/number of predicted cycles

Applicable factor for tests

ground operation before flight

4 (min. number is 10)

in orbit predicted cycles (when prediction is 1 - 10)

10

in orbit predicted cycles (when prediction is 11 - 1000)

4 (min. number is 100)

in orbit predicted cycles (when prediction is 1001 100000)

2 (min. number is 4000)

in orbit predicted cycles (when prediction > 100000)

1.25 (min. number is 20000)

An actuation is a full output cycle or a full revolution of the mechanism to be applied. # #

*

Reference IIDA-DV-REQ-0340

lifetime of critical mechanism components shall be declared successful if the following conditions are satisfied: −

no metal to metal contact identified,

−

no chemical degradation of dry lubricant,

−

operational requirements met within specified tolerances for entire life tests,

−

no rupture or loss of functionality of any part,

−

stiffness requirement met for entire life test. #

*

9.5.6 EMC Verification and Testing The approach taken for the system EMC verification is by analysis and test. This is outlined below and defined in the EMC control plan (document Alcatel H-P-1-ASPI-PL-0038). The analysis and the inputs to be provided by the instruments are defined in Alcatel Herschel/Planck EMC Control Plan H-P-1-ASPI-PL-0038 §5.1.2 "Instruments EMC models".

9.5.6.1

EMC Verification Methods

The methods to be used in verifying the specified design requirements for both subsystem and equipment are defined in this section. The verification activities include: Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

9.5.6.1.1

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-48/65

Analysis (A)

Verification by analysis will be accomplished to satisfy specified requirements that do not necessitate test or demonstration to assure that these requirements have been met. Calculation replaces the test results.

9.5.6.1.2

Review of Design (ROD)

The verification of physical requirements will be performed by review of drawings, circuit diagrams etc. Commentary: Example ⇒ Correct use of shielded wires, twisted wires, twisting rate, shield grounding, grounding diagrams.

9.5.6.1.3

Inspection (INS)

Verification by inspection will be accomplished to satisfy requirements such as: −

Conformance of drawings

−

Workmanship

−

Use of proper parts and materials

Commentary: Example ⇒ Use of correct wire and cable types, minimum distance between different wire classes for harness routing.

9.5.6.1.4

Test (T), (DT), (QT), (AT)

Several kind of testing will be used for verification of requirements during the different stages of the subsystem equipment project.

9.5.6.1.4.1

Development testing (DT)

Development testing is performed to substantiate analyses and to verify: −

Conformance characteristics

−

Safety Margins

−

Failure Modes.

The development tests will not be performed to formal test procedures. Breadboards and engineering models that must be of flight configuration in all the important electrical aspects will be used for these tests.

9.5.6.1.4.2

Qualification Testing (QT)

Formal qualification testing will be fully documented. Test data will be recorded on data sheets that are an integral part of the formal test procedures utilised for verification of the subsystem equipment. The EMC qualification test sequence is outlined below: −

Bonding

−

Isolation

−

Grounding and conductivity test of space exposed surfaces

−

Conducted emission

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

−

Conducted susceptibility

−

Radiated emission

−

Radiated susceptibility

−

ESD.

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-49/65

Note: Electrostatic susceptibility tests can be waived if they are critical for the health of the units.

9.5.6.1.4.3

Acceptance testing (AT)

Acceptance testing are conducted to prove that the subsystem equipment design is like the design that was qualified, to demonstrate that the workmanship used meets the required standards and to demonstrate that the subsystem equipment meets the specification requirements. Formal acceptance testing will also be fully documented as required for qualification testing. This test shall be accomplished on all FM hardware. Acceptance level testing shall comprise the verification of: −

Bonding

−

Isolation

−

Grounding and conductivity test of space exposed surfaces

−

Conducted emission

−

Conducted susceptibility

−

ESD.

Note: Electrostatic susceptibility tests can be waived if they are critical for the health of the units.

9.5.6.1.5

Similarity Assessment (SIM)

Similarity verification will be accomplished for equipment/components where proof exists that it was previously qualified to the same, or more severe, environment. Commentary: Example ⇒ A qualified pressure transducer used in an earlier mission and still manufactured can be verified by similarity.

9.5.6.1.6

Verification Matrix

Verification Method

Verification Phase

1: Similarity

A.

Design

2: Analysis

B.

Development

3: Inspection

C.

Qualification

4: Review

D.

Acceptance

5: Test It is responsibility of the Prime Contractor and/or the relevant Subcontractor to complete the matrix in Table 9.5.6-1 in accordance with the requirements of the previous section and to submit it to ESA for approval. The Prime Contractor is responsible to provide an overall verification matrix at subsystem level for approval by ESA.

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

EMC Performance Requirement Reference

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

Verification Methods N/A

A

B

C

PAGE : 9-50/65

Document Reference and Remarks D

Table 9.5.6-1: Example of Verification Matrix

9.5.6.2

Test Facility and Test Instrumentation Requirements

The test shall be performed following the applicable requirements contained in this section. Any condition, method not covered by these requirements or deviation to them shall be agreed with the prime. #

Reference IIDA-DV-REQ-0345

The actual test condition and methods selected for the test in question shall be described and documented in the relevant test documentation. #

9.5.6.2.1 #

*

Ambient Electromagnetic Levels

Reference IIDA-DV-REQ-0350

Ambient conducted and radiated emission levels shall be measured prior to test and shall be at least 6 dB below the applicable limits. These measurements shall be performed with the test article turned off and with all the auxiliary equipment turned on. Ambient levels on power leads shall be measured with the leads disconnected from the test article and connected to a resistive load which draws the same current as the test article. The LISN shall be included in the test set-up.

9.5.6.2.2 #

#

*

#

*

Test Site Conditions

Reference IIDA-DV-REQ-0355

Testing shall be performed under the following atmospheric conditions where possible: −

Temperature

19° C to 26° C

−

Pressure

813 to 1040 hPa

−

Relative humidity

20% to 80%

Restriction as required by the ESA (e.g. Cleanliness class) might be added to those requirements.

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

9.5.6.2.3 #

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-51/65

Shielded Enclosures

Reference IIDA-DV-REQ-0360

Shielded enclosures shall be of sufficient size to adequately accept the test article without sacrificing test accuracy or requiring deviation from the methods specified herein. #

9.5.6.2.4 #

*

RF Absorber Material

Reference IIDA-DV-REQ-0365

RF absorber material shall be used in shielded enclosures to reduce reflections from the surface of the enclosure to the measurement antennas. #

9.5.6.2.5 #

*

Ground Plane

Reference IIDA-DV-REQ-0370

A solid plate ground plane shall be used. It shall have a minimum thickness of 0.25 mm for copper or 0.63 mm for brass and be 2.25 m2 or larger in area with the smaller side no less than 76 cm in length. When testing is performed in a shielded enclosure, the ground plane shall be bonded to the shielded room such that the DC bonding resistance shall not exceed 2.5 mΩ. In addition, the bonds shall be placed at distances no greater than 90 cm apart. For large test articles mounted on a metal test stand, the test stand shall be considered a part of the ground plane for testing purposes and shall be bonded accordingly. #

9.5.6.3

*

Measuring Equipment/Instrumentation

This section describes the test equipment and instrumentation used in the test methods contained in this document. Any other instruments that are capable of measuring the parameters of this specification may be used, after approval by the prime. In any case, the actual characteristics of the instrumentation used (factors, useful bandwidths, accuracy, sweep speeds etc) shall be listed in the test documentation.

9.5.6.3.1

Measurement Receivers / Spectrum Analysers.

Any frequency selective receiver can be used to perform the testing described in this document. The receiver characteristics (i.e. sensitivity, selection of the bandwidths, detector functions dynamic range and frequency of operations) shall meet the requirements specified in this standard and shall be sufficient to demonstrate compliance with the applicable limits. Concerning the use of spectrum analysers, they can be used when overloading protection is provided by means of pre-selection input filters. Commentary: In EMI testing, one of the most important considerations is preventing saturation of the spectrum analyser because spurious responses can be created within the instrument. A solution is to use a band-pass or tracking pre-selector that will greatly increase the analyser’s tolerance to broadband overload. These pre-selectors will virtually eliminate multiple and image responses. For these reasons, EMI receivers are preferred but spectrum analysers are allowed if input pre-selectors are used. Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

9.5.6.3.2

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-52/65

Computer Controlled Receivers

A detailed description of the operations that are directed by software for computer controlled receivers, shall be included in the test plan. Verification techniques used to demonstrate proper performance of the software shall also be included.

9.5.6.3.3 #

Detector Function

Reference IIDA-DV-REQ-0375

A peak detector shall be used for all emission and susceptibility measurements. This device shall detect the peak value of the modulation envelope in the receiver band-pass. The output of the measurement receiver shall be calibrated in terms of equivalent root mean square (RMS) value of a sine wave with the same peak value. When other measurement devices such as oscilloscopes, non-selective voltmeters etc are used for testing, correction factors shall be applied for modulated test signals to correct the reading to equivalent RMS values under the peak of the modulation envelope. #

9.5.6.3.4

*

Current Probes

The current probe transfer impedance which is defined as the ratio between secondary voltage across a 50 Ω load to the primary current shall be determined using the following procedure: Terminate the signal generator with a short length of wire (20 cm) and a 50 Ω non-inductive resistor. The primary current Ip can be calculated. Clamp the current probe around the wire between the signal generator and the 50 Ω load. Connect the current probe to a receiver (50 Ω input impedance) and measure the secondary voltage Vs. The transfer impedance is Zt = Vs/ Ip #

Reference IIDA-DV-REQ-0380

The transfer impedance of the current probe shall be included in the Test Procedure and Test Report. Any current probe capable of measuring to the limits specified in this document may be used. The current probe shall be located not more than 5 cm apart from the test article. #

9.5.6.3.5 #

*

Test Antennas

Reference IIDA-DV-REQ-0385

Antennas used in performing the radiated emission and susceptibility tests shall be listed in the EMI test procedure. #

*

The following antenna characteristics are recommended: −

30 Hz – 50 kHz, (RE01): Sensors that measure only magnetic fields •

a): Electrically small loops, whose impedance shall not resonate over the frequency range of use.

•

b): Active magnetic sensors, which sense amplitude as opposed to the time derivative of the amplitude.

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-53/65

−

14 kHz – 30 MHz, (RE02): Electrically short high impedance electric field probe, vertically polarised. Traditionally the 41’’ rod with active or passive matching network to 50 Ω has been used.

−

14 kHz – 30 MHz, (RS03): The parallel plate (and its numerous modifications), long wire, and E-Field generator are available and listed in order of preference. The E-Field generator should be reserved for the case in which the test article is too large for other methods.

−

30 MHz – 200 MHz, (RE02/RS03): Dipole-like antennas. Typical antenna used in this band has been the bi-conical. Care should be exercised in the antenna selection to ascertain that the balun does an adequate job of matching the low frequency high antenna impedance to 50 Ω.

−

200 MHz – 1 GHz, (RE02, RS03): The traditional Log-Periodic and Log-Conical are available. The double ridge horn can also be used, although the gain increases dramatically with the frequency. In this case, accurate calibration of the double ridge horn shall be proven and included in the EMC Test procedure.

−

1 GHz – 10 GHz, (RE02/RS03): Broadband (ridged) or standard gain horn. Log-Conicals are also available.

−

10 GHz and above (RE02/RS03): 20 dB standard gain horns.

9.5.6.3.6 #

REFERENCE :

Test Antenna Counterpoise (Monopole):

Reference IIDA-DV-REQ-0390

The following requirements shall be used when rod antennas that require a counterpoise are used. The test antenna counterpoise shall be referenced to the same ground reference used for the Electromagnetic Interference (EMI) meters. In shielded enclosures, the counterpoise shall be bonded to the reference ground plane. The bonding strap shall be a solid metal sheet having the same width as the counterpoise, welded along the entire edge at the points of contact. Alternatively, the counterpoise shall be clamped and/or soldered to the ground plane in two places. If desired, the counterpoise may be configured so that one dimension is of adequate length to reach the test article ground plane. #

9.5.6.3.7

*

Impulse generators

Impulse generators shall conform to the above requirements: −

Calibrated in terms of output to a 50 Ω load.

−

Spectrum shall be flat over its frequency range with an amplitude accuracy of ± 1 dB within the frequency band being displayed by the spectrum analyser.

9.5.6.3.8 #

Standard Laboratory Equipment (SLE)

Reference IIDA-DV-REQ-0395

All SLE shall be operated as prescribed by the applicable instruction manual unless otherwise specified therein. This requirements document shall take precedence in the event of conflict with instruction manuals or other documents issued by industry or other Agencies unless identified in an approved test plan. For test repeatability, all test parameters used to configure the test shall be recorded in the EMI test plan and the EMI test report. These parameters shall include measurement bandwidths, video bandwidths, sweep speeds etc. #

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

*

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

9.5.6.3.9

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-54/65

Power Supply Characteristics

Power supplies for test articles requiring a power source for their operation, supplied or not as part of the test article Electrical Ground Support Equipment (EGSE), shall have characteristics and tolerances as specified in the test article detailed specification measured at the test article input.

9.5.6.3.10 #

Signal Sources

Reference IIDA-DV-REQ-0400

Any commercially available signal source, power amplifier and general purpose amplifier capable of supplying the power required to develop the susceptibility level specified herein, may be used provided the following requirements are met: −

Frequency accuracy shall be within ± 2%.

−

Amplitude accuracy shall be within ± 2 dB.

−

Harmonic content and spurious outputs shall be no more that –30 dB as related to fundamental power level. #

9.5.6.3.11 #

*

Test Article Electrical Ground Support Equipment (EGSE)

Reference IIDA-DV-REQ-0405

The EGSE shall simulate the actual loads of the test article using the actual interface required in flight. Grounding techniques different from those approved are forbidden. The EGSE shall not interfere or cause EMI to the normal test article operations and shall withstand without malfunctions the environment in which it shall operate. Whenever possible, during the EMC tests the EGSE shall be located outside the shielded test enclosure area in an adjacent, attached shielded enclosure. #

9.5.6.4

Measurement Requirements

9.5.6.4.1

Measuring Equipment Calibration

#

*

Reference IIDA-DV-REQ-0410

Measuring instruments and accessories used in determining compliance with this document shall be calibrated under an approved program in accordance with MIL-STD-45662A. #

9.5.6.4.2 #

*

Measurement Accuracy

Reference IIDA-DV-REQ-0415

All test equipment (SLE, EGSE etc) shall be capable of measuring to within the following accuracy: −

2% for frequency

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

−

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-55/65

3 dB for amplitude #

9.5.6.4.3

*

Measurement Bandwidths

Narrow-band ranges for each tuned frequency range are listed in Table 9.5.7-1 below: Tuned Frequency (Hz)

Bandwidth Range (Hz)

30 – 300

1 – 30

300 – 3 k

5 – 50

3k – 30 k

10 – 500

30k – 1M

300 – 5k

1M – 30 M

1k – 50 k

30M – 1G

1k – 100 k

1G – 40G

100k – 50 M

Table 9.5.7-1: Narrow-band range for each tuned frequency range N.B. For conducted emission 30 Hz to 15 kHz (CE01) range the limit shall be measured with an effective bandwidth not exceeding 100 Hz.

9.5.6.4.4

Measurement frequency range

A continuous scan and recording of the specified frequency range for each applicable test shall be performed.

9.5.6.4.5

Susceptibility Frequency Range

Whether the interference shall be applied as continuous swept or as discrete frequencies shall be determined on the basis of the susceptibility criteria. When acceptable, discrete frequencies and their number/decade shall be approved by the prime.

9.5.6.5

Test set-up arrangement.

9.5.6.5.1

Isolation

Test instruments shall use an isolation transformer on the AC power lines and a separate ground cable to the central ground point. The ground cable shall consist of a braided cable.

9.5.6.5.2 #

Test Article Arrangement

Reference IIDA-DV-REQ-0420

Interconnecting cable assemblies and supporting structures shall simulate actual installation and usage. Shielded leads shall not be used in the test set up unless they have been specified in approved installation drawings. Diagrams of all cables that interconnect the test article showing all conductors, shielded and Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-56/65

unshielded, shall be included in both the EMC test plan and EMC test report. In the event that the as-run procedure is included as an appendix to the test report, the cable diagrams in the test procedure will satisfy the requirement. Cables and test article shall be so arranged that there is minimum shielding interposed between the test article cables and the measurement antennas. All leads and cables shall be located within 10 cm from the ground plane edge nearest the measurement antenna and shall be supported at least 5 cm above the ground plane on non-conductive spacers. #

9.5.6.6

*

Test Harness

The test article shall be connected to the relevant EGSE and SLE via dedicated cabling, which consist of: −

Standard Cabling

−

Additional Cabling

−

Connector Savers

9.5.6.6.1

Standard Cabling

The standard cabling shall implement the connection between the test article and its interfaces, simulated by the EGSE and SLE. It shall be identical to the respective flight cabling for the following aspects: −

Number and type of wires.

−

Shielding termination

−

Over-shielding and termination

The adopted shielding termination technology shall be agreed with ESA. In particular, shield disconnection shall be possible.

9.5.6.6.2

Additional Cabling

The additional cabling shall be interposed between the test article and the standard cabling as required by test methods. This cabling shall be configured as necessary to accommodate test needs (probe insertion, LISN insertion, etc) while maintaining the standard cabling configuration for all the other cables that are not involved.

9.5.6.6.3

Connector Savers

The type of connector savers shall be agreed with ESA. They shall not impair the shielding effectiveness of the standard cabling.

9.5.6.6.4

Shock and Vibration Isolators

If the test article is mounted on a base with shock or vibration isolators in the operational installation, the test set up shall include such mounting provisions. Bonding hardware and application for the test article shall be identical to the approved installation drawing. If no provisions for bond strap are made on the installation drawings, then no bond straps shall be used during testing.

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

9.5.6.7

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-57/65

Test Article loading

The test article shall be loaded with the full mechanical and electrical load or equivalent for which it is designed. If worst case EMI condition exist at a reduced load, the test shall include the reduced level loads as well as the full load.

9.5.6.7.1

Representative loading

The loads used shall simulate the impedance of the actual load. Mechanical devices, if any, shall also be operated under load. The test article shall be actuated by the same means as in the installation. As an example, if a solenoid is actuated through a silicon-controlled rectifier (SCR), a toggle switch shall not be used to operate the solenoid for the test.

9.5.6.7.2

Signal Inputs

Actual or simulated signal inputs and software required to activate, utilise or operate a representative set of all circuits shall be used during emission and susceptibility testing.

9.5.6.7.3

Source/Loads for Communication-Electronics Test Articles

All RF outputs of communication electronics test article shall be terminated with shielded dummy loads as appropriate for the test article and the test being performed to produce maximum normal output. At the frequencies of concern, the Voltage Standing Wave Ratio (VSWR) of the resistive dummy loads, attenuators, directional couplers, samplers, power dividers and the internal standard impedance of the signal generators shall not be greater than: −

Transmitter Loads ⇒ 1.5:1

−

All other dummy loads and pads ⇒ 1.3:1

−

Standard signal generators ⇒ 1.3:1

9.5.6.8

Measurement Antenna Position

9.5.6.8.1

Location

#

Reference IIDA-DV-REQ-0425

When performing radiated emission and susceptibility tests, no points of the antennas shall be less than 1 m from the walls, ceiling or floors of the shielded enclosure or obstruction. #

9.5.6.8.2

*

Biconical Antenna

A minimum distance of 30 cm from the floor and ceiling and 1 m from the walls of the shielding enclosure or obstruction can be accepted when the biconical antenna is used in vertical polarisation.

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

9.5.6.8.3 #

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-58/65

Linearly polarised antennas

Reference IIDA-DV-REQ-0430

For radiated emission measurements above 30 MHz, linearly polarised antennas shall be positioned to measure the vertical and horizontal components of the emission For radiated susceptibility measurements above 30 MHz, linearly polarised test antennas shall be positioned so as to generate vertical and horizontal fields. #

9.5.6.9 #

*

Line Impedance Stabilisation Network (LISN)

Reference IIDA-DV-REQ-0435

In order to reproduce the system power bus impedance and to standardise the measurement conditions used in different test sites, emissions and susceptibility measurements on primary power lines shall be performed on inserting a Line Stabilisation Network (LISN) between the EGSE power supply and the unit under test. The LISN schematic and the relevant impedance versus frequency are given in Fig. 9.5.6-1 and Fig. 9.5.6-2 shall be used.

#

*

Figure 9.5.6-1: LISN schematic

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-59/65

2

10

50 Ohm

Impedance Amplitude (Ohms)

1

10

125 mOhm

0

10

-1

10

2

10

4

6

10

10 Frequency (Hz)

8

10

10

10

Figure 9.5.6-2:Output impedance of the LISN with shorted input terminals

9.5.6.10

Test Configuration and Operation Requirements

9.5.6.10.1

Test Article Operations

#

Reference IIDA-DV-REQ-0440

For a representative set of all modes of operation, controls on the EUT shall be operated and adjusted as prescribed in the instruction manuals or as required by the test article specification in order to obtain optimum design performance. For susceptibility testing, the expected most susceptible modes shall be selected. For emission noise, the noisier modes shall be selected. #

9.5.6.10.2

*

Input Voltage Selection

Except when specified differently, the voltage at the test article input power leads shall be selected as the worst case value with respect to the test within the nominal voltage range.

9.5.6.10.3

Interface Signal Operation

Interface signal of the test article shall be active during testing as required by operations defined in paragraph 9.5.6.10.1.

9.5.6.10.4 #

Susceptibility Criteria

Reference IIDA-DV-REQ-0445

The threshold of susceptibility shall be determined for test articles unable to meet the susceptibility criteria. #

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

*

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

9.5.6.10.5 #

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-60/65

Time Duration

Reference IIDA-DV-REQ-0450

Each susceptibility level shall be maintained for a minimum time in order to ensure that possible susceptibility conditions are achievable and detectable. #

9.5.6.10.6

*

Test Equipment Warm-up time.

Prior to performing tests, the measuring equipment shall have been switched on for a period of time adequate to allow parameter stabilisation. If the operation manual does not specify a specific warm up time, the minimum warm up period shall be 1 hour.

9.5.6.11

Bonding, Isolation and Grounding/Conductivity Tests

These tests are carried out to demonstrate compliance with the required instrument performance.

9.5.6.12

Conducted Emission Tests

The suggested test set-ups for CEDM and CECM are shown in figure 9.5.6-3. to spectrum analyser

to spectrum analyser

IDM

ICM/2

HF probe

ICM/2

HF probe

IDM

Figure 9.5.6-3: Conducted Emission - Test set-up for DM and CM

9.5.6.13

Conducted Susceptibility Tests

The test set-up for differential mode susceptibility on primary power lines is shown in Figure 9.5.6-4 for frequencies up to 50kHz. For the frequency range 50kHz-50MHz then the test set-ups shown in Figure 9.5.6-5 or Figure 9.5.6-6 should be used. The injected voltage relevant to the susceptibility threshold shall be monitored and recorded. The injected current shall be limited to 1 Ar.m.s on the input power lines.

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-61/65

Figure 9.5.6-4: Conducted susceptibility on primary power lines, differential mode. Frequency domain 30Hz-50kHz

Note: Coupling Capacitor C 50kHz-1MHz - 1uF 1MHz-50MHz - 0.1uF or use R.F. Coupler

Ground Plane

Signal Lines C

EGSE Primary Power

Generator

+ve -ve

Amplifier

Isolation Transformer

Oscilloscope

Figure 9.5.6-5: Conducted susceptibility on primary power lines, differential mode. Frequency domain 50kHz-50MHz

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

Signal Generator

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-62/65

Amplifier

Injection probe Power Supply

Equipment Under Test

LISN (power return grounded at input)

(performance monitor for degradation or deviation)

Oscilloscope (voltage measured with differential input or differential probe)

Figure 9.5.6-6: Conducted susceptibility on primary power lines, differential mode. Frequency domain 50kHz-50MHz The text set-up for common mode susceptibility on primary power lines and on signal bundles is shown in Figure 9.5.6-7. The signal lines shall be loaded with electrical simulators of the interfacing circuits. Signal Generator

Amplifier

Injection probe Power Supply

Equipment Under Test

LISN (power return grounded at input)

(performance monitor for degradation or deviation)

Oscilloscope (voltage measured with differential input or differential probe)

Figure 9.5.6-7 Conducted susceptibility on primary power lines and signal bundles. Common mode, frequency domain 10kHz-50MHz The test set-up for common mode conducted susceptibility between the subsystem equipment signal reference and the ground plane (transient and steady state) is shown in Figure 9.5.6-8 (externally accessible ground wire) and Figure 9.5.6-9 (no accessible ground wire).

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-63/65

Figure 9.5.6-8; Conducted susceptibility, common mode between signal reference and ground, transient and steady state, externally accessible ground wire

Figure 9.5.6-9: Conducted susceptibility, common mode between signal reference and ground, transient and steady state, no accessible ground wire

9.5.6.14 #

Radiated Emission Tests

Reference IIDA-DV-REQ-0455

The suggested test set-up is as shown in Figure 9.5.6-10. The emission at the antenna at one metre distance from the test object, which gives the highest reading, shall be the Radiated Electric Field Emission (REE). Above 30 MHz, the requirement shall be met for both horizontally and vertically polarised waves. The upper frequency range of the measurement shall be in accordance with the following Table 9.5.6-2. Tenth harmonic of highest operating frequency of equipment

Required Upper Limit

< 1 GHz

1 GHz

> 1 GHz

18 GHz

Table 9.5.6-2: Radiated E-Field Frequency Range for Emission Test

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-64/65

Figure 9.5.6-10: Radiated Emission E-Field Test #

Reference IIDA-DV-REQ-0460

The Radiated Emission E-field in the notch defined to protect the spacecraft TC band shall be tested for all equipment involving high frequency (> 10 MHz) clocks or signals. #

9.5.6.15

*

Electro Static discharge ESD Tests

Figure 9.5.6-11 contains a suggested arc source schematic capable of establishing the required discharge. The discharge circuit must be adjusted in order to get the energy and the voltage specified in paragraph 5.14.3.11. Any other equivalent type of circuitry (e.g. ESD simulator) can be used and shall be fully described in the relevant plan.

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A SECTION 9

REFERENCE :

SCI-PT-IIDA-04624

DATE :

30/06/2004

ISSUE :

3.3

PAGE : 9-65/65

Figure 9.5.6-11: Arc source schematic capable of generating the discharge A minimum of 10 discharges shall be performed. The discharge shall be a direct discharge of current through the equipment chassis and shall be generated by putting the tip of the gun in contact with the chassis or/and by moving it closer to the chassis until the discharge occurs

9.5.7 Qualification to the Radiation Environment In order to demonstrate compliance of the instrument design with the radiation environment in space, the following requirements shall be satisfied: −

the components and their shielding shall be compatible with the requirements of the radiation environment such that neither Cumulative Effects (Dose / Displacement Damage) neither Single Event Effects will cause failures or produce unacceptable changes in performance,

−

components shall be selected, depending on their type and the effects, according to RD12 (radiation requirements)

−

in the design there shall be included the tools necessary to restore the original performance of the detector systems (curing). It is highly recommended that detectors and associated electronics are exposed to a simulated radiation environment with the objectives of establishing preliminary curing procedures and determining realistic performance predictions.

−

Single Event Effects such as SEU (logic devices) or SET (linear bipolar devices and digital optocouplers) shall not result in failure propagation outside the instruments.

Référence Fichier :IID-A-09-3-3.doc du 13/07/2004 10:35

Référence du modèle : DOORS - Modèle de page seule_v79.dot

Reproduction interdite

© ALCATEL SPACE

Company confidential

IID-A Section 10

Reference :

SCI-PT-IIDA-04624

Date :

30/06/2004

Issue :

3.3

PAGE : 10-1/23

10 MANAGEMENT, PROGRAMME, SCHEDULE 10.1 General A major constraint of ESA’s Herschel/Planck programme is to implement a mission, which meets its scientific objectives within the defined financial envelope. In order to meet these constraints, it is ESA’s policy to minimise the spacecraft development risks by using as far as possible off the shelf hardware and to minimise the risks by following a properly phased design, development and verification programme. However, the programme may also be extremely vulnerable to potential payload problems. It is therefore essential that the PI adheres to the requirements established in this chapter. These requirements address: §

the management structure of the instrument team, to ensure that an efficient organisational structure is established which will perform the design, development and verification of the instrument within the constraints of the programme

§

project control processes to ensure that the work to be performed is adequately scoped and scheduled, and that appropriate configuration management principles are implemented

§

regular reviews and reporting to provide an assessment of the completion status of the instruments and early identification of potential risks which may impact the performance of the instruments, the satellite interfaces and resources, and the schedule of deliverables

§

the definition of deliverables as a working basis for spacecraft development and implementation

§

the Herschel/Planck programme baseline schedule to synchronise due dates of deliverables.

10.2 Management

10.2.1

ESA Responsibilities

The overall management of the implementation and execution of the Herschel/Planck programme will be under the responsibility of the ESA Project Manager (PM) located at ESTEC, Noordwijk, The Netherlands. He will have overall responsibility for the implementation and execution of all technical and programmatic aspects including: - Spacecraft development, integration and test - Launch - Initial Orbit Phase - Spacecraft/Instrument Commissioning Phase The ESA PM will be directly supported in the execution of the programme by an ESA Project Office located at ESTEC. All scientific aspects of the programme will be co-ordinated by the ESA Herschel/Planck Project Scientists (PS’s), who are the formal interface for scientific matters. The ESA Space Science Department will be responsible for the Herschel/Planck scientific operations after successful completion of the Spacecraft/Instrument Commissioning Phase.

IID-A Section 10 10.2.2

Reference :

SCI-PT-IIDA-04624

Date :

30/06/2004

Issue :

3.3

PAGE : 10-2/23

ESA Organisation

Under the responsibility of the ESA PM, a formal ESA Project Office structure will be implemented, which will include the following disciplines: - System Engineering - Spacecraft Engineering - Payload Engineering - Overall Spacecraft Assembly, Integration and Verification - Mission Operations - Product Assurance Within the Payload Engineering, a group of engineers will be the interface on the ESA side between the Project Office and the Principal Investigator (PI) team, and will: -

Co-ordinate with the Pl and his/her team on all matters pertaining to their instrument

-

control the programmatic and technical interfaces as defined in the (to be) approved Instrument Interface Documents (AD 04,05,06,07,08)

-

ensure that the Project Office is fully cognisant of the PI’s needs on the spacecraft and mission design

-

assist the PI’s from the Project Office’s side in resolution of technical or programmatic problems as appropriate, and pursue formal approval of possible changes

-

witness the pre-delivery acceptance tests of the instrument on behalf of the ESA using appropriate PI team expertise.

10.2.3

Prime contractor Responsibilities

The ESA intends to delegate to the Prime contractor the responsibility of the management of all technical interfaces of the payload with the spacecraft system including all margins and schedules. In the frame of its responsibilities, the Prime contractor will: •

Design, produce and verify Herschel and Planck spacecraft in compliance with the ESA system requirements and;

•

Deliver in time a flight-worthy Flight Model for both spacecraft including the respective scientific instruments.

As part of its tasks related to instrument interfaces, the Prime contractor and its industrial team will jointly : •

Maintain (update & issue) the Instrument Interface Document (IID) part B, describing each instrument interface data to be used for the spacecraft design, manufacturing and verification, using inputs from each relevant instrument team and after agreement with the relevant PI,

•

Design, develop and verify both spacecraft in compliance with instrument interfaces as specified in each Instrument Interface Document (IID) part B,

•

Produce this Instrument Interface Document (IID) part A, describing each spacecraft interface data to be used for the instrument design, manufacturing and verification.

These activities will be conducted under the supervision of the ESA and according to the rules defined in the ESA prime Contract. In particular, the Prime contractor with participation of the Instrument

IID-A Section 10

Reference :

SCI-PT-IIDA-04624

Date :

30/06/2004

Issue :

3.3

PAGE : 10-3/23

Consortium shall directly manage, define, analyse, verify all technical interfaces (mechanical, thermal, electrical, optical, software, …) between the Instrument and the spacecraft in order to guarantee the compatibility of the instrument with the spacecraft and with the other instruments. Monitoring of the interfaces will be done via a close follow up of the instrument activities, and synchronisation with the satellites developments: technical meetings, teleconferences, exchange of technical documents, analyses of monthly report, reviews, … The agency will approve the IID-B / IID-A, ensure the compliance of these documents with the scientific objectives of the mission and manage the interfaces of the instruments with the ground segment. Industry responsibilities related to instrument interfaces are described in more details in RD10.

10.2.4

Prime contractor Organisation related to instrument interfaces

(refer to RD 100)

Prime contractor Herschel - Planck : Alcatel Herschel / Planck Alcatel Project Manager

HIFI

J.J.Juillet HFI HIFI FPU

Instrument Interface Manager B.Collaudin

Herschel Instruments Manager G.Doubrovik

SPIRE

Planck Instrument Manager J.P.Chambelland

SPIRE FPU Herschel EPLM contractor: ASED

PACS

PACS FPU

SVM contractor: Alenia

Herschel EPLM Project Manager K;Moritz / W.Ruehe

Herschel Planck SVM's Project Manager O.Tornani / P.Musi

Payload engineering manager

System Engineer

E.Hoelzle HIFI FPU Interfaces S.Idler

LFI

M.Sias

Instrument interface engineer

SPIRE FPU Interfaces H.Faas

Marco Cesa

PACS FPU Interfaces D.Schink

Figure 10.2.4-1 Prime contractor organisation related to Instrument interfaces

10.2.5

Principal Investigator Responsibilities

The PI shall represent the single point formal interface for the instrument with the ESA Project Office. It is the overall responsibility of the PI to ensure that the complete instrument programme is implemented and executed in a manner such that the science objectives are achieved within the mission constraints of the approved project.

IID-A Section 10

Reference :

SCI-PT-IIDA-04624

Date :

30/06/2004

Issue :

3.3

PAGE : 10-4/23

Specifically the responsibility of the PI will include:

10.2.5.1 Management -

Taking full responsibility for the instrument at all times and retaining full authority within the instrument team over all aspects related to the procurement and execution of the instrument programme. In this context the PI shall be empowered to take commitments and make decisions on behalf of the other participants in the instrument team.

-

Establishing an efficient and effective managerial scheme to be utilised in all aspects of the instrument project.

-

Organising the efforts, assigning tasks and guiding other members of his/her team

-

The establishment, implementation, analysis and reporting of schedule network planning as required

-

Providing the formal managerial interface of the instrument to ESA Project Office and supporting ESA management requirements (e.g. Instrument progress reviews, Spacecraft and Mission Project reviews, Change procedures, Product Assurance etc.) as required.

10.2.5.2 Scientific -

Attending meetings of the Science Teams and supporting groups as appropriate and taking a full and active part in their work

-

Participation in Herschel/Planck workshops and scientific conferences

-

Publishing scientific results

-

Cooperation with other Herschel/Planck PIs, Guest Observers, Mission and Survey

-

Scientists, or other science colleagues in order to maximise the scientific return of the Herschel/Planck mission.

10.2.5.3 Hardware -

Defining functional requirements of his/her instrument and its ancillary equipment

-

Ensuring the development, construction, testing and delivery of the hardware associated with the instrument. This shall be in accordance with the scientific performance, technical and programmatic requirements in the (to be) approved IIDs (AD04, 05, 06, 07, 08)

-

Ensuring adequate scientific calibration of all parts of the instrument both on the ground and in orbit

-

Ensuring that the design and construction of necessary hardware, and its development and test programmes are appropriate to the objectives of his/her instrument, and reflect properly the environmental and interface constraints to which the hardware will be subjected during the complete mission

-

To ensure that all procured hardware is compliant with ESA requirements through participation in technical working groups and control boards as requested, to ensure system level compatibility to be maintained.

IID-A Section 10

Reference :

SCI-PT-IIDA-04624

Date :

30/06/2004

Issue :

3.3

PAGE : 10-5/23

10.2.5.4 Software -

To ensure the development, testing and documenting of all software necessary for the control, monitoring, testing, operation and data retrieval of his/her instrument

-

To ensure the delivery of such software and its documentation to ESA or elsewhere, as requested in due time, to support each project phase such as Assembly, Integration, Verification (AIV), Launch and Flight Operations

-

To ensure that all instrument software that interfaces with the project is compliant with ESA requirements

10.2.5.5 Documentation -

Providing all required analysis and documentation as specified in the IIDs (AD 04,05,06,07,08).

10.2.5.6 Product Assurance -

Providing Product Assurance functions that are compliant with the requirements in AD 19.

10.2.5.7 Data Processing and Dissemination -

Ensuring that calibrated data of the instrument is made available in due time for payload operations and planning as agreed by the Herschel/Planck Science Teams.

-

Generation of retrieval and processing software that will ensure accessibility of the data generated by the instrument to Guest Observers and/or users of data banks.

-

Making data and scientific results available to ESA in a timely manner and in a form suitable for public relations purposes (also for general public) as and when required.

-

Provision of due acknowledgement to ESA in all published material

10.2.6

Instrument Team Organisation

The PI shall establish a detailed organisation chart for his/her team with defined named responsibilities clearly showing that all aspects of the instrument are efficiently covered by the appropriate expertise. Co-investigators shall be identified in the organisation chart. Managerially team members shall have no FORMAL interface with ESA and shall communicate formally to ESA via the PI. Key personnel, including technical Instrument Managers, should be identified within the management scheme together with a short description of their tasks and functions.

10.2.7

Formal Communication

10.2.7.1 Principal Investigators All FORMAL communication and agreements concerning technical and programmatic aspects shall be agreed between the PI, the Prime contractor PM and are to be approved of ESA PM.

IID-A Section 10

Reference :

SCI-PT-IIDA-04624

Date :

30/06/2004

Issue :

3.3

PAGE : 10-6/23

All formal communication and agreements concerning scientific aspects shall be made between the PI and the ESA PS.

10.2.7.2 Communication with ESA Contractors All communication between PI’s and the Spacecraft Prime Contractor shall be conducted directly, with copy to the ESA Project Manager.

10.2.7.3 Communication with ESA Departments Contacts with ESA departments concerning all non-scientific aspects of the instrument controlled by the PI/ESA agreement including post-launch activities shall be via the ESA Project Office. This does not apply for direct, separate contracts outside the PI/ESA agreement.

10.2.8

Financing

PI’s shall at all times be responsible for the funding arrangements of their instruments and the management thereof. PI’s shall not assume any funding from ESA for any part of their instrument. Should, for programmatic or technical reasons, a PI requests to use an ESA facility, then the use will be charged to the PI. This requirement shall apply up to the point of final acceptance of the instrument by ESA.

10.3 Project Control

10.3.1

Project Control Objectives

In order to manage the overall Herschel/Planck programme, the Principal Investigator (PI) will implement project control systems and procedures focusing on the definition, maintenance and reporting of schedule, costs, and configuration information. The objective of this section is to clearly specify the management information required from each Instrument Team. Due to the importance of the instruments in the programme, it is critical that each PI supports this scheme with relevant schedule and configuration information. In case the Principal Investigator feels that the spirit of the requirement could be met by a more appropriate approach, he should propose alternatives which will be reviewed by ESA.

10.3.2

Project Breakdown Structures

In order to clearly identify the instrument, the scope of the work and the responsibilities involved, the following structures will be created by the Instrument Team: -

the Product Tree (PT) to break down the instrument into its components, both hardware and software

-

the Work Breakdown Structure (WBS) to define the scope of the work and the responsibilities of the Co-I’s involved.

Product Tree:

IID-A Section 10

Reference :

SCI-PT-IIDA-04624

Date :

30/06/2004

Issue :

3.3

PAGE : 10-7/23

A Product Tree shall be developed by the PI, depicting a product oriented breakdown of the instrument into successive levels of detail. The Product Tree shall be submitted to ESA. Work Breakdown Structure: A Work Breakdown Structure shall be developed by the PI, based on its agreed Product Tree and extending the applicable elements to include appropriate development models and support functions necessary to produce all the deliverables. For each Work Package, the PI shall complete a Work Package Description (WPD). The PI shall ensure all the responsibilities assigned to manage or to perform all the Work Packages are identified in the instrument team organisation chart (see section 10.1). The WBS shall be submitted to ESA.

10.4 Schedule Control

10.4.1

Baseline Master Schedule

The PI shall establish and submit to ESA, a Baseline Master Schedule covering all the instrument programme activities identified in the Work Breakdown Structure. All milestones specified by ESA, shall be included in the schedule and be agreed by the Instrument Team. The PI shall identify additional milestones as required and agree them with ESA. All interfaces, such as procurement items, hardware deliveries, reviews, etc. shall be clearly identified. The schedule shall reflect the result of detailed task analysis and critical review of all the activities associated with the instrument programme. It shall contain all activity interdependencies, durations and constraints. Directly from the Baseline Master Schedule, a set of bar charts shall be created, covering: - Overall instrument programme - Individual instrument models - Instrument model integration and testing - Detailed bar chart of critical activities Changes to the Baseline Master Schedule shall only be made with the approval of ESA.

10.4.2

Schedule Monitoring

The PI shall continuously record progress achieved and maintain forecasts. The PI shall consolidate the progress and forecasts of all groups contributing to the instrument and compare schedule performance with respect to the overall Baseline Master Schedule. Where deviations to the baseline have occurred or are predicted, the PI shall develop and implement corrective actions.

10.4.3

Schedule Reporting

In order to track the progress, the PI shall provide to the prime contractor and to ESA, the following schedule reports as part of the reporting procedure (see section 10.10): - on a monthly basis:

IID-A Section 10 -

Reference :

SCI-PT-IIDA-04624

Date :

30/06/2004

Issue :

3.3

PAGE : 10-8/23

Quick Look Report

- additionally, on a quarterly basis, progressed bar charts showing: -

a summary of the whole instrument project

-

a summary of each constituent and each organisation

-

details of the next 6 months period.

During the manufacture and test phases the frequency of schedule reports may be increased should the ESA judge progress to be critical.

10.5 Configuration Management

10.5.1

Objectives

The objectives of Configuration Management are to establish: -

a configuration identification baseline system which defines through approved specifications, interface documents and associated data the requirements for the instrument

-

a configuration control system which controls all the changes to the identified configuration of the instrument

-

a configuration accounting system which documents all changes to the baseline configurations, maintains an accurate record of configuration change incorporation, and ensures conformity between the end item As Built Configuration (ABCL) and its appropriate design and qualification identification (CIDL including waivers).

10.5.2

Responsibilities

The PI shall be responsible for managing the configuration of his/her instrument and the lower level products of which it consists. For this purpose, he shall set up the necessary organisation and means for satisfying the objectives and requirements of configuration management. The PI shall also impose configuration management requirements on contractors and suppliers as appropriate for the items being provided to the instrument. For this purpose, the PI shall ensure compatibility between his/her own configuration management and the one implemented by all other participants to his/her instrument programme. The PI shall be responsible for the implementation and operation of a Configuration Control Board (CCB) at his/her level.

10.5.3

Configuration Identification

The configuration baseline shall be established with respect to requirements, design and verification. The baseline shall include: - Instrument System Specification - Instrument System Support Specification - Interface Control Documents - Design Analysis documents - Design Specification

IID-A Section 10

Reference :

SCI-PT-IIDA-04624

Date :

30/06/2004

Issue :

3.3

PAGE : 10-9/23

- Drawings (Design and manufacturing) - Manufacturing Procedures - Alignment Plan - Parts, Materials and Process lists - Verification test plan. The configuration baseline shall be established and reviewed at each Instrument Review. It may also be established and reviewed as required at selected intermediate stages. The "as designed" baseline shall be finalised at the Instrument Hardware Design Review. Verification documents including design analyses and test reports shall make reference to the configuration status of the design or the hardware or software being evaluated.

10.6 Configuration Control

10.6.1

Instrument Internal Configuration Control

As a Herschel/Planck part of the management structure, the PI shall set up a configuration control procedure for his/her instrument in such a manner that the status of all aspects of the instrument such as the design and manufacturing of hardware and development of software can be unambiguously defined at any time. The control procedure shall allow ESA, to conduct a configuration audit at any point in the programme in order to obtain the up-to-date status of the instrument.

10.6.2

IID Configuration Control

The requirements defined in the IID Part A and Bs (AD 04,05,06,07,08) will be subject to configuration control and shall reflect the up to date agreed configuration baseline between ESA, prime contractor and the PI. Changes to these documents shall be handled using the Engineering Change Request (ECR) form. Deviations from the requirements defined in IID A and B will be handled using the Request for Waiver (RFW) form.

10.7 Configuration Status Accounting The current status of all configured documents shall be sent to ESA, as part of the reporting procedure required in section 10.10. Configuration Item Data Lists (CIDL) listing all the documents and their applicable issues and revisions which define the configuration baseline shall be prepared and submitted for each Instrument Review. The PI shall establish and maintain As Built Configuration Lists (ABCL) listing all the documents and their issues and revisions defining the as built configuration. Differences between the as designed baseline and the as built configuration list shall be identified for all qualification and flight hardware and software. The validity of all design verifications, including analyses and tests, shall be assessed for all the differences and modifications from the as designed baseline.

IID-A Section 10

Reference :

SCI-PT-IIDA-04624

Date :

30/06/2004

Issue :

3.3

PAGE : 10-10/23

10.8 Reviews and reporting

10.8.1

General

The technical and programmatic aspects of each instrument programme shall be assessed between ESA, and each Instrument Team through: -

a cycle of formal Instrument Reviews

-

instrument progress meetings

-

regular progress reporting.

The overall scientific performance shall be monitored by ESA, during the review cycle and through the regular progress reporting supplied by the PI. Detailed scientific aspects shall be reviewed within the context of the Herschel/Planck Science Teams, as defined in the Herschel/Planck Science Management Plans. Operations and data processing aspects shall be reviewed according to the Herschel and Planck SIRD’s. (AD 4-1 & 2)

10.8.2

Instrument Reviews

10.8.2.1 General There shall be six major reviews for each instrument selected for the Herschel/Planck mission. The reviews form part of the overall Herschel/Planck review programme. For each of the reviews, a review board will be set-up. The board will consist of ESA Personnel and will be chaired by the Herschel/Planck Payload Manager together with the Project Scientist or their designated representatives. The reviews shall be conducted by ESA, nominally at ESA premises. The objectives will be to ensure that: -

The instrument design will be compatible for achieving the instrument performance.

-

The instrument design complies with the interface requirements of the Instrument Interface Documents (IID’s)

-

The scheduled delivery dates are compliant with the system level programme.

The data package to be reviewed shall cover both the instrument hardware and software together with details of any other deliverables such as MGSE, EGSE, OGSE and documentation and shall be delivered to the ESA Project Team as a minimum twenty working days prior to the scheduled review date. The output of the review shall provide recommendations for consideration by the ESA Project Manager of the Principal Investigator in technical or programmatic areas. Either party shall provide a formal response to such recommendations within one month of review completion. Non-compliance with other system elements will be brought forward to the following system level review for resolution. Following the system level reviews the IID’s will be formally reissued to reflect the results of the review. It is realised that, aside the formal ESA reviews defined in this paper, instruments might want to conduct further instrument reviews, e.g. for internal monitoring of progress, request from funding agencies. In order to avoid duplication of effort combination of instrument internal and formal ESA reviews can be

IID-A Section 10

Reference :

SCI-PT-IIDA-04624

Date :

30/06/2004

Issue :

3.3

PAGE : 10-11/23

envisaged, as long as the objectives of both reviews match. For that reason it is planned to handle the below given dates for reviews in a flexible way, i.e. allowing a bandwidth of several months. The following Instrument Reviews shall be held: -

the Instrument Science Verification Review (ISVR, end 1999 / early 2000 )

-

the Instrument Intermediate Design Review (IIDR, end 2000 / early 2001)

-

the Instrument Baseline Design Review (IBDR, mid/end 2002)

-

the Instrument Hardware Design Review (IHDR, mid/end 2003)

-

The Instrument Qualification Review (IQR, end 2004/Beg 2005)

-

the Instrument Flight Acceptance Review (IFAR, date 3rd quarter 2006)

In addition, Instrument Acceptance Reviews (IAR's) will be held at delivery of each of the instrument models.

10.8.2.2 Instrument Science Verification Review (ISVR) It shall be conducted after instrument selection, in preparation for the release of the ITT for S/C development. The objectives of the review shall be to demonstrate that: -

the instrument conceptual design has been finalised/ i.e. is compatible for achieving the instrument performance

-

the instrument design will achieve the anticipated science objectives

-

the overall interface requirements definition has been finalised

-

the conceptual design for on-board software has been finalised

-

the conceptual design for the necessary MGSE, EGSE and OGSE has been finalised.

10.8.2.3 Instrument Intermediate Design Review (IIDR) It shall be conducted at the time of Prime Contractor selection. The objectives of the review shall be to demonstrate that: -

the instrument detailed system design has been finalised

-

the instrument subsystem design has been finalised

-

the detailed interface requirements have been finalised

-

the design for the on-board software has been finalised (User Requirements Document)

-

the design of the necessary MGSE, EGSE and OGSE has been finalised.

10.8.2.4 Instrument Baseline Design Review (IBDR) It shall be conducted in preparation for the S/C SRR. The objectives of the review shall be:

IID-A Section 10

Reference :

SCI-PT-IIDA-04624

Date :

30/06/2004

Issue :

3.3

PAGE : 10-12/23

-

the freeze of instrument system and subsystem requirements

-

the freeze of the on-board software requirements (Software Requirements Documents)

-

the release for manufacture of instrument Avionics Model (AVM) and Cold Qualification Model (CQM)

-

the freeze of the MGSE, EGSE and OGSE design

-

the release for manufacture of the MGSE, EGSE and OGSE.

10.8.2.5 Instrument Hardware Design Review (IHDR) It shall be conducted in preparation for the S/C AVM/CQM phase. The objectives of the review shall be: -

the assessment of the instrument AVM/CQM programme

-

acceptance of the AVM/CQM models for spacecraft system level

-

the acceptance and freeze of the on-board software (Architectural Design Document)

10.8.2.6 Instrument Qualification Review (IQR) -

Confirmation of instrument hardware and software qualification

-

Assessment of scientific performance and compliance with scientific requirements

-

Completion of instrument design verification and compliance with requirements

-

Identification and confirmation of improvements/modifications for FM

-

Completion of OBSW design and demonstration of functionality

-

Confirmation of EGSE design and demonstration of functionality

-

Confirmation of instrument operability and User Manual

10.8.2.7 Instrument Flight Acceptance Review (IFAR) This review shall be conducted after completion of the spacecraft system level FM electrical verification including on-line compatibility tests with the respective flight operations centres and shall precede the programme level Flight Acceptance Review. The objectives of the review shall be: -

the assessment of the results of the system level FM testing with respect to the instrument

-

the assessment of the completion of qualification of instrument units and subsystems

-

the update of the Instrument Users' Manual as required

-

the close out any outstanding issue.

IID-A Section 10

Reference :

SCI-PT-IIDA-04624

Date :

30/06/2004

Issue :

3.3

PAGE : 10-13/23

10.9 Instrument Progress Meetings Regular Instrument Progress Meetings shall be held nominally on the premises of the PI’s during the design, development and verification programme of the instrument. These meetings will be conducted between ESA, the Prime Contractor and each Instrument Team with the objective of ensuring that the interface technical design integrity of the instrument, its compatibility with the spacecraft system, and instrument programmatics are proceeding in a manner which will not jeopardise the overall programme. The Instrument Team shall be represented by the necessary team to provide the required information, i.e. by the PI, the CO-Is, the Instrument Manager and the Local Project Managers as necessary. The meetings shall be held on a quarterly basis. The frequency may be changed on request of ESA. Detailed technical problems occurring on either side of the interface shall be flagged during these meetings and corrective actions, including their schedule impact, agreed and implemented.

10.10 Reporting The Principal Investigator shall submit to the Prime contractor and to ESA, 5 days after the end of the month, a Monthly Progress Report in which the current status of each activity is described and problem areas or potential problem areas are highlighted together with identification of proposed remedial action. The Monthly Progress Report shall include the following topics: - Overall summary - Design Development and Verification status - PA status - Programmatic status, including schedule reports - Science Performance status - Problem areas and corrective actions. The Monthly Progress Reports submitted will be analysed in conjunction with the overall spacecraft programme by the prime contractor and ESA, and will serve as input to the regular Instrument Progress Meetings. By this monitoring action early alerting to potential conflicts will be communicated back to the PI. In the case of major conflicts ESA and the prime contractor, may call for special schedule meetings to resolve the issue.

10.11 Deliverable Items

10.11.1

Mathematical Models

The PI shall deliver a Structural Mathematical Model (SMM) ,a Thermal Mathematical Model (TMM), an optical model, and a straylight model of his/her instrument units. These instrument mathematical models shall be updated as the design progresses. They will serve as input to the spacecraft mathematical models.

IID-A Section 10 10.11.2

Reference :

SCI-PT-IIDA-04624

Date :

30/06/2004

Issue :

3.3

PAGE : 10-14/23

Instrument Models

10.11.2.1 General The PI shall deliver the instrument models as defined in section 9.2: Warm Electronic Units: After the delivery of the PFM and for the duration of its testing, the AVM shall stay with the PFM for immediate replacement in the case of a failure in a PFM unit for which only spare subassemblies are available. The failed PFM shall be reparable within a period of 30 calendar days. FPU/LOU/ Coolers: For all units where CQM units will be refurbished as flight spares (see para 9.2.1.2), the CQM/FS units will be returned after test to the instrument team and shall be delivered at the defined date. Each delivery shall include, as appropriate, instrument hardware, on-board software and ground support equipment. Each item delivered shall be accompanied by an End Item Data Package. Prior to delivery, each item shall undergo formal acceptance on the basis of mutually agreed acceptance programme witnessed by engineers from ESA, and the spacecraft Prime Contractor. This acceptance shall include as a minimum the formal verification of all interfaces between the instrument and spacecraft together with review of all applicable test reports and supporting analyses and documentation. Shipment of the instrument models and any other equipment required by either ESA or the PI, shall be the financial responsibility of the PI. This responsibility shall extend to return for repair and return of all equipment following launch. The points of delivery of all items will be determined later in the programme and be included in this document. Any insurance deemed necessary by the Principal Investigator for his/her equipment during shipment or whilst on the premises of ESA, its Contractors or on the launch site, shall be the financial responsibility of the Principal Investigator.

10.11.2.2 Instrument Hardware The build standard of each model shall be defined in IID-B and agreed with ESA. The PFM and the FS shall be fully calibrated before delivery. The PI shall support the system level integration and test activities as well as the launch preparation by supplying the GSE and the appropriate manpower and expertise.

10.11.2.3 On-board Software The instrument on-board software shall be delivered together with the corresponding instrument model. The on-board software shall either reside in the instrument in a non volatile memory or be delivered in a format such that it can be loaded through the spacecraft telecommand up-link.

IID-A Section 10

Reference :

SCI-PT-IIDA-04624

Date :

30/06/2004

Issue :

3.3

PAGE : 10-15/23

In addition to the flight software, special test software for instrument diagnostics and failure investigation may be required. The on-board software to be delivered shall comply with the ESA software standard AD 14 and its guide to implementation. The PI remains responsible for the maintenance of the instrument software after delivery up to the end of mission. He shall support the verification of updated instrument software at system level.

10.11.2.4 Ground Support Equipment The PI shall deliver the following ground support equipment together with each instrument model: -

Mechanical Ground Support Equipment (MGSE) necessary to transport, handle and integrate instrument hardware together with appropriate documentation and proof load and calibration certificates,

-

Electrical Ground Support Equipment (EGSE) necessary to stimulate the instrument and to perform quick look analysis of instrument TM during system tests. It shall be designed such that it can be integrated into the system EGSE set-up. The instrument EGSE software to be delivered with the EGSE equipment shall comply with the ESA software standard AD14.

The instrument ground support equipment shall remain at the spacecraft integration site until launch. However, the PI remains responsible for the maintenance of this equipment. The PI shall also provide the necessary manpower and expertise support to integrate the instrument EGSE into the system EGSE.

10.12 Review Data Packages A data package shall be provided for each of the scheduled Instrument reviews, detailed above. The package shall be delivered to the ESA Project Team in electronic form (PDF-file). The packages shall contain the following information to the appropriate level (system, subsystem, unit) as required by the objective of the review and shall be adapted to each specific review. In order to avoid duplication of effort, the project is prepared to discuss and accept on a case by case basis different ways to provide the required information, i.e. either in a self-standing document package (preferred way) or distributed among instrument generated documents and technical notes with a guide identifying the location of the information. Instrument Description Document: -

A description of the current instrument design, its expected performance and interfaces

Instrument Interface Document(s): -

The IID-B updated to the current status

Development Plan/AIV: -

A New/critical technologies demonstration plan

-

The Instrument Development and Verification plan

-

Integration Plan and Procedures

Test reports:

IID-A Section 10 -

Reference :

SCI-PT-IIDA-04624

Date :

30/06/2004

Issue :

3.3

PAGE : 10-16/23

Test reports of environmental and functional tests, which demonstrate that the objectives of the instrument development, scheduled for the time of the review, have been met

User Manual: -

The User Manual

Product Assurance: -

Product Assurance documentation as required in the Product Assurance Requirements for the Herschel/Planck instruments

Schedule: -

Schedule network and bar-chart together with an assessment of progress and problem areas covering all aspects of the instrument and associated equipment

Management: -

Management Plan

Ground Support Equipment: -

Electrical ground support equipment, design, development and verification status including both hardware and software

-

Mechanical ground support equipment, design, development and verification status

-

Optical ground support equipment, design, development and verification status.

Software: -

Onboard software (OBSW) – URD, SRD, ADD, DDD

-

GSE’s, e.g. s/c simulator

-

Technical notes, covering any topic or analysis which is either required by the IID or has been requested by the ESA Project Team

Notes:

10.13 Baseline schedule

10.13.1

Overall Herschel/Planck Baseline Schedule

The overall baseline schedule for Herschel/Planck is given on next page.

10.13.2

Baseline Schedule of Deliverables

(ref ESA fax SCI-PT-027979, modified to correct SPIRE DRCU QM2)

IID-A Section 10

Reference :

SCI-PT-IIDA-04624

Date :

30/06/2004

Issue :

3.3

PAGE : 10-17/23

The following instrument delivery dates have been proposed by ESA to constitute a common base-line for the system CDR

10.13.2.1

CQM deliveries (for Herschel EQM, resp. Planck QM testing)

Herschel HIFI: Instrument CQM delivery FPU (CQM):

15 November 2004

FCU (DM2):

15 November 2004

IFH (DM):

15 January 2005 – unit only required for IMT

IFV:

no delivery for CQM test

LOU (QM):

15 January 2005 – unit only required for IMT

LCU (IM2):

15 January 2005 – unit only required for IMT

LSU (DM):

15 January 2005 – unit only required for IMT*3

WEH (QM):

15 January 2005 – unit only required for IMT

WEV:

no delivery for CQM test

WHO (QM):

15 January 2005 – unit only required for IMT

WOV:

no delivery for CQM test

HRH (QM):

15 January 2005 – unit only required for IMT

HRV:

no delivery for CQM test

ICU (QM):

15 January 2005 – unit only required for IMT

Herschel PACS: Instrument CQM delivery FPU (QM) :

15 November 2004

BOLC (QM1):

15 November 2004

BOLC PSU (EM):

15 November 2004

DECMEC (EM):

15 November 2004

SPU (EM):

15 November 2004

DPU (AVM2):

15 November 2004

IID-A Section 10

Reference :

SCI-PT-IIDA-04624

Date :

30/06/2004

Issue :

3.3

PAGE : 10-18/23

Herschel SPIRE: Instrument CQM delivery FPU (CQM) :

15 November 2004

PJFET (CQM):

15 November 2004

SJFET (CQM):

15 November 2004

DRCU #1 (QM1):

15 November 2004 – FCU, DCU QM1 units can be used for integration checks. Unit need to be returned to SPIRE for early FM instrument tests.

DPU (AVM):

15 November 2004 – unit only required for IMT

Planck LFI: Instrument CQM delivery – no CQM delivery from LFI

Planck HFI: Instrument CQM delivery FPU (CQM) :

31 August 2004*1

DPU (CQM):

31 August 2004*1

REU (CQM):

31 August 2004*1

PAU (EM):

31 August 2004*1

JFET (QM):

31 August 2004*1

0.1 pipes PLM (QM): 31 July 2004 0.1 pipes SVM (QM): 31 July 2004 0.1 PGSE:

31 July 2004 – only needed for CQM test

DCCU (QM) :

31 August 2004*1

4K CDE (QM):

01 August 2004*2

4K DCE (CQM):

31 August 2004*2

4K pipes (QM):

31 July 2004*2

4K compr+anc.:

Planck Sorption Cooler: Cooler CQM delivery

31 July 2004*2.

IID-A Section 10 Pace (CQM) :

10.13.2.2

Reference :

SCI-PT-IIDA-04624

Date :

30/06/2004

Issue :

3.3

08. April 2004

AVM deliveries (for system AVM testing)

Herschel HIFI: Instrument CQM delivery Instrument simulator network: with AVM2 delivery ICU (AVM2):

from Herschel EQM after completion of test

Herschel PACS: Instrument CQM delivery FPU (simulator):

delivered with DECMEC and BOLC

BOLC (QM1):

from Herschel EQM after completion of test

BOLC PSU (EM):

from Herschel EQM after completion of test

DECMEC (EM):

from Herschel EQM after completion of test

SPU (EM):

from Herschel EQM after completion of test

DPU (AVM2):

from Herschel EQM after completion of test

Herschel SPIRE: Instrument CQM delivery DRCU Simulator:

with AVM2 delivery

DPU (AVM2):

from Herschel EQM after completion of test

Planck LFI: REBA (AVM):

01 March 2005

DAE Power Box:

01 March 2005

Planck HFI: Instrument CQM delivery FPU/JFET/PAU/REU simulator: 31. December 2004 DPU (CQM3): REU/PAU Simulator:

31. January 2005 31. January 2005

PAGE : 10-19/23

IID-A Section 10

Reference :

SCI-PT-IIDA-04624

Date :

30/06/2004

Issue :

3.3

DCE (CQM):

from Planck CQM after completion of test

4K CDE (QM):

from Planck CQM after completion of test

Planck Sorption Cooler: Cooler AVM delivery SCE (EQM):

30. November 2004

PAGE : 10-20/23

IID-A Section 10

3. FM deliveries Herschel HIFI: Instrument FM delivery FPU (FM):

15 November 2005*3

FCU (FM):

15 November 2005*3

IFH (FM):

15 November 2005*3

IFV (FM):

15 November 2005*3

LOU (FM):

15 November 2005*3

LCU (FM):

15 November 2005*3

LSU (FM):

15 November 2005*3

WEH (FM):

15 November 2005*3

WEV (FM):

15 November 2005*3

WHO (FM):

15 November 2005*3

WOV (FM):

15 November 2005*3

HRH (FM):

15 November 2005*3

HRV (FM):

15 November 2005*3

ICU (FM):

15 November 2005*3

Herschel PACS: Instrument FM delivery FPU (FM) :

15 November 2005*4

BOLC (FM):

15 November 2005*4

DECMEC (FM):

15 November 2005*4

SPU (FM):

15 November 2005*4

DPU (FM):

15 November 2005*4

Herschel SPIRE: Instrument FM delivery FPU (FM) :

15 November 2005

PJFET (FM):

15 November 2005

SJFET (FM):

15 November 2005

DRCU (FM):

15 November 2005

DPU (FM):

15 November 2005

Reference :

SCI-PT-IIDA-04624

Date :

30/06/2004

Issue :

3.3

PAGE : 10-21/23

IID-A Section 10

Reference :

SCI-PT-IIDA-04624

Date :

30/06/2004

Issue :

3.3

PAGE : 10-22/23

Planck LFI: Instrument FM delivery Complete FM:

15 May 2005

Planck HFI: Instrument FM delivery FPU (FM) :

15 May 2005

DPU (FM):

15 June 2005

REU (FM):

15 June 2005

PAU (FM):

15 June 2005

JFET (FM):

15 June 2005

0.1 pipes PLM (FM): 02 May 2005 0.1 pipes SVM (FM):

02 May 2005

0.1 K tanks (FM):

02 May 2005

DCCU (FM) :

02 May 2005

4K CDE (FM):

02 May 2005

4K DCE (CQM):

02 May 2005

4K pipes (FM):

02 May 2005

4K compr+anc.:

02 May 2005

Planck Sorption Cooler: Cooler FM delivery TMU (FM 1) :

15 December 2004

TMU (FM 1) :

15 March 2005

SCE (FM1):

15 March 2005

SCE (FM2):

15 March 2005

Note *1: HFI CQM delivery: The latest announced date for the delivery of HFI moved from the agreed date of 31.08.2004 to 23.09.2004.This substantial delay is being worked on with HFI in order to advance it. The work will be closely coordinated with Alcatel to minimize the impact on the CQM test.

Note *2: HFI 4 K cooler delivery:

IID-A Section 10

Reference :

SCI-PT-IIDA-04624

Date :

30/06/2004

Issue :

3.3

PAGE : 10-23/23

The latest information, as a result of a non conformance during qualification testing indicates delivery in September, however, before the CQM units (see note *1). This delay is being worked on with HFI/RAL in order to advance the delivery back to 31 July 2004

Note *3: HIFI delivery: The LSU DM is reported to be late, however, an AIV approach is being worked on and will be presented to deliver the LSU (DM), respectively a functionally adequate (lab.) source unit, when needed. The latest reported delivery date for the HIFI FM instrument is in February 2006. This delay is being worked on with HIFI in order to advance it to the nominal date quoted.

Note *4: PACS FM delivery: The PACS FM instrument delivery is reported to be January 2006. This assumes acceptance of replacement of FM detector arrays with more performing FS detector arrays. The final selection of FM or FS detectors for flight need to be taken by end 2004.

10.13.3

Satellite Schedule

Removed . Instrument will be informed on main milestones as needed.